GS-BT2416C1.H Bluetooth(R) class 1 module with embedded HCI FW Features Bluetooth(R) specification V.1.2 compliant Transmission rate up to 721 Kbps Output power class 1 ( 20 dBm max) Working distance up to 100 meters ACL and SCO links AFH interference resistance Supports USB (1.1) /UART/PCM (pulse code modulation)/SPI/ IC interfaces Optimized link manager and control Support wireless LAN coexistence in collocated scenario Integrated 4 Mbit Flash, 64 Kbytes RAM, 4 Kbytes ROM 3.3 V single supply voltage Hardware based UART flow control Applications ) s ( ct u d o t e l o r P e May 2008 c u d o r P ST Bluetooth(R) modules are highly integrated for easy implementation in embedded applications. Class 1 modules enable wireless communication with other Bluetooth(R) enabled devices up to 100 m away. The GS-BT2416C1.H integrates on a unique FR4 PCB support: BT 1.2 radio and baseband, memory, 32 kHz and 13 MHz oscillator, Vreg as well PA function. The module embeds customer framework up to HCI level allowing interoperability with HCI top resident on Host. The antenna has not been included in order to grant a degree of freedom to the user in selecting the most suitable design and placement between external and integrated antenna that could be SMA aerial or a low cost antenna trace designed on PCB. For more details pleas refer to GS-BT2416C1DB application note. The GS-BT2416C1.H is the HCI module of the GS-BT2416C1.xx series. GS-BT2416C1.H is BQB pre-qualified. Conformance testing through Bluetooth(R) qualification program enables a fast time to market after system integration by ensuring a high degree of compliance and interoperability. e t le o s b O - Serial cable replacement Industrial control Laptops POS terminals Data acquisition equipment Internet access points Machine control Sensor monitoring Robotic and bionic control Security control Patient monitoring Audio gateway applications Hands-free sets Wireless printers Cordless terminals Laptops, PCs and accessories Hand held devices and accessories HID devices (keyboard, mouse, joystick, game controller...) s b O Description ) s t( Rev 2 1/19 www.st.com 19 Contents GS-BT2416C1.H Contents 1 Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.1 4 DC I/O specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Bluetooth(R) section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4.1 5 ) s t( RF performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 c u d 6 Integrate firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 o r P 5.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5.2 Command interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5.3 Usage scenarios . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 e t le o s b O - Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6.1 Antenna reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 ) s ( ct 7 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 8 Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 r P e 8.1 8.2 9 t e l o s b O u d o Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 10 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 11 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 2/19 GS-BT2416C1.H 1 Certifications Certifications CE compliant (IMQ Exp. opinion 0081-AREF00017) - Safety EN60950-1 (2001) - EMC EN301 489 17V1.2.1 - Radio ES 300 328 V1.6. - FCC certified on GS-BT2416C1DB (for a more exhaustive explanation, please refer to GS-BT2416C1DB application note) - FCC ID: S9NBT2416C1DB BQB compliant c u d e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o s b O 3/19 Maximum ratings GS-BT2416C1.H 2 Maximum ratings 2.1 Absolute maximum ratings Absolute maximum ratings (see Table 1) indicate limits beyond which damage to the device may occur. Sustained exposure to these limits will adversely affect device reliability. Operating ranges (see Table 2) define the limits for functional operation and parametric characteristics of