AP2501A/AP2511A Green 2.5A SINGLE CHANNEL CURRENT - LIMITED POWER SWITCH Description Pin Assignments The AP2501A and AP2511A are single channel current-limited integrated high-side power switches optimized for Universal Serial Bus (USB) and other hot-swap applications. The family of devices complies with USB standards and is available with both polarities of Enable input. The devices have fast short-circuit response time for improved overall system robustness, and include integrated output discharge function to ensure completely controlled discharging of the output voltage capacitor. They provide a complete protection solution for applications subject to heavy capacitive loads and the prospect of short circuit, and offer reverse current blocking, over-current, overtemperature and short-circuit protection, as well as controlled rise time and under-voltage lockout functionality. A 7ms deglitch capability on the open-drain Flag output prevents false overcurrent reporting and does not require any external components. All devices are available in SO-8, MSOP-8, U-DFN3030-8 and U-DFN2020-6 packages. (Top View) GND IN IN EN 8 NC 2 7 OUT 3 6 OUT 4 5 FLG Applications UL Recognized, File Number E322375 IEC60950-1 CB Scheme Certified Moisture Sensitivity: Level 1 per J-STD-020 Notes: IN OUT IN OUT EN FLG (SO-8) (Top View) (Top View) Features NC U-DFN3030-8 Type E U-DFN2020-6 GND 1 MSOP-8EP, Single channel current-limited power switch Output discharge function Fast short-circuit response time: 2s 3.7A accurate current limiting (typ) Reverse current blocking 70m on-resistance (typ) Input voltage range: 2.7V - 5.5V Built-in soft-start with 0.6ms typical rise time Overcurrent and thermal protection Fault report (FLG) with blanking time (7ms typ) ESD protection: 2KV HBM, 200V MM Active low (AP2501A) or active high (AP2511A) enable Ambient temperature range: -40C to +85C SO-8, MSOP-8, MSOP-8EP, U-DFN3030-8 and U-DFN2020-6: Available in "Green" Molding Compound (No Br, Sb) Lead-Free Finish; RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. "Green" Device (Note 3) (Top View) GND 1 8 NC IN 2 7 OUT IN EN 3 6 4 5 OUT FLG MSOP-8/MSOP-8EP Note: Latter with exposed pad (dotted line) LCD TVs & Monitors Set-Top-Boxes, Residential Gateways Laptops, Desktops, Servers, E-Readers Printers, Docking Stations, HUBs 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated's definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green" products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. AP2501A/AP2511A Document number: DS37745 Rev. 4 - 2 1 of 19 www.diodes.com November 2015 (c) Diodes Incorporated AP2501A/AP2511A Typical Applications Circuit Enable Active High (AP2511A) IN Power Supply 2.7V to 5.5V 0.1uF 0.1uF 10k Load OUT 120uF FLG EN ON GND OFF Available Options Part Number Channel Enable Pin (EN) AP2501A 1 Active Low AP2511A 1 Active High Recommended Maximum Continuous Load Current (A) 2.5A Typical Current Limit (A) Package 3.7A SO-8 MSOP-8 MSOP-8EP U-DFN3030-8 U-DFN2020-6 Pin Descriptions Pin Number SO-8, MSOP-8 1 Pin Name MSOP-8EP, U-DFN3030-8 GND 1 IN 2, 3 2, 3 EN 4 4 FLG 5 5 OUT NC 6, 7 8 6, 7 8 Exposed Pad Exposed Pad Not applicable AP2501A/AP2511A Document number: DS37745 Rev. 4 - 2 Function U-DFN2020-6 2 1 Ground Voltage Input Pin. Connect