4
Raychem Circuit Protection Protected Power Switch Devices 325
Protected Power Switch Devices
Raychem Circuit Protection
offers silicon-based Protected
Power Switch devices as well as
the PolySwitch resettable
devices for USB protection. USB
bus-powered hubs and some
USB host applications require
power switching as well as over-
current protection. Raychem
Circuit Protection’s protected
power switch devices help meet
both of these requirements as
well as in-rush current control.
Benefits:
• Reduced nuisance tripping
during hot-plug
• Reduced component count
• Device designed such that a
fault on one port does not dis-
able remaining ports
Features:
• Compliant to USB 1.1 and
proposed USB 2.0
specifications
• UL recognized component
• Built-in hot-plug flag delay
• Low On-Resistance (90mΩ, typ)
• Independent OC and OT
protection
• Resistance decreases as
voltage decreases
• Optional imbedded resistors on
EN pins
Application:
• USB Hosts
Desktop PC
Notebook PC
• USB Self-Powered Hubs
Monitor
Stand-Alone Hub
• USB Bus-Powered Hubs
Keyboard
• USB Function
CCD Camera
Joystick
Protected Power Switch Devices
326 Protected Power Switch Devices Raychem Circuit Protection
4
Selection Guide for Protected Power Switch Devices
Step 1. Verify the circuit’s operating parameters.
Confirm that the circuit’s operating parameters are within the following
device ratings.
• Input voltage (VIN) +3 to +5.5V
• Output voltage (VOUT) +3 to +5.5V
• Output current per port (IOUT) 0.6A
• Operating temperature range -40 to +85°C
Step 2. Determine the package type and number of switches per
package.
The RYC82xx series are available in a variety of package types and
number of switches per package. Refer to Table P1 for the options
available in package type and switches per package. Dimensions of
each package type are available in Table P3 to confirm the device
selected will fit in your space requirements.
Step 3. Determine the output parameters of the USB controller
chip used in your circuit.
Some USB controller chips have enable logic that requires the power
switch to be active low while others require the switch to be active
high. This signal will be connected to the enable pin of the device
selected. See Table P1 to select the correct enable logic voltage of the
device selected in Step 2 above.
Step 4. Determine your preferred circuit implementation for the
internal Enable (EN) pull-up/pull-down resistors.
The RYC82xx series devices have been designed with an option to
minimize the number of external components to achieve functionality.
Depending on the design of your circuit you may or may not require
the enable resistor to maximize performance of your USB circuit.
Devices with the EN resistor on board may eliminate the need for an
external resistor, thereby reducing external components. See Table
P1 to select the desired configuration for your USB circuit.
Step 5. Independently evaluate and test the suitability of and per-
formance of the selected protected power switch.
Protected Power Switch Devices
Raychem Circuit Protection Protected Power Switch Devices 327
4
Table P1. Product Series – Number of Switches, Package Type, Enable Logic and EN Resistor Options for
Protected Power Switch Devices
Part Number Number of Switches Package Type* Enable Logic EN Resistor on Chip
RYC8210-1M 1 SO-8 Active high Yes
RYC8210-1MM** 1 TSSOP-8 Active high Yes
RYC8210-2M 1 SO-8 Active low Yes
RYC8210-2MM** 1 TSSOP-8 Active low Yes
RYC8210-3M 1 SO-8 Active high No
RYC8210-4M 1 SO-8 Active low No
RYC8220-1M 2 SO-8 Active high Yes
RYC8220-2M 2 SO-8 Active low Yes
RYC8220-3M 2 SO-8 Active high No
RYC8220-4M 2 SO-8 Active low No
RYC8240-1WM 4 SO-16 Active high Yes
RYC8240-2WM 4 SO-16 Active low Yes
Notes:
*Leaded packages are available. Please contact your Raychem Circuit Protection representative for more information.
**Please contact your Raychem Circuit Protection representative for availability.
4
328 Protected Power Switch Devices Raychem Circuit Protection
Table P2. Electrical and Thermal Specifications for Protected Power Switch Devices
Thermal and Maximum Ratings 1, 2 Symbol Value Units
Max. supply voltage VIN +8 V
Fault flag voltage VFLG +8 V
Fault flag current IFLG 50 µA
Output voltage VOUT +8 V
Output current IOUT Internally limited A
Control input VEN -0.3 to +12.0 V
Storage temperature TS-65 to +150 °C
Max. lead temperature during soldering (5 sec.) 260 °C
Operating Ratings, 3
Supply voltage VIN +3 to +5.5 V
Continuous output current IOUT 0.6 A
Ambient operating temperature TA-40 to +85 °C
Thermal resistance (SO-8) θJA120 °C/W
Electrical Characteristics (VIN = 5V, TA= 25˚C, unless noted.)
