Pb
RoHS
ES52C1A25N-12.288M TR
ES52C1 A 25 N -12.288M TR
Series
RoHS Compliant (Pb-free) 5mm x 7mm Ceramic SMD
3.3Vdc Clipped Sinewave TC(VC)XO
Operating Temperature Range
0°C to +50°C
Frequency Stability
±2.5ppm Maximum
Packaging Options
Tape & Reel
Nominal Frequency
12.288MHz
Control Voltage
None (No Connect on Pin 1)
ELECTRICAL SPECIFICATIONS
Nominal Frequency 12.288MHz
Frequency Stability vs. Frequency
Tolerance ±1.0ppm Maximum (Measured at 25°C ±2°C, Vdd=3.3Vdc, Vc=1.5Vdc)
Frequency Stability ±2.5ppm Maximum
Frequency Stability vs. Input Voltage ±0.2ppm Maximum (Vdd ±5%)
Frequency Stability vs. Aging ±1ppm/Year Maximum (at 25°C)
Frequency Stability vs. Load ±0.2ppm Maximum (±1kOhm//±1pF)
Operating Temperature Range 0°C to +50°C
Supply Voltage 3.3Vdc ±5%
Input Current 1.5mA Maximum
Output Voltage 0.8Vp-p Clipped Sinewave Minimum
Load Drive Capability 10kOhms//10pF
Output Logic Type Clipped Sinewave
Control Voltage None (No Connect on Pin 1)
Phase Noise -80dBc/Hz at 10Hz offset, -115dBc/Hz at 100Hz offset, -135dBc/Hz at 1kHz offset, -145dBc/Hz at 10kHz
offset, -145dBc/Hz at 100kHz offset (Typical Values, at 12.800MHz)
Start Up Time 5mSec Maximum
Storage Temperature Range -55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test MIL-STD-883, Method 1014 Condition A
Gross Leak Test MIL-STD-883, Method 1014 Condition C
Mechanical Shock MIL-STD-202, Method 213 Condition C
Resistance to Soldering Heat MIL-STD-202, Method 210
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, Method 1010
Vibration MIL-STD-883, Method 2007 Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev J 2/20/2010 | Page 1 of 5
ES52C1A25N-12.288M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
MARKING
ORIENTATION
5.0
±0.2
7.0
±0.2
2.0
MAX
0.3
±0.1
(x10)
0.8 ±0.1
(x4)
2.0 ±0.1
(x4)
2.7 ±0.1
(x4)
1.4 ±0.1
(x4)
1
5 6
10
PIN CONNECTION
1 No Connect
2 Do Not Connect
3 Do Not Connect
4 Do Not Connect
5 Case/Ground
6 Output
7 Do Not Connect
8 Do Not Connect
9 Do Not Connect
10 Supply Voltage
LINE MARKING
1E12.288
E=Ecliptek
2XXYZZ
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
All Tolerances are ±0.1
Suggested Solder Pad Layout
Solder Land
(X4)
All Dimensions in Millimeters
3.9
3.0
1.2 (X4)
1.8 (X4)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev J 2/20/2010 | Page 2 of 5
ES52C1A25N-12.288M TR
OUTPUT WAVEFORM
0VDC
CLOCK OUTPUT
VP-P
Power
Supply
Oscilloscope
Probe
(Note 2)
Voltage
Meter
Frequency
Counter
0.01µF
(Note 1) 0.1µF
(Note 1)
Supply
Voltage
(VDD)Output
No Connect
Ground
RL = 10kOhms
Test Circuit for No Connect Option
Current
Meter
CL = 10pF
(Note 3)
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev J 2/20/2010 | Page 3 of 5
DIA 50 MIN
DIA 20.2 MIN
DIA 13.0 ±0.2
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
DIA 40 MIN
Access Hole at
Slot Location
1.5 MIN
Tape & Reel Dimensions
*Compliant to EIA 481A
ES52C1A25N-12.288M TR
16.0
+0.3/-0.1
7.5 ±0.1
6.75 ±0.10
4.0 ±0.1
2.0 ±0.1
8.0 ±0.1 B0*
DIA 1.5 +1.0/-0
A0*
0.30 ±0.05
K0*
22.4 MAX
360 MAX
Quantity Per Reel: 1,000 units
16.4 +2.0/-0
www.ecliptek.com | Specification Subject to Change Without Notice | Rev J 2/20/2010 | Page 4 of 5
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
ES52C1A25N-12.288M TR
Low Temperature Infrared/Convection 220°C
TS MAX to TL (Ramp-up Rate) 5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 60 - 120 Seconds
Ramp-up Rate (TL to TP)5°C/second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)220°C Maximum
Target Peak Temperature (TP Target) 220°C Maximum 1 Time / 215°C Maximum 1 Time
Time within 5°C of actual peak (tp)15 seconds Maximum 1 Time / 80 seconds Maximum 1 Time
Ramp-down Rate 5°C/second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev J 2/20/2010 | Page 5 of 5
