Description
This series of right angle mount ChipLEDs is
designed with the smallest footprint to achieve high
density of components on board. They have the
industry standard footprint of 1.6 mm x 1.0 mm and
a height of only 0.6 mm. This makes them very
suitable for cellular phone and mobile equipment
backlighting and indication application where space
is a constraint. They are available in a wide range of
color combination. In order to facilitate automated
pick and place operation, these ChipLEDs are
shipped in tape and reel, with 4000 units per reel.
These parts are compatible with IR soldering.
Features
•Small size right angle mount
•0603 industry standard footprint
•Operating temperature range of –30˚C to +85˚C
•Available in various colors
•Compatible with IR solder reflow
•Available in 8 mm tape on 7" diameter reel
•Reel sealed in zip locked moisture barrier bags
Applications
•LCD backlighting
•Keypad backlighting
•Pushbutton backlighting
•Symbol indicator
CAUTION: HSMM/N/Q/R-C120 LEDs are Class 1 ESD sensitive per MIL-STD-1686. Please observe
appropriate precautions during handling and processing. Refer to Avago Technologies Application
Note AN-1142 for additional details.
HSMA/C/L-C120
HSMD/G/S/H-C120
HSMM/N/Q/R-C120
Right Angle ChipLED
Data Sheet
2
Package Dimensions
Device Selection Guide
AS AlInGaP InGaN
Amber Red Orange Green Blue Package Description
HSMA-C120 HSMC-C120 HSML-C120 HSMM-C120 HSMN-C120 Untinted,
HSMQ-C120 HSMR-C120 Non Diffused
AlGaAs GaP
Red Green Orange HER Package Description
HSMH-C120 HSMG-C120 HSMD-C120 HSMS-C120 Untinted, Non Diffused
1.6 (0.063)
0.4 (0.016)
POLARITY
[3]
CATHODE MARK
(ANODE MARK FOR HSMH-C120)
1.0 (0.039)
3 – 0.3 (0.012)
1.2 (0.047)
0.3 (0.012)
LED DIE
CLEAR
EPOXY
PC BOARD
SOLDERING
TERMINAL
0.6 (0.024)
CATHODE LINE
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
3. POLARITY FOR HSMH-C120 WILL BE THE OPPOSITE OF WHAT IS SHOWN ON ABOVE DRAWING.
3
Absolute Maximum Ratings at TA = 25˚C
HSMA/C/L- HSMD/G/S- HSMH- HSMM/N- HSMQ/R-
Parameter C120 C120 C120 C120 C120 Units
DC Forward Current[1] [2] 25 20 25 20 20 mA
Power Dissipation 60 52 65 78 78 mW
Reverse Voltage (IR = 100 µA) 55555V
LED Junction Temperature 95 95 95 95 95 ˚C
Operating Temperature Range –30 to +85 ˚C
Storage Temperature Range –40 to +85 ˚C
Soldering Temperature See IR soldering profile (Figure 6)
Notes:
1. Derate linearly as shown in Figure 4.
2. Drive currents above 5 mA are recommended for best long term performance.
Electrical Characteristics at TA = 25˚C
Forward Reverse
Voltage Breakdown Capacitance C Thermal
VF (Volts) VR (Volts) (pF), VF = 0, Resistance
@ IF = 20 mA @ IR = 100 µAf = 1 MHz RθJ-PIN (˚C/W)
Part Number Typ. Max. Min. Typ. Typ.
HSMA-C120 1.9 2.4 5 11 400
HSMC-C120 1.9 2.4 5 15 400
HSML-C120 1.9 2.4 5 20 400
HSMD-C120 2.2 2.6 5 7 350
HSMG-C120 2.2 2.6 5 9 350
HSMS-C120 2.1 2.6 5 5 350
HSMH-C120 1.8 2.6 5 20 400
HSMM-C120 3.4 3.9 5 45 450
HSMN-C120 3.4 3.9 5 45 450
HSMQ-C120 3.4 3.9 5 100 450
HSMR-C120 3.4 3.9 5 100 450
Note:
1. VF tolerance: ± 0.1 V
4
Color Bin Limits[1]
Green Color Bins
Dom. Wavelength (nm)
Bin ID Min. Max.
