DATA SH EET
Product specification
Supersedes data of 1999 Feb 24
File under Integrated Circuits, IC06
1999 Sep 28
INTEGRATED CIRCUITS
74AHC244; 74AHCT244
Octal buffer/line driver; 3-state
1999 Sep 28 2
Philips Semiconductors Product specification
Octal buffer/line driver; 3-state 74AHC244; 74AHCT244
FEATURES
•ESD protection:
HBM EIA/JESD22-A114-A
exceeds 2000 V
MM EIA/JESD22-A115-A
exceeds 200 V
CDM EIA/JESD22-C101
exceeds 1000 V
•Balanced propagation delays
•All inputs have a Schmitt-trigger
action
•Inputsacceptsvoltageshigherthan
VCC
•For AHC only:
operates with CMOS input levels
•For AHCT only:
operates with TTL input levels
•Specified from
−40 to +85 and +125 °C.
DESCRIPTION
The 74AHC/AHCT244 is a
high-speed Si-gate CMOS device.
The 74AHC/AHCT244 is an octal
non-inverting buffer/line driver with
3-state outputs.
The 3-state outputs are controlled by
the outputs enable inputs 1OE and
2OE.
AHIGHonnOEcausestheoutputsto
assume a high-impedance OFF state.
FUNCTION TABLE
See note 1.
Note
1. H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
Z = high-impedance OFF state.
QUICK REFERENCE DATA
GND = 0 V; Tamb =25°C; tr=t
f≤3.0 ns.
Notes
1. CPD is used to determine the dynamic power dissipation (PDin µW).
PD=C
PD ×VCC2×fi+∑(CL×VCC2×fo) where:
fi= input frequency in MHz;
fo= output frequency in MHz;
∑(CL×VCC2×fo) = sum of outputs;
CL= output load capacitance in pF;
VCC = supply voltage in Volts.
2. The condition is VI= GND to VCC.
INPUTS OUTPUT
nOE nAnnYn
LLL
LHH
HXZ
SYMBOL PARAMETER CONDITIONS TYPICAL UNIT
AHC AHCT
tPHL/tPLH propagation delay
1Anto 1Yn;
2Anto 2Yn
CL=15pF;
V
CC =5V 3.5 5.0 ns
CIinput capacitance VI=V
CC or GND 3.5 3.5 pF
COoutput capacitance 4.0 4.0 pF
CPD power dissipation
capacitance CL=50pF;
f = 1 MHz;
notes 1 and 2
10 12 pF
1999 Sep 28 3
Philips Semiconductors Product specification
Octal buffer/line driver; 3-state 74AHC244; 74AHCT244
PINNING
ORDERING INFORMATION
PIN SYMBOL DESCRIPTION
11
OE output enable input (active LOW)
2, 4, 6 and 8 1A0to 1A3data inputs
3, 5, 7 and 9 2Y0to 2Y3bus outputs
10 GND ground (0 V)
11, 13, 15 and 17 2A3to 2A0data inputs
12, 14, 16 and 18 1Y3to 1Y0data outputs
19 2OE output enable input (active LOW)
20 VCC DC supply voltage
OUTSIDE NORTH
AMERICA NORTH AMERICA PACKAGES
PINS PACKAGE MATERIAL CODE
74AHC244D 74AHC244D 20 SO plastic SOT163-1
74AHC244PW 74AHC244PW DH 20 TSSOP plastic SOT360-1
74AHCT244D 74AHCT244D 20 SO plastic SOT163-1
74AHCT244PW 7AHCT244PW DH 20 TSSOP plastic SOT360-1
1999 Sep 28 4
Philips Semiconductors Product specification
Octal buffer/line driver; 3-state 74AHC244; 74AHCT244
Fig.1 Pin configuration.
handbook, halfpage
1OE
1A0
2Y0
1A1
2Y1
1A2
2Y2
1A3
2Y3
GND
VCC
2OE
1Y0
2A0
2A1
1Y2
1Y1
2A2
1Y3
2A3
1
2
3
4
5
6
7
8
9
10 11
12
20
19
18
17
16
15
14
13
244
MNA162
Fig.2 IEEE/IEC logic symbol.
handbook, halfpage
12
14
2
4
6
8
18
16
1EN
MNA169
3
5
11
13
15
17
9
7
19 EN
Fig.3 Logic diagram.
handbook, halfpage
MNA170
1A3
1A2
1A1
1A0
2
4
6
8
1
1Y0
1Y1
18
16
14
12
1Y2
1Y3
1OE
2A3
2A2
2A1
2A0
17
15
13
11
19
2Y0
2Y1
3
5
7
9
2Y2
2Y3
2OE
1999 Sep 28 5
Philips Semiconductors Product specification
Octal buffer/line driver; 3-state 74AHC244; 74AHCT244
RECOMMENDED OPERATING CONDITIONS
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V).
