FSV1045V - Fairchild Semiconductor

FSV1045V — 10 A, 45 V Ultra-Low VF Schottky Rectifier

FSV1045V Rev. 1.1

May 2015

FSV1045V

10 A, 45 V Ultra-Low VF Schottky Rectifier

Features

• Ultra-Low Forward Voltage Drop:

- 0.41 V Typical at 10 A, TA = 25°C

- 0.44 V Maximum at 10 A, TA = 25°C

• Low Thermal Resistance

• Very Low Profile: Typical Height of 1.1 mm

• RoHS Compliant

• Halogen Free

• Meets MSL 1 per JESD22-A111 Full-Body Solder

Immersion

Applications

• Mobile Charger

• Solar Panel

• Reverse Polarity Protection

Ordering Information

Part Number Top Mark Package Packing Method

FSV1045V FSV1045V TO-277 3L Tape and Reel

Anode 2

Anode 1

Cathode

Description

The FSV1045V schottky rectifier offers break-through

size and performance. The device is optimized for mobile

charger applicatio ns. It sinks only 18 mA reverse current

at high temperature and provides forward voltage drop of

0.18 V at 1 A operating current in a charger design.

All this capability is packed into a small, flat-lead, TO-277

package, optimized for space-constrained applications.

The FSV1045V sup port s a typica l Z heigh t of 1.1 mm. It is

RoHS compliant and hal ogen fre e. It is also quali fied fo r a

wave soldering proces s.

TO-277

FSV1045V — 10 A, 45 V Ultra-Low VF Schottky Rectifier

FSV1045V Rev. 1.1 2

Absolute Maximum Ratings(1)

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-

ble above the re co mmen ded operating conditions and stressing the parts to these levels is n ot re co mme nded. In addi-

tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The

absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.

Notes:

1. All tests conducted at TA = TJ = 25°C unless otherwi s e noted.

2. Mounted on 30 mm x 30 mm FR4 PCB.

3. Pulse condition: 8.3 ms single half-sine wave. Test method is compliant with MIL standard. (MIL-STD-750E)

Thermal Characteristics(4)

Values are at TA = 25°C unless otherwise noted.

Note:

4. The thermal resistances (RθJA & ψJL) are characterized with device mounted on the following FR4 printed circuit

boards, as shown in Figure 1 and Figure 2. PCB size: 76.2 x 114.3 mm. Minimum land pattern size: 4.9 x 4.8 mm

(big pattern, x1), 1.4 x 1.52 mm (small pattern, x2). Maximum land pattern size: 30 x 30 mm (pattern, x2).

Force line trace size = 55 mils, sense line trace size = 4 mils.

Symbol Parameter Value Unit

VRRM Peak Repetitive Reverse Voltage 45 V

VRWM Working Peak Reverse Voltage 45 V

VRMS RMS Reverse Voltage 32 V

VRDC Blocking Voltage 45 V

IOAverage Rectified O utput Current(2) TL = 105°C 10 A

IFSM Non-Repetitive Peak Forward Surge Current(3) 300 A

CJTypical Junction Capacitance VR = 4 V, 1 MHz 820 pF

TJOperating Junction Temperature Range -55 to +150 °C

TSTG Storage Temperature Range -55 to +150 °C

Symbol Parameter Minimum

Land Pattern Maximum

Land Pattern Unit

RθJA Junction-to-Ambient Thermal Resistance 100 40 °C/W

ψJL

Junction-to-Lead Thermal Characteristics,

Thermocouple Soldered to Anode 15 12

°C/W

Junction-to-Lead Thermal Characteristics,

Thermocouple Soldered to Cathode 65

Figure 1. Minimum Land Pattern of 2 oz Copper Figure 2. Maximum Land Pattern of 2 oz Copper

FSV1045V — 10 A, 45 V Ultra-Low VF Schottky Rectifier

FSV1045V Rev. 1.1 3

Electrical Characteristics

Values are at TA = 25°C unless otherwise noted.

Symbol Parameter Conditions Min. Typ. Max. Unit

VBR Breakdown Voltage IT = 500 μA45 V

VFForward Voltage Drop

IF = 1 A TA = 25°C0.28

IF = 10 A 0.41 0.44

IF = 1 A TA = 125°C0.18

IF = 10 A 0.36 0.39

IRMaximum Leakage V = VRWM TA = 25°C 0.065 0.220 mA

TA = 125°C1932

FSV1045V — 10 A, 45 V Ultra-Low VF Schottky Rectifier

FSV1045V Rev. 1.1 4

Typical Performance Characteristics

Figure 3. Forward Current Characteristics Figure 4. Typical Reverse Characteristics

Figure 5. Typical Junction Capacitance Figure 6. Forward Current Derating Curve

Figure 7. Surge Current Derating Curve

1E-3

0.01

0.1

0.00.10.20.30.40.5

TA= 150oC

TA= 125oC

TA= 85oC

TA= 25oC

TA= -55oC

Forward Voltage, VF[V]

Forward Current, I F[A]

10 15 20 25 30 35 40 45

1E-3

0.01

0.1

100

1000

10000

100000

TA=150oC

TA=125oC

TA=25oC

TA=85oC

Reverse Current, IR[uA]

Reve rse Voltage, VR[V]

TA=-55oC

110100

100

1000

10000

Junction Capacitance, CJ[pF]

Reverse Voltage, VR[V]

0 255075100125150175

ψjl (30mm x 30mm Pad)

θja (30mm x 30mm Pad)

Average Current, [A]

Ambient / Lead Temperat ure, [oC]

θja (Min. Pad)

ψjl (Min. Pad)

0 20406080100

100

150

200

250

300

350

Peak Forward Surge Current, IFSM[A]

Number of Cycles

1.15 MIN

4.15 MIN

1.97

1.45 MIN

4.65 MIN

2.75

1.00

(0.35)

1.20

1.00

0.40

0.23

0.01

SEATING

PLANE

6.65

6.35

6.15

5.67

4.63

4.25

1.40

1.10

(2X)

0.63

0.43

(2X)

2.25

1.95

4.15

3.25 2.20

2.00

1.25

0.90

4.90

4.23

(0.25)

3.680

0.913

4.75 MAX

0.60

3.81

DAP OPTION

NOTES: UNLESS OTHERWISE SPECIFIED

A. PACKAGE REFERENCE: JEDEC TO-277

B. DIMENSIONS ARE EXCLUSIVE OF

BURRS, MOLD FLASH, AND TIE BAR

EXTRUSIONS.

C. ALL DIMENSIONS ARE IN MILLIMETERS.

DOES NOT COMPLY TO JEDEC

STANDARD VALUE.

E. DRAWING FILENAME: MKT-TO277A03rev4

TOP VIEW

LAND PATTERN RECOMMENDATION

BOTTOM VIEW - DAP OPTION

FRONT VIEW

BOTTOM VIEW

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Rev. I77

Mouser Electronics

Authorized Distributor

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