the module. Functionality outside these limits is not implied. Table 1. Absolute maximum ratings Values Symbol Parameter Unit Min 2.2 VDD Module supply voltage VIN Input voltage on any digital pin Tstg Storage temperature Tsold Soldering temperature Symbol Parameter VDD Module supply voltage Tstg Operating ambient temperature t c u t e l o s b O (s) V Vss1-0.5 Vdd+0.3 -40 +85 c u d 240 e t le Operating ranges d o r P e 4/19 4 Operating ranges Table 2. Max so ) s t( b O - C o r P Values Conditions - 20 C < T < 70 C V Unit Min Typ Max 3.13 3.3 3.47 V +70 C -20 GS-BT2416C1.H Electrical characteristics 3 Electrical characteristics 3.1 DC I/O specification Table 3. DC input / output specification Values Symbol Parameter Conditions Unit Min Low level input voltage 3.13 V < VDD < 3.47 V Vih High level input voltage 3.13 V < VDD < 3.47 V 2 V Vhyst Schmitt trigger hysteresis 3.13 V < VDD < 3.47 V 0.4 V Vol Low level output voltage Io load = pin drive capability Voh High level output voltage Io load = pin drive capability Table 4. Bluetooth(R) section Symbol Parameter ) s ( ct CHs Channel space Hop Hopping 13M CK s b O e t le o s b O - 0.15 VDD0.15 u d o V Values Unit Min Typ Max 1 MHz 1600 Hops/ sec 13 MHZ - 20 Low power clock Low power clock accuracy V ) s t( Conditions - 20 C to 70 C V o r P System clock System clock stability LP CK 0.8 c u d r P e t e l o Max Vil Bluetooth(R) section 4 Typ 20 32 - 200 ppm kHz 200 ppm Tra Transmission rate asynchronous 721 Kbits/ sec Trs Transmission rate synchronous 432 Kbits/ sec Operation current TX mode 180 mA Operation RX mode 60 mA Iop 5/19 Bluetooth(R) section 4.1 GS-BT2416C1.H RF performance characteristics In the performance characteristics table the following applies: Test condition: nominal - Voltage typical Vdd 3.3 V - Temperature typical TA = 25 C Parameters are given at antenna pin Table 5. Transmitter and receiver performance characteristics Symbol TX Pout ACP RX sens Table 6. Parameter TX output power TX output spectrum adjacent channel power Receiver sensitivity Parameter RF in RF out Input and output frequency range TX out TX output spectrum at -20 dB Bandwidth lF -pn l t e l o 6/19 Typ Max Unit 2.402 GHz 18 20 dBm 2.441 GHz 18 20 dBm 2.480 GHz 18 20 dBm lM-Nl = 2 - 36 lM-Nl 3 - 44 @BER 0.1 % - 84 c u d (t s) TX carrier frequency drift Min dBm Typ ) s t( dBm uc d o r P e let Conditions dBm Max Unit 2480 MHz 1000 kHz 75 kHz DH1 data packet 25 kHz DH3 data packet 40 kHz DH5 data packet 40 kHz Drift rate 20 Hz 2402 o s b O - TX initial carrier frequency tolerance o r P e lF/50sl Min Synthesizer performance characteristics Symbol F s b O Conditions - 75 920 GS-BT2416C1.H 5 Integrate firmware Integrate firmware The GS-BT2416C1.H includes customer framework up to HCI (host control interface) Figure 1. HCI firmware implementation HCI Top resident on the Host HCI Physical HCI Bottom Serial Interface Layer UART, USB, ... AUDIO SCO channels - Synchronous Connection Oriented 5.1 resident on the Module HCI FIRMWARE c u d LINK MANAGER Hardware Layer BASEBAND HW Set up the physical connection RF H W Features ) s ( ct e t le ) s t( Host Control Interface Between lower and upper levels Set up, manage and secure the link: it's responsible for paging, including ACL, SCO, inquiry, authentication, encryption, low consumption... o r P o s b O - The module with HCI embedded is interoperable with qualified BT stack protocols and suitable for any BT applications. u d o 5.2 Command interface r P e The HCI commands are accessible through the serial port using the host control SW any HCI SW for example bluesoleil (most popular Bluetooth(R) PC open SW). s b O t e l o Usage scenarios 5.3 The module with embedded HCI FW is completely open to any custom implementation, strictly depending on the BT stack and profiles that will be added. Module can be configured both as master or slave. Master can support point to point connection or standard point to multi point Pico net up to seven points. 