Power Switch Condition Min Typ Max Units
Switch resistance VIN = 5V, IOUT = 500mA, each switch — 95 120 mΩ
VIN = 3.3V, IOUT = 500mA, each switch — 90 110 mΩ
Output turn-on time RL= 10 Ωeach output, consists of delay+rise time — 3.6 12 ms
Output turn-off time RL= 10 Ωeach output, consists of delay+fall time — 2 40 µs
Short-circuit current limit Each output (enable into 0Ωload) 0.6 0.9 1.25 A
Each output (3Ωload hot-plugged into EN device), VOUT = 4.0V 0.6 0.9 1.25 A
Enable input threshhold Low-to-high transition, 4 — 1.5 2.4 V
High-to-low transition, 4 0.8 1.5 — V
Enable input current VEN = 0V to 5.5V — 0.01 1 µA
Enable input capacitance — — 5 pF
Supply current Switch off, OUT = open — 0.5 5 µA
Switches on, OUT = open, 5 — 200 250 µA
Output leakage current Each output (output disabled) — — 10 µA
Over Temperature, Under Voltage (UVLO) Lock Out (OVLO)
Over temperature shutdown TJincreasing — 135 — •C
Threshold TJdecreasing — 125 — •C
UVLO threshold VIN = increasing — 2.5 — V
VIN = decreasing — 2.3 — V
OVLO threshold VIN = increasing — 6.4 — V
VIN = decreasing — 6.1 — V
Error Flag
Error flag output resistance VIN =5V, IL= 10mA, 6 — 50 100 Ω
VIN = 3.3V, IL= 10mA, 6 — 80 100 Ω
Error flag output delay Fault on overcurrent, 7 6 9 1 5 ms
Error flag off current VFLAG = 5V — 0.01 1 µA
Notes:
1. Exceeding the maximum rating may damage the device.
2. Devices are ESD sensitive. Handling precautions recommended.
3. The device is not designed to function outside its operating rating.
4. Off is ≤0.8V and on is ≥2.4V for the RYC82x0-1 and RYC82x0-3. Off is ≥2.4V and on is ≤0.8V for the RYC82x0-2 and RYC82x0-4.
The enable input has approximately 200mV of hysteresis. Pull-down/pull-up resistors are on chip for “-1” and “-2” configurations.
5. With internal enable pull up/down resistors.
6. Pull-up resistors are on chip.
7. No error flag output delay on UVLO, OVLO and thermal shut down.
Raychem Circuit Protection Protected Power Switch Devices 329
4
Protected Power Switch Devices
Figures P1–P20. Typical Characteristics for Protected Power Switch Devices
RL CL
OUT
TEST CIRCUIT Output rise and fall time
Active-high switch delay time
Active-low switch delay time
50% 50%
90% 10%
ton off
VEN
VOUT
50% 50%
90% 10%
ton toff
VEN
VOUT
90% 90%
10% 10%
VOUT
trtf
Figure P1. Test Circuit and Timing Diagram
0 4.0 8.0 12.0 16.0 20.0 24.0 28.0 32.0 36.0 40
VEN
(10V/div)
VFlg
(5V/div)
Vout
(5V/div)
Iout
(0.5A/div)
1
2
3
4
T (ms)
Figure P3. Enabled into Short Circuit
1 2 3 4 5 6 7 8 9 10
VEN
(10V/div)
VFlg
(5V/div)
Vout
(5V/div)
Iout
(0.5A/div)
1
2
3
4
T (sec)
(VIN = 5V, RL= 0.1Ω)(VIN = 5V, RL= 0.1Ω)
0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0
VEN
(5V/div)
VFlg
(5V/div)
Vout
(5V/div)
Iout
(500mA/div)
1
3
4
T (ms)
2
T
T
T
T
Figure P2. Turn-on Delay Time
(VIN = 5V, RL= 10Ω)
Figure P4. Enabled into Short Circuit
(extended time with thermal cycling)
330 Protected Power Switch Devices Raychem Circuit Protection
4
VEN
(10V/div)
IOUT
(200mA/div)
1
T (ms)
40 10 20 30 40 50 60 70 80 90 100
CL = 1000µFCL = 2000µF
CL = 100µF
Figure P7. Nuisance Trip Elimination
Time (500ms/div.)
