SCLS256J - DECEMBER 1995 - REVISED JULY 2003 D Operating Range 2-V to 5.5-V VCC D Latch-Up Performance Exceeds 250 mA Per JESD 17 3 12 4 11 5 10 6 9 7 8 VCC 4OE 4A 4Y 3OE 3A 3Y 1A 1Y 2OE 2A 2Y 14 1A 1OE NC VCC 4OE 1 2 13 4OE 3 12 4A 4 11 4Y 5 10 3OE 9 3A 6 7 8 SN54AHC125 . . . FK PACKAGE (TOP VIEW) 1Y NC 2OE NC 2A 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 4A NC 4Y NC 3OE 2Y GND NC 3Y 3A 13 VCC 14 2 3Y 1 1OE 1OE 1A 1Y 2OE 2A 2Y GND SN74AHC125 . . . RGY PACKAGE (TOP VIEW) GND SN54AHC125 . . . J OR W PACKAGE SN74AHC125 . . . D, DB, DGV, N, NS, OR PW PACKAGE (TOP VIEW) NC - No internal connection description/ordering information The 'AHC125 devices are quadruple bus buffer gates featuring independent line drivers with 3-state outputs. Each output is disabled when the associated output-enable (OE) input is high. When OE is low, the respective gate passes the data from the A input to its Y output. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERING INFORMATION Tape and reel SN74AHC125RGYR HA125 PDIP - N Tube SN74AHC125N SN74AHC125N Tube SN74AHC125D Tape and reel SN74AHC125DR SOP - NS Tape and reel SN74AHC125NSR AHC125 SSOP - DB Tape and reel SN74AHC125DBR HA125 Tube SN74AHC125PW Tape and reel SN74AHC125PWR TVSOP - DGV Tape and reel SN74AHC125DGVR HA125 CDIP - J Tube SNJ54AHC125J SNJ54AHC125J CFP - W Tube SNJ54AHC125W SNJ54AHC125W LCCC - FK Tube SNJ54AHC125FK SNJ54AHC125FK TSSOP - PW -55C 125C -55 C to 125 C TOP-SIDE MARKING QFN - RGY SOIC - D -40C -40 C to 85 85C C ORDERABLE PART NUMBER PACKAGE TA AHC125 HA125 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated !"#$ % &'!!($ #% )'*+&#$ ,#$(!,'&$% &!" $ %)(&&#$% )(! $.( $(!"% (/#% %$!'"($% %$#,#!, 0#!!#$1- !,'&$ )!&(%%2 ,(% $ (&(%%#!+1 &+',( $(%$2 #++ )#!#"($(!%- )!,'&$% &")+#$ $ 34 #++ )#!#"($(!% #!( $(%$(, '+(%% $.(!0%( $(,- #++ $.(! )!,'&$% )!,'&$ )!&(%%2 ,(% $ (&(%%#!+1 &+',( $(%$2 #++ )#!#"($(!%- POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SCLS256J - DECEMBER 1995 - REVISED JULY 2003 FUNCTION TABLE (each buffer) INPUTS OE A OUTPUT Y L H H L L L H X Z logic diagram (positive logic) 1OE 1A 2OE 2A 1 2 3OE 3 1Y 4 5 3A 4OE 6 2Y 4A 10 9 8 3Y 13 12 11 4Y Pin numbers shown are for the D, DB, DGV, J, N, NS, PW, RGY, and W packages. absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA Package thermal impedance, JA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86C/W (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96C/W (see Note 2): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127C/W (see Note 2): N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80C/W (see Note 2): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76C/W (see Note 2): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113C/W (see Note 3): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 3. The package thermal impedance is calculated in accordance with JESD 51-5. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SCLS256J - DECEMBER 1995 - REVISED JULY 2003 recommended operating conditions (see Note 4) SN54AHC125 VCC VIH Supply voltage VCC = 2 V VCC = 3 V High-level input voltage VI VO IOH MAX 2 5.5 1.5 VCC = 5.5 V VCC = 2 V VIL MIN Output voltage t/v 2.1 V V 0.5 0.9 0.9 1.65 1.65 V 0 5.5 0 5.5 V 0 VCC -50 0 VCC -50 mA VCC = 3.3 V 0.3 V VCC = 5 V 0.5 V VCC = 3.3 V 0.3 V Input transition rise or fall rate 5.5 3.85 VCC = 2 V VCC = 3.3 V 0.3 V Low-level output current 2 UNIT 1.5 2.1 VCC = 5 V 0.5 V VCC = 2 V IOL MAX 0.5 Input voltage High-level output current MIN 3.85 VCC = 3 V VCC = 5.5 V Low-level input voltage SN74AHC125 VCC = 5 V 0.5 V -4 -4 -8 -8 50 50 4 4 8 8 100 100 20 20 V mA mA mA ns/V TA Operating free-air temperature -55 125 -40 85 C NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VCC MIN TA = 25C TYP MAX 2V 1.9 2 1.9 1.9 3V 2.9 3 2.9 2.9 4.5 V 4.4 4.5 4.4 4.4 IOH = -4 