RC4558 SLOS073F - MARCH 1976 - REVISED SEPTEMBER 2010 www.ti.com DUAL GENERAL-PURPOSE OPERATIONAL AMPLIFIER Check for Samples: RC4558 FEATURES 1 * * * * * * * * D, DGK, P, PS, OR PW PACKAGE (TOP VIEW) Continuous Short-Circuit Protection Wide Common-Mode and Differential Voltage Ranges No Frequency Compensation Required Low Power Consumption No Latch-Up Unity-Gain Bandwidth . . . 3 MHz Typ Gain and Phase Match Between Amplifiers Low Noise . . . 8 nV/Hz Typ at 1 kHz 1OUT 1IN- 1IN+ VCC- 1 8 2 7 3 6 4 5 VCC+ 2OUT 2IN- 2IN+ DESCRIPTION/ORDERING INFORMATION The RC4558 device is a dual general-purpose operational amplifier, with each half electrically similar to the A741, except that offset null capability is not provided. The high common-mode input voltage range and the absence of latch-up make this amplifier ideal for voltage-follower applications. The device is short-circuit protected, and the internal frequency compensation ensures stability without external components. Table 1. ORDERING INFORMATION PACKAGE (1) TA 0C to 70C RC4558DGKR YR_ (2) PDIP - P Tube of 50 RC4558P RC4558P Tube of 75 RC4558D Reel of 2500 RC4558DRG3 Reel of 2000 RC4558PSR Tube of 150 RC4558PW Reel of 2000 RC4558PWR MSOP/VSSOP - DGK Reel of 2500 RC4558IDGKR YS_ (2) PDIP - P Tube of 50 RC4558IP RC4558IP Tube of 75 RC4558ID Reel of 2500 RC4558IDR Tube of 150 RC4558IPW Reel of 2000 RC4558IPWR SOIC - D TSSOP - PW SOIC - D TSSOP - PW (1) (2) TOP-SIDE MARKING Reel of 2500 SOP - PS -40C to 85C ORDERABLE PART NUMBER MSOP/VSSOP - DGK RC4558 R4558 R4558 R4558I R4558I Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. The actual top-side marking has one additional character that designates the assembly/test site. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1976-2010, Texas Instruments Incorporated RC4558 SLOS073F - MARCH 1976 - REVISED SEPTEMBER 2010 www.ti.com SCHEMATIC (EACH AMPLIFIER) VCC+ IN- IN+ OUT VCC- 2 Copyright (c) 1976-2010, Texas Instruments Incorporated RC4558 SLOS073F - MARCH 1976 - REVISED SEPTEMBER 2010 www.ti.com Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN VCC+ VCC- MAX 18 Supply voltage (2) VID Differential input voltage (3) VI Input voltage (any input) (2) -18 (4) Duration of output short circuit to ground, one amplifier at a time (5) (7) TJ Operating virtual junction temperature Tstg Storage temperature range (1) (2) (3) (4) (5) (6) (7) 30 V 15 V 97 DGK package Package thermal impedance (6) V Unlimited D package JA UNIT 172 P package 85 PS package 95 PW package 149 -65 C/W 150 C 150 C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, unless otherwise noted, are with respect to the midpoint between VCC+ and VCC-. Differential voltages are at IN+ with respect to IN-. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less. Temperature and/or supply voltages must be limited to ensure that the dissipation rating is not exceeded. Maximum power dissipation is a function of TJ (max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ (max) - TA)/JA. Operating at the absolute maximum TJ of 150C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions MIN VCC+ VCC- TA 5 15 -5 -15 RC4558 0 70 RC4558I -40 85 Supply voltage Operating free-air temperature Copyright (c) 1976-2010, Texas Instruments Incorporated MAX UNIT V C 3 RC4558 SLOS073F - MARCH 1976 - REVISED SEPTEMBER 2010 www.ti.com Electrical Characteristics at specified free-air temperature, VCC+ = 15 V, VCC- = -15 V TEST CONDITIONS (1) PARAMETER VIO Input offset voltage VO = 0 IIO Input offset current VO = 0 IIB Input bias current VO = 0 VICR Common-mode input voltage range RL = 10 k VOM Maximum output voltage swing RL = 2 k RL 2 k, VO = 10 V TA (2) 25C 14 12 14 13 25C 10 Full range 10 25C 20 Full range 15 25C Common-mode rejection ratio 25C ICC Supply current (both amplifiers) VO = 0, No load PD Total power dissipation (both amplifiers) VO1/VO2 (1) (2) Crosstalk attenuation Open loop AVD = 100 VO = 0, No load RS = 1 k, f = 