LMV7271/LMV7275/LMV7272 Single & Dual, 1.8V Low Power Comparators with Rail-to-Rail Input General Description Features The LMV727X are rail-to-rail input low power comparators, which are characterized at supply voltage 1.8V, 2.7V and 5.0V. They consume only 9uA supply current per channel while achieving a 800ns propagation delay. The LMV7271/LMV7275 (single) are available in SC70 and SOT23 packages. The LMV7272 (dual) is available in micro SMD package. With these tiny packages, the PC board area can be significantly reduced. They are ideal for low voltage, low power and space critical designs. The LMV7271/LMV7272 both feature a push-pull output stage which allows operation with minimum power consumption when driving a load. The LMV7275 features an open drain output stage that allows for wired-OR configurations. The open drain output also offers the advantage of allowing the output to be pulled to any voltage up to 5.5V, regardless of the supply voltage of the LMV7275. The LMV727X are built with National Semiconductor's advance submicron silicon-gate BiCMOS process. They all have bipolar inputs for improved noise performance and CMOS outputs for rail-to-rail output swing. (VS = 1.8V, TA = 25C, Typical values unless specified). Single or Dual Supplies 9A per channel Ultra low supply current 10nA Low input bias current 200pA Low input offset current 4mV Low guaranteed VOS 880ns (20mV overdrive) Propagation delay 0.1V beyond rails Input common mode voltage range LMV7272 is available in micro SMD package Applications Mobile communications Laptops and PDA's Battery powered electronics General purpose low voltage applications Typical Circuit 20064024 FIGURE 1. Threshold Detector Part Number Single/Dual Package Output LMV7271 Single SC70, SOT23 Push/Pull LMV7272 Dual micro SMD Push/Pull LMV7275 Single SC70, SOT23 Open Drain PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. 200640 SNOSA56G Copyright (c) 1999-2012, Texas Instruments Incorporated LMV7271/LMV7275/LMV7272 Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. ESD Tolerance VIN Differential Supply Voltage (V+ - V-) Voltage at Input/Output pins Soldering Information Infrared or Convection (20 sec.) Wave Soldering (10 sec.) Storage Temperature Range Junction Temperature (Note 4) Operating Ratings 2KV (Note 2) 200V (Note 6) Supply Voltage 6V V+ +0.1V, V- -0.1V 235C 260C -65C to +150C +150C (Note 1) Supply Voltage Range Temperature Range (Note 3) Package Thermal Resistance (Note 3) SOT23-5 SC-70 8-Bump Thin micro SMD 1.8V to 5.5V -40C to +85C 325C/W 265C/W 220C/W 1.8V Electrical Characteristics Unless otherwise specified, all limits guaranteed for TJ = 25C, V+ = 1.8V, V- = 0V. Boldface limits apply at the temperature extremes. Symbol Parameter Condition Min (Note 5) Max (Note 5) Units 0.3 4 6 mV VOS Input Offset Voltage TC VOS Input Offset Temperature Drift 20 uV/C IB Input Bias Current 10 nA IOS Input Offset Current 200 VCM = 0.9V (Note 7) LMV7271/LMV7275 IS Supply Current LMV7272 ISC Output Short Circuit Current Sourcing, VO = 0.9V (LMV7271/LMV7272 only) pA 9 12 14 A 18 25 28 A 3.5 6 4 6 IO = 0.5mA 1.7 1.74 IO = 1.5mA 1.47 1.63 Sinking, VO = 0.9V 2 Typ (Note 4) mA VOH Output Voltage High (LMV7271/LMV7272 only) VOL Output Voltage Low VCM Input Common Mode Voltage Range CMRR > 45 dB CMRR Common Mode Rejection Ratio 0 < VCM < 1.8V 46 78 dB PSRR Power Supply Rejection Ratio V+ = 1.8V to 5V 55 80 dB ILEAKAGE Output Leakage Current VO = 1.8V (LMV7275 only) 2 pA V IO = -0.5mA 52 100 IO = -1.5mA 166 220 1.9 -0.1 mV V V Copyright (c) 1999-2012, Texas Instruments Incorporated LMV7271/LMV7275/LMV7272 1.8V AC Electrical Characteristics Unless otherwise specified, all limits guaranteed for TJ = 25C, V+ = 1.8V, V- = 0V, VCM = 0.5V, VO = V+/2 