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Dear Customer,
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1. General description
The 74HC541-Q100; 74HCT541-Q100 is an octal non-inverting buffer/line driver with
3-state outp ut s. The device features two output-enables (OE1 and OE2) . A HIGH on O En
causes the outputs to assume a high-impedance OFF-state. Inputs include clamp diodes
that enable the use of current limiting resistors to interface inputs to voltages in excess of
VCC.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from 40 C to +85 C and from 40 C to +125 C
Non-Inverting outputs
Complies with JEDEC standard no. 7A
Input levels:
For 74HC541-Q100: CMOS level
For 74HCT541-Q100: TTL level
ESD protection:
MIL-STD-883, method 3015 exceeds 2000 V
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 )
Multiple package options
3. Ordering information
74HC541-Q100; 74HCT541-Q100
Octal buffer/line driver; 3-state
Rev. 1 — 19 June 2014 Product data sheet
Table 1. Ordering information
Type number Package
Temperature range Name Description Version
74HC541D-Q100 40 C to +125 C SO20 plastic small outline package; 20 leads;
body width 7.5 mm SOT163-1
74HCT541D-Q100
74HC541PW-Q100 40 C to +125 C TSSOP20 plastic thin shrink small outline package; 20 leads;
body width 4.4 mm SOT360-1
74HCT541PW-Q100
74HC_HCT541_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 2 of 17
NXP Semiconductors 74HC541-Q100; 74HCT541-Q100
Octal buffer/line driver; 3-state
4. Functional diagram
Fig 1. Logic symbol Fig 2. IEC logic symbol
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74HC_HCT541_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 3 of 17
NXP Semiconductors 74HC541-Q100; 74HCT541-Q100
Octal buffer/line driver; 3-state
Fig 3. Functional diagram
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74HC_HCT541_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 4 of 17
NXP Semiconductors 74HC541-Q100; 74HCT541-Q100
Octal buffer/line driver; 3-state
Fig 4. Logic diagra m
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74HC_HCT541_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 5 of 17
NXP Semiconductors 74HC541-Q100; 74HCT541-Q100
Octal buffer/line driver; 3-state
5. Pinning information
5.1 Pinning
5.2 Pin description
6. Functional description
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.
Fig 5. Pin configuration SO2 0 an d TSSO P2 0
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Table 2. Pin description
Symbol Pin Description
OE1 1 output-enable input (active LOW)
A0 to A7 2, 3, 4, 5, 6, 7, 8, 9 data input
GND 10 ground (0 V)
Y0 to Y7 18, 17, 16, 15, 14, 13, 12, 11 data output
OE2 19 output-enable inpu t (active LOW)
VCC 20 supply voltage
Table 3. Functional table[1]
Control Input Output
OE1OE2An Yn
LL L L
LL H H
XH X Z
HX X Z
74HC_HCT541_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 6 of 17
NXP Semiconductors 74HC541-Q100; 74HCT541-Q100
Octal buffer/line driver; 3-state
7. Limiting values
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] For SO20 packages: above 70 C the value of Ptot derates linearly with 8 mW/K.
For TSSOP20 packages: above 60 C the value of Ptot derates linearly with 5.5 mW/K.
8. Recommended operating conditions
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage 0.5 +7 V
IIK input clamping current VI < 0.5 V or VI>V
CC +0.5 V [1] -20 mA
IOK output clamping current VO<0.5 V or VO>V
CC +0.5V [1] -20 mA
IOoutput curren t 0.5 V < VO < VCC +0.5V - 35 mA
ICC supply current - 70 mA
IGND ground current 70 - mA
Tstg storage temperature 65 +150 C
Ptot total power dissipation [2] - 500 mW
Table 5. Recommended operating con ditions
Voltages are referenced to GND (ground = 0 V)
Symbol Parameter Conditions 74HC541-Q100 74HCT541-Q100 Unit
Min Typ Max Min Typ Max
VCC supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V
VIinput voltage 0 - VCC 0- V
CC V
VOoutput voltage 0 - VCC 0- V
CC V
Tamb ambient temperature 40 +25 +125 40 +25 +125 C
