DISCRETE SEMICONDUCTORS DATA SHEET M3D071 BAT74 Schottky barrier double diode Product data sheet Supersedes data of 1996 Mar 19 2001 Sep 05 NXP Semiconductors Product data sheet Schottky barrier double diode BAT74 FEATURES PINNING * Low forward voltage PIN * Guard ring protected 1 * Small plastic SMD package. cathode (k1) 2 cathode (k2) 3 anode (a2) 4 anode (a1) APPLICATIONS DESCRIPTION * Ultra high-speed switching * Voltage clamping * Protection circuits handbook, halfpage 4 * Blocking diodes. 3 4 3 1 2 DESCRIPTION Planar Schottky barrier double diode. Two separate dies encapsulated in a SOT143B small plastic SMD package. 1 2 Top view MAM194 MARKING TYPE NUMBER Fig.1 MARKING CODE BAT74 Simplified outline (SOT143B), pin configuration and symbol. L41 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Per diode VR continuous reverse voltage - 30 V IF continuous forward current - 200 mA IFRM repetitive peak forward current tp 1 s; 0.5 - 300 mA IFSM non-repetitive peak forward current tp < 10 ms 600 mA Ptot total power dissipation Tamb 25 C; see Fig.2 - 230 mW Tstg storage temperature -65 +150 C Tj junction temperature - 125 C Tamb operating ambient temperature -65 +125 C - 30 V - 60 V - 110(1) mA - 200 mA Double diode operation VR continuous reverse voltage series connection IF continuous forward current IFRM repetitive peak forward current tp 1 s; 0.5 Note 1. If both diodes are in forward operation at the same moment, total device current is max. 110 mA. If one diode is in reverse operation and the other is in forward operation at the same moment, total device current is max. 200 mA. 2001 Sep 05 2 NXP Semiconductors Product data sheet Schottky barrier double diode BAT74 THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient CONDITIONS VALUE UNIT 500 K/W MAX. UNIT note 1 Note 1. Refer to SOT143B standard mounting conditions. ELECTRICAL CHARACTERISTICS Tamb = 25 C unless otherwise specified. SYMBOL PARAMETER CONDITIONS Per diode VF forward voltage see Fig.3 IF = 0.1 mA 240 mV IF = 1 mA; note 1 320 mV IF = 10 mA 400 mV IF = 30 mA 500 mV IF = 100 mA 800 mV IR reverse current VR = 25 V; note 2; see Fig.4 2 A trr reverse recovery time when switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA; see Fig.6 5 ns Cd diode capacitance f = 1 MHz; VR = 1 V; see Fig.5 10 pF Notes 1. Temperature coefficient of forward voltage -0.6%/K. 2. Pulsed test: tp = 300s; = 0.02. 2001 Sep 05 3 NXP Semiconductors Product data sheet Schottky barrier double diode BAT74 MSA894 300 MSA892 3 10halfpage handbook, IF (mA) P tot (mW) (1) (2) (3) 10 2 200 10 100 1 0 0 75 10 1 150 Tamb ( oC) (1) (2) (3) 0 0.4 0.8 VF (V) 1.2 (1) Tamb = 125 C. (2) Tamb = 85 C. (3) Tamb = 25 C. Fig.3 Forward current as a function of forward voltage; typical values. Fig.2 Power derating curve. MSA893 10 3 MSA891 15 handbook, halfpage IR (A) (1) Cd (pF) 10 2 10 (2) 10 5 1 (3) 0 10 1 0 10 20 VR (V) 30 0 10 (1) Tamb = 125 C. (2) Tamb = 85 C. (3) Tamb = 25 C. f = 1 MHz; Tamb = 25 C. Fig.4 Fig.5 Reverse current as a function of reverse voltage; typical values. 2001 Sep 05 4 20 VR (V) 30 Diode capacitance as a function of reverse voltage; typical values. NXP Semiconductors Product data sheet Schottky barrier double diode BAT74 handbook, halfpage I F dI F dt 10% t Qr 90% IR tf MRC129 - 1 Fig.6 Reverse recovery definitions. 2001 Sep 05 5 NXP Semiconductors Product data sheet Schottky barrier double diode BAT74 PACKAGE OUTLINE Plastic surface mounted package; 4 leads SOT143B D B E A X y HE v M A e bp w M B 4 3 Q A A1 c 1 2 Lp b1 e1 detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp b1 c D E e e1 HE Lp Q v w y mm 1.1 0.9 0.1 0.48 0.38 0.88 0.78 0.15 0.09 3.0 2.8 1.4 1.2 1.9 1.7 2.5 2.1 0.45 0.15 0.55 0.45 0.2 0.1 0.1 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 97-02-28 SOT143B 2001 Sep 05 EUROPEAN PROJECTION 6 NXP Semiconductors Product data sheet Schottky barrier double diode BAT74 DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. General Information in this document is believed to be accurate and reliable. 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Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions 2001 Sep 05 7 NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were made to the content, except for the legal definitions and disclaimers. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com (c) NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613514/02/pp8 Date of release: 2001 Sep 05 Document order number: 9397 750 08588