Filter Type Feedthrough EMI Filter Datasheet SFAB (6-32 UNC Thread : 4.0mm Hexagonal Head) Circuit Configurations Available Electrical Details Electrical Configuration Capacitance Measurement Current Rating Insulation Resistance (IR) Temperature Rating Ferrite Inductance (Typical) C Filter @ 1000hr Point 10A 10G or 1000F -55oC to +125oC See relevant tables Mechanical Details Head A/F Nut A/F Washer Diameter 4mm (0.157") 4.75mm (0.187") 6.9mm (0.272") 0.3Nm (2.65lbf in) max. if using nut 0.15Nm (1.32lbf in) max. into tapped hole 3.7mm 0.1 (0.146" 0.004") 3.2mm (0.126") 0.6g (0.02oz) Silver plate on copper undercoat Mounting Torque 6-32 UNC Class 2A Thread Mounting Hole Diameter Max. Panel Thickness Weight (Typical) Finish C Configuration 100MHz 0.1MHz Hardware (Nuts & Washers etc.) 0.01MHz Typical Insertion Loss (db) DWV (dc) * SFABC5000100ZC 10pF -20% / +80% C0G 500# 750 SFABC5000150ZC 15pF -20% / +80% C0G 500# 750 7 SFABC5000220ZC 22pF -20% / +80% C0G 500# 750 10 SFABC5000330ZC 33pF -20% / +80% C0G 500# 750 * SFABC5000470ZC 47pF -20% / +80% C0G 500# 750 1 15 1GHz Rated Voltage (dc) 10MHz Dielectric 1MHz Capacitance 20% UOS Product Code 4 12 C0G 500# 750 2 18 * SFABC5000101MC 100pF C0G 500# 750 4 22 SFABC5000151MC 150pF C0G 500# 750 7 25 220pF C0G 500# 750 10 29 330pF C0G 500# 750 13 33 470pF X7R 500# 750 1 16 35 680pF X7R 500# 750 2 19 36 1.0nF X7R 500# 750 4 23 41 1.5nF X7R 500# 750 7 26 45 2.2nF X7R 500# 750 10 30 50 3.3nF X7R 500# 750 13 33 52 4.7nF X7R 500# 750 1 16 36 55 6.8nF X7R 500# 750 2 19 39 57 10nF X7R 500# 750 4 22 41 60 * SFABC5000153MX 15nF X7R 500# 750 7 25 44 62 * SFABC5000223MX 22nF X7R 500# 750 10 29 46 65 SFABC5000333MX 33nF X7R 500# 750 13 33 48 68 * SFABC2000473MX 47nF X7R 200 500 16 35 50 70 * SFABC5000221MC * SFABC5000471MX SFABC5000681MX * SFABC5000102MX SFABC5000152MX * SFABC5000222MX SFABC5000332MX 0 = No hardware supplied * SFABC5000331MC * SFABC5000472MX SFABC5000682MX * SFABC5000103MX Other options available - please contact factory 68pF 1 = supplied with standard nut and wavy washer * SFABC5000680MC 1 SFABC2000683MX 68nF X7R 200 500 2 19 39 54 70 * SFABC1000104MX 100nF X7R 100 250 4 22 41 57 70 * SFABC0500154MX 150nF X7R 50 125 7 25 45 60 70 # - Also rated for operation at 115Vac 400Hz. Self-heating will occur - evaluation in situ recommended * Recommended values Also available in C0G Syfer Technology Ltd. Old Stoke Road, Arminghall Norwich, Norfolk, NR14 8SQ United Kingdom Tel: +44 1603 723300 | Email sales@syfer.co.uk | www.syfer.com SFAB Issue 2 (P108893) Release Date 04/03/14 Page 1 of 4 L-C Configuration 0.1MHz 100MHz Typical Insertion Loss (db) 0.01MHz Ferrite Inductance (Typical) - 50nH Rated Voltage (dc) DWV (dc) * SFABL5000100ZC 10pF -20% / +80% C0G 500# 750 SFABL5000150ZC 15pF -20% / +80% C0G 500# 750 9 SFABL5000220ZC 22pF -20% / +80% C0G 500# 750 12 SFABL5000330ZC 33pF -20% / +80% C0G 500# 750 1 15 * SFABL5000470ZC 47pF -20% / +80% 1MHz 1GHz Dielectric Hardware 10MHz Capacitance 20% UOS Product Code 6 750 2 19 C0G 500# 750 4 20 * SFABL5000101MC 100pF C0G 500# 750 7 24 150pF C0G 500# 750 10 27 220pF C0G 500# 750 12 30 330pF C0G 500# 750 1 16 34 470pF X7R 500# 750 2 19 38 680pF X7R 500# 750 3 22 41 1.0nF X7R 500# 750 6 25 44 1.5nF X7R 500# 750 9 29 48 2.2nF X7R 500# 750 12 31 51 3.3nF X7R 500# 750 15 35 54 4.7nF X7R 500# 750 1 18 39 57 6.8nF X7R 500# 750 2 21 41 60 10nF X7R 500# 750 4 23 43 63 * SFABL5000153MX 15nF X7R 500# 750 7 27 46 66 * SFABL5000223MX 22nF X7R 500# 750 10 30 48 68 SFABL5000333MX 33nF X7R 500# 750 13 34 50 70 * SFABL2000473MX 47nF X7R 200 500 1 17 37 51 >70 SFABL2000683MX 68nF X7R 200 500 2 20 40 55 >70 * SFABL1000104MX 100nF X7R 100 250 4 22 44 60 >70 * SFABL0500154MX 150nF X7R 50 125 7 25 47 62 >70 SFABL5000151MC * SFABL5000221MC * SFABL5000471MX SFABL5000681MX * SFABL5000102MX