SN54LVC573A, SN74LVC573A OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS www.ti.com SCAS300R - JANUARY 1993 - REVISED SEPTEMBER 2005 FEATURES 1 20 2 19 3 18 4 5 17 16 6 7 15 14 8 9 13 12 10 11 VCC 1Q 2Q 3Q 4Q 5Q 6Q 7Q 8Q LE xxxxx 1D 2D 3D 4D 5D 6D 7D 8D 20 19 1Q 18 2Q 3 17 3Q 16 4Q 4 5 7 15 5Q 14 6Q 8 13 7Q 6 12 8Q 9 10 11 3D 4D 5D 6D 7D 1Q 1 2 SN54LVC573A . . . FK PACKAGE (TOP VIEW) 2D 1D OE VCC SN74LVC573A . . . RGY PACKAGE (TOP VIEW) 4 3 2 1 20 19 18 5 17 6 16 7 15 14 9 10 11 12 13 8 2Q 3Q 4Q 5Q 6Q 8D GND LE 8Q 7Q OE 1D 2D 3D 4D 5D 6D 7D 8D GND * VCC SN54LVC573A . . . J OR W PACKAGE SN74LVC573A . . . DB, DGV, DW, N, NS, OR PW PACKAGE (TOP VIEW) * LE * Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 - 2000-V Human-Body Model (A114-A) - 200-V Machine Model (A115-A) - 1000-V Charged-Device Model (C101) OE * * Operate From 1.65 V to 3.6 V Inputs Accept Voltages to 5.5 V Max tpd of 6.9 ns at 3.3 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25C Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25C Support Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With 3.3-V VCC) GND * * * * DESCRIPTION/ORDERING INFORMATION The SN54LVC573A octal transparent D-type latch is designed for 2.7-V to 3.6-V VCC operation, and the SN74LVC573A octal transparent D-type latch is designed for 1.65-V to 3.6-V VCC operation. These devices feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, input/output (I/O) ports, bidirectional bus drivers, and working registers. While the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the logic levels at the D inputs. A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without interface or pullup components. OE does not affect the internal operations of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1993-2005, Texas Instruments Incorporated On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. SN54LVC573A, SN74LVC573A OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS www.ti.com SCAS300R - JANUARY 1993 - REVISED SEPTEMBER 2005 DESCRIPTION/ORDERING INFORMATION (CONTINUED) To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translators in a mixed 3.3-V/5-V system environment. ORDERING INFORMATION PACKAGE (1) TA Tube of 20 SN74LVC573AN SN74LVC573AN QFN - RGY Reel of 1000 SN74LVC573ARGYR LC573A Tube of 25 SN74LVC573ADW Reel of 2000 SN74LVC573ADWR SOP - NS Reel of 2000 SN74LVC573ANSR LVC573A SSOP - DB Reel of 2000 SN74LVC573ADBR LC573A Tube of 70 SN74LVC573APW Reel of 2000 SN74LVC573APWR Reel of 250 SN74LVC573APWT Reel of 2000 SN74LVC573ADGVR TSSOP - PW TVSOP - DGV VFBGA - GQN (1) LVC573A LC573A LC573A SN74LVC573AGQNR Reel of 1000 VFBGA - ZQN (Pb-free) -55C to 125C LC573A SN74LVC573AZQNR CDIP - J Tube of 20 SNJ54LVC573AJ SNJ54LVC573AJ CFP - W Tube of 85 SNJ54LVC573AW SNJ54LVC573AW LCCC - FK Tube of 55 SNJ54LVC573AFK SNJ54LVC573AFK Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. GQN OR ZQN PACKAGE (TOP VIEW) TERMINAL ASSIGNMENTS 1 2 3 4 A 1D OE VCC 1Q A B 3D 3Q 2D 2Q B C 5D 4D 5Q 4Q C D 7D 7Q 6D 6Q D E GND 8D LE 8Q 1 2 3 4 E FUNCTION TABLE (EACH LATCH) INPUTS 2 TOP-SIDE MARKING PDIP - N SOIC - DW -40C to 85C ORDERABLE PART NUMBER OE LE D OUTPUT Q L H H H L H L L L L X Q0 H X X Z SN54LVC573A, SN74LVC573A OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS www.ti.com SCAS300R - JANUARY 1993 - REVISED SEPTEMBER 2005 LOGIC DIAGRAM (POSITIVE LOGIC) OE LE 1 11 C1 1D 2 19 1D 1Q To Seven Other Channels Pin numbers shown are for the DB, DGV, DW, FK, J, N, NS, PW, RGY, and W packages. Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage -0.5 6.5 V VI Input voltage range (2) -0.5 6.5 V VO Voltage range applied to any output in the high-impedance or power-off state (2) -0.5 6.5 V -0.5 VCC + 0.5 state (2) (3) UNIT VO Voltage range applied to any output in the high or low IIK Input clamp current VI < 0 -50 mA IOK Output clamp current VO < 0 -50 mA IO Continuous output current 50 mA 100 mA Continuous current through VCC or GND JA Tstg (1) (2) (3) (4) (5) Package thermal impedance Storage temperature range DB package (4) 70 DGV package (4) 92 DW package (4) 58 GQN/ZQN package (4) 78 N package (4) 69 NS package (4) 60 PW package (4) 83 RGY package (5) 37 -65 150 V C/W C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. 3 SN54LVC573A, SN74LVC573A OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS www.ti.com SCAS300R - JANUARY 1993 - REVISED SEPTEMBER 2005 Recommended Operating Conditions (1) SN54LVC573A VCC Supply voltage VIH High-level input voltage Operating Data retention only MIN MAX MIN MAX 2 3.6 1.65 3.6 1.5 1.5 VCC = 2.3 V to 2.7 V 1.7 2 Low-level input voltage Input voltage VO Output voltage 0.7 0.8 High-level output current 0 5.5 0 5.5 High or low state 0 VCC 0 VCC 3-state 0 5.5 0 5.5 Low-level output current t/v Input transition rise or fall rate TA Operating free-air temperature (1) 4 V V -4 VCC = 2.3 V -8 VCC = 2.7 V -12 -12 VCC = 3 V -24 -24 VCC = 1.65 V IOL V 0.8 VCC = 1.65 V IOH V 0.35 x VCC VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VI V 2 VCC = 1.65 V to 1.95 V VIL UNIT 0.65 x VCC VCC = 1.65 V to 1.95 V VCC = 2.7 V to 3.6 V SN74LVC573A mA 4 VCC = 2.3 V 8 VCC = 2.7 V 12 12 VCC = 3 V 24 24 6 -55 125 -40 mA 6 ns/V 85 C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. SN54LVC573A, SN74LVC573A OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS www.ti.com SCAS300R - JANUARY 1993 - REVISED SEPTEMBER 2005 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS 2.7 V to 3.6 V 1.2 2.3 V 1.7 2.2 2.2 3V 2.4 2.4 3V 2.2 2.2 0.2 2.7 V to 3.6 V 0.2 IOL = 4 mA 1.65 V 0.45 IOL = 8 mA 2.3 V 0.7 IOL = 12 mA 2.7 V 0.4 0.4 IOL = 24 mA 3V 0.55 0.55 5 5 A 3.6 V Ioff VI or VO = 5.5 V 0 IOZ VO = 0 to 5.5 V 3.6 V ICC (1) (2) 2.7 V V 1.65 V to 3.6 V VI = 0 to 5.5 V ICC UNIT VCC - 0.2 IOH = -8 mA IOL = 100 A MAX VCC - 0.2 1.65 V IOH = -24 mA II SN74LVC573A MIN TYP (1) MAX IOH = -4 mA IOH = -12 mA VOL SN54LVC573A MIN TYP (1) 1.65 V to 3.6 V IOH = -100 A VOH VCC VI = VCC or GND 3.6 V VI 5.5 V (2) IO = 0 One input at VCC - 0.6 V, Other inputs at VCC or GND 3.6 V 2.7 V to 3.6 V V 10 A 15 10 A 10 10 10 10 500 500 A A Ci VI = VCC or GND 3.3 V 4 4 pF Co VO = VCC or GND 3.3 V 5.5 5.5 pF All typical values are at VCC = 3.3 V, TA = 25C. This applies in the disabled state only. Timing Requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) SN54LVC573A VCC = 2.7 V MIN tw Pulse duration, LE high tsu Setup time, data before LE th Hold time, data after LE 3.3 MAX VCC = 3.3 V 0.3 V MIN UNIT MAX 3.3 ns 2 2 ns 2.5 2.5 ns 5 SN54LVC573A, SN74LVC573A OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS www.ti.com SCAS300R - JANUARY 1993 - REVISED SEPTEMBER 2005 Timing Requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) SN74LVC573A VCC = 1.8 V 0.15 V MIN MAX VCC = 2.5 V 0.2 V MIN VCC = 3.3 V 0.3 V VCC = 2.7 V MAX MIN MAX MIN UNIT MAX tw Pulse duration, LE high 9 4 3.3 3.3 ns tsu Setup time, data before LE 6 4 2 2 ns th Hold time, data after LE 4 2 1.5 1.5 ns VCC = 3.3 V 0.3 V UNIT Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) SN54LVC573A