1
Subject to change without notice.
www.cree.com/power
Datasheet: C2D05120 Rev. -
C2D05120–Silicon Carbide Schottky Diode
Zero recovery® RectifieR
VRRM = 1200 V
IF = 5 A
Qc = 28 nC
Features
1200-Volt Schottky Rectier
Zero Reverse Recovery
Zero Forward Recovery
High-Frequency Operation
Temperature-Independent Switching Behavior
Extremely Fast Swtitching
Positive Temperature Coefcient on VF
Benets
Replace Bipolar with Unipolar Rectiers
Essentially No Switching Losses
Higher Efciency
Reduction of Heat Sink Requirements
Parallel Devices Without Thermal Runaway
Applications
Switch Mode Power Supplies
Power Factor Correction
Motor Drives
High Voltage Multipliers
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Package
TO-220-2
Maximum Ratings
Symbol Parameter Value Unit Test Conditions Note
VRRM Repetitive Peak Reverse Voltage 1200 V
VRSM Surge Peak Reverse Voltage 1200 V
VDC DC Blocking Voltage 1200 V
IF(AVG) Average Forward Current 5
10 ATC=160˚C, DC
TC=125˚C, DC
IF(PEAK) Peak Forward Current 15 A TC=125˚C, TREP<1mS, Duty=0.5
IFRM Repetitive Peak Forward Surge Current 30 A TC=25˚C, tP=8.3 ms, Half Sine Wave
IFSM Non-Repetitive Peak Forward Surge Current 100 A TC=25˚C, tP=10 µs, Pulse
Ptot Power Dissipation 136
45 WTC=25˚C
TC=125˚C
TJ , Tstg Operating Junction and Storage Temperature -55 to
+175 ˚C
Part Number Package Marking
C2D05120A TO-220-2 C2D05120
2C2D05120 Rev. -
Electrical Characteristics
Symbol Parameter Typ. Max. Unit Test Conditions Note
VFForward Voltage 1.6
2.6
1.8
3.0 VIF = 5 A TJ=25°C
IF = 5 A TJ=175°C
IRReverse Current 50
100
200
1000 μA VR = 1200 V TJ=25°C
VR = 1200 V TJ=175°C
QCTotal Capacitive Charge 28 nC
VR = 1200 V, IF = 5 A
di/dt = 500 A/μs
TJ = 25°C
CTotal Capacitance
455
45
33
pF
VR = 0 V, TJ = 25°C, f = 1 MHz
VR = 200 V, TJ = 25˚C, f = 1 MHz
VR = 400 V, TJ = 25˚C, f = 1 MHz
Note:
This is a majority carrier diode, so there is no reverse recovery charge.
Thermal Characteristics
Symbol Parameter Typ. Max. Unit Test Conditions Note
RθJC
Thermal Resistance from Junction
to Case 1.1 °C/W
Typical Performance
1.
Figure 1. Forward Characteristics
0
1
2
3
4
5
6
7
8
9
10
0.0 1.0 2.0 3.0 4.0 5.0
VF Forward Voltage (V)
IF Forward Current (A)
TJ = 25°C
TJ = 75°C
TJ = 125°C
TJ = 175°C
Figure 2. Reverse Characteristics
0
20
40
60
80
100
120
140
160
180
200
0 500 1000 1500
VR Reverse Voltage (V)
IR Reverse Current (µA)
TJ = 25°C
TJ = 75°C
TJ = 125°C
TJ = 175°C
3C2D05120 Rev. -
Figure 3. Current Derating
0
5
10
15
20
25 50 75 100 125 150 175 200
IF(AV) Forward Current (A)
Figure 4. Capacitance vs. Reverse Voltage
0
50
100
150
200
250
300
350
400
1 10 100 1000
VR Reverse Voltage (V)
C Capacitance (PF)
Figure 5. Transient Thermal Impedance
1.00E-03
1.00E-02
1.00E-01
1.00E+00
1.00E+01
1.00E-07 1.00E-06 1.00E-05 1.00E-04 1.00E-03 1.00E-02 1.00E-01 1.00E+00
time [s]
Zth [°C/W]
Typical Performance
Typical Performance
I
F(AVG)
Forward Current (A)
4C2D05120 Rev. -
Package Dimensions
Package TO-220-2
POS Inches Millimeters
Min Max Min Max
A .381 .410 9.677 10.414
B.235 .255 5.969 6.477
C .100 .120 2.540 3.048
D .223 .337 5.664 8.560
E .590 .615 14.986 15.621
F.143 .153 3.632 3.886
G1.105 1.147 28.067 29.134
H .500 .550 12.700 13.970
J R 0.197 R 0.197
L.025 .036 .635 .914
M.045 .055 1.143 1.397
N .195 .205 4.953 5.207
P .165 .185 4.191 4.699
Q .048 .054 1.219 1.372
S 3° 6° 3° 6°
T 3° 6° 3° 6°
U3° 6° 3° 6°
V .094 .110 2.388 2.794
W.014 .025 .356 .635
X 3° 5.5° 3° 5.5°
Y .385 .410 9.779 10.414
z.130 .150 3.302 3.810
NOTE:
Dimension L, M, W apply for Solder Dip
Finish
1.
A
C
E
D
G
H
B
J
L
MN
FP
Q
S
T U
V
W
X
Y
M in M ax M in M ax
A .395 .410 10.033 10.414
B .235 .255 5.969 6.477
C .102 .112 2.591 2.845
D .337 .337 8.560 8.560
E .590 .610 14.986 15.494
F .149 .153 3.785 3.886
G 1.127 1.147 28.626 29.134
H .530 .550 13.462 13.970
J
L .028 .036 .711 .914
M .045 .055 1.143 1.397
N .195 .205 4.953 5.207
P .170 .180 4.318 4.572
Q .048 .054 1.219 1.371
S 3° 5° 3° 5°
T 3° 5° 3° 5°
U 3° 5° 3° 5°
V .100 .110 2.54 2.794
W .014 .021 .356 .533
X 3° 5° 3° 5°
Y .395 .410 10.033 10.414
Z .130 .150 3.302 3.810
Inc h es
M illim eters
P OS
R 0.010 R 0.254
1 2
Z
55 C2D05120 Rev. -
This product has not been designed or tested for use in, and is not intended for use in, applications implanted into the human body
nor in applications in which failure of the product could lead to death, personal injury or property damage, including but not limited
to equipment used in the operation of nuclear facilities, life-support machines, cardiac debrillators or similar emergency medical
equipment, aircraft navigation or communication or control systems, air trafc control systems, or weapons systems.
Copyright © 2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the
Cree logo, and Zero Recovery are registered trademarks of Cree, Inc.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5451
www.cree.com/power
Recommended Solder Pad Layout
TO-220-2
Part Number Package Marking
C2D05120A TO-220-2 C2D05120