and RL > 1M to V-. Boldface limits apply at the temperature extremes. Symbol tPHL tPLH Parameter Propagation Delay (High to Low) Propagation Delay (Low to High) Condition Min (Note 6) Typ (Note 5) Max (Note 6) Units Input Overdrive = 20mV Load = 50pF//5k 880 ns Input Overdrive = 50mV Load = 50pF//5k 570 ns Input Overdrive = 20mV Load = 50pF//5k 1100 ns Input Overdrive = 50mV Load = 50pF//5k 800 ns 2.7V Electrical Characteristics Unless otherwise specified, all limits guaranteed for TJ = 25C, V+ = 2.7V, V- = 0V. Boldface limits apply at the temperature extremes. Symbol Parameter Conditions Min (Note 6) Typ (Note 5) Max (Note 6) Units 0.3 4 6 mV VOS Input Offset Voltage TC VOS Input Offset Temperature Drift 20 V/C IB Input Bias Current 10 nA IOS Input offset Current 200 VCM = 1.35V (Note 7) LMV7271/LMV7275 IS Supply Current LMV7272 ISC Output Short Circuit Current pA 9 13 15 18 25 28 Sourcing, VO = 1.35V (LMV7271/LMV7272 only) 10 15 Sinking, VO = 1.35V 10 15 IO = 0.5mA 2.63 2.66 IO = 2.0mA 2.48 2.55 A A mA VOH Output Voltage High (LMV7271/LMV7272 only) VOL Output Voltage Low VCM Input Common Voltage Range CMRR > 45dB CMRR Common Mode Rejection Ratio 0 < VCM < 2.7V 46 78 dB PSRR Power Supply Rejection Ratio V+ = 1.8V to 5V 55 80 dB ILEAKAGE Output Leakage Current VO = 2.7V (LMV7275 only) 2 pA Copyright (c) 1999-2012, Texas Instruments Incorporated V IO = -0.5mA 50 70 IO = -2mA 155 220 2.8 -0.1 mV V V 3 LMV7271/LMV7275/LMV7272 2.7V AC Electrical Characteristics Unless otherwise specified, all limits guaranteed for TJ = 25C, V+ = 2.7V, V- = 0V, VCM = 0.5V, VO = V+/2 and RL > 1M to V-. Boldface limits apply at the temperature extremes. Symbol tPHL tPLH Parameter Propagation Delay (High to Low) Propagation Delay (Low to High) Condition Min (Note 6) Typ (Note 5) Max (Note 6) Units Input Overdrive = 20mV Load = 50pF//5k 1200 ns Input Overdrive = 50mV Load = 50pF//5k 810 ns Input Overdrive = 20mV Load = 50pF//5k 1300 ns Input Overdrive = 50mV Load = 50pF//5k 860 ns 5.0V Electrical Characteristics Unless otherwise specified, all limits guaranteed for TJ = 25C, V+ = 5V, V- = 0V. Boldface limits apply at the temperature extremes. Symbol Parameter VOS Input Offset Voltage TC VOS Input Offset Temperature Drift IB IOS Conditions Min (Note 6) VCM = 2.5V (Note 7) 0.3 4 6 mV Input Bias Current 10 nA Input Offset Current 200 pA Supply Current Output Short Circuit Current Sourcing, VO = 2.5V (LMV7271/LMV7272 only) Sinking, VO = 2.5V 18 10 14 16 A 20 27 30 A 34 18 34 IO = 0.5mA 4.93 4.96 IO = 4.0mA 4.675 4.77 mA VOH Output Voltage High (LMV7271/LMV7272 only) VOL Output Voltage Low VCM Input Common Voltage Range CMRR > 45dB CMRR Common Mode Rejection Ratio 0 < VCM < 5.0V 46 78 dB PRSS Power Supply Rejection Ratio V+ = 1.8V to 5V 55 80 dB Output Leakage Current VO = 5V (LMV7275 only) 2 pA ILEAKAGE 4 Units V/C LMV7272 ISC Max (Note 6) 20 LMV7271/LMV7275 IS Typ (Note 5) V IO = -0.5mA 27 70 IO = -4.0mA 225 315 5.1 -0.1 mV V Copyright (c) 1999-2012, Texas Instruments Incorporated LMV7271/LMV7275/LMV7272 5.0V AC Electrical Characteristics Unless otherwise specified, all limits guaranteed for TJ = 25C, V+ = 5.0V, V- = 0V, VCM = 0.5V, VO = V+/2 and RL > 1M to V-. Boldface limits apply at the temperature extremes. Symbol tPHL tPLH Parameter Propagation Delay (High to Low) Propagation Delay (Low to High) Condition Min (Note 6) Typ (Note 5) Max (Note 6) Units Input Overdrive = 20mV Load = 50pF//5k 2100 ns Input Overdrive = 50mV Load = 50pF//5k 1380 ns Input Overdrive = 20mV Load = 50pF//5k 1800 ns Input Overdrive = 50mV Load = 50pF//5k 1100 ns Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics. Note 2: Human body model, 1.5k in series with 100pF. Note 3: The maximum power dissipation is a function of