VIB
(0.1A/div.) VFLG A
(5V/div.)
VFLG B
(5V/div.)
VIA
(2.0A/div.)
Figure P8. Independent OC/OT Coordination
(OC/OT protection in channel A, normal operation in channel B,
VIN = 5V, RL= 0.1Ω)
(VIN = 5V, RL= 10Ω)
Figures P1–P20. Typical Characteristics for Protected Power Switch Devices continued
(TA= 25˚C, VIN = 5V, RL= .05Ω)(TA= 25˚C, VIN = 5V, RL= .05Ω)
0 4 8 12 16 20 24 28 32 36 40
VEN
(10V/div)
VFLG
(5V/div)
IOUT
(1A/div)
1
T (ms)
2
4
Figure P5. Hot-Plugged Short Circuit
VEN
(10V/div)
VFLG
(5V/div)
IOUT
(1A/div)
1
T (s)
2
3
41 2 3 4 5 6 7 8 9 10 11
VOUT
(5V/div)
Figure P6. Hot-Plugged Short Circuit
(extended time with thermal cycling)
Raychem Circuit Protection Protected Power Switch Devices 331
4
Protected Power Switch Devices
Figures P1–P20. Typical Characteristics for Protected Power Switch Devices continued
1.05E-01
1.00E-01
9.50E-02
9.00E-02
8.50E-02
8.00E-023.0 3.5 4.0 4.5 5.0 5.5 6.0
V_in(V)
RON(Ω)
Figure P9. On-Resistance vs. Input Voltage
Temperature [˚C]
RON [Ω]
0.11
0.1
0.09
0.08
0.07
0.06
0.05
-60 -45 -30 -15 0 15 30 45 60 75 90 105
Figure P10. On-Resistance vs. Ambient Temperature
(TA= 25˚C, IL= 500 mA) (VIN = 5V, IL= 500 mA)
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
03 3.5 4 4.5 5 5.5
Supply Voltage (V)
Enable Threshold Voltage (V)
Figure P11. Enable Threshold vs. Supply Voltage
400
350
300
250
200
150
100
50
3.0 3.5 4.0 4.5 5.0 5.5
0
Vin (V)
On-State Supply Current (µA)
-40˚C 25˚C 125˚C
Figure P12. On-State Supply Current vs. Input Voltage
332 Protected Power Switch Devices Raychem Circuit Protection
4
Figures P1–P20. Typical Characteristics for Protected Power Switch Devices continued
1000
100
0 20 40 60 80 100
10
Temperature (C˚)
Current (µA)
Figure P13. On-State Supply Current vs.
Ambient Temperature
1.0
0.1
0.01
0.001
020406080100
0.0001
Temperature (°C)
Off-State Supply Current (µA)
10
100
Figure P15. Off-State Supply Current vs.
Ambient Temperature
1.2
1
0.8
0.6
0.4
0.2
3.5 4 4.5 5 5.5
0
Vin (V)
Current Limit (A)
Figure P16. Current Limit vs. Input Voltage
(VIN = 5V) (TA= 25˚C)
1.0
0.1
0.01
0.001
0.0001
0.00 1.00 2.00 3.00 4.00 5.00 6.00 7.00
Input Voltage (V)
Off-State Supply Current (µA)
Figure P14. Off-State Supply Current vs. Input Voltage
(TA= 25˚C)
(VIN = 5V)
Raychem Circuit Protection Protected Power Switch Devices 333
4
Protected Power Switch Devices
Figures P1–P20. Typical Characteristics for Protected Power Switch Devices continued
10
11
12
13
14
15
8
9
7
6
-50 -30 -10 10 30 50 70 90 110 130
5
Ambient Temperature (C˚)
Peak Short Circuit Current (A)
Figure P19. Hot-Plug Short Circuit vs.
