LMH6703 LMH6703 1.2 GHz, Low Distortion Op Amp with Shutdown Literature Number: SNOSAF2C LMH6703 1.2 GHz, Low Distortion Op Amp with Shutdown General Description Features The LMHTM6703 is a very wideband, DC coupled monolithic operational amplifier designed specifically for ultra high resolution video systems as well as wide dynamic range systems requiring exceptional signal fidelity. Benefiting from National's current feedback architecture, the LMH6703 offers a practical gain range of 1 to 10 while providing stable operation without external compensation, even at unity gain. At a gain of +2 the LMH6703 supports ultra high resolution video systems with a 750 MHz 2 VPP -3 dB Bandwidth. With 12-bit distortion levels through 10 MHz (RL = 100), and a input referred noise, the LMH6703 is the ideal 2.3nV/ driver or buffer for high speed flash A/D and D/A converters. Wide dynamic range systems such as radar and communication receivers requiring a wideband amplifier offering exceptional signal purity will find the LMH6703's low input referred noise and low harmonic distortion an attractive solution. n n n n n n n -3 dB bandwidth (VOUT = 0.5 VPP, AV = +2) 1.2 GHz 2nd/3rd harmonics (20 MHz, SOT23-6) -69/-90 dBc Low noise 2.3nV/ Fast slew rate 4500 V/s Supply current 11 mA Output current 90 mA Low differential gain and phase 0.01%/0.02 Applications n n n n n n n n RGB video driver High resolution projectors Flash A/D driver D/A transimpedance buffer Wide dynamic range IF amp Radar/communication receivers DDS post-amps Line driver Connection Diagrams 8-pin SOIC 6-pin SOT23 20110601 Top View 20110602 Top View Ordering Information Package 8-Pin SOIC 6-Pin SOT23 Part Number Package Marking LMH6703MA LMH6703MA LMH6703MAX LMH6703MF AR1A LMH6703MFX Transport Media 95 Units/Rail 2.5k Units Tape and Reel 1k Units Tape and Reel 3k Units Tape and Reel NSC Drawing M08A MF06A LMHTM is a trademark of National Semiconductor Corporation. (c) 2005 National Semiconductor Corporation DS201106 www.national.com LMH6703 1.2 GHz, Low Distortion Op Amp with Shutdown May 2005 LMH6703 Absolute Maximum Ratings (Note 1) Soldering Information If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. ESD Tolerance (Note 5) Human Body Model IOUT (Note 3) V- to V+ Maximum Junction Temperature Storage Temperature Range -40C to +85C 4V to 6V Supply Voltage Range 6.75V Common Mode Input Voltage 260C Operating Temperature Range 200V VS 235C Wave Soldering (10 sec.) Operating Ratings (Note 1) 2000V Machine Model Infrared or Convection (20 sec.) Package Thermal Resistance (JA) (Note 4) +150C 6-Pin SOT23 208C/W 8-Pin SOIC 160C/W -65C to +150C Electrical Characteristics (Note 2) Unless otherwise specified, all limits guaranteed for TJ = 25C, AV = +2, VS = 5V, RL = 100, RF = 560, SD = Floating. Boldface limits apply at the temperature extremes. Symbol Parameter Conditions Min (Note 8) Typ (Note 7) Max (Note 8) Units Frequency Domain Performance SSBW -3 dB Bandwidth LSBW GF 0.1 dB Gain Flatness VOUT = 0.5 VPP, AV = +1 1800 VOUT = 0.5 VPP, AV = +2 1200 VOUT = 2 VPP 750 VOUT = 4 VPP 500 VOUT = 0.5 VPP 150 VOUT = 2 VPP 150 MHz MHz DG Differential Gain RL = 150, 4.43 MHz 0.01 % DP Differential Phase RL = 150, 4.43 MHz 0.02 deg 2V Step, 10% to 90% 0.5 ns 6V Step, 10% to 90% 1.05 ns 2V Step, 10% to 90% 0.5 ns 6V Step, 10% to 90% 1.05 ns 4V Step, 10% to 90% (Note 6) 4200 V/s 6V Step, 10% to 90% (Note 6) 4500 V/s 2V Step, VOUT within 0.1% 10 ns 2 VPP, 5 MHz, SOT23-6 -87 2 VPP, 20 MHz, SOT23-6 -69 2 VPP, 50 MHz, SOT23-6 -60 2 VPP, 5 MHz, SOT23-6 -100 2 VPP, 20 MHz, SOT23-6 -90 2 VPP, 50 MHz, SOT23-6 -70 50 MHz, PO = 5 dBm/ tone -80 Time Domain Response tr tf SR ts Rise Time Fall Time Slew Rate Settling Time Distortion And Noise Response HD2 HD3 2nd Harmonic Distortion 3rd Harmonic Distortion dBc dBc IMD 3rd Order Intermodulation Products en Input Referred Voltage Noise > 1 MHz 2.3 nV/ in Input Referred Noise Current Inverting Pin > 1 MHz 18.5 pA/ Input Referred Noise Current Non-Inverting Pin > 1 MHz 3 pA/ dBc Static, DC Performance VOS 1.5 Input Offset Voltage