TJ(MAX), JA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/JA. All numbers apply for packages soldered directly into a PC board. Note 4: Typical values represent the most likely parametric norm. Note 5: All limits are guaranteed by testing or statistical analysis. Note 6: Machine Model, 0 in series with 200pF. Note 7: Offset Voltage average drift determined by dividing the change in VOS at temperature extremes into the total temperature change. Note 8: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically. Copyright (c) 1999-2012, Texas Instruments Incorporated 5 LMV7271/LMV7275/LMV7272 Connection Diagrams 5-Pin SOT23/SC70 (LMV7271/LMV7275) 8-Bump micro SMD (LMV7272) 20064023 Top View 20064041 Top View (bump side down) Ordering Information Package Part Number LMV7271MF/NOPB 5-Pin SOT23 LMV7271MFX/NOPB LMV7275MF/NOPB LMV7275MFX/NOPB LMV7271MG/NOPB 5-Pin SC70 LMV7271MGX/NOPB LMV7275MG/NOPB LMV7275MGX/NOPB 8-Bump micro SMD LMV7272TL/NOPB LMV7272TLX/NOPB Eco Plan (Note 9) Package Marking Green (RoHS & no Sb/Br) C25A Green (RoHS & no Sb/Br) C26A Green (RoHS & no Sb/Br) C34 Green (RoHS & no Sb/Br) C35 Green (RoHS & no Sb/Br) I 01 Transport Media NSC Drawing 1k Units Tape and Reel 3k Units Tape and Reel 1k Units Tape and Reel MF05A 3k Units Tape and Reel 1k Units Tape and Reel 3k Units Tape and Reel 1k Units Tape and Reel MAA05A 3k Units Tape and Reel 250 Units Tape and Reel 3k Units Tape and Reel TLA08AAA Note 9: Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http:// www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) leadbased die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). 6 Copyright (c) 1999-2012, Texas Instruments Incorporated LMV7271/LMV7275/LMV7272 Typical Performance Characteristics VOS vs. VCM (TA = 25C, Unless otherwise specified). VOS vs. VCM 20064028 VOS vs. VCM Short Circuit vs. Supply Voltage 20064030 Supply Current vs. Supply Voltage (LMV7271) 20064002 Copyright (c) 1999-2012, Texas Instruments Incorporated 20064029 20064001 Supply Current vs. Supply Voltage (LMV7272) 20064031 7 LMV7271/LMV7275/LMV7272 Supply Current vs. Supply Voltage (LMV7272) Output Positive Swing vs. VSUPPLY 20064032 Output Negative Swing vs. VSUPPLY 20064033 Output Positive Swing vs. ISOURCE 20064035 20064034 Output Negative Swing vs. ISINK Output Positive Swing vs. ISOURCE 20064036 8 20064037 Copyright (c) 1999-2012, Texas Instruments Incorporated LMV7271/LMV7275/LMV7272 Output Negative Swing vs. ISINK Output Negative Swing vs. ISINK 20064039 20064038 Output Positive Swing vs. ISOURCE Propagation Delay (tPLH) 20064014 20064040 Propagation Delay (tPHL) Propagation Delay (tPLH) 20064018 Copyright (c) 1999-2012, Texas Instruments Incorporated 20064015 9 LMV7271/LMV7275/LMV7272 Propagation Delay (tPHL) Propagation Delay (tPLH) 20064020 Propagation Delay (tPHL) 20064016 tPHL vs. Overdrive 20064022 20064050 tPLH vs. Overdrive 20064049 10 Copyright (c) 1999-2012, Texas Instruments Incorporated LMV7271/LMV7275/LMV7272 Application Notes BASIC COMPARATOR A comparator is often used to convert an analog signal to a digital signal. As shown in Figure 2, the comparator compares an input voltage (VIN) to a reference voltage (VREF). If VIN is less than VREF, the output (VO) is low. However, if VIN is greater than VREF, the output voltage (VO) is high. LMV7271 20064025 20064017 FIGURE 2. LMV7271 Basic Comparator RAIL-TO-RAIL INPUT STAGE The LMV727X has an input common mode voltage range (VCM) of -0.1V below the V- to 0.1V above V+. This is achieved by using paralleled PNP and NPN differential input pairs. When the VCM is near V+, the NPN pair is on and the PNP pair is off. When the VCM is near V-, the NPN pair is off and the PNP pair is on. The crossover point between the NPN and PNP input