A561.5 564.5
B564.5 567.5
C567.5 570.5
D570.5 573.5
E573.5 576.5
Tolerance: ± 0.5 nm
Light Intensity (Iv) Bin Limits[1]
Intensity (mcd)
Bin ID Min. Max.
A0.110.18
B0.180.29
C0.290.45
D0.450.72
E0.721.10
F1.101.80
G1.802.80
H2.804.50
J4.507.20
K7.2011.20
L11.20 18.00
M18.00 28.50
N28.50 45.00
P45.00 71.50
Q71.50 112.50
R112.50 180.00
S180.00 285.00
T285.00 450.00
U450.00 715.00
Tolerance: ± 15%
Optical Characteristics at TA = 25˚C
Luminous
Intensity Peak Dominant Luminous
Iv (mcd) Wavelength Wavelength Viewing Angle Efficacy
@ 20 mA[1] λpeak[2] (nm) λd[2] (nm) 2 θ1/2 Degrees[3] ηv (lm/w)
Part Number Min. Typ. Typ. Typ. Typ. Typ.
HSMA-C120 25 90 595 592 155 480
HSMC-C120 25 90 637 626 155 155
HSML-C120 25 90 609 605 155 370
HSMD-C120 2.5 8 605 604 155 380
HSMG-C120 4.0 15 570 572 155 595
HSMS-C120 2.5 10 630 626 155 145
HSMH-C120 4.0 15 660 639 155 70
HSMM-C120 40 120 523 525 155 490
HSMN-C120 10 30 468 470 155 80
HSMQ-C120 40 145 520 527 155 500
HSMR-C120 16 55 469 473 155 85
Notes:
1.The luminous intensity Iv is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical
axis of the lamp package.
2.The coordinate is derived from the CIE Chromatically Diagram and represents the perceived color of the device.
3.θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Yellow/Amber Color Bins
Dom. Wavelength (nm)
Bin ID Min. Max.
A582.0 584.5
B584.5 587.0
C587.0 589.5
D589.5 592.0
E592.0 594.5
F594.5 597.0
Tolerance: ± 0.5 nm
Blue Color Bins
Dom. Wavelength (nm)
Bin ID Min. Max.
A460.0 465.0
B465.0 470.0
C470.0 475.0
D475.0 480.0
Tolerance: ± 1 nm
InGaN Green Color Bins
Dom. Wavelength (nm)
Bin ID Min. Max.
A515.0 520.0
B520.0 525.0
C525.0 530.0
D530.0 535.0
Tolerance: ± 1 nm
5
Figure 1. Relative intensity vs. wavelength.
Figure 2. Forward current vs. forward voltage.
Color Bin Limits
Orange Color Bins
Dom. Wavelength (nm)
Bin ID Min. Max.
A597.0 600.0
B600.0 603.0
C603.0 606.0
D606.0 609.0
E609.0 612.0
F612.0 615.0
Tolerance: ± 1 nm
Notes:
1.Bin categories are established for
classification of products. Products may not
be available in all categories.
Please contact your Avago representative for
information on currently available bins.
100
50
0
500 550 600 650 700 750
RELATIVE INTENSITY – %
WAVELENGTH - nm
GaP GREEN
90
80
70
60
40
30
20
10
GaP ORANGE
HER
AlGaAs RED
100
50
0
400 450 550 600 650 700
RELATIVE INTENSITY – %
WAVELENGTH - nm
InGaN BLUE
90
80
70
60
40
30
20
10
AS ORANGE
500
InGaN GREEN
AS AMBER
AS RED
GaP ORANGE
100
10
1
0.1
1.5 1.6 2.0 2.3
V
F
– FORWARD VOLTAGE – V
I
F
– FORWARD CURRENT – mA
AS AllnGaP
1.7 1.8 1.9 2.1 2.2
AlGaAs
HER
GaP GREEN
100
10
1
0.1
1.5 2.0 4.0
V
F
– FORWARD VOLTAGE – V
I
F
– FORWARD CURRENT – mA
HSMM,
HSMN InGaN
2.5 3.0 3.5
HSMQ,
HSMR InGaN
6
Figure 4. Maximum forward current vs. ambient temperature.