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. For SO packages: above 70 °C the value of PDderates linearly with 8 mW/K.
For TSSOP packages: above 60 °C the value of PDderates linearly with 5.5 mW/K.
SYMBOL PARAMETER CONDITIONS 74AHC 74AHCT UNIT
MIN. TYP. MAX. MIN. TYP. MAX.
VCC DC supply voltage 2.0 5.0 5.5 4.5 5.0 5.5 V
VIinput voltage 0 −5.5 0 −5.5 V
VOoutput voltage 0 −VCC 0−VCC V
Tamb operating ambient temperature
range see DC and AC
characteristics per
device
−40 +25 +85 −40 +25 +85 °C
−40 +25 +125 −40 +25 +125 °C
tr,tf (∆t/∆f) input rise and fall rates VCC = 3.3 V ±0.3 V −−100 −−−ns/V
VCC =5V±0.5 V −−20 −−20
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCC DC supply voltage −0.5 +7.0 V
VIinput voltage range −0.5 +7.0 V
IIK DC input diode current VI<−0.5 V; note 1 −−20 mA
IOK DC output diode current VO<−0.5 Vor VO>V
CC + 0.5 V; note 1 −±20 mA
IODC output source or sink current −0.5V<V
O<V
CC + 0.5 V −±25 mA
ICC DC VCC or GND current −±75 mA
Tstg storage temperature range −65 +150 °C
PDpower dissipation per package for temperature range: −40 to +125 °C; note 2 −500 mW
1999 Sep 28 6
Philips Semiconductors Product specification
Octal buffer/line driver; 3-state 74AHC244; 74AHCT244
DC CHARACTERISTICS
74AHC family
Over recommended operating conditions; voltages are referenced to GND (ground=0V).
SYMBOL PARAMETER
TEST CONDITIONS Tamb (°C)
UNIT
OTHER VCC (V) 25 −40 to +85 −40 to +125
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
VIH HIGH-level input
voltage 2.0 1.5 −−1.5 −1.5 −V
3.0 2.1 −−2.1 −2.1 −
5.5 3.85 −−3.85 −3.85 −
VIL LOW-level input
voltage 2.0 −− 0.5 −0.5 −0.5 V
3.0 −− 0.9 −0.9 −0.9
5.5 −− 1.65 −1.65 −1.65
VOH HIGH-level output
voltage; all
outputs
VI=V
IH or VIL;
IO=−50 µA2.0 1.9 2.0 −1.9 −1.9 −V
3.0 2.9 3.0 −2.9 −2.9 −
4.5 4.4 4.5 −4.4 −4.4 −
HIGH-level output
voltage VI=V
IH or VIL;
IO=−4.0 mA 3.0 2.58 −−2.48 −2.40 −V
VI=V
IH or VIL;
IO=−8.0 mA 4.5 3.94 −−3.8 −3.70 −
VOL LOW-level output
voltage; all
outputs
VI=V
IH or VIL;
IO=50µA2.0 −0 0.1 −0.1 −0.1 V
3.0 −0 0.1 −0.1 −0.1
4.5 −0 0.1 −0.1 −0.1
LOW-level output
voltage VI=V
IH or VIL;
IO=4mA 3.0 −− 0.36 −0.44 −0.55 V
VI=V
IH or VIL;
IO=8mA 4.5 −− 0.36 −0.44 −0.55
IIinput leakage
current VI=V
CC or GND 5.5 −− 0.1 −1.0 −2.0 µA
IOZ 3-state output
OFF current VI=V
IH or VIL;
VO=V
CC or GND 5.5 −− ±0.25 −±2.5 −±10.0 µA
ICC quiescent supply
current VI=V
CC or GND;
IO=0 5.5 −− 4.0 −40 −80 µA
CIinput capacitance −−310−10 −10 pF
1999 Sep 28 7
Philips Semiconductors Product specification
Octal buffer/line driver; 3-state 74AHC244; 74AHCT244
74AHCT family
Over recommended operating conditions; voltages are referenced to GND (ground=0V).