Ambient Temperature
0 20 40 60 80 100 120 140 160 180 200
T (ms)
2
4
IOUTA
(500mA/div)
VOUTA
(5V/div)
[ T ]
Tek Stop: 5.00kS/s 16 Acqs
Figure P20. Enable Voltage vs. Ambient Temperature
(VIN = 5V)
(VIN = 5V)
(VIN = 5V) (TA= 25˚C)
0.4
0.5
0.6
0.7
0.8
0.9
0.3
0.2
0.1
-40 -20 0 20 40 60 80 100
0
Temperature (°C)
Current Limit (A)
1
Figure P17. Current Limit vs. Ambient Temperature
8
10
12
14
16
6
4
2
3 3.5 4 4.5 5 5.5
0
Input Voltage (V)
Peak Short Circuit Current (A)
Figure P18. Hot-Plug Short Circuit Current vs.
Supply Voltage
4
Pin Descriptions
Pin Name Pin Number Pin Function
EN 1 Enable (Input): Logic-compatible enable input. High input > 2.4V.
Low input < 0.8V (-1 active high, -2 active low). Do not float.
FLG 2 Fault Flag (Output): Active-low open-drain output. Indicates overcurrent,
UVLO, OVLO and thermal shutdown.
GND 3 Ground: Supply return
IN 7 Supply Input: Output MOSFET drain. Also supplies IC’s internal circuitry.
Connect to positive supply.
OUT 6 and 8 Switch Output: Output MOSFET source. Typically connect to switched side of load.
NC 4 and 5 No connections
RYC8210
8
7
6
5
4
3
2
1OUT
IN
OUT
NC
EN
FLG
GND
NC
RYC8210
6, 8 (OUT)
7 (IN)
5 (NC)
(EN) 1
(FLG) 2
(NC) 4
LOGIC
CHARGE
PUMP
(GND) 3
Figure P21. Pin Configuration for RYC8210 Series
Pin Descriptions
Pin Number Pin Name Pin Function
ENA 1 Enable (Input): Logic-compatible enable input. High input > 2.4V.
ENB 4 Low input < 0.8V (-1 active high, -2 active low). Do not float.
FLGA 2 Fault Flag (Output): Active-low open-drain output. Indicates overcurrent,
FLGB 3 UVLO, OVLO and thermal shutdown.
GND 6 Ground: Supply return
IN 7 Supply Input: Output MOSFET drain. Also supplies IC’s internal circuitry.
Connect to positive supply.
OUTA 8 Switch Output: Output MOSFET source. Typically connect to switched side of load.
OUTB 5
RYC8220
8
7
6
5
4
3
2
1OUTA
IN
GND
OUTB
ENA
FLGA
FLGB
ENB
RYC8220
8 (OUTA)
7 (IN)
5 (OUTB)
(ENA) 1
(FLGA) 2
(FLGB) 3
LOGIC
CHARGE
PUMP
(GND) 6
LOGIC
CHARGE
PUMP
(ENB) 4
Figure P22. Pin Configuration for RYC8220 Series
334 Protected Power Switch Devices Raychem Circuit Protection
RYC8210 & RYC8220 Pin Configurations for Protected Power Switch Devices
Raychem Circuit Protection Protected Power Switch Devices 335
4
Protected Power Switch Devices
RYC8240 Pin Configurations for Protected Power Switch Devices
Pin Descriptions
Pin Number Pin Name Pin Function
ENA 16 Enable (Input): Logic-compatible enable input. High input > 2.4V
ENB 13 Low input < 0.8V (-1 active high, -2 active low).
ENC 5
END 8
FLGA 15 Fault Flag (Output): Active-low open-drain output. Indicates overcurrent, UVLO,
FLGB 14 OVLO and thermal shutdown.
FLGC 6
FLGD 7
OUTA 2 Switch Output: Output MOSFET source. Typically connect to switched side of load.
OUTB 4
OUTC 12
OUTD 10
GND(A/B) 1 Ground: Supply return
GND(C/D) 9
IN(A/B) 3 Supply Input: Output MOSFET drain. Also supplies IC’s internal circuitry.
IN(C/D) 11 Connect to positive supply.