www.national.com 2 7 9 mV LMH6703 Electrical Characteristics (Note 2) (Continued) Unless otherwise specified, all limits guaranteed for TJ = 25C, AV = +2, VS = 5V, RL = 100, RF = 560, SD = Floating. Boldface limits apply at the temperature extremes. Symbol TCVOS Parameter Conditions Min (Note 8) Typ (Note 7) Input Offset Voltage Average Drift (Note 10) 22 Input Bias Current Non-Inverting (Note 9) -7 Inverting (Note 9) -2 Non-Inverting (Note 10) +30 Inverting (Note 10) -70 IB TCIB Input Bias Current Average Drift VO Output Voltage Range RL = RL = 100 3.3 3.2 3.14 3.45 3.4 Max (Note 8) Units V/C 20 23 35 44 A nA/C V PSRR Power Supply Rejection Ratio VS = 4.0V to 6.0V 48 46 52 CMRR Common Mode Rejection Ratio VCM = -1.0V to +1.0V 45 44 47 IS Supply Current (Enabled) SD = 2V, RL = 11 12.5 15.0 mA Supply Current (Disabled) SD = 0.8V, RL = 0.2 0.900 0.935 mA 1 M Output Impedance of Input Buffer 30 0.8 pF 0.05 dB dB Miscellaneous Performance RIN+ Non-Inverting Input Resistance RIN- Inverting Input Resistance CIN Non-Inverting Input Capacitance RO Output Resistance Closed Loop CMVR Input Common Mode Voltage Range CMRR 40 dB 1.9 IO Linear Output Current VIN = 0V, VOUT 80 mV 55 V 90 mA Enable/Disable Performance (Disabled Low) TON Enable Time 10 ns TOFF Disable Time 10 ns 50 mVPP Output Glitch VIH Enable Voltage SD VIH VIL Disable Voltage SD VIL IIH Disable Pin Bias Current, High SD = V+ (Note 9) IIL Disable Pin Bias Current, Low SD = 0V (Note 9) IOZ Disabled Output Leakage Current VOUT = 1.8V 2.0 -50 V 0.8 V -7 70 A -240 -400 A 0.07 25 40 A Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications, see the Electrical Characteristics tables. Note 2: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. Note 3: The maximum output current (IOUT) is determined by device power dissipation limitations. Note 4: The maximum power dissipation is a function of TJ(MAX), JA and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) -- TA)/ JA. All numbers apply for package soldered directly into a 2 layer PC board with zero air flow. Note 5: Human body model: 1.5 k in series with 100 pF. Machine model: 0 in series with 200 pF. Note 6: Slew Rate is the average of the rising and falling edges. Note 7: Typical numbers are the most likely parametric norm. Note 8: Limits are 100% production tested at 25C. Limits over the operating temperature range are guaranteed through correlation using Statistical Quality Control (SQC) methods. Note 9: Negative input current implies current flowing out of the device. Note 10: Drift determined by dividing the change in parameter at temperature extremes by the total temperature change. 3 www.national.com LMH6703 Typical Performance Characteristics (AV = +2, RL = 100, VS = 5V, RF = 560, TA = +25C, SOT23-6; unless otherwise specified). Small Signal Non-Inverting Frequency Response (SOT23) Large Signal Frequency Response (SOT23) 20110618 20110620 Large Signal Frequency Response (SOT23) Small Signal Inverting Frequency Response (SOT23) 20110621 20110619 Small Signal Non-Inverting Frequency Response (SOIC) Large Signal Frequency Response (SOIC) 20110615 www.national.com 20110616 4 Large Signal Frequency Response (SOIC) Small Signal Pulse Response 20110622 20110617 Large Signal Pulse Response Harmonic Distortion vs. Frequency 20110623 20110624 Harmonic Distortion vs. Output Voltage Harmonic Distortion vs. Load 20110627 20110625 5 www.national.com LMH6703 Typical Performance Characteristics (AV = +2, RL = 100, VS = 5V, RF = 560, TA = +25C, SOT23-6; unless otherwise specified). (Continued) LMH6703 Typical Performance Characteristics (AV = +2, RL = 100, VS = 5V, RF = 560, TA = +25C, SOT23-6; unless otherwise specified). (Continued) 2-Tone 3rd Order Intermodulation Differential Gain 20110626 20110613 Differential Phase Noise 20110632 20110614 CMRR vs. Frequency PSRR vs. Frequency 20110629 20110628 www.national.com 6 Disable Timing Disable Output Glitch 20110631 20110630 RISO vs. CLOAD (See Applications Section) Non-Inverting Input Bias vs. Temperature 20110638 20110608 Inverting Input Bias vs. Temperature Input