10 kHz nA 500 nA 800 12 Input resistance AVD = 100, RS = 100 , f = 1 kHz, BW = 1 Hz 200 150 25C CMRR mV 300 25C ri Equivalent input noise voltage (closed loop) 5 25C 25C Vn 6 Full range Unity-gain bandwith UNIT 7.5 Full range B1 Supply-voltage sensitivity (VIO/VCC) MAX 0.5 25C Large-signal differential voltage amplification kSVS TYP Full range AVD VCC = 15 V to 9 V MIN V V 300 V/mV 3 MHz 0.3 5 M 70 90 dB 25C 30 25C 8 25C V/V 150 nV/Hz 2.5 5.6 TA min 3 6.6 TA max 2.3 5 25C 75 170 TA min 90 200 TA max 70 150 85 25C mA mW dB 105 All characteristics are measured under open-loop conditions with zero common-mode input voltage, unless otherwise specified. Full range is 0C to 70C for RC4558 and -40C to 85C for RC4558I. Operating Characteristics VCC+ = 15 V, VCC- = -15 V, TA = 25C PARAMETER tr SR 4 TEST CONDITIONS MIN Rise time VI = 20 mV, RL = 2 k, CL = 100 pF Overshoot VI = 20 mV, RL = 2 k, CL = 100 pF Slew rate at unity gain VI = 10 V, RL = 2 k, CL = 100 pF TYP 0.13 5 1.1 1.7 MAX UNIT ns % V/s Copyright (c) 1976-2010, Texas Instruments Incorporated RC4558 SLOS073F - MARCH 1976 - REVISED SEPTEMBER 2010 www.ti.com TYPICAL CHARACTERISTICS SUPPLY CURRENT vs TEMPERATURE (VCC = 15 V) 6 6 5 5 ICC - Supply Current - mA 4 3 2 4 3 2 1 1 0 -55 0 0 2 4 6 8 10 12 14 16 18 20 -35 -15 5 25 45 GAIN AND PHASE vs FREQUENCY (VCC = 15 V, RL = 2 k, CL = 22 pF) GAIN AND PHASE vs FREQUENCY (VCC = 15 V, RL = 10 k, CL = 22 pF) 40 0 -20 30 -40 -60 10 -80 -100 -120 Phase -140 -160 -10 Gain - dB Gain -40 -60 20 Phase - deg 20 Gain 10 0 f - Frequency - kHz Copyright (c) 1976-2010, Texas Instruments Incorporated -200 10000 -80 -100 Phase -120 -140 -160 -10 -180 -180 1000 125 0 -20 Gain - dB 105 TA - Temperature - C 30 -20 100 85 VCC - Supply Voltage - V 40 0 65 Phase - deg ICC - Supply Current - mA SUPPLY CURRENT vs SUPPLY VOLTAGE (TA = 25C) -20 100 1000 -200 10000 f - Frequency - kHz 5 RC4558 SLOS073F - MARCH 1976 - REVISED SEPTEMBER 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) OUTPUT VOLTAGE SWING vs FREQUENCY (VCC = 15 V, RL = 2 k, TA = 25C) 15 30 10 25 VOM - Output Voltage Swing - V VOM - Output Voltage Swing - V OUTPUT VOLTAGE SWING vs SUPPLY VOLTAGE (RL = 2 k, TA = 25C) 5 0 -5 -10 -15 6 8 10 12 14 16 20 15 10 5 0 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 10 100 10k 100k 1.E+06 1 1k 1M 18 VCC - Supply Voltage - V f - Frequency - Hz OUTPUT VOLTAGE SWING vs LOAD RESISTANCE (VCC = 15 V, TA = 25C) OUTPUT VOLTAGE SWING vs TEMPERATURE (VCC = 15 V, RL = 10 k) 15 32 14.75 28 VOM - Output Voltage Swing - V VOM - Output Voltage Swing - V 30 26 24 22 20 18 16 14.25 14 13.75 13.5 13.25 14 12 100 1000 RloadR- -Load LoadResistance Resistance-- W L 6 14.5 10000 13 -55 -35 -15 5 25 45 65 85 105 125 TA - Temperature - C Copyright (c) 1976-2010, Texas Instruments Incorporated RC4558 SLOS073F - MARCH 1976 - REVISED SEPTEMBER 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) NEGATIVE OUTPUT VOLTAGE SWING vs TEMPERATURE (VCC = 15 V, RL = 10 k) OPEN LOOP GAIN vs FREQUENCY (VCC = 15 V, RL = 2 k, CL = 22 pF, TA = 25C) 120 -12 110 100 -12.5 G M - Open Loop Gain - dB -V OM - Output Voltage Swing - V -12.25 -12.75 -13 -13.25 -13.5 90 80 70 60 50 40 30 20 -13.75 10 -14 -55 -35 -15 5 25 45 65 85 0 100 1.E+02 105 125 1k 1.E+03 10k 1.E+04 100k 1.E+05 1M 1.E+06 10M 1.E+07 f - Frequency - Hz TA - Temperature - C INPUT BIAS CURRENT vs TEMPERATURE (VCC = 15 V) INPUT OFFSET VOLTAGE vs TEMPERATURE (VCC = 15 V) 200 0.003 190 0.002 VIO - Input Offset Voltage - V IIB - Input Bias Current - nA 180 170 160 150 140 130 120 0.001 0 -0.001 -0.002 110 100 -55 -35 -15 5 25 45 65 TA - Temperature - C Copyright (c) 1976-2010, Texas Instruments Incorporated 85 105 125 -0.003 -55 -35 -15 5 25 45 65 85 105 125 TA - Temperature - C 7 RC4558 SLOS073F - MARCH 1976 - REVISED SEPTEMBER 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) INPUT NOISE VOLTAGE vs FREQUENCY (VCC = 15 V, TA = 25C) - Input NoiseVoltage Voltage--nV/rt(Hz) nV/OHz