RYC8240
16
15
14
13
4
3
2
1ENA
FLGA
FLGB
ENB
GND(A/B)
OUTA
IN(A/B)
OUTB
RYC8240
(OUTA)
(IN)
(OUTB)
(ENA)
(FLGA)
(FLGB)
LOGIC
CHARGE
PUMP
GND(C/D)
LOGIC
CHARGE
PUMP
(ENB)
12
11
10
9
8
7
5OUTC
IN(C/D)
OUTD
GND(C/D)
ENC
FLGC
FLGD
END
6(OUTC)
(IN)
(OUTD)
(ENC)
(FLGC)
(FLGD)
LOGIC
CHARGE
PUMP
LOGIC
CHARGE
PUMP
(END)
(GND A/B)
Figure P23. Pin Configuration for RYC8240 Series
4
A
G
85
4
1
BP4 PL .25 [0.010] MB
Base Plane
K
C
D8PL 0.08 [0.003] M
.10 [0.004]
F
M
J
TBA
Figure P24. TSSOP-8 Device Dimensions
336 Protected Power Switch Devices Raychem Circuit Protection
Figure P24-P26 Physical Descriptions for Dimensions of Protected Power Switch Devices
A
85
4
1
BP4 PL
.25 [0.010] MB
Base Plane
K
C
D8 PL 0.25 [0.010] M
.10 [0.004]
F
M
J
TB
A
G
M
T
MS
Figure P25. SO-8 Device Dimensions
Raychem Circuit Protection Protected Power Switch Devices 337
4
Protected Power Switch Devices
Figure P24-P26 Physical Descriptions for Dimensions of Protected Power Switch Devices continued
A
16 9
8
1
BP8 PL
.25 [0.010] MB
Base Plane
K
C
D8 PL 0.25 [0.010] M
.10 [0.004]
F
M
J
TB
A
G
M
T
MS
Figure P26. SO-16 Device Dimensions
Table P3. Dimensions of Protected Power Switch Devices in Millimeters (Inches)
Figure Figure P24 Figure P25 Figure P26
Package Type TSSOP-8 SO-8 SO-16
Dimension Min Max Min Max Min Max
A 2.90 3.10 4.80 5.00 9.80 10.00
(0.114) (0.122) (0.190) (0.197) (0.386) (0.393)
B 2.90 3.10 3.80 4.00 3.80 4.00
(0.114) (0.122) (0.150) (0.157) (0.150) (0.157)
C 0.80 1.10 1.35 1.75 1.35 1.75
(0.032) (0.043) (0.054) (0.068) (0.054) (0.068)
D 0.25 0.40 0.35 0.49 0.35 0.49
(0.110) (0.016) (0.013) (0.020) (0.013) (0.020)
F 0.40 0.70 0.40 1.27 0.40 1.27
(0.016) (0.027) (0.016) (0.050) ( 0.016) ( 0.050)
G 0.65 BSC 1.27 BSC 1.27 BSC
(0.026) BSC (0.05) BSC (0.05) BSC
J 0.13 0.23 0.18 0.25 0.18 0.25
(0.005) (0.009) (0.0075) (0.010) ( 0.0075) ( 0.010)
K 0.05 0.15 0.10 0.25 0.10 0.25
(0.002) (0.006) (0.004) (0.010) (0.004) (0.101)
M0°6°0°8°0°8°
P 4.80 5.00 5.80 6.20 5.80 6.20
(0.189) (0.197) (0.228) (0.244) (0.228) (0.244)
Note: Dimensions and tolerancing per ANSI Y14.5M-1982.
Dimensions A and B are datums and T is a datum surface.
Dimensions A and C do not include mold flash. Mold flash shall not exceed 0.15 mm (0.006 in.) per side.
Dimension D does not include interlead flash. Interlead flash shall not exceed 0.25 mm (0.010 in.)
4
338 Protected Power Switch Devices Raychem Circuit Protection
Table P4. Environmental Specifications and Reliability Tests for Protected Power Switch Devices
Test Conditions Pass Criteria
Flammability IEC 695-2-2 (Needle flame test) 20 sec. Flame application
Solderability ANSI/J-STD-002, Category 3 > 95% coverage
Solder heat withstand IEC 68-2-2, 260°C for 10 sec. no damage
Solvent resistance MIL-STD 202 Method 215 no mechanical damage
Temperature humidity bias per JESD26, Test Method A101-B 1000 hrs @ 85°C/85% RH
High temperature storage life per JESD26, Test Method A103-A 1000 hrs @ 150°C
High temperature operating life per JESD26, Test Method A108-A 1000 hrs @ rated current, 120°C
Thermal shock per JESD26, Test Method A104-A 1000 cycles @ –55°C to 125°C
Autoclave (PTH) per JESD26, Test Method A102-B 96 hrs @ 121°C, 100% RH, 15 psi
Recommended Reflow Profile for Protected Power Switch Devices
Preheating
30 to 90 sec.
50
100
150
200
250
300
010 to 15 sec.
Temperature (°C)
120 sec.