Offset vs. Temperature 20110609 20110610 7 www.national.com LMH6703 Typical Performance Characteristics (AV = +2, RL = 100, VS = 5V, RF = 560, TA = +25C, SOT23-6; unless otherwise specified). (Continued) LMH6703 Typical Performance Characteristics (AV = +2, RL = 100, VS = 5V, RF = 560, TA = +25C, SOT23-6; unless otherwise specified). (Continued) Supply Current vs. Temperature Voltage Swing vs. Temperature 20110611 www.national.com 20110612 8 An Evaluation Board is shipped upon request when a sample order is placed with National Semiconductor. FEEDBACK RESISTOR SELECTION One of the key benefits of a current feedback operational amplifier is the ability to maintain optimum frequency response independent of gain by using appropriate values for the feedback resistor (RF). The Electrical Characteristics and Typical Performance plots specify an RF of 560 (390 for the SOIC package), a gain of +2 V/V and 5V power supplies (unless otherwise specified). Generally, lowering RF from it's recommended value will peak the frequency response and extend the bandwidth while increasing the value of RF will cause the frequency response to roll off faster. Reducing the value of RF too far below it's recommended value will cause overshoot, ringing and, eventually, oscillation. 20110603 FIGURE 1. Recommended Non-Inverting Gain Circuit (SOIC Pinout Shown) 20110639 FIGURE 3. Recommended RF vs. Gain 20110604 Since a current feedback amplifier is dependant on the value of RF to provide frequency compensation and since the value of RF can be used to optimize the frequency response, different packages use different RF values. As shown in Figure 3, Recommended RF vs. Gain, the SOT23-6 and the SOIC package use different values for the feedback resistor, RF. Since each application is slightly different, it is worth some experimentation to find the optimal RF for a given circuit. In general, a value of RF that produces 0.1 dB of peaking is the best compromise between stability and maximum bandwidth. Note that it is not possible to use a current feedback amplifier with the output shorted directly to the inverting input. The buffer configuration of the LMH6703 requires a 560 (390 for SOIC package) feedback resistor for stable operation. The LMH6703 was optimized for high speed operation. As shown in Figure 3, the suggested value for RF decreases for higher gains. Due to the output impedance of the input buffer, there is a practical limit for how small RF can go, based on the lowest practical value of RG. This limitation applies to both inverting and non inverting configurations. For the LMH6703 the input resistance of the inverting input is approximately 30 and 20 is a practical (but not hard and fast) lower limit for RG. The LMH6703 begins to operate in a gain bandwidth limited fashion in the region when RG is nearly equal to the input buffer impedance. Note that the FIGURE 2. Recommended Inverting Gain Circuit (SOIC Pinout Shown) GENERAL DESCRIPTION The LMH6703 is a high speed current feedback amplifier, optimized for excellent bandwidth, gain flatness, and low distortion. The loop gain for a current feedback op amp, and hence the frequency response, is predominantly set by the feedback resistor value. The LMH6703 in the SOT23-6 package is optimized for use with a 560 feedback resistor. The LMH6703 in the SOIC package is optimized for use with a 390 feedback resistor. Using lower values can lead to excessive ringing in the pulse response while a higher value will limit the bandwidth. Application Note OA-13 discusses this in detail along with the occasions where a different RF might be advantageous. EVALUATION BOARDS Device Package Evaluation Board Part Number LMH6703MF SOT23-6 CLC730216 LMH6703MA SOIC CLC730227 9 www.national.com LMH6703 Application Section LMH6703 Application Section DC ACCURACY AND NOISE (Continued) Example below shows the output offset computation equation for the non-inverting configuration (see Figure 1) using the typical bias current and offset specifications for AV = + 2: amplifier will operate with RG values well