SFABL5000152MX * SFABL5000222MX SFABL5000332MX * SFABL5000472MX SFABL5000682MX * SFABL5000103MX 0 = No hardware supplied * SFABL5000331MC Other options available - please contact factory 500# 68pF 1 = supplied with standard nut and wavy washer C0G * SFABL5000680MC # - Also rated for operation at 115Vac 400Hz. Self-heating will occur - evaluation in situ recommended * Recommended values Also available in C0G Ordering Information Type Case Style Thread Electrical configuration SF A B C Syfer Filter 4.0mm 6-32 UNC C = C Filter Hex Head L = L-C Filter Voltage (dc) Capacitance in picofarads (pF) 500 050 = 50V 100 = 100V 200 = 200V 500 = 500V Capacitance Tolerance Dielectric Hardware 0102 M X 0 First digit is 0. Second and third digits are significant figures of capacitance code. The fourth digit is the number of zeros following. M = 20% C = C0G/NP0 0 = Without Z = -20+80% X = X7R 1 = With Examples: 0101 = 100pF 0332 = 3300pF Note: The addition of a 4-digit numerical suffix code can be used to denote changes to the standard part. Options include for example: change of pin length / custom body dimensions or threads / alternative voltage rating / non-standard intermediate capacitance values / test requirements. Please refer specific requests to the factory. Syfer Technology Ltd. SFAB Issue 2 (P108893) Release Date 04/03/14 Page 2 of 4 Surface Mount and Panel Mount Solder-in filters Solder pad layouts are included with the detailed information for each part. Recommended soldering profile E01, E03, E07 SBSP ranges are compatible with all standard solder types including lead-free, maximum temperature 260C. For SBSG, SBSM and SFSS ranges, solder time should be minimised, and the temperature controlled to a maximum of 220C. For SFSR, SFST and SFSU ranges the maximum temperature is 250C. Cooling to ambient temperature should be allowed to occur naturally. Natural cooling allows a gradual relaxation of thermal mismatch stresses in the solder joints. Draughts should be avoided. Forced air cooling can induce thermal breakage, and cleaning with cold fluids immediately after a soldering process may result in cracked filters. Note: The use of FlexiCapTM terminations is strongly recommended to reduce the risk of mechanical cracking. Soldering to axial wire leads Soldering temperature The tip temperature of the iron should not exceed 300C. Dwell time Soldering of filters The soldering process should be controlled such that the filter does not experience any thermal shocks which may induce thermal cracks in the ceramic dielectric. The pre-heat temperature rise of the filter should be kept to around 2C per second. In practice successful temperature rises tend to be in the region of 1.5C to 4C per second dependent upon substrate and components. The introduction of a soak after pre-heat can be useful as it allows temperature uniformity to be established across the substrate thus preventing substrate warping. The magnitude or direction of any warping may change on cooling imposing damaging stresses upon the filter. Dwell time should be 3-5 seconds maximum to minimise the risk of cracking the capacitor due to thermal shock. Heat sink Where possible, a heat sink should be used between the solder joint and the body, especially if longer dwell times are required. Bending or cropping of wire leads Bending or cropping of the filter terminations should not be carried out within 4mm (0.157") of the epoxy encapsulation, the wire should be supported when cropping. Soldering irons should not be used for mounting surface mount filters as they can result in thermal shock damage to the chip capacitor. A more comprehensive application note covering installation of all Syfer products is available on the Syfer website. Syfer Technology Ltd. SFAB Issue 2 (P108893) Release Date 04/03/14 Page 