SYMBOL PARAMETER
TEST CONDITIONS Tamb (°C)
UNIT
OTHER VCC (V) 25 −40 to +85 −40 to +125
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
VIH HIGH-level input
voltage 4.5 to 5.5 2.0 −−2.0 −2.0 −V
VIL LOW-level input
voltage 4.5 to 5.5 −− 0.8 −0.8 −0.8 V
VOH HIGH-level output
voltage; all outputs VI=V
IH or VIL;
IO=−50 µA4.5 4.4 4.5 −4.4 −4.4 −V
HIGH-level output
voltage VI=V
IH or VIL;
IO=−8.0 mA 4.5 3.94 −−3.8 −3.70 −V
VOL LOW-level output
voltage; all outputs VI=V
IH or VIL;
IO=50µA4.5 −0 0.1 −0.1 −0.1 V
LOW-level output
voltage VI=V
IH or VIL;
IO=8mA 4.5 −− 0.36 −0.44 −0.55 V
IIinput leakage
current VI=V
IH or VIL 5.5 −− 0.1 −1.0 −2.0 µA
IOZ 3-state output
OFF current VI=V
IH or VIL;
VO=V
CC or GND
per input pin;
other inputs at
VCC or GND;
IO=0
5.5 −− ±0.25 −±2.5 −±10.0 µA
ICC quiescent supply
current VI=V
CC or GND;
IO=0 5.5 −− 4.0 −40 −80 µA
∆ICC additional
quiescent supply
current per input
pin
VI=V
CC −2.1 V
other inputs at
VCC or GND;
IO=0
4.5 to 5.5 −− 1.35 −1.5 −1.5 mA
CIinput capacitance −−310−10 −10 pF
1999 Sep 28 8
Philips Semiconductors Product specification
Octal buffer/line driver; 3-state 74AHC244; 74AHCT244
AC CHARACTERISTICS
Type 74AHC244
GND = 0 V; tr=t
f≤3.0 ns.
Notes
1. Typical values at VCC = 3.3 V.
2. Typical values at VCC = 5.0 V.
SYMBOL PARAMETER
TEST CONDITIONS Tamb (°C)
UNIT
WAVEFORMS CL25 −40 to +85 −40 to +125
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
VCC = 3.0 to 3.6 V; note 1
tPHL/tPLH propagation delay
nAnto nYn
see Figs 4 and 6 15 pF −5.0 8.4 1.0 10.0 1.0 10.5 ns
tPZL/tPZH propagation delay
nOE to nYn
see Figs 5 and 6 −6.5 10.6 1.0 12.5 1.0 13.5 ns
tPLZ/tPHZ propagation delay
nOE to nYn
−5.5 9.7 1.0 11.0 1.0 12.5 ns
tPHL/tPLH propagation delay
nAnto nYn
see Figs 4 and 6 50 pF −7.0 11.9 1.0 13.5 1.0 15.0 ns
tPZL/tPZH propagation delay
nOE to nYn
see Figs 5 and 6 −7.5 14.1 1.0 16.0 1.0 18.0 ns
tPLZ/tPHZ propagation delay
nOE to nYn
−10.0 14.0 1.0 16.0 1.0 17.5 ns
VCC = 4.5 to 5.5 V; note 2
tPHL/tPLH propagation delay
nAnto nYn
see Figs 4 and 6 15 pF −3.4 5.5 1.0 6.5 1.0 7.0 ns
tPZL/tPZH propagation delay
nOE to nYn
see Figs 5 and 6 −4.0 7.3 1.0 8.5 1.0 9.5 ns
tPLZ/tPHZ propagation delay
nOE to nYn
−4.8 7.2 1.0 8.5 1.0 9.0 ns
tPHL/tPLH propagation delay
nAnto nYn
see Figs 4 and 6 50 pF −5.0 7.5 1.0 8.5 1.0 9.5 ns
tPZL/tPZH propagation delay
nOE to nYn
see Figs 5 and 6 −5.5 9.3 1.0 10.5 1.0 12.0 ns
tPLZ/tPHZ propagation delay
nOE to nYn
−7.0 9.2 1.0 10.5 1.0 11.5 ns
1999 Sep 28 9
Philips Semiconductors Product specification
Octal buffer/line driver; 3-state 74AHC244; 74AHCT244
Type 74AHCT244
GND = 0 V; tr=t
f≤3.0 ns.