t/V input transition rise and fall rate VCC = 2.0 V - - 625 - - - ns/V
VCC = 4.5 V - 1.67 139 - 1.67 139 ns/V
VCC = 6.0 V--83---ns/V
74HC_HCT541_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 7 of 17
NXP Semiconductors 74HC541-Q100; 74HCT541-Q100
Octal buffer/line driver; 3-state
9. Static characteristics
Table 6. Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Tamb = 25 C Tamb = 40 C
to +85 CTamb = 40 C
to +125 CUnit
Min Typ Max Min Max Min Max
74HC541-Q100
VIH HIGH-level
input voltage VCC = 2.0 V 1.5 1.2 - 1.5 - 1.5 - V
VCC = 4.5 V 3.15 2.4 - 3.15 - 3.15 - V
VCC = 6.0 V 4.2 3.2 - 4.2 - 4.2 - V
VIL LOW-level
input voltage VCC = 2.0 V - 0.8 0.5 - 0.5 - 0.5 V
VCC = 4.5 V - 2.1 1.35 - 1.35 - 1.35 V
VCC = 6.0 V - 2.8 1.8 - 1.8 - 1.8 V
VOH HIGH-level
output voltage VI=V
IH or VIL
IO = 20 A; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V
IO = 20 A; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V
IO = 20 A; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V
IO = 6.0 mA; VCC = 4.5 V 3.98 4.32 - 3.84 - 3.7 - V
IO = 7.8 mA; VCC = 6.0 V 5.48 5.81 - 5.34 - 5.2 - V
VOL LOW-level
output voltage VI=V
IH or VIL
IO = 20 A; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V
IO = 20 A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V
IO = 20 A; VCC = 6.0 V - 0 0.1 - 0.1 - 0.1 V
IO = 6.0 mA; VCC = 4.5 V - 0.15 0.26 - 0.33 - 0 .4 V
IO = 7.8 mA; VCC = 6.0 V - 0.16 0.26 - 0.33 - 0 .4 V
IIinput leakage
current VI = VCC or GND; VCC =6.0V - - 0.1 - 1.0 - 1.0 A
IOZ OFF-state
output current per input pin; VI=V
IH or VIL;
VO=V
CC or GND;
other inputs at VCC or GND;
VCC =6.0V; I
O=0A
--0.5 - 5.0 - 10 A
ICC supply current VI = VCC or GND; IO=0A;
VCC =6.0V - - 8.0 - 80 - 160 A
CIinput
capacitance -3.5- - - - - pF
74HCT541-Q100
VIH HIGH-level
input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - 2.0 - V
VIL LOW-level
input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 - 0.8 V
VOH HIGH-level
output voltage VI=V
IH or VIL; VCC = 4.5 V
IO = 20 A 4.4 4.5 - 4.4 - 4.4 - V
IO = 6.0 mA 3.98 4.32 - 3.84 - 3.7 - V
74HC_HCT541_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 8 of 17
NXP Semiconductors 74HC541-Q100; 74HCT541-Q100
Octal buffer/line driver; 3-state
10. Dynamic characteristics
VOL LOW-level
output voltage VI=V
IH or VIL; VCC = 4.5 V
IO = 20 A; - 0 0.1 - 0.1 - 0.1 V
IO = 6.0 mA; - 0.16 0.26 - 0.33 - 0.4 V
IIinput leakage
current VI = VCC or GND; VCC =5.5V - - 0.1 - 1.0 - 1.0 A
IOZ OFF-state
output current per input pin; VI=V
IH or VIL;
VO=V
CC or GND;
other inputs at VCC or GND;
VCC =5.5V; I
O=0A
--0.5 - 5.0 - 10 A
ICC supply current VI=V
CC or GND; IO = 0 A;
VCC =5.5V - - 8.0 - 80 - 160 A
ICC additional
supply current per input pin; IO=0A; V
I=V
CC 2.1 V; other inputs at VCC or GND; VCC = 4.5 V to 5.5 V
An input - 70 252 - 315 - 343 A
OE1 input - 150 540 - 675 - 735 A
OE2 input - 100 360 - 450 - 490 A
CIinput
capacitance -3.5- - - - - pF
Table 6. Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Tamb = 25 C Tamb = 40 C
to +85 CTamb = 40 C
to +125 CUnit
Min Typ Max Min Max Min Max
Table 7. Dynam ic characteristics
GND = 0 V; CL= 50 pF; for test circuit, see Figure 8.
Symbol Parameter Conditions Tamb = 25 C Tamb = 40 C to +125 CUnit
Min Typ Max Max (85 C) Max (125 C)
74HC541-Q100
tpd propagation delay An to Yn; see Figure 6 [1]
VCC = 2.0 V - 33 115 145 175 ns
VCC = 4.5 V - 12 23 29 35 ns
VCC = 5.0 V; CL=15pF - 10 - - - ns
VCC = 6.0 V - 10 20 25 30 ns
ten enable time OEn to Yn; see Figure 7 [1]
VCC = 2.0 V - 55 160 200 240 ns
VCC = 4.5 V - 20 32 40 48 ns
VCC = 6.0 V - 16 27 34 41 ns
tdis disable time OEn to Yn; see Figure 7 [1]
VCC = 2.0 V - 61 160 200 240 ns
VCC = 4.5 V - 22 32 40 48 ns
VCC = 6.0 V - 18 27 34 41 ns
74HC_HCT541_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 9 of 17
NXP Semiconductors 74HC541-Q100; 74HCT541-Q100
Octal buffer/line driver; 3-state
[1] tpd is the same as tPLH and tPHL.
ten is the same as tPZL and tPZH.
tdis is the same as tPLZ and tPHZ.
[2] tt is the same as tTHL and tTLH.
