243-23320-15 - Electronic Precision Technology

Product Data Sheet

hm2.0 Male connector, type B19,

Part No. 243-23320-15

Illustration similar

Perpendicular Press-fit

133 contacts

termination length 3.7 mm

for PCB > 2.2 mm

tested according to IEC 61076-4-101

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Version from 22.06.2021, 04:54 - subject to change without notice Page 1

Product Data Sheet

hm2.0 Male connector, type B19,

Part No. 243-23320-15

Technical Specifications

Basics

Specification IEC 61076-4-101

Performance Level 2

No. of Contacts 133

Termination Technology Press-fit

Termination Length 3.7 mm

Operating Temperature Range -55°C to +125°C

Material

Insulator Material PBT glass filled, UL 94 V-0

CTI value

IEC 60112 200

Contact Material Bronze

Mechanical

Pitch 2.0 mm

Mating Force per Pin Contact: max. 0.75 N, Shielding: max. 1 N

Separating Force per Pin Contact: min. 0.15 N, Shielding: min. 0.15 N

Durability > 250 mating cycles

Electrical

Operational Current 1.5 A @ +20°C, 1.0 A @ +70°C

Contact Resistance max. 20 mΩ

Clearance and Creepage ≥ 0.8 mm

Insulation Resistance min. 104 MΩ

Test Voltage 750 V r.m.s

Data Transfer Rate 3.125 Gbit/s

Approval / Compliance

UL file E130314

Environment RoHS compliant

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Product Data Sheet

hm2.0 Male connector, type B19,

Part No. 243-23320-15

Derating Diagram

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Product Data Sheet

hm2.0 Male connector, type B19,

Part No. 243-23320-15

Hole Specifications

Plated through-hole according to IEC 60352-5

Material imm. Sn printed circuit boards

Nominal Hole Ø 0.6 mm

A PCB Thickness min 2.2 mm

B Plated Hole Ø 0.60 ±0.05 mm

C Drill Hole 0.70 ±0.02 mm

D Cu Plating min. 25 µm

E Surface max. 1.5 µm; imm. Sn plating

F Annular Ring min. 0.1 mm

Material Ni, Au printed circuit boards

Nominal Hole Ø 0.6 mm

A PCB Thickness min 2.2 mm

B Plated Hole Ø 0.60 ±0.05 mm

C Drill Hole 0.70 ±0.02 mm

D Cu Plating min. 25 µm

E Surface Ni, Au plating, 0.05 - 0.2 µm Au over 2.5 - 5

µm Ni

F Annular Ring min. 0.1 mm

Material pure Cu printed circuit boards

Nominal Hole Ø 0.6 mm

A PCB Thickness min 2.2 mm

B Plated Hole Ø 0.60 ±0.05 mm

C Drill Hole 0.70 ±0.02 mm

D Cu Plating min. 25 µm

E Surface OSP*,z.B. GLICOAT-SMD (F2) with 0.12 -

0.15 µm

F Annular Ring min. 0.1 mm

Material HAL Sn printed circuit boards

Nominal Hole Ø 0.6 mm

A PCB Thickness min 2.2 mm

B Plated Hole Ø 0.60 ±0.05 mm

C Drill Hole 0.70 ±0.02 mm

D Cu Plating min. 25 µm

E Surface HAL Sn, 5 - 15 µm

F Annular Ring min. 0.1 mm

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Product Data Sheet

hm2.0 Male connector, type B19,

Part No. 243-23320-15

Options

for PCB thickness 1.4 - 2.2 the part number is 243-23320-05

Modifications

Available on request

special contact arrangement

other contact surface

Drawings

Component data in 2D and 3D format you can download here:

» PDF » 3D IGES » 3D STEP » 3D PDF

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