below 20, however results may be substantially different than predicted from ideal models. In particular the voltage potential between the Inverting and Non-Inverting inputs cannot be expected to remain small. Inverting gain applications that require impedance matched inputs may limit gain flexibility somewhat (especially if maximum bandwidth is required). The impedance seen by the source is RG || RT (RT is optional). The value of RG is RF /Gain. Thus for a SOT23 in a gain of -- 5V/V, an RF of 460 is optimum and RG is 92. Without a termination resistor, RT, the input impedance would equal RG, 92. Using an RT of 109 will set the input resistance to match a 50 source. Note that source impedances greater then RG cannot be matched in the inverting configuration. Output Offset : VO = (IBN * RIN VOS) (1 + RF/RG) IBI * RF Where RIN is the equivalent input impedance on the noninverting input. Example computation for AV = +2, RF = 560, RIN = 25: VO = (7 A * 25 1.5 mV) (1 + 560/560) 2A * 560 -3.7 mV to 4.5 mV A good design, however, should include a worst case calculation using Min/Max numbers in the data sheet tables, in order to ensure "worst case" operation. Further improvement in the output offset voltage and drift is possible using the composite amplifiers described in Application Note OA-7. The two input bias currents are physically unrelated in both magnitude and polarity for the current feedback topology. It is not possible, therefore, to cancel their effects by matching the source impedance for the two inputs (as is commonly done for matched input bias current devices). For more information see Application Note OA-13 which describes the relationship between RF and closed-loop frequency response for current feedback operational amplifiers. The value for the inverting input impedance for the LMH6703 is approximately 30. The LMH6703 is designed for optimum performance at gains of +1 to +10 V/V and -1 to -9 V/V. Higher gain configurations are still useful, however, the bandwidth will fall as gain is increased, much like a typical voltage feedback amplifier. The LMH6703 data sheet shows both SOT23-6 and SOIC data in the Electrical Characteristic section to aid in selecting the right package. The Typical Performance Characteristics section shows SOT23-6 package plots only. The total output noise is computed in a similar fashion to the output offset voltage. Using the input noise voltage and the two input noise currents, the output noise is developed through the same gain equations for each term but combined as the square root of the sum of squared contributing elements. See Application Note OA-12 for a full discussion of noise calculations for current feedback amplifiers. PRINTED CIRCUIT LAYOUT CAPACITIVE LOAD DRIVE Whenever questions about layout arise, use the evaluation board as a guide. The CLC730216 is the evaluation board supplied with SOT23-6 samples of the LMH6703 and the CLC730227 is the evaluation board supplied with SOIC samples of the LMH6703. To reduce parasitic capacitances, ground and power planes should be removed near the input and output pins. Components in the feedback path should be placed as close to the device as possible to minimize parasitic capacitance. For long signal paths controlled impedance lines should be used, along with impedance matching elements at both ends. Bypass capacitors should be placed as close to the device as possible. Bypass capacitors from each voltage rail to ground are applied in pairs. The larger electrolytic bypass capacitors can be located further from the device, the smaller ceramic bypass capacitors should be placed as close to the device as possible. In Figure 1 and Figure 2 CSS is optional, but is recommended for best second order harmonic distortion. 20110635 FIGURE 4. Decoupling Capacitive Loads Capacitive output loading applications will benefit from the use of a series output resistor RISO. Figure 4 shows the use of a series output resistor, RISO, to stabilize the amplifier output under capacitive loading. Capacitive loads from 5 to 120 pF are the most critical, causing ringing, frequency response peaking and possible oscillation. The chart "Suggested RISO vs. Cap Load" gives a recommended value for selecting a series output resistor for mitigating capacitive loads. The values suggested in the charts are selected for 0.5 dB or less of peaking in the frequency response. This produces a good compromise between settling time and bandwidth. For applications where maximum frequency response is needed and some peaking is tolerable, the value of RISO can be reduced slightly from the recommended values. www.national.com 10 For 5V supplies only the LMH6703 has a TTL logic compatible disable function. Apply a logic low ( < .8V) to the SD pin and the LMH6703 is disabled. Apply a logic high ( > 2.0V), or let the pin float and the LMH6703 is enabled. Voltage, not current, at the Shutdown pin (SD) determines the enable/ disable state. Care must be exercised to prevent the shutdown pin voltage from going more than 0.8V below the midpoint of the supply voltages (0V with split supplies, V+/2 with single supply biasing). Doing so could cause transistor Q1 to Zener resulting in damage to the disable circuit (See Figure 6). The core amplifier is unaffected by this, but the shutdown operation could become permanently slower as a result. (Continued) VIDEO PERFORMANCE Disabled, the LMH6703 inputs and output become high impedances. While disabled the LMH6703 quiescent current is approximately 200 A. Because of the pull up resistor on the shutdown circuit, the ICC and IEE currents (positive and negative supply currents respectively) are not balanced in the disabled state. The positive supply current (ICC) is approximately 300 A while the negative supply current (IEE) is only 200 A. The remaining IEE current of 100 A flows through the shutdown pin. The disable function can be used to create analog switches or multiplexers. Implement a single analog switch with one LMH6703 positioned between an input and output. Create an analog multiplexer with several LMH6703's and tie the outputs together. 20110633 FIGURE 5. Typical Video Application The LMH6703 has been designed to provide excellent performance with production quality video signals in a wide variety of formats such as HDTV and High Resolution VGA. NTSC and PAL performance is nearly flawless with DG of 0.01% and DP of 0.02. Best performance will be obtained with back terminated loads. The back termination reduces reflections from the transmission line and effectively masks transmission line and other parasitic capacitance from the amplifier output stage. Figure 5 shows a typical configuration for driving 75 cable. The amplifier is configured for a gain of two compensating for the 6 dB loss due to ROUT. ENABLE/DISABLE 20110637 FIGURE 6. SD Pin Simplified Schematic (SOT23 Pinout Shown) 11 www.national.com LMH6703 Application Section LMH6703 Physical Dimensions inches (millimeters) unless otherwise noted 8-Pin SOIC NS Package Number M08A 6-Pin SOT23 NS Package Number M06A www.national.com 12 LMH6703 1.2 GHz, Low Distortion Op Amp with Shutdown Notes National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. For the most current product information visit us at www.national.com. LIFE SUPPORT POLICY NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. BANNED SUBSTANCE COMPLIANCE National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ``Banned Substances'' as defined in CSP-9-111S2. Leadfree products are RoHS compliant. National Semiconductor Americas Customer Support Center Email: new.feedback@nsc.com Tel: 1-800-272-9959 www.national.com National Semiconductor Europe Customer Support Center Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Francais Tel: +33 (0) 1 41 91 8790 National Semiconductor Asia Pacific Customer Support Center Email: ap.support@nsc.com National Semiconductor Japan Customer Support Center Fax: 81-3-5639-7507 Email: jpn.feedback@nsc.com Tel: 81-3-5639-7560 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP(R) Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2011, Texas Instruments Incorporated