Soldering Cooling
Time
Figure P27. Recommended Reflow Profile
Power switches are compatible
with standard reflow soldering
techniques. The following guide-
lines will assist in the proper
installation of the device:
•Recommended reflow methods:
IR, vapor phase oven, hot air
oven.
•Always preheat the device to
prevent excessive thermal
shock and stress.
•Recommended maximum paste
thickness of 0.25 mm (0.010 in.)
•Profile may vary among differ-
ent soldering systems, depend-
ing on board density and types
of components used.
•Devices may be cleaned using
standard industry methods and
solvents.
•Due to potential damage, it is
recommended that reworked
boards should use a new
device.
Raychem Circuit Protection Protected Power Switch Devices 339
4
Protected Power Switch Devices
Table P5. Packaging and Marking Information for Protected Power Switch Devices
Part Tape & Reel Standard Package Part Agency
Number Quantity Quantity Marking Recognition
RYC8210-1M 2,500 10,000 8210-1M UL
RYC8210-1MM 2,500 10,000 8210-1MM UL
RYC8210-2M 2,500 10,000 8210-2M UL
RYC8210-2MM 2,500 10,000 8210-2MM UL
RYC8210-3M 2,500 10,000 8210-3M UL
RYC8210-4M 2,500 10,000 8210-4M UL
RYC8220-1M 2,500 10,000 8220-1M UL
RYC8220-2M 2,500 10,000 8220-2M UL
RYC8220-3M 2,500 10,000 8220-3M UL
RYC8220-4M 2,500 10,000 8220-4M UL
RYC8240-1WM 2,500 10,000 8240-1WM UL
RYC8240-2WM 2,500 10,000 8240-2WM UL
Agency Recognition for Protected Power Switch Devices
UL File # E211484
Part Numbering System for Protected Power Switch Devices
RYC82 20 –3M
Number of ports
1 – 1 port
2 – 2 ports
4 – 4 ports
Enable and resistor indicator
1 – Enable high/with internal resistor
2 – Enable low/with internal resistor
3 – Enable high/without internal resistor
4 – Enable low/without internal resistor
Package type indicator
M – SO-8
MM – TSSOP-8
WM – SO-16
Product Series
4
340 Protected Power Switch Devices Raychem Circuit Protection
Table P6. Tape and Reel Specifications for Protected Power Switch Devices
Protected power switch devices are supplied on tape and reel per EIA481-2 standards. See Figures P28
and P29 on the next page for details.
Dimension Description SO-8 SO-16
Dimension (mm) Tolerance Dimension (mm) Tolerance
W 12 ±0.3 16 ±0.3
P04.0 ±0.10 4.0 ±0.10
P18.0 ±0.10 8.0 ±0.10
P22.0 ±0.10 2.0 ±0.10
A06.40 ±0.10 6.55 ±0.10
B05.2 ±0.10 10.38 ±0.10
B1max. 6.0 — 11.18 —
D01.55 ±0.05 1.55 ±0.05
F 7.5 ±0.10 7.5 ±0.10
E11.75 ±0.10 1.75 ±0.10
E2min. 10.25 — 14.25 —
T max. 0.3 ±0.05 0.3 ±0.05
T1max 0.1 — 0.1 —
K02.10 ±0.1 2.10 ±0.1
Leader min. 390 — 390 —
Trailer min. 160 — 160 —
Reel Dimensions
A max 340 — 340 —
N min. 50 — 50 —
W112.4 +2.0,-0 12.4 +2.0,-0
W2max. 16.4 — 16.4 —
Raychem Circuit Protection Protected Power Switch Devices 341
4
Protected Power Switch Devices
A
W2 (measured at hub
)
W1 (measured at hub)
N (hub dia.)
Cover tape
Embossed cavity
Carrier tape
Figure P29. EIA Reel Dimensions
Cover tape
Center lines
of cavity
T
K0
D0P2
P0
E1
Embossment
E2
FW
B0
A0
P1
T1
B1
Figure P28. EIA Taped Component Dimensions
342 Protected Power Switch Devices Raychem Circuit Protection
4
• Operation beyond the maximum ratings or improper use may result in device damage and possible electrical
arcing and flame.
• The devices are intended for protection against occasional overcurrent fault conditions and should not
be used when repeated fault conditions or prolonged trip events are anticipated.
• Device performance can be impacted negatively if devices are handled in a manner inconsistent with
recommended electronic, thermal, and mechanical procedures for electronic components.
WARNING:
