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G% 7\SLFDOYDOXHV#7$ &DQG9 $OOPLQPD[OLPLWVDUHJXDUDQWHHGE\,6'YLDHOHFWULFDOWHVWLQJRUFKDUDFWHUL]DWLRQ1RWDOOVSHFLILFDWLRQVDUH SHUFHQWWHVWHG :KHQGULYHQE\DYROWPLFURFRQWUROOHUWKHPD[LPXP9,+IRUWKH026,6&/.DQG66SLQVLVYROWV 9&&$DQG9&&'FRQQHFWHGWRJHWKHU 66 9&&$ 9&&';&/. 026, 966$ 966'DQGDOORWKHUSLQVIORDWLQJ 0HDVXUHGZLWK$XWR0XWHIHDWXUHGLVDEOHG Table 11: AC Parameters (Die) Symbol )6 Characteristic 6DPSOLQJ)UHTXHQF\ Min(2) Typ(1) Max(2) Units Conditions ,6' ,6' ,6' ,6' .+] .+] .+] .+] .+] .+] .+] .+] G%5ROO2II3RLQW G%5ROO2II3RLQW G%5ROO2II3RLQW G%5ROO2II3RLQW )&) )LOWHU3DVV%DQG ,6' ,6' ,6' ,6' 75(& 5HFRUG'XUDWLRQ ,6' ,6' ,6' ,6' VHF VHF VHF VHF ,6' ,6' ,6' ,6' VHF VHF VHF VHF ,6' ,6' ,6' ,6' PVHF PVHF PVHF PVHF 73/$< 738' 3OD\EDFN'XUDWLRQ 3RZHU8S'HOD\ 76723RU 73$86( 6WRSRU3DXVHLQ 5HFRUGRU3OD\ ,6' ,6' ,6' ,6' 75$& 5$&&ORFN3HULRG ,6' ,6' ,6' ,6' 14 PVHF PVHF PVHF PVHF PVHF PVHF PVHF PVHF Voice Solutions in SiliconTM ,6'3URGXFWV Table 11: AC Parameters (Die) Symbol 75$&/2 Min(2) Characteristic 5$&&ORFN/RZ7LPH Typ(1) Max(2) Units ,6' ,6' ,6' ,6' PVHF PVHF PVHF PVHF 75$&0 5$&&ORFN3HULRGLQ 0HVVDJH&XHLQJ 0RGH ,6' ,6' ,6' ,6' VHF VHF VHF VHF 75$&0/ 5$&&ORFN/RZ7LPH LQ0HVVDJH&XHLQJ 0RGH ,6' ,6' ,6' ,6' VHF VHF VHF VHF 7+' 7RWDO+DUPRQLF'LVWRUWLRQ 9,1 $1$,1,QSXW9ROWDJH P9 Conditions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able 12: SPI AC Parameters(1) Symbol Characteristics Min Max Units Conditions 7666 666HWXS7LPH QVHF 766+ 66+ROG7LPH QVHF 7',6 'DWDLQ6HWXS7LPH QVHF 7',+ 'DWDLQ+ROG7LPH QVHF 73' 2XWSXW'HOD\ QVHF 7') 2XWSXW'HOD\WRKL= QVHF 766PLQ 66+,*+ 76&.KL VHF 6&/.+LJK7LPH QVHF 76&.ORZ 6&/./RZ7LPH QVHF ) &/.)UHTXHQF\ .+] 7\SLFDOYDOXHV#7$ &DQG97LPLQJPHDVXUHGDWSHUFHQWRIWKH9&&OHYHO 7ULVWDWHWHVWFRQGLWLRQ 16 Voice Solutions in SiliconTM ,6'3URGXFWV 7,0,1*',$*5$06 Figure 5: Timing Diagram Figure 6: 8-Bit Command Format ISD 17 ,6'3URGXFWV Figure 7: 16-Bit Command Format Figure 8: Playback/Record and Stop Cycle 18 Voice Solutions in SiliconTM ,6'3URGXFWV Figure 9: Application Example Using SPI 127( ISD 7KLVDSSOLFDWLRQH[DPSOHLVIRULOOXVWUDWLRQSXUSRVHVRQO\,6'PDNHVQRUHSUHVHQWDWLRQRUZDUUDQW\WKDWVXFK