a 0.1F or larger ceramic capacitor from IN to GND as close as possible. (all IN pins must be tied together externally) 3 Enable Input. Active low (AP2501A) or active high (AP2511A). Over-temperature and over-current fault reporting with 7ms deglitch; active 4 low open-drain output. FLG is disabled for 7ms after turn-on. 5 Voltage Output Pin (all OUT pins must be tied together externally) 6 No internal connection; recommend tie to OUT pins. Exposed pad. It should be externally connected to GND and thermal mass for Exposed Pad enhanced thermal impedance. It should not be used as electrical ground conduction path. 2 of 19 www.diodes.com November 2015 (c) Diodes Incorporated AP2501A/AP2511A Functional Block Diagram Current Sense IN OUT Discharge Control UVLO Current Limit Driver EN FLG Deglitch Thermal Sense GND Absolute Maximum Ratings (@TA = +25C, unless otherwise specified.) Symbol ESD HBM ESD MM VIN VOUT VEN , VFLG ILOAD TJMAX TST Notes: Parameter Human Body Model ESD Protection Machine Model ESD Protection Input Voltage (Note 4) Output Voltage (Note 4) Enable Voltage (Note 4) Maximum Continuous Load Current Maximum Junction Temperature Storage Temperature Range (Note 5) Rating 2 200 -0.3 to +6.5 -0.3 to VIN +0.3 or 6.5 -0.3 to VIN +0.3 0r 6.5 Internal Limited +150 -65 to +150 Unit KV V V V V A C C 4. All voltages referred to GND pin. Maximums are the lower of (VIN + 0.3V) and 6.5V. 5. UL Recognized Rating from -30C to +70C (Diodes qualified TST from -65C to +150C). Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices Recommended Operating Conditions (@TA = +25C, unless otherwise specified.) Symbol Note: Parameter VIN Input Voltage IOUT Output Current VIH High-Level Input Voltage on EN VIL Low-Level Input Voltage on EN TA Operating Ambient Temperature (Note 6) Min Max Unit 2.7 5.5 V 0 2.5 A 2.0 VIN V 0 0.8 V -40 +85 C 6. TA(MAX) = +70C if VIN 4.1V and IOUT = 2.5A to keep device from going into thermal protection. AP2501A/AP2511A Document number: DS37745 Rev. 4 - 2 3 of 19 www.diodes.com November 2015 (c) Diodes Incorporated AP2501A/AP2511A Electrical Characteristics Symbol VUVLO VUVLO ISHDN IQ ILEAK IREV RDS(ON) ILIMIT ITRIG (@ TA = +25C, VIN = +5.0V, CIN = 0.1F, CL = 1F, unless otherwise specified.) Parameter Input UVLO Input UVLO Hysteresis Input Shutdown Current Input Quiescent Current Input Leakage Current Reverse Leakage Current Switch on-Resistance ISHORT TSHORT VIL VIH ILEAK-EN ILEAK-O TD(ON) TR TD(OFF) TF RFLG IFOH Overload Current Limit (Note 7) Current Limiting Trigger Threshold Short-Circuit Current Limit Short-Circuit Response Time EN Input Logic Low Voltage EN Input Logic High Voltage EN Input Leakage Output Leakage Current Output turn-on Delay Time Output turn-on Rise Time Output turn-off Delay Time Output turn-off Fall Time FLG output FET on-Resistance FLG Off Current TBLANK FLG Blanking Time TDIS RDIS TSHDN THYS Discharge Time Discharge Resistance (Note 8) Thermal Shutdown Threshold Thermal Shutdown Hysteresis JA Notes: Thermal Resistance Junction-toAmbient Conditions (Note 7) VIN rising VIN decreasing Disabled, OUT = open Enabled, OUT = open Disabled, OUT grounded Disabled, VIN = 0V, VOUT = 5V, IREV at VIN TA = 25oC VIN = 5V, IOUT = 1A -40C TA +85C TA = 25C VIN = 3.3V, IOUT = 1A -40C TA +85C VIN = 