Rev.2.00 Sep 07, 2005 page 1 of 7
2SK1880(L), 2SK1880(S)
Silicon N Channel MOS FET REJ03G0983-0200
(Previous : AD E-208- 1 331)
Rev.2.00
Sep 07, 2005
Application
High speed power swit ching
Features
Low on-resistance
High speed switching
No secondary breakdown
Suitable for switching regulator
Outline
RENESAS Package code: PRSS0004ZD-A
(Package name: DPAK(L)-(1))
1. Gate
2. Drain
3. Source
4. Drain
RENESAS Package code: PRSS0004ZD-C
(Package name: DPAK(S))
D
G
S
123
4
123
4
2SK1880(L) , 2SK 188 0( S)
Rev.2.00 Sep 07, 2005 page 2 of 7
Absolute Maximum Ratings
(Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage VDSS 600 V
Gate to source voltage VGSS ±30 V
Drain current ID 1.5 A
Drain peak current ID(pulse)*1 3.0 A
Body to drain diode reverse drain current IDR 1.5 A
Channel dissipation Pch*2 20 W
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
Notes: 1. PW 10 µs, duty cycle 1 %
2. Value at Tc = 25°C
Electrical Characteristics
(Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions
Drain to source breakdown voltage V(BR)DSS 600 V ID = 10 mA, VGS = 0
Gate to source breakdown voltage V(BR)GSS ±30 — V IG = ±100 µA, VDS = 0
Gate to source leak current IGSS ±10 µA VGS = ±25 V, VDS = 0
Zero gate voltage drain current IDSS 100 µA VDS = 500 V, VGS = 0
Gate to source cutoff volta ge VGS(off) 2.0 — 3.0 V ID = 1 mA, VDS = 10 V
Static drain to source on state
resistance RDS(on) 6.5 8.0 I
D = 1 A, VGS = 10 V*3
Forward transfer admittance |yfs| 0.85 1.4 S ID = 1 A, VDS = 20 V*3
Input capacitan ce Ciss 250 pF
Output capacitance Coss 55 pF
Reverse transfer capacitance Crss 8 pF
VDS = 10 V, VGS = 0,
f = 1 MHz
Turn-on delay time td(on) 10 ns
Rise time tr25 ns
Turn-off delay time td(off) 35 ns
Fall time tf30 ns
ID = 1 A, VGS = 10 V,
RL = 30
Body to drain diode forward voltage VDF — 0.95 — V IF = 1.5 A, VGS = 0
Body to drain diode reverse
recovery time trr350 µs IF = 1.5 A, VGS = 0,
diF/dt = 100 A/µs
Note: 3. Pulse Test
2SK1880(L) , 2SK 188 0( S)
Rev.2.00 Sep 07, 2005 page 3 of 7
Main Characteristics
Case Temperature TC (°C)
Power vs. Temperature Derating
Channel Dissipation Pch (W)
Drain to Source Voltage VDS (V)
Drain Current ID (A)
Maximum Safe Operation Area
Drain to Source Voltage VDS (V)
Typical Output Characteristics
Drain Current ID (A)
Gate to Source Voltage VGS (V)
Drain Current ID (A)
Typical Transfer Characteristics
Gate to Source Voltage VGS (V)
Drain to Source Saturation Voltage VDS (on) (V)
Drain to Source Saturation Voltage
vs. Gate to Source Voltage
Drain Current ID (A)
Static Drain to Source on State Resistance
RDS (on) ()
Static Drain to Source on State
Resistance vs. Drain Current
30
20
10
50 100 150
0
1 ms
PW = 10 ms (1 shot)
100 s
µ
10 s
µ
Operation in this
area is limited
by R (on)
DS
0.1 0.3 1 3 10 300 1000
Ta = 25°C
DC Operation (Tc = 25°C)
10
3
1
0.3
0.1
0.03
0.01
2.0
1.6
1.2
0.8
0.4
GS
V = 3.5 V
10 V
5 V
4.5 V
4 V
10 20 30 40 50
Pulse Test
0
DS
V = 20 V
Pulse Test
2.0
1.6
1.2
0.8
0.4
2
Tc = 25°C
–25°C
75°C
46810
0
Pulse Test
04
20
16
12
8
4
I = 1.5 A
D
1 A
0.5 A
812 2016
V = 10 V
GS
0.1 0.2 0.5 1 2 5
100
0.05
50
20
10
5
2
1
Pulse Test
2SK1880(L) , 2SK 188 0( S)
Rev.2.00 Sep 07, 2005 page 4 of 7
Case Temperature T
C
(°C)
Static Drain to Source on State Resistance
R
DS (on)
()
Static Drain to Source on State
Resistance vs. Temperature
Drain Current I
D
(A)
Forward Transfer Admittance yfs (S)
Forward Transfer Admittance
vs. Drain Current
Reverse Recovery Time trr (ns)
Body to Drain Diode Reverse
Recovery Time
Reverse Drain Current I
DR
(A) Drain to Source Voltage V
DS
(V)
Capacitance C (pF)
Typical Capacitance vs.