FROM (INPUT) PARAMETER TO (OUTPUT) VCC = 2.7 V MIN D tpd MAX MIN MAX 7.7 1 6.9 8.4 1 7.7 Q LE ns ten OE Q 8.5 1 7.5 ns tdis OE Q 7 0.5 6.7 ns Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) SN74LVC573A PARAMETER tpd FROM (INPUT) D LE TO (OUTPUT) Q VCC = 1.8 V 0.15 V VCC = 2.5 V 0.2 V VCC = 3.3 V 0.3 V VCC = 2.7 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX 1 19.1 1 9.6 1 7.7 1.5 6.9 1 22.8 1 10.5 1 8.4 2 7.7 ns ten OE Q 1 20 1 10.5 1 8.5 1.5 7.5 ns tdis OE Q 1 19.3 1 7.8 1 7 1.6 6.5 ns 1 ns tsk(o) Operating Characteristics TA = 25C PARAMETER Cpd 6 Power dissipation capacitance Outputs enabled per latch Outputs disabled TEST CONDITIONS f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V TYP TYP TYP 61 56 37 3 3 4 UNIT pF SN54LVC573A, SN74LVC573A OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS www.ti.com SCAS300R - JANUARY 1993 - REVISED SEPTEMBER 2005 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test CL (see Note A) Open GND RL TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUTS VCC 1.8 V 0.15 V 2.5 V 0.2 V 2.7 V 3.3 V 0.3 V VI tr/tf VCC VCC 2.7 V 2.7 V 2 ns 2 ns 2.5 ns 2.5 ns VM VLOAD CL RL V VCC/2 VCC/2 1.5 V 1.5 V 2 x VCC 2 x VCC 6V 6V 30 pF 30 pF 50 pF 50 pF 1 k 500 500 500 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tw tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPLH VM VM VOL tPHL VM VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPLH tPLZ VLOAD/2 VM tPZH VOH Output VM tPZL tPHL VOH Output VI Output Control VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at GND (see Note B) VOL + V VOL tPHZ VM VOH - V VOH 0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 . D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 7 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Top-Side Markings (3) (4) 5962-9757501Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI -55 to 125 59629757501Q2A SNJ54LVC 573AFK 5962-9757501QRA ACTIVE CDIP J 20 1 TBD Call TI Call TI -55 to 125 5962-9757501QR A SNJ54LVC573AJ 5962-9757501QSA ACTIVE CFP W 20 1 TBD Call TI Call TI -55 to 125 5962-9757501QS A SNJ54LVC573AW SN74LVC573ADBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI -40 to 85 SN74LVC573ADBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LC573A SN74LVC573ADBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LC573A SN74LVC573ADBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LC573A SN74LVC573ADGVR ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LC573A SN74LVC573ADGVRE4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LC573A SN74LVC573ADGVRG4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LC573A SN74LVC573ADW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LVC573A SN74LVC573ADWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LVC573A SN74LVC573ADWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LVC573A SN74LVC573ADWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LVC573A SN74LVC573AGQNR OBSOLETE BGA MICROSTAR JUNIOR GQN 20 TBD Call TI Call TI -40 to 85 LC573A Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 11-Apr-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Top-Side Markings (3) (4) SN74LVC573AN ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74LVC573AN SN74LVC573ANE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74LVC573AN SN74LVC573ANSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LVC573A SN74LVC573ANSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LVC573A SN74LVC573ANSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LVC573A