Figure 3. Luminous intensity vs. forward current.
05 15 25
I
F
– FORWARD CURRENT – mA
0
0.4
1.0
1.2
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
20
AS AlInGaP
0.6
0.8
0.2
10
GaP
AlGaAs
05 15 25
I
F
– FORWARD CURRENT – mA
0
0.4
1.0
1.2
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
20
0.6
0.8
0.2
10
HSMQ,
HSMR InGaN
HSMM,
HSMN InGaN
AlInGaP
AlGaAs
GaP
0102030405060708090
T
A
– AMBIENT TEMPERATURE – °C
30
25
20
15
10
5
0
I
F MAX.
– MAXIMUM FORWARD CURRENT – mA
HSMQ,
HSMR InGaN
HSMM,
HSMN InGaN
0102030405060708090
T
A
– AMBIENT TEMPERATURE – °C
25
20
15
10
5
0
I
F MAX.
– MAXIMUM FORWARD CURRENT – mA
7
Figure 5. Relative intensity vs. angle.
Figure 6. Recommended reflow soldering profile. Figure 7. Recommended soldering pattern.
Note: All dimensions in millimeters (inches).
100
90
80
70
60
50
40
30
20
10
0
RELATIVE INTENSITY
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
100
90
80
70
60
50
40
30
20
10
0
RELATIVE INTENSITY
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
140-160°C
–3°C/SEC. MAX.
4°C/SEC. MAX.
0.7 (0.028)
0.8
(0.031) 0.8
(0.031)
1.2
(0.047)
0.4 (0.016)
0.15 (0.006)
0.4 (0.016)
CENTERING
BOARD
8
Figure 8. Reeling orientation.
Figure 9. Reel dimensions.
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
CATHODE SIDE
PRINTED LABEL
USER FEED DIRECTION
x
x
x
x
x
10.50 ± 1.0 (0.413 ± 0.039)
59.60 ± 1.00
(2.346 ± 0.039)
∅ 20.20 MIN.
(∅ 0.795 MIN.)
6
PS
;;
;;;
;;
;;
;;
;;
178.40 ± 1.00
(7.024 ± 0.039)
3.0 ± 0.5
(0.118 ± 0.020)
4.0 ± 0.5
(0.157 ± 0.020) 5.0 ± 0.5
(0.197 ± 0.020)
∅ 13.1 ± 0.5
(∅ 0.516 ± 0.020)
8.0 ± 1.0 (0.315 ± 0.039)
NOTE: ALL DIMENSIONS IN MILLIMETERS (INCHES).
9
Figure 10. Tape dimensions.
Figure 11. Tape leader.
;;;;;;
;;;;;;;
;;;;;;;
;
;;
;;
;;
;
8.0 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.5 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
DIM. B
(SEE TABLE 1)
4.0 (0.157)
4.0 (0.157) ∅1.50 (0.059)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (0.004) DIM. B
± 0.10 (0.004)PART NUMBER DIM. C
± 0.10 (0.004)
HSMx-C120 SERIES 1.90 (0.075) 1.15 (0.045) 0.75 (0.030)
COVER TAPE
R 0.5 ± 0.05
(0.020 ± 0.002)
2.00 ± 0.05
(0.079 ± 0.002)
END START
THERE SHALL BE A MINIMUM
OF 160 mm (6.3 INCHES) OF
EMPTY COMPONENT POCKETS
SEALED WITH COVER TAPE.
MOUNTED WITH
COMPONENTS. MINIMUM OF
230 mm (9.05 IN.)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
THERE SHALL BE A MINIMUM
OF 160 mm (6.3 INCHES) OF
EMPTY COMPONENT POCKETS
SEALED WITH COVER TAPE.
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.
Convective IR Reflow Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Surface
Mounting SMT LED Indicator
Components.
Storage Condition: 5 to 30˚C
@ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent
color
b) the pack has been opened for
more than 1 week
Baking recommended condition:
60 +/– 5˚C for 20 hours.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved.
5988-5401EN November 5, 2006