Vn V-n Input Noise 14 12 10 8 6 4 2 0 10 1.E+01 100 1.E+02 1k 1.E+03 10k 1.E+04 100k 1.E+05 f - Frequency - Hz 8 Copyright (c) 1976-2010, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 17-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4558DE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4558DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4558DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4558DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4558DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4558DRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4558DRG3 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) RC4558DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4558ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4558IDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4558IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4558IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4558IDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4558IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4558IDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4558IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 Samples (Requires Login) RC4558D CU SN (3) Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM www.ti.com 17-Aug-2012 Orderable Device Status (1) RC4558IP ACTIVE RC4558IPE4 ACTIVE RC4558IPW ACTIVE RC4558IPWE4 ACTIVE RC4558IPWG4 Package Type Package Drawing PDIP Pins P 8 PDIP P TSSOP PW TSSOP ACTIVE RC4558IPWR Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4558IPWRE4 ACTIVE TSSOP PW 8 TBD Call TI Call TI RC4558IPWRG4 ACTIVE TSSOP PW 8 TBD Call TI Call TI RC4558P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type RC4558PE4 ACTIVE PDIP P 8 RC4558PSLE OBSOLETE SO PS 8 RC4558PSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4558PSRE4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4558PSRG4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4558PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4558PWE4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4558PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM RC4558PWLE OBSOLETE TSSOP PW 8 RC4558PWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) TBD Call TI Call TI Call TI Call TI CU NIPDAU Level-1-260C-UNLIM RC4558PWRE4 ACTIVE TSSOP PW 8 TBD Call TI Call TI RC4558PWRG4 ACTIVE TSSOP PW 8 TBD Call TI Call TI RC4558Y OBSOLETE DIESALE Y 0 TBD Call TI Call TI Addendum-Page 2 Samples (Requires Login) 50 TBD (3) PACKAGE OPTION ADDENDUM www.ti.com 17-Aug-2012 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant RC4558DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 RC4558DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 RC4558DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 RC4558DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 RC4558DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 RC4558IDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 RC4558IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 RC4558IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 RC4558IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 RC4558PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 RC4558PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 RC4558PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) RC4558DGKR VSSOP DGK 8 2500 364.0 364.0 27.0 RC4558DR SOIC D 8 2500 367.0 367.0 35.0 RC4558DR SOIC D 8 2500 340.5 338.1 20.6 RC4558DRG4 SOIC D 8 2500 367.0 367.0 35.0 RC4558DRG4 SOIC D 8 2500 340.5 338.1 20.6 RC4558IDGKR VSSOP DGK 8 2500 364.0 364.0 27.0 RC4558IDR SOIC D 8 2500 340.5 338.1 20.6 RC4558IPWR TSSOP PW 8 2000 367.0 367.0 35.0 RC4558IPWR TSSOP PW 8 2000 364.0 364.0 27.0 RC4558PSR SO PS 8 2000 367.0 367.0 38.0 RC4558PWR TSSOP PW 8 2000 364.0 364.0 27.0 RC4558PWR TSSOP PW 8 2000 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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