5V, VOUT = 4.5V -40C TA +85C Output Current Slew rate (<100A/s) Enabled into short circuit VOUT = 0V to IOUT = ILIMIT (OUT shorted to ground) VIN = 2.7V to 5.5V VIN = 2.7V to 5.5V VIN = 5V, VEN = 0V and 5.5V Disabled, VOUT = 0V CL = 1F, RLOAD = 5 CL = 1F, RLOAD = 5 CL = 1F, RLOAD = 5 CL = 1F, RLOAD = 5 IFLG = 10mA VFLG = 5V Assertion or deassertion due to overcurrent and over-temperature condition CL= 1F, VIN = 5V, disabled to VOUT < 0.5V VIN = 5V, disabled, IOUT = 1mA Enabled - Min 1.6 2.8 2 - Typ 2.0 50 0.1 60 0.1 0.01 70 90 3.7 3.7 3.7 2 0.01 0.5 0.1 0.6 0.1 0.05 20 0.01 Max 2.4 0.10 40 1.00 A A A s V V A A ms ms ms ms A 4 7 15 ms - 0.6 105 +140 +20 - ms C C SO-8 (Note 9) - 96 - C/W MSOP-8 (Note 9) - 130 - C/W MSOP-8EP (Note 10) - 92 - C/W U-DFN3030-8 (Note 10) U-DFN2020-6 (Note 11) - 84 90 - C/W C/W 1.0 100 1.0 1.00 78 105 108 135 4.6 0.8 1.00 1 1.5 Unit V mV A A A A m 7. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately. 8. The discharge function is active when the device is disabled (when enable is de-asserted or during power-up power-down when VIN < VUVLO). The discharge function offers a resistive discharge path for the external storage capacitor for limited time. 9. Device mounted on 2" x 2" FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout. 10. Device mounted on 2" x 2" FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane. 11. Device mounted on 1" x 1" FR-4 substrate PCB, 2oz copper, with minimum recommended padon top layer and thermal vias to bottom layer ground plane. AP2501A/AP2511A Document number: DS37745 Rev. 4 - 2 4 of 19 www.diodes.com November 2015 (c) Diodes Incorporated AP2501A/AP2511A Typical Performance Characteristics VEN 50% TD(ON) TD(ON) 90% 10% 10% TD(OFF) TR TF 90% 50% 50% TD(OFF) TR VOUT VEN 50% VOUT TF 90% 10% 90% 10% Figure 1 Voltage Waveforms: AP2501A (left), AP2511A (right) All Enable Plots are for Enable Active Low Turn-On Delay and Rise Time Vout 2V/div Turn-Off Delay and Fall Time TA=25C Vin=5V CL=1uF Rout=2.5 Ven 5V/div TA=25C Vin=5V CL=1uF Rout=2.5 Vout 2V/div Ven 5V/div Device Enable Device Disable Iin 1A/div Iin 1A/div Turn-On Delay and Rise Time Turn-Off Delay and Fall Time TA=25C Vin=5V CL=120uF Rout=2.5 Vout 2V/div TA=25C Vin=5V CL=120uF Rout=2.5 Vout 2V/div Ven 5V/div Device Enable Ven 5V/div Device Disable Iin 1A/div AP2501A/AP2511A Document number: DS37745 Rev. 4 - 2 Iin 1A/div 5 of 19 www.diodes.com November 2015 (c) Diodes Incorporated AP2501A/AP2511A Typical Performance Characteristics (continued) Device Enabled Into Short-Circuit Ven 5V/div TA=25C Vin=5V CL=120uF Rout=1 Inrush Current Ven 5V/div CL=470uF CL=220uF Iin 1A/div Iin 1A/div Full-Load to Short-Circuit Transient Response CL=120uF Short-Circuit to Full-Load Recovery Response TA=25C Vin=5V Rout=2 Output Short Circuit Vout 2V/div TA=25C Vin=5V CL=120uF,220uF,470uF Rout=2.5 Output Short Circuit Removed TA=25C Vin=5V Rout=2 Vout 2V/div Iin 2A/div Device Turns off and Re-enables Into Current-Limit Iin Short Circuit Present Device 2A/div Thermal Cycles FLG 5V/div FLG 5V/div No-Load to Short-Circuit Transient Response Vout 2V/div Iin 2A/div Output Short Circuit TA=25C Vin=5V Short-Circuit to No-Load Recovery Response Output Short Circuit Removed Vout 2V/div TA=25C Vin=5V Device Enable Current-Limit FLG 5V/div AP2501A/AP2511A Document number: DS37745 Rev. 4 - 2 Iin 2A/div FLG 5V/div 6 of 19 www.diodes.com Short Circuit Present Device Thermal Cycles November 2015 (c) Diodes Incorporated AP2501A/AP2511A Typical Performance Characteristics (cont.) Power ON FLG 5V/div Short-Circuit with Blanking Time and Recovery FLG 5V/div TA=25C Vin=5V Rout=2.5 CL=120uF Iout 1A/div TA=25C Vin=5V Vout 5V/div Vout 5V/div Iout 2A/div Vin 5V/div UVLO Increasing UVLO Decreasing Vout 2A/div Vout 2V/div TA=25C Vin=5V Rout=33 CL=120uF Vin 2V/div TA=25C Vin=5V Rout=33 CL=120uF Vin 2A/div AP2501A/AP2511A Document number: DS37745 Rev. 4 - 2 7 of 19 www.diodes.com November 2015 (c) Diodes Incorporated AP2501A/AP2511A 150 140 130 120 110 100 90 80 70 60 50 40 30 TURN-ON TIME (s) 20 10 0 2.0 200 TURN-OFF TIME (s) CL = 1F 3.0 3.5 4.0 4.5 5.0 5.5 INPUT VOLTAGE (V) Turn-On Time vs. Input Voltage 100 80 60 20 0 6.0 2.0 900 90 800 80 700 70 600 500 400 300 CL = 1F 200 3.5 4.0 4.5 5.0 5.5 INPUT VOLTAGE (V) Rise Time vs. Input Voltage 100 VIN = 5.5V 90 VIN = 5V 70 60 VIN = 2.7V 50 VIN =3.3V 40 30 20 10 0 -50 -25 0 25 50 75 100 125 TEMPERATURE (C) Supply Current, Output Enabled vs. Temperature AP2501A/AP2511A Document number: DS37745 Rev. 4 - 2 3.5 4.0 4.5 5.0 5.5 INPUT VOLTAGE (V) Turn-Off Time vs. Input Voltage 6.0 CL = 1F RL = 5 TA = 25C 60 50 40 30 0 2.0 6.0 SUPPLY CURRENT OUTPUT DISABLED (A) 3.0 3.0 10 0 2.5 2.5 20 RL = 5 TA = 25C 100 SUPPLY CURRENT OUTPUT ENABLED (A) 120 40 RL = 5 TA = 25C 2.5 140 100 80 R L = 5 TA = 25C 160 1000 2.0 C L = 1F 180 FALL TIME (s) TURN-ON TIME (s) Typical Performance Characteristics (cont.) 8 of 19 www.diodes.com 2.5 3.0 3.5 4.0 4.5 5.0 5.5 INPUT VOLTAGE (V) Rise Time vs. Input Voltage 6.0 0.30 0.25 0.20 VIN = 5.5V 0.15 VIN = 5V 0.10 0.05 0.00 -0.05 VIN = 2.7V VIN =3.3V -0.10 -0.15 -0.20 -0.25 -0.30 -50 -25 0 25 50 75 100 125 TEMPERATURE (C) Supply Current, Output Disabled vs. Temperature November 2015 (c) Diodes Incorporated AP2501A/AP2511A 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 -50 SHORT-CIRCUIT OUTPUT CURRENT(A) R DS(ON) (m) Typical Performance Characteristics (cont.) VIN = 2.7V VIN =3.3V VIN = 5.5V VIN = 5V -25 0 25 50 75 100 TEMPERATURE (C) RDS(ON) vs. Temperature 4.5 4.4 4.3 4.2 4.1 4.0 3.9 3.8 3.7 3.6 3.5 3.4 33 VIN =3.3V VIN = 5V 3.2 3.1 3.0 -50 -25 4.5 CL = 120F TA = 25C 2.1 2.0 UVLO Rising 1.9 UVLO Falling 1.8 1.7 THRESHOLD TRIP CURRENT(A) 4.4 UNDERVOLTAGE LOCKOUT (V) VIN = 5.5V 0 25 50 75 100 125 TEMPERATURE (C) Short-Circuit Output Current vs. Temperature 125 2.2 1.6 -50 VIN = 2.7V 4.1 4.0 3.9 3.8 3.7 3.6 3.0 3.5 4.0 4.5 5.0 5.5 6.0 INPUT VOLTAGE (V) Threshold Trip Current vs. Input Voltage 0 25 50 75 100 125 TEMPERATURE (C) Undervoltage Lockout vs. Temperature Document number: DS37745 Rev. 4 - 2 4.2 3.5 2.0 2.5 -25 AP2501A/AP2511A 4.3 9 of 19 www.diodes.com November 2015 (c) Diodes Incorporated AP2501A/AP2511A Application Note Power Supply Considerations A 0.1F to 2.2F X7R or X5R ceramic bypass capacitor placed between IN and GND, close to the device, is recommended. When an external power supply is used, or an additional ferrite bead is added to the input, high inrush current may cause voltage spikes higher than the device maximum input rating during short circuit condition. In this case a 2.2F or bigger capacitor