stages is around 950mV from V+. Since each input stage has its own offset voltage (VOS), the VOS of the comparator becomes a function of the VCM. See curves for VOS vs. VCM in Typical Performance Characteristics section. In application design, it is recommended to keep the VCM away from the crossover point to avoid problems. The wide input voltage range makes LMV727X ideal in power supply monitoring circuits, where the comparators are used to sense signals close to ground and power supplies. OUTPUT STAGE The LMV7271 and LMV7272 have a push-pull output stage. This output stage keeps the total system power consumption to the absolute minimum. The only current consumed is the low supply current and the current going directly into the load. When the output switches, both PMOS and NMOS at the output stage are on at the same time for a very short time. This allows current to flow directly between V+ and V- through output transistors. The result is a short spike of current (shoot-through current) drawn from the supply and glitches in the supply voltages. The glitches can spread to other parts of the board as noise. To prevent the glitches in supply lines, power supply bypass capacitors must be installed. See section for supply bypassing in the Application Notes for details. HYSTERESIS It is a standard procedure to use hysteresis (positive feedback) around a comparator, to prevent oscillation, and to avoid excessive noise on the output because the comparator is a good amplifier of its own noise. Inverting Comparator with Hysteresis The inverting comparator with hysteresis requires a three resistor network that is referenced to the supply voltage VCC of the comparator (Figure 3). When VIN at the inverting input is less than VA, the voltage at the non-inverting node of the comparator (VIN < VA), the output voltage is high (for simplicity assume VO switches as high as VCC). The three network resistors can be represented as R1||R3 in series with R2. The lower input trip voltage VA1 is defined as Copyright (c) 1999-2012, Texas Instruments Incorporated 11 LMV7271/LMV7275/LMV7272 When VIN is greater than VA (VIN > VA), the output voltage is low and very close to ground. In this case the three network resistors can be presented as R2//R3 in series with R1. The upper trip voltage VA2 is defined as The total hysteresis provided by the network is defined as VA = VA1 - VA2 A good typical value of VA would be in the range of 5 to 50mV. This is easily obtained by choosing R3 as 1000 to 100 times (R1||R2) for 5V operation, or as 300 to 30 times (R1||R2) for 1.8V operation. 20064042 FIGURE 3. Inverting Comparator with Hysteresis 12 Copyright (c) 1999-2012, Texas Instruments Incorporated LMV7271/LMV7275/LMV7272 Non-Inverting Comparator with Hysteresis A non-inverting comparator with hysteresis requires a two resistor network, and a voltage reference (VREF) at the inverting input (Figure 4). When VIN is low, the output is also low. For the output to switch from low to high, VIN must rise up to VIN1, where VIN1 is calculated by When VIN is high, the output is also high. To make the comparator switch back to its low state, VIN must equal VREF before VA will again equal VREF. VIN can be calculated by: The hysteresis of this circuit is the difference between VIN1 and VIN2. VIN = VCCR1/R2 20064044 20064043 FIGURE 4. Non-Inverting Comparator with Hysteresis CIRCUIT TECHNIQUES FOR AVOIDING OSCILLATIONS IN COMPARATOR APPLICATIONS Feedback to almost any pin of a comparator can result in oscillation. In addition, when the input signal is a slow voltage ramp or sine wave, the comparator may also burst into oscillation near the crossing point. To avoid oscillation or instability, PCB layout should be engineered