DSSOLFDWLRQZLOOEHVXLWDEOHIRUSURGXFWLRQ 19 ,6'3URGXFWV Figure 10: Application Example Using Microwire 7KLVDSSOLFDWLRQH[DPSOHLVIRULOOXVWUDWLRQSXUSRVHVRQO\,6'PDNHVQRUHSUHVHQWDWLRQRUZDUUDQW\WKDWVXFK DSSOLFDWLRQZLOOEHVXLWDEOHIRUSURGXFWLRQ Figure 11: Application Example Using SPI Port on Microcontroller 127( 20 7KLVDSSOLFDWLRQH[DPSOHLVIRULOOXVWUDWLRQSXUSRVHVRQO\,6'PDNHVQRUHSUHVHQWDWLRQRUZDUUDQW\WKDWVXFK DSSOLFDWLRQZLOOEHVXLWDEOHIRUSURGXFWLRQ Voice Solutions in SiliconTM ,6'3URGXFWV '(9,&(3+<6,&$/',0(16,216 Figure 12: 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type I (E) Table 13: Plastic Thin Small Outline Package (TSOP) Type I (E) Dimensions INCHES Min Nom Max Min Nom Max $ % & ' ( ) * + , - 127( ISD MILLIMETERS /HDGFRSODQDULW\WREHZLWKLQLQFKHV 21 ,6'3URGXFWV Figure 13: 28-Lead 0.600-Inch Plastic Dual Inline Package (PDIP) (P) Table 14: Plastic Dual Inline Package (PDIP) (P) Dimensions INCHES $ Min Nom Max Min Nom Max % % & & ' ' ( ) * + 22 MILLIMETERS - 6 T Voice Solutions in SiliconTM ,6'3URGXFWV Figure 14: 28-Lead 0.300-Inch Plastic Small Outline Integrated Circuit (SOIC) (S) Table 15: Plastic Small Outline Integrated Circuit (SOIC) (S) Dimensions INCHES Min Nom Max Min Nom Max $ % & ' ( ) * + 127( ISD MILLIMETERS /HDGFRSODQDULW\WREHZLWKLQLQFKHV 23 ,6'3URGXFWV Figure 15: ISD33120/150/180/240 Products Bonding Physical Layout(1) (Unpackaged Die) 966' 026, 0,62 6&/. 9&&' ;&/. ,17 9&&' 66 5$& ,6'; I. 'LH'LPHQVLRQV ;PLOV <PLOV II. 'LH7KLFNQHVV PLOV 966' 966$ ,6'; III. 3DG2SHQLQJPLQ PLFURQVPLOV 966$ 966$ 24 $8'287 $1$,1r $0&$3 9&&$ $1$,1 7KHEDFNVLGHRIWKHGLHLVLQWHUQDOO\FRQQHFWHGWR966,W0867127EHFRQQHFWHGWRDQ\RWKHUSRWHQWLDORU GDPDJHPD\RFFXU 'RXEOHERQGUHFRPPHQGHG Voice Solutions in SiliconTM ,6'3URGXFWV Table 16: ISD33120/150/180/240 Devices PIN/PAD Designations, with Respect to Die Center (m) Pin Pin Name X Axis Y Axis 966$ 966$QDORJ3RZHU6XSSO\ r r 966$ 966$QDORJ3RZHU6XSSO\ r r $8'287 $XGLR2XWSXW r $0&$3 $XWR0XWH r $1$,1r ,QYHUWLQJ$QDORJ,QSXW r $1$,1 1RQLQYHUWLQJ$QDORJ,QSXW r 9&&$ 9&&$QDORJ3RZHU6XSSO\ r 966$ 966$QDORJ3RZHU6XSSO\ 5$& 5RZ$GGUHVV&ORFN ,17 ,QWHUUXSW ;&/. 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