is recommended. Placing a high-value electrolytic capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.1F to 1.0F ceramic capacitor improves the immunity of the device to short circuit transients. Overcurrent and Short Circuit Protection An internal sensing FET is employed to check for overcurrent conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN has been applied. The AP2501A/AP2511A senses the short circuit and immediately clamps output current to a certain safe level namely ISHORT. In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher inrush current may flow for a very short period of time before the current limit function can react. The input capacitor(s) rapidly discharge through the device, activating current limit circuitry. Protection is achieved by momentarily opening the P-MOS high-side power switch and then gradually turning it on. After the current limit function has tripped (reached the overcurrent trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT. In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2501A/AP2511A is capable of delivering current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode and is set at ILIMIT. FLG Response When an overcurrent or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms deglitch timeout. The FLG output remains low until both overcurrent and over-temperature conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary overcurrent condition, which does not trigger the FLG due to the 7-ms deglitch timeout. The AP2501A/AP2511A is designed to eliminate false overcurrent reporting without the need of external components to remove unwanted pulses. Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by: PD = RDS(ON) x I 2 Finally, calculate the junction temperature: TJ = PD x RJA + TA Where: TA = Ambient temperature C RJA = Thermal resistance PD = Total power dissipation Thermal Protection Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The AP2501A/AP2511A implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately 140C due to excessive power dissipation in an overcurrent or short-circuit condition the internal thermal sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to cool down approximately 20C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or overcurrent occurs with 7-ms deglitch. AP2501A/AP2511A Document number: DS37745 Rev. 4 - 2 10 of 19 www.diodes.com November 2015 (c) Diodes Incorporated AP2501A/AP2511A Application Note (continued) Undervoltage Lockout (UVLO) Undervoltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 2V, even if the switch is enabled. Whenever the input voltage falls below approximately 2V, the power switch is quickly turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. Discharge Function The discharge function of the device is active when enable is disabled or de-asserted. The discharge function with the N-MOS power switch implementation is activated and offers a resistive discharge path for the external storage capacitor. This is designed for discharging any residue of the output voltage when either no external output resistance or load resistance is present at the output. Dual-Purpose Port Applications AP2501A/AP2511A requires special consideration for use in dual-purpose port applications in which