thoughtfully. Several precautions are recommended: 1. Power supply bypassing is critical, and will improve stability and transient response. Resistance and inductance from power supply wires and board traces increase power supply line impedance. When supply current changes, the power supply line will move due to its impedance. Large enough supply line shift will cause the comparator to mis-operate. To avoid problems, a small bypass capacitor, such as 0.1uF ceramic, should be placed immediately adjacent to the supply pins. An additional 6.8F or greater tantalum capacitor should be placed at the point where the power supply for the comparator is introduced onto the board. These capacitors act as an energy reservoir and keep the supply impedance low. In dual supply application, a 0.1F capacitor is recommended to be placed across V+ and V- pins. 2. Keep all leads short to reduce stray capacitance and lead inductance. It will also minimize any unwanted coupling from any high-level signals (such as the output). The comparators can easily oscillate if the output lead is inadvertently allowed to capacitively couple to the inputs via stray capacitance. This shows up only during the output voltage transition intervals as the comparator changes states. Try to avoid a long loop which could act as an inductor (coil). 3. It is a good practice to use an unbroken ground plane on a printed circuit board to provide all components with a low inductive ground connection. Make sure ground paths are low-impedance where heavier currents are flowing to avoid ground level shift. Preferably there should be a ground plane under the component. Copyright (c) 1999-2012, Texas Instruments Incorporated 13 LMV7271/LMV7275/LMV7272 4. The output trace should be routed away from inputs. The ground plane should extend between the output and inputs to act as a guard. This can be achieved by running a topside ground plane between the output and inputs. A typical PCB layout is shown in Figure 5. 20064051 FIGURE 5. Typical PCB Layout 5. When the signal source is applied through a resistive network to one input of the comparator, it is usually advantageous to connect the other input with a resistor with the same value, for both DC and AC consideration. Input traces should be laid out symmetrically if possible. 6. All pins of any unused comparators should be tied to the negative supply. micro SMD LIGHT SENSITIVITY Exposing the micro SMD device to direct sunlight will cause mis-operation of the device. Light sources such as Halogen lamps can also affect electrical performance if brought near to the device. The wavelengths, which have the most detrimental effect, are reds and infrareds. micro SMD MOUNTING The micro SMD package requires specific mounting techniques, which are detailed in National Semiconductor Application Note AN-1112. LMV7272 micro SMD to DIP Conversion Board To facilitate characterization and testing, a micro SMD to DIP conversion board, LMV7272TLCONV, is available. It is a 2-layer board, with the LMV7272 mounted on the bottom layer, and a capacitor (C1, between the positive and negative supplies) added to the top layer. 20064060 LMV7272TLCONV Diagram 14 Copyright (c) 1999-2012, Texas Instruments Incorporated LMV7271/LMV7275/LMV7272 Typical Applications UNIVERSAL LOGIC LEVEL SHIFTER The output of LMV7275 is an unconnected drain of an NMOS device, which can be pulled up, through a resistor, to any desired output level within the permitted power supply range. Hence, the following simple circuit works as a universal logic level shifter, pulling up the signal to the desired level. 