Note
1. Typical values at VCC = 5.0 V.
AC WAVEFORMS
SYMBOL PARAMETER
TEST CONDITIONS Tamb (°C)
UNIT
WAVEFORMS CL25 −40 to +85 −40 to +125
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
VCC = 4.5 to 5.5 V; note 1
tPHL/tPLH propagation delay
nAnto nYn
see Figs 4 and 6 15 pF −3.5 7.4 1.0 8.5 1.0 9.5 ns
tPZL/tPZH propagation delay
nOE to nYn
see Figs 5 and 6 −3.5 10.4 1.0 12.0 1.0 13.0 ns
tPLZ/tPHZ propagation delay
nOE to nYn
−5.0 9.4 1.0 10.0 1.0 12.0 ns
tPHL/tPLH propagation delay
nAnto nYn
see Figs 4 and 6 50 pF −5.0 8.4 1.0 9.5 1.0 10.5 ns
tPZL/tPZH propagation delay
nOE to nYn
see Figs 5 and 6 −5.5 11.4 1.0 13.0 1.0 14.5 ns
tPLZ/tPHZ propagation delay
nOE to nYn
−7.0 11.4 1.0 13.0 1.0 14.5 ns
Fig.4 The input (nAn) to output (nYn) propagation delays.
handbook, halfpage
MNA171
nAn INPUT
nYn OUTPUT
tPLH tPHL
GND
VI
VM
VM
VM
VM
VOH
VOL
FAMILY VI INPUT
REQUIREMENTS VM
INPUT VM
OUTPUT
AHC GND to VCC 50% VCC 50% VCC
AHCT GND to 3.0 V 1.5 V 50% VCC
1999 Sep 28 10
Philips Semiconductors Product specification
Octal buffer/line driver; 3-state 74AHC244; 74AHCT244
Fig.5 The 3-state output enable and disable times.
handbook, full pagewidth
MNA172
tPLZ
tPHZ
outputs
disabled outputs
enabled
VOH − 0.3 V
VOL + 0.3 V
outputs
enabled
OUTPUT
LOW-to-OFF
OFF-to-LOW
OUTPUT
HIGH-to-OFF
OFF-to-HIGH
nOE INPUT
VI
VCC
VM
VOL
VOH
GND
GND
tPZL
tPZH
VM
VM
FAMILY VI INPUT
REQUIREMENTS VM
INPUT VM
OUTPUT
AHC GND to VCC 50% VCC 50% VCC
AHCT GND to 3.0 V 1.5 V 50% VCC
Fig.6 Load circuitry for switching times.
TEST S1
tPLH/tPHL open
tPLZ/tPZL VCC
tPHZ/tPZH GND
handbook, full pagewidth
open
GND
VCC
VCC
VIVO
MNA183
D.U.T.
CL
RT
1000 Ω
PULSE
GENERATOR
S1
1999 Sep 28 11
Philips Semiconductors Product specification
Octal buffer/line driver; 3-state 74AHC244; 74AHCT244
PACKAGE OUTLINES
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 13.0
12.6 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT163-1
10
20
wM
bp
detail X
Z
e
11
1
D
y
0.25
075E04 MS-013AC
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.51
0.49 0.30
0.29 0.050
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
0 5 10 mm
scale
X
θ
A
A1
A2
HE
Lp
Q
E
c
L
vMA
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
95-01-24
97-05-22
1999 Sep 28 12
Philips Semiconductors Product specification
Octal buffer/line driver; 3-state 74AHC244; 74AHCT244
UNIT A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.15
0.05 0.95
0.80 0.30
0.19 0.2
0.1 6.6
6.4 4.5
4.3 0.65 6.6
6.2 0.4
0.3 0.5
0.2 8
0
o
o
0.13 0.10.21.0
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT360-1 MO-153AC 93-06-16
95-02-04
wM
bp
D
Z
e
0.25
110
20 11
pin 1 index
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
HE
E
c
vMA
X
A
y
0 2.5 5 mm
scale
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1
A
max.
1.10
1999 Sep 28 13
Philips Semiconductors Product specification
Octal buffer/line driver; 3-state 74AHC244; 74AHCT244
SOLDERING
Introduction to soldering surface mount packages
Thistext givesa verybriefinsight toa complextechnology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit board byscreenprinting, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Wave soldering
Conventional single wave soldering is not recommended
forsurfacemountdevices (SMDs)or printed-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
•Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
•For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
•Forpackageswithleads onfour sides,the footprintmust
be placed at a 45°angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1999 Sep 28 14
Philips Semiconductors Product specification
Octal buffer/line driver; 3-state 74AHC244; 74AHCT244
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE SOLDERING METHOD
WAVE REFLOW(1)
BGA, SQFP not suitable suitable
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable(2) suitable
PLCC(3), SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended(3)(4) suitable
SSOP, TSSOP, VSO not recommended(5) suitable
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
1999 Sep 28 15
Philips Semiconductors Product specification
Octal buffer/line driver; 3-state 74AHC244; 74AHCT244
NOTES
© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
1999 68
Philips Semiconductors – a w orldwide compan y
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Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PTPhilipsDevelopmentCorporation, SemiconductorsDivision,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777
Printed in The Netherlands 245002/03/pp16 Date of release: 1999 Sep 28 Document order number: 9397 750 06296
