QSE-042-01-L-D-DP-A F-208-1 (R) QSE-028-01-F-D-DP-A-RT1 QSE-014-01-F-D-DP-A 0,80 mm DIFFERENTIAL PAIR QSE-DP SERIES SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?QSE-DP Insulator Material: Liquid Crystal Polymer Contact Material: Phosphor Bronze Plating: Au over 50" (1,27m) Ni Current Rating: Contacts: 2A @ 80C Ground Plane: 9.5A @ 80C Operating Temp Range: -55C to +125C Voltage Rating: 225 VAC (5mm Stack Height) Max Cycles: 100 Unmating Force (-RT1 option): -RT1 option increases unmating force up to 50% RoHS Compliant: Yes Processing: Max Processing Temp: 230C for 60 seconds, or 260C for 20 seconds 3x Lead-Free Solderable: Yes SMT Lead Coplanarity: (0,10mm) .004" max (014-042) (0,15mm) .006" max (056) Board Stacking: For applications requiring more than two connectors per board or 56 pairs or higher, contact ipg@samtec.com Integral metal plane for power or ground (R) fina l i nch.com STACK HEIGHT (0,80mm) .0315" pitch HEIGHT WITH QTE-DP QTE-DP LEAD STYLE (5,00) .198 -01 Processing conditions will affect mated height. ALSO AVAILABLE 5mm Stack Height Rated @ -3dB Insertion Loss Differential Pair Signaling 8.5 GHz / 17 Gbps Performance data for other stack heights available at www.samtec.com?QSE-DP Board Spacing Standoffs. See SO Series. QSE NO. OF PAIRS 01 PLATING OPTION D DP A = 10" (0,25m) Gold on Signal Pins and Ground Plane, Matte Tin on tails (14 pairs per bank) -F = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails -C* = Electro-Polished Selective 50" (1,27m) min Au over 150" (3,81m) Ni on Signal Pins in contact area, 10" (0,25m) min Au over 50" (1,27m) Ni on Ground Plane in contact area, Matte Tin over 50" (1,27m) min Ni on all solder tails (No. of Pairs/14) x (20,00) .7875 + (1,27) .050 (20,00) .7875 02 (7,24) .285 (3,05) .120 (0,80) .0315 = (8,25mm) .325" DIA Polyimide film Pick & Place Pad -TR = Tape & Reel Packaging (-042 positions maximum) -RT1 = Retention Option (-042 positions maximum) (0,15) .006 (7,49) .295 01 OTHER OPTION -K -L -014, -028, -042, -056 APPLICATION SPECIFIC OPTION * 8mm, 11mm, 14mm, 15mm, 16mm, 19mm, 22mm, 25mm and 30mm stack height (Caution: Some automatic placement/ inspection machines may have component height restrictions. Please consult machinery specifications.) * 30" (0,76m) Gold (Specify -H plating for Data Rate cable mating applications.) * Guide Posts & Edge Mount * 70 Pairs * "Partitionable"-combine differential & single-ended banks in same connector Call Samtec. Blade & Beam Design Mates with: QTE-DP, EQDP (See Application Specific note) (2,40) .0945 (3,25) .128 *Note: -C Plating passes 10 year MFG testing (3,81) .150 -RT1 (0,76) .030 (0,89) .035 DIA -01 Note: Some lengths, styles and options are non-standard, non-returnable. WWW.SAMTEC.COM (3,76) .148 DIA