mA 3V 2.58 2.48 2.48 IOH = -8 mA 4.5 V 3.94 3.8 3.8 TEST CONDITIONS IOH = -50 mA VOH IOL = 50 mA VOL IOL = 4 mA IOL = 8 mA II IOZ VI = 5.5 V or GND VO = VCC or GND ICC Ci VI = VCC or GND, VI = VCC or GND IO = 0 SN54AHC125 MIN MAX SN74AHC125 MIN MAX UNIT V 2V 0.1 0.1 0.1 3V 0.1 0.1 0.1 4.5 V 0.1 0.1 0.1 3V 0.36 0.5 0.44 V 4.5 V 0.36 0.5 0.44 0 V to 5.5 V 0.1 1* 1 mA 5.5 V 0.25 2.5 2.5 mA 5.5 V 4 40 40 mA 10 pF 5V 4 10 * On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SCLS256J - DECEMBER 1995 - REVISED JULY 2003 switching characteristics over recommended operating free-air temperature range, VCC = 3.3 V 0.3 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE tPLH tPHL A Y CL = 15 pF tPZH tPZL OE Y CL = 15 pF tPHZ tPLZ OE Y CL = 15 pF tPLH tPHL A Y CL = 50 pF tPZH tPZL OE Y CL = 50 pF tPHZ tPLZ OE Y CL = 50 pF MIN TA = 25C TYP MAX SN54AHC125 SN74AHC125 MIN MAX MIN MAX 5.6* 8* 1* 9.5* 1 9.5 5.6* 8* 1* 9.5* 1 9.5 5.4* 8* 1* 9.5* 1 9.5 5.4* 8* 1* 9.5* 1 9.5 7* 9.7* 1* 11.5* 1 11.5 7* 9.7* 1* 11.5* 1 11.5 8.1 11.5 1 13 1 13 8.1 11.5 1 13 1 13 7.9 11.5 1 13 1 13 7.9 11.5 1 13 1 13 9.5 13.2 1 15 1 15 9.5 13.2 1 15 1 15 tsk(o) Y CL = 50 pF OE On products compliant to MIL-PRF-38535, this parameter is not production tested. On products compliant to MIL-PRF-38535, this parameter does not apply. 1.5** 1.5 UNIT ns ns ns ns ns ns ns switching characteristics over recommended operating free-air temperature range, VCC = 5 V 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE tPLH tPHL A Y CL = 15 pF tPZH tPZL OE Y CL = 15 pF tPHZ tPLZ OE Y CL = 15 pF tPLH tPHL A Y CL = 50 pF tPZH tPZL OE Y CL = 50 pF tPHZ tPLZ OE Y CL = 50 pF TA = 25C MIN TYP MAX POST OFFICE BOX 655303 SN74AHC125 MIN MAX MIN MAX 3.8* 5.5* 1* 6.5* 1 6.5 3.8* 5.5* 1* 6.5* 1 6.5 3.6* 5.1* 1* 6* 1 6 3.6* 5.1* 1* 6* 1 6 4.6* 6.8* 1* 8* 1 8 4.6* 6.8* 1* 8* 1 8 5.3 7.5 1 8.5 1 8.5 5.3 7.5 1 8.5 1 8.5 5.1 7.1 1 8 1 8 5.1 7.1 1 8 1 8 6.1 8.8 1 10 1 10 6.1 8.8 1 10 1 10 tsk(o) CL = 50 pF On products compliant to MIL-PRF-38535, this parameter is not production tested. On products compliant to MIL-PRF-38535, this parameter does not apply. 4 SN54AHC125 * DALLAS, TEXAS 75265 1** 1 UNIT ns ns ns ns ns ns ns SCLS256J - DECEMBER 1995 - REVISED JULY 2003 noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25C (see Note 5) SN74AHC125 PARAMETER MIN MAX UNIT VOL(P) VOL(V) Quiet output, maximum dynamic VOL 0.8 V Quiet output, minimum dynamic VOL -0.8 V VOH(V) VIH(D) Quiet output, minimum dynamic VOH 4.4 High-level dynamic input voltage 3.5 VIL(D) Low-level dynamic input voltage NOTE 5: Characteristics are for surface-mount packages only. V V 1.5 V operating characteristics, VCC = 5 V, TA = 25C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance No load, POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 f = 1 MHz TYP 14 UNIT pF 5 SCLS256J - DECEMBER 1995 - REVISED JULY 2003 PARAMETER MEASUREMENT INFORMATION From Output Under Test RL = 1 k From Output Under Test Test Point S1 VCC Open TEST GND CL (see Note A) CL (see Note A) S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Drain Open VCC GND VCC LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS VCC 50% VCC Timing Input tw tsu VCC Input 50% VCC 50% VCC 0V th VCC 50% VCC Data Input 50% VCC 0V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION VCC 50% VCC Input 50% VCC 0V tPLH In-Phase Output tPHL 50% VCC tPHL Out-of-Phase Output VOH 50% VCC VOL VCC Output Control Output Waveform 1 S1 at VCC (see Note B) 50% VCC 0V tPZL 50% VCC tPLZ VCC 50% VCC tPZH tPLH VOH 50% VCC VOL 50% VCC Output Waveform 2 S1 at GND (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + 0.3 V VOL tPHZ 50% VCC VOH - 0.3 V VOH 0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 , tr 3 ns, tf 3 ns. D. The outputs are measured one at a time with one input transition per measurement. E. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 21-Dec-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9686801Q2A ACTIVE LCCC FK 20 1 TBD 5962-9686801QCA ACTIVE CDIP J 14 1 TBD 5962-9686801QDA ACTIVE CFP W 14 1 SN74AHC125D ACTIVE SOIC D 14 50 SN74AHC125DBLE OBSOLETE SSOP DB 14 SN74AHC125DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC125DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC125DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC125DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC125DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC125DGVR ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC125DGVRE4 ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC125DGVRG4 ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC125DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC125DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC125DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC125N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74AHC125NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74AHC125NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC125NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC125PW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC125PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC125PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC125PWLE OBSOLETE TSSOP PW 14 TBD Call TI SN74AHC125PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC125PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC125PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM A42 N / A for Pkg Type TBD A42 N / A for Pkg Type Green (RoHS & no Sb/Br) CU NIPDAU TBD Addendum-Page 1 POST-PLATE N / A for Pkg Type Call TI Level-1-260C-UNLIM Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 21-Dec-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74AHC125RGYR ACTIVE VQFN RGY 14 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74AHC125RGYRG4 ACTIVE VQFN RGY 14 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SNJ54AHC125FK ACTIVE LCCC FK 20 1 TBD SNJ54AHC125J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54AHC125W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54AHC125, SN74AHC125 : SN74AHC125-Q1 * Automotive: * Enhanced Product: SN74AHC125-EP NOTE: Qualified Version Definitions: - Q100 devices qualified for high-reliability automotive applications targeting zero defects * Automotive * Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 21-Dec-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74AHC125DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 SN74AHC125DGVR TVSOP DGV 14 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1 SN74AHC125DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74AHC125DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74AHC125NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74AHC125PWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 SN74AHC125RGYR VQFN RGY 14 3000 180.0 12.4 3.75 3.75 1.15 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 21-Dec-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AHC125DBR SSOP DB 14 2000 346.0 346.0 33.0 SN74AHC125DGVR TVSOP DGV 14 2000 346.0 346.0 29.0 SN74AHC125DR SOIC D 14 2500 346.0 346.0 33.0 SN74AHC125DR SOIC D 14 2500 333.2 345.9 28.6 SN74AHC125NSR SO NS 14 2000 346.0 346.0 33.0 SN74AHC125PWR TSSOP PW 14 2000 346.0 346.0 29.0 SN74AHC125RGYR VQFN RGY 14 3000 190.5 212.7 31.8 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C - JANUARY 1995 - REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0- 8 A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C - FEBRUARY 1996 - REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0-8 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. 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