[3] CPD is used to determine the dynamic power dissipation (PD in W):
PD=C
PD VCC2fiN+ (CLVCC2fo) where:
fi= input frequency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CLVCC2fo) = sum of outputs.
tttransition time see Figure 6 [2]
VCC = 2.0 V - 14 60 75 90 ns
VCC = 4.5 V - 5 12 15 18 ns
VCC = 6.0 V - 4 10 13 15 ns
CPD power dissipation
capacitance per package;
VI=GNDtoV
CC
[3] -37- - - pF
74HCT541-Q100
tpd propagation delay An to Yn; see Figure 6 [1]
VCC = 4.5 V - 15 28 35 42 ns
VCC = 5.0 V; CL=15pF - 12 - - - ns
ten enable time OEn to Yn; see Figure 7 [1]
VCC = 4.5 V - 21 35 44 53 ns
tdis disable time OEn to Yn; see Figure 7 [1]
VCC = 4.5 V - 21 35 44 53 ns
tttransition time V CC = 4.5 V; see Figure 6 [2] - 5 12 15 18 ns
CPD power dissipation
capacitance per package;
VI=GNDtoV
CC 1.5 V [3] -39- - - pF
Table 7. Dynam ic characteristics
GND = 0 V; CL= 50 pF; for test circuit, see Figure 8.
Symbol Parameter Conditions Tamb = 25 C Tamb = 40 C to +125 CUnit
Min Typ Max Max (85 C) Max (125 C)
74HC_HCT541_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 10 of 17
NXP Semiconductors 74HC541-Q100; 74HCT541-Q100
Octal buffer/line driver; 3-state
11. Waveforms
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 6. Input to output propagation delays
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Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 7. 3-state enable and disa ble times
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Table 8. Measurement points
Type Input Output
VMVMVXVY
74HC541-Q100 0.5VCC 0.5VCC 0.1VCC 0.9VCC
74HCT541-Q100 1.3 V 1.3 V 0.1VCC 0.9VCC
74HC_HCT541_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 11 of 17
NXP Semiconductors 74HC541-Q100; 74HCT541-Q100
Octal buffer/line driver; 3-state
Test data is given in Table 9.
Definitions test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator
CL = Load capacitance including jig and probe capacitance
RL = Load resistance
S1 = Test selection switch
Fig 8. Test circuit for measuring switching times
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Table 9. Test data
Type Input Load S1 position
VItr, tfCLRLtPHL, tPLH tPZH, tPHZ tPZL, tPLZ
74HC541-Q100 VCC 6ns 15pF, 50 pF 1kopen GND VCC
74HCT541-Q100 3 V 6 ns 15 pF, 50 pF 1 kopen GND VCC
74HC_HCT541_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 12 of 17
NXP Semiconductors 74HC541-Q100; 74HCT541-Q100
Octal buffer/line driver; 3-state
12. Package outline
Fig 9. Package outline SOT163-1 (SO20)
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74HC_HCT541_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 13 of 17
NXP Semiconductors 74HC541-Q100; 74HCT541-Q100
Octal buffer/line driver; 3-state
Fig 10. Package outline SOT360-1 (TSSOP20)
UNIT A1A2A3bpcD
(1) E(2) (1)
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REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.15
0.05 0.95
0.80 0.30
0.19 0.2
0.1 6.6
6.4 4.5
4.3 0.65 6.6
6.2 0.4
0.3 0.5
0.2 8
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o
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0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT360-1 MO-153 99-12-27
03-02-19
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scale
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1
A
max.
1.1
74HC_HCT541_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 14 of 17
NXP Semiconductors 74HC541-Q100; 74HCT541-Q100
Octal buffer/line driver; 3-state
13. Abbreviations
14. Revision history
Table 10. Abbreviations
Acronym Description
CMOS Complementary Metal-Oxide Semiconductor
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
LSTTL Low-power Schottky Transistor-Transistor Logic
MIL Military
MM Machine Model
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
74HC_HCT541_Q10 0 v.1 20140619 Product data sheet - -
74HC_HCT541_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 15 of 17
NXP Semiconductors 74HC541-Q100; 74HCT541-Q100
Octal buffer/line driver; 3-state
15. Legal information
15.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificat io n — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
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Limited warr a nty and liability — Information in this document is believed to
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Notwithstanding any damages that customer might incur for any reason
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limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
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Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
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Applications — Applications that are described herein for any of these
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representation or warranty tha t such application s will be suitable for the
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Customers are responsible for the design and ope ration of their applications
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design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly object s to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document cont ains the product specification.
74HC_HCT541_Q100 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 19 June 2014 16 of 17
NXP Semiconductors 74HC541-Q100; 74HCT541-Q100
Octal buffer/line driver; 3-state
No offer to sell or license — Nothing in this document may be interpret ed or
construed as an of fer to sell product s that is op en for accept ance or the grant ,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
15.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors 74HC541-Q100; 74HCT541-Q100
Octal buffer/line driver; 3-state
© NXP Semiconductors N.V. 2014. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 19 June 2014
Document identi fier: 74HC_HCT541_Q100
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
17. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1
4 Functional di agram . . . . . . . . . . . . . . . . . . . . . . 2
5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 5
5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
6 Functional de scription . . . . . . . . . . . . . . . . . . . 5
7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
8 Recommended operating conditions. . . . . . . . 6
9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
13 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 14
14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14
15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
15.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
16 Contact information. . . . . . . . . . . . . . . . . . . . . 16
17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