a single port is used for data communication between the host and peripheral devices while simultaneously maintaining a charge to the battery of the peripheral device. An example of such application is a shared HDMI/MHL (Mobile High-definition Link) port that allows streaming video between an HDTV or set-top box and a smartphone or tablet while maintaining a charge to the smartphone or tablet battery. Since the AP2501A/AP2511A includes an embedded discharge feature that discharges the output load of the device when the device is disabled, the batteries of the connected peripheral device will be subject to continual discharge whenever the AP2501A/AP2511A is disabled. An overstress condition to the device's discharge MOS transistor may result. In addition, if the output of the AP2501A/AP2511A is subjected to a constant voltage that would be present during a dual-purpose port application such as MHL, an overstress condition to the device may result. AP2501A/AP2511A Document number: DS37745 Rev. 4 - 2 11 of 19 www.diodes.com November 2015 (c) Diodes Incorporated AP2501A/AP2511A Ordering Information AP25X 1 A X -X Enable Channel 0 : Active Low 1 : Active High 1 : 1 Channel Packing Package Part Number Package Code Packaging AP25X1AS-13 AP25X1AM8-13 AP25X1AMP-13 AP25X1AFGE-7 AP25X1ASN-7 S M8 MP FGE SN SO-8 MSOP-8 MSOP-8EP U-DFN3030-8 U-DFN2020-6 S: SO-8 7 : 7" Tape & Reel M8 : MSOP-8 13 : 13" Tape & Reel MP : MSOP-8EP FGE : U-DFN3030-8 7"/13" Tape and Reel Quantity Part Number Suffix 2,500/Tape & Reel -13 2,500/Tape & Reel -13 2,500/Tape & Reel -13 3,000/Tape & Reel -7 3,000/Tape & Reel -7 Marking Information (1) SO-8 ( Top view ) 8 7 6 5 Logo Part Number 0 : Active Low 1 : Active High YY WW XX 2 1 (2) YY : Year : 08, 09,10~ WW : Week : 01~52; 52 represents 52 and 53 week X : Internal Code AP25X 1 A 3 4 MSOP-8 ( Top view ) 8 7 Logo Y : Year : 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : Internal Code AP25X1A 1 Document number: DS37745 Rev. 4 - 2 5 YWX Part Number 0 : Active Low 1 : Active High AP2501A/AP2511A 6 2 3 4 12 of 19 www.diodes.com November 2015 (c) Diodes Incorporated AP2501A/AP2511A Marking Information (continued) (3) MSOP-8EP ( Top view ) 8 7 Logo 5 YWXE Part Number 0 : Active Low 1 : Active High AP25X1A 1 (4) 6 2 3 MSOP-8EP Y : Year : 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : Internal Code 4 U-DFN3030-8 ( Top View ) XX YW X Part Number AP2501AFGE-7 AP2511AFGE-7 (5) XX : Identification Code Y : Year : 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : A~Z : Internal Code Package U-DFN3030-8 U-DFN3030-8 Identification Code 5W 5X U-DFN2020-6 ( Top View ) XX YW X Part Number AP2501ASN-7 AP2511ASN-7 AP2501A/AP2511A Document number: DS37745 Rev. 4 - 2 XX : Identification Code Y : Year : 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : A~Z : Internal Code Package U-DFN2020-6 U-DFN2020-6 13 of 19 www.diodes.com Identification Code 5Y 5Z November 2015 (c) Diodes Incorporated AP2501A/AP2511A Package Outline Dimensions (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. Package type: SO-8 0.254 1. E1 E Gauge Plane Seating Plane A1 L Detail `A' 7~9 h 45 Detail `A' A2 A A3 b e SO-8 Dim Min Max A 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25 b 0.3 0.5 D 4.85 4.95 E 5.90 6.10 E1 3.85 3.95 e 