3 of 4 Resin filled screw mounted EMI filters Grounding General To ensure the proper operation of the filters, the filter body should be adequately grounded to the panel to allow an effective path for the interference. The use of locking adhesives is not recommended, but if used should be applied after the filter has been fitted. The ceramic capacitor, which is the heart of the filter, can be damaged by thermal and mechanical shock, as well as by over-voltage. Care should be taken to minimise the risk of stress when mounting the filter to a panel and when soldering wire to the filter terminations. Mounting to chassis Mounting torque It is important to mount the filter to the bulkhead or panel using the recommended mounting torque, otherwise damage may be caused to the capacitor due to distortion of the case. When a threaded hole is to be utilised, the maximum mounting torque should be 50% of the specified figure which relates to unthreaded holes. For details of torque figures for each filter range, please see below. Torque (max.) Thread Minimum plate thickness Users should be aware that the majority of these filters have an undercut between the thread and the mounting flange of the body, equal to 1.5 x the pitch of the thread. Mounting into a panel thinner than this undercut length may result in problems with thread mating and filter position. It is recommended that a panel thicker than this undercut length be used wherever possible. Maximum plate thickness This is specified for each filter in order that the nut can be fully engaged even when using a washer. Soldering to axial wire leads With nut Into tapped hole - 0.15Nm (1.32lbf in) The tip temperature of the iron should not exceed 300C. 0.25Nm (2.21lbf in) 0.15Nm (1.32lbf in) Dwell time 0.3Nm (2.65lbf in) 0.15Nm (1.32lbf in) Dwell time should be 3-5 seconds maximum to minimise the risk of cracking the capacitor due to thermal shock. 0.35Nm (3.09lbf in) 0.18Nm (1.59lbf in) Heat sink M4 & 8-32 UNC 0.5Nm (4.42lbf in) 0.25Nm (2.21lbf in) M5, 12-32 UNEF & 2BA 0.6Nm (5.31lbf in) 0.3Nm (2.65lbf in) Where possible, a heat sink should be used between the solder joint and the body, especially if longer dwell times are required. M6 & 1/4-28 UNF 0.9Nm (7.97lbf in) - M2.5 & 4-40 UNC M3 6-32 UNC M3.5 Tools Hexagonal devices should be assembled using a suitable socket. Round bodied filters may be fitted to the panel in one of two ways (and should not be fitted using pliers or other similar tools which may damage them): Round bodies with slotted tops are designed to be screwed in using a simple purpose-designed tool. Round bodies without slotted tops are intended to be inserted into slotted holes and retained with a nut. Syfer Technology Ltd. Soldering temperature Bending or cropping of wire leads Bending or cropping of the filter terminations should not be carried out within 4mm (0.157") of the epoxy encapsulation, the wire should be supported when cropping. RoHS compliance All surface mount filters, resin sealed panel mount filters and power filters are fully RoHS compliant through material exemption, although care must be taken not to exceed the maximum soldering temperatures of surface mount parts. Standard hermetic sealed panel mount filters use SnPb solders as part of their assembly, and are intended for exempt applications such as aerospace or military. Substitution of the SnPb solder with Pb free solders is possible to create a RoHS compliant part - please contact factory for further details. SFAB Issue 2 (P108893) Release Date 04/03/14 Page 4 of 4 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Syfer: SFABC5000152MX1 SFABL0500473MX1 SFABC0500154MX1 SFABC1000104MX1 SFABC5000223MX1 SFABL0500154MX1 SFABL5000103MX1 SFABL5000472MX1 SFABL5000102MX1 SFABC5000102MX1 SFABL2000103MX1 SFABC2000103MX1