Drain to Source Voltage
Gate Charge Qg (nc)
Drain to Source Voltage V
DS
(V)
Dynamic Input Characteristics
Gate to Source Voltage V
GS
(V)
Drain Current I
D
(A)
Switching Time t (ns)
Switching Characteristics
20
16
12
8
4
I = 1 A
D
–40
0.5 A
0 40 80 120 160
Tc = –25°C
75°C
5
2
1
0.5
0.2
0.1
0.05
25°C
Pulse Test
V = 20 V
DS
0.02 0.05 0.1 0.2 0.5 1 2
di/dt = 100 A/ s
V = 0
Ta = 25°C
Pulse Test
5000
0.1 0.2 0.5 1 2 5 10
GS
µ
2000
1000
500
200
100
50
1000
100
10
1
Ciss
Coss
Crss
V = 0
f = 1 MHz
GS
01020304050
1000
800
600
400
200
20
16
12
8
4
0
I = 1.5 A
D
V = 100 V
250 V
400 V
DD
048121620
V = 100 V
250 V
400 V
DD
V
GS
V
DS
500
200
100
50
20
10
5
0.1 0.2 0.5 1 2 5 10
V
GS
= 10 V, V
DD
= 30 V
PW = 2 µs, duty 1 %
tf
tr
td(off)
td(on)
2SK1880(L) , 2SK 188 0( S)
Rev.2.00 Sep 07, 2005 page 5 of 7
Source to Drain Voltage V
SD
(V)
Reverse Drain Current I
DR
(A)
Pulse Width PW (S)
Normalized Transient Thermal Impedance γ
S
(t)
Normalized Transient Thermal Impedance vs. Pulse Width
2.0
1.6
1.2
0.8
0.4
0.4 0.8 1.2 1.6 2.0
GS
Pulse Test
V = 10 V
0 V, –5 V
0
10 100 1 m 10 m 100 m 10
0.01
0.03
0.1
0.3
1.0
3
µµ
D = 1
0.5
0.2
0.1
0.05
0.02
1 shot Pulse
Tc = 25°C
0.01
1
θch – c(t) = s(t) ch – c
ch – c = 6.25°C / W. Tc = 25°C
PD = PW
T
PW
T
DM
γ
θθ
Reverse Drain Current vs.
Source to Drain Voltage
2SK1880(L) , 2SK 188 0( S)
Rev.2.00 Sep 07, 2005 page 6 of 7
Package Dimensions
6.5 ± 0.5 2.3 ± 0.2
0.55 ± 0.1
1.2 ± 0.3
0.55 ± 0.1
5.5 ± 0.5 1.7 ± 0.5
16.2 ± 0.5
3.1 ± 0.5
5.4 ± 0.5
1.15 ± 0.1
2.29 ± 0.5 2.29 ± 0.5
0.8 ± 0.1
Package Name
PRSS0004ZD-A DPAK(L)-(1) / DPAK(L)-(1)V
MASS[Typ.]
0.42g
RENESAS CodeJEITA Package Code
Unit: mm
6.5 ± 0.5
5.4 ± 0.5
2.3 ± 0.2
0.55 ± 0.1
0 – 0.25
0.55 ± 0.1
1.5 ± 0.5
5.5 ± 0.5
2.5 ± 0.5
(1.2)
0.8 ± 0.1
2.29 ± 0.5
2.29 ± 0.5
1.2 Max
(5.1)
(5.1)
1.0 Max.
(0.1)(0.1)
Package Name
PRSS0004ZD-C DPAK(S) / DPAK(S)V
MASS[Typ.]
0.28gSC-63
RENESAS CodeJEITA Package Code
Unit: mm
2SK1880(L) , 2SK 188 0( S)
Rev.2.00 Sep 07, 2005 page 7 of 7
Ordering Information
Part Name Quantity Shipping Container
2SK1880L-E 3200 pcs Box (Sack)
2SK1880STL-E 3000 pcs Taping
Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of
production before ordering the product.
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
http://www.renesas.com
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology (Shanghai) Co., Ltd.
Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China
Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> 2-796-3115, Fax: <82> 2-796-2145
Renesas Technology Malaysia Sdn. Bhd.
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
RENESAS SALES OFFICES
© 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .3.0