20064052 FIGURE 6. Logic Level Shifter POSITIVE PEAK DETECTOR A positive peak detect circuit is basically a comparator operated in a unity gain follower configuration, with a capacitor as a load to maintain the highest voltage. A diode is added at the output to prevent the capacitor from discharging through the pull-up resistor, and a 1M resistor added in parallel to the capacitor to provide a high impedance discharge path. When the input VIN increases, the inverting input of the comparator follows it, thus charging the capacitor. When it decreases, the cap discharges through the 1M resistor. The decay time can be modified by changing the resistor. The output should be accessed through a follower circuit to prevent loading. 20064054 FIGURE 7. Positive Peak Detector Copyright (c) 1999-2012, Texas Instruments Incorporated 15 LMV7271/LMV7275/LMV7272 OR'ING THE OUTPUT Since the output is an unconnected NMOS drain, many drains can be tied together, pulled up to VDD by a single resistor to provide an output OR'ing function. If any of the comparator outputs is pulled low the output VO goes down. 20064053 FIGURE 8. OR'ing the Outputs 16 Copyright (c) 1999-2012, Texas Instruments Incorporated LMV7271/LMV7275/LMV7272 NEGATIVE PEAK DETECTOR For the negative detector, the output transistor of the comparator acts as a low impedance current sink. Since there is no pull-up resistor, the only discharge path will be the 1M resistor and any load impedance used. Decay time is changed by varying the 1M resistor. 20064055 FIGURE 9. Negative Peak Detector SQUARE WAVE GENERATOR A typical application for a comparator is as a square wave oscillator. The circuit below generates a square wave whose period is set by the RC time constant of the capacitor C1and resistor R4. The maximum frequency is limited by the large signal propagation delay of the comparator, and by the capacitive loading at the output, which limits the output slew rate. 20064056 20064057 FIGURE 10. Squarewave Oscillator Copyright (c) 1999-2012, Texas Instruments Incorporated 17 LMV7271/LMV7275/LMV7272 To analyze the circuit, consider it when the output is high. That implies that the inverted input (VC) is lower than the non-inverting input (VA). This causes the C1 to get charged through R4, and the voltage VC increases till it is equal to the non-inverting input. The value of VA at this point is If R1 = R2 = R3, then VA1 = 2VCC/3 At this point the comparator switches pulling down the output to the negative rail. The value of VA at this point is If R1 = R2 = R3, then VA2 = VCC/3 The capacitor C1 now discharges through R4, and the voltage VC decreases till it is equal to VA2, at which point the comparator switches again, bringing it back to the initial stage. The time period is equal to twice the time it takes to discharge C1 from 2VCC/3 to VCC/3, which is given by R4C1.ln2. Hence the formula for the frequency is: F = 1/(2*R4*C1*ln2) 18 Copyright (c) 1999-2012, Texas Instruments Incorporated LMV7271/LMV7275/LMV7272 Physical Dimensions inches (millimeters) unless otherwise noted 5-Pin SOT-23 NS Package Number MF05A 5-Pin SC-70 NS Package Number MAA05A Copyright (c) 1999-2012, Texas Instruments Incorporated 19 LMV7271/LMV7275/LMV7272 NOTE: UNLESS OTHERWISE SPECIFIED 1. EPOXY COATING 2. 63Sn/37Pb EUTECTIC BUMP 3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD. 4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION REMAINING PINS ARE NUMBERED COUNTERCLOCKWISE. 5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC. 8-Bump micro SMD NS Package Number TLA08AAA X1 = 1.514mm X2 = 1.514mm X3 = 0.600mm 20 Copyright (c) 1999-2012, Texas Instruments Incorporated LMV7271/LMV7275/LMV7272 Notes Copyright (c) 1999-2012, Texas Instruments Incorporated 21 Notes Copyright (c) 1999-2012, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. 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