1.27 Typ h 0.35 L 0.62 0.82 0 8 All Dimensions in mm D 2. Package type: MSOP-8 D 4x 10 0.25 E Gauge Plane x Seating Plane a y 4x10 L Detail C 1 b E3 A3 A2 A e A1 AP2501A/AP2511A Document number: DS37745 Rev. 4 - 2 E1 c See Detail C 14 of 19 www.diodes.com MSOP-8 Dim Min Max Typ A 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 D 2.90 3.10 3.00 E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E3 2.85 3.05 2.95 e 0.65 L 0.40 0.80 0.60 a 0 8 4 x 0.750 y 0.750 All Dimensions in mm November 2015 (c) Diodes Incorporated AP2501A/AP2511A Package Outline Dimensions (continued) (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. 3. Package type: MSOP-8EP D 4X 10 0.25 D1 x E E2 Gauge Plane Seating Plane a y 1 4X 10 8Xb e Detail C E3 A1 L A3 c A2 A D E1 See Detail C 4. MSOP-8EP Dim Min Max Typ A 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 D 2.90 3.10 3.00 D1 1.60 2.00 1.80 E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E2 1.30 1.70 1.50 E3 2.85 3.05 2.95 e 0.65 L 0.40 0.80 0.60 a 0 8 4 x 0.750 y 0.750 All Dimensions in mm Package type: U-DFN3030-8 Type E A A3 U-DFN3030-8 Type E Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.02 A3 0.15 b 0.20 0.30 0.25 D 2.95 3.05 3.00 D2 2.15 2.35 2.25 E 2.95 3.05 3.00 e 0.65 E2 1.40 1.60 1.50 L 0.30 0.60 0.45 Z 0.40 All Dimensions in mm A1 D D2 L (x8) E E2 Z (x4) 5. e b (x8) Package type: U-DFN2020-6 A1 A3 A Seating Plane D D2 D2/2 R0 E E2 0 .10 E2/2 Pin #1 ID U-DFN2020-6 Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.03 A3 0.15 b 0.20 0.30 0.25 D 1.95 2.075 2.00 D2 1.45 1.65 1.55 e 0.65 E 1.95 2.075 2.00 E2 0.76 0.96 0.86 L 0.30 0.40 0.35 All Dimensions in mm L e AP2501A/AP2511A Document number: DS37745 Rev. 4 - 2 b 15 of 19 www.diodes.com November 2015 (c) Diodes Incorporated AP2501A/AP2511A Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. (1) Package type: SO-8 X Dimensions X Y C1 C2 C1 C2 Value (in mm) 0.60 1.55 5.4 1.27 Y (2) Package type: MSOP-8 X C Y Dimensions Value (in mm) C 0.650 X 0.450 Y 1.350 Y1 5.300 Y1 (3) Package type: MSOP-8EP X C Dimensions C G X X1 Y Y1 Y2 Y G Y2 Y1 X1 AP2501A/AP2511A Document number: DS37745 Rev. 4 - 2 16 of 19 www.diodes.com Value (in mm) 0.650 0.450 0.450 2.000 1.350 1.700 5.300 November 2015 (c) Diodes Incorporated AP2501A/AP2511A Suggested Pad Layout (continued) Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. (4) Package type: U-DFN3030-8 Type E X (x8) C Y (x8) Y1 Dimensions C C1 X Y Y1 Y2 Y2 Value (in mm) 0.65 2.35 0.30 0.65 1.60 2.75 C1 (5) Package type: U-DFN2020-6 X C G Y Dimensions C G X X1 Y Y1 Y1 Value (in mm) 0.65 0.15 0.37 1.67 0.45 0.90 G X X1 AP2501A/AP2511A Document number: DS37745 Rev. 4 - 2 17 of 19 www.diodes.com November 2015 (c) Diodes Incorporated AP2501A/AP2511A Taping Orientation (Note 12) For U-DFN2020-6 and U-DFN3030-8 Type E Note: 12. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf. AP2501A/AP2511A Document number: DS37745 Rev. 4 - 2 18 of 19 www.diodes.com November 2015 (c) Diodes Incorporated AP2501A/AP2511A IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. 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Copyright (c) 2015, Diodes Incorporated www.diodes.com AP2501A/AP2511A Document number: DS37745 Rev. 4 - 2 19 of 19 www.diodes.com November 2015 (c) Diodes Incorporated