SN74LVC573APW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LC573A SN74LVC573APWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LC573A SN74LVC573APWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LC573A SN74LVC573APWLE OBSOLETE TSSOP PW 20 TBD Call TI Call TI -40 to 85 SN74LVC573APWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LC573A SN74LVC573APWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LC573A SN74LVC573APWRG3 PREVIEW TSSOP PW 20 2000 TBD Call TI Call TI -40 to 85 SN74LVC573APWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LC573A SN74LVC573APWT ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LC573A SN74LVC573APWTE4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LC573A SN74LVC573APWTG4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LC573A SN74LVC573ARGYR ACTIVE VQFN RGY 20 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 LC573A SN74LVC573ARGYRG4 ACTIVE VQFN RGY 20 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 LC573A Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 11-Apr-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Top-Side Markings (3) (4) SN74LVC573AZQNR ACTIVE BGA MICROSTAR JUNIOR ZQN 20 1000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 LC573A SNJ54LVC573AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 59629757501Q2A SNJ54LVC 573AFK SNJ54LVC573AJ ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9757501QR A SNJ54LVC573AJ SNJ54LVC573AW ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-9757501QS A SNJ54LVC573AW (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54LVC573A, SN74LVC573A : * Catalog: SN74LVC573A * Automotive: SN74LVC573A-Q1, SN74LVC573A-Q1 * Enhanced Product: SN74LVC573A-EP, SN74LVC573A-EP * Military: SN54LVC573A NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects * Enhanced Product - Supports Defense, Aerospace and Medical Applications * Military - QML certified for Military and Defense Applications Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 8-Jul-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 7.5 2.5 12.0 16.0 Q1 SN74LVC573ADBR SSOP DB 20 2000 330.0 16.4 SN74LVC573ADGVR TVSOP DGV 20 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74LVC573ADWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 SN74LVC573ANSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 SN74LVC573APWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 SN74LVC573APWT TSSOP PW 20 250 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 SN74LVC573ARGYR VQFN RGY 20 3000 330.0 12.4 3.8 4.8 1.6 8.0 12.0 Q1 ZQN 20 1000 330.0 12.4 3.3 4.3 1.6 8.0 12.0 Q1 SN74LVC573AZQNR BGA MI CROSTA R JUNI OR Pack Materials-Page 1 8.2 B0 (mm) PACKAGE MATERIALS INFORMATION www.ti.com 8-Jul-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LVC573ADBR SSOP DB 20 2000 367.0 367.0 38.0 SN74LVC573ADGVR TVSOP DGV 20 2000 367.0 367.0 35.0 SN74LVC573ADWR SOIC DW 20 2000 367.0 367.0 45.0 SN74LVC573ANSR SO NS 20 2000 367.0 367.0 45.0 SN74LVC573APWR TSSOP PW 20 2000 364.0 364.0 27.0 SN74LVC573APWT TSSOP PW 20 250 367.0 367.0 38.0 SN74LVC573ARGYR VQFN RGY 20 3000 367.0 367.0 35.0 SN74LVC573AZQNR BGA MICROSTAR JUNIOR ZQN 20 1000 338.1 338.1 20.6 Pack Materials-Page 2 MECHANICAL DATA MPDS006C - FEBRUARY 1996 - REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0-8 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins - MO-153 14/16/20/56 Pins - MO-194 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2013, Texas Instruments Incorporated