7/19 Application information 6 GS-BT2416C1.H Application information Here below there are some suggestions to better implement the module in the final application. Module is usually put on a motherboard, avoid that traces with switching signals are routed below the module. The best would be to have a ground plane underneath the module. Connect the supply voltage ground of the module with the other grounds present on the motherboard in a star way. Keep the RF ground separate from the module supply voltage ground; the two grounds are already connected inside the module in one point, see below a possible implementation. Figure 2. Module foot print Supply voltage GND e t le ) s ( ct u d o r P e t e l o s b O 8/19 c u d RF gnd Module foot print o s b O - o r P ) s t( GS-BT2416C1.H 6.1 Application information Antenna reference RF output pin must be connected to an antenna which could be: Figure 3. Antenna directly printed on the pcb (Figure 3.) Integrated antenna as, for example, antenova(R) 30-30-A5839-01, Murata ANCV12G44SAA127, pulse W3008, Yageo CAN4311153002451K. (Figure 4.) External antenna connected by means a SMA connector (Figure 5.) Antenna on PCB Figure 4. Antenna examples SMA connector for external antenna c u d ) s t( o r P Despite of the type of antenna chosen, the connection between the RF out pin and the antenna must be executed in such a way that the connection trace must be matched to have characteristic impedance (Z0) of 50 to get the maximum power transfer. Matching for 50 is depending on the various factors, elements to be taken into consideration are: e t le o s b O - - Type of material, i.e. FR4 - The electrical characteristics of the material, i.e. the r, electric constant at 2.4 GHz - Mechanical dimensions of the PCB and traces, i.e. PCB thickness, trace/ reference ground thickness, trace width, trace thickness. - Just to give an example, using a 1 mm thick FR4 board, with an r = 4.3 at 2.4 GHz, with Cu thickness of 41 m, the resulted width of 50 strip-line is 1.9 mm (Microstrip type calculation). ) s ( ct u d o r P e Figure 6. Parameters for trace matching t e l o Trace width s b O Figure 5. PCB thickness Trace thickness r (Dielectric constant) Reference ground Tools for calculating the characteristic impedance, based on the physical and mechanical characteristics of the PCB, can be easily found on the web. 9/19 Block diagram 7 GS-BT2416C1.H Block diagram Figure 7. Block diagram RF antenna 32kHz XTAL UART 32kHz XTAL USB PCM PA SPI STLC2416 Baseband ARM7 proc IC GPIO STLC2150 Radio chip SW Filter LNA c u d e t le ) s ( ct u d o r P e t e l o s b O 10/19 o s b O - o r P ) s t( GS-BT2416C1.H Pin settings 8 Pin settings 8.1 Pin connections Figure 8. Pin connection diagram c u d e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o s b O 11/19 Pin settings GS-BT2416C1.H 8.2 Pin descriptions Table 7. Pin descriptions Pin N Name I/O Description Power, ground and system signal 1 Vss1 --- GND 2 Vdd --- Module supply voltage- single 3.3 V 41 1V8 O 1.8 V digital supply out (test purpose) to be left not connected 42 3V3 O 3.3 V I/O power supply out (test purpose) to be left not connected 43 Vss1 --- GND (test purpose) to be left not connected 44 2V7 O 2.7 digital core supply out (test purpose) to be left not connected 45 RESET I Reset pin (active low) 46 BOOT I External downloading enable (active low) internally pull-upped to 1.8 V by 10 k 13 LP CLOCK OUT O 32 kHz out I External Interrupt signal internally connected to VSS1 with 10 k / If not used connect to VSS1 26 INT1 c u d General purpose signals 3 GPIO0 I/O General purpose I/O line 4 GPIO1 I/O General purpose I/O line 5 GPIO2 I/O General purpose I/O line 6 GPIO3 I/O General purpose I/O line 7 GPIO4 I/O General purpose I/O line 8 GPIO5 I/O General purpose I/O line 10 GPIO7 I/O General purpose I/O line 11 GPIO8 I/O General purpose I/O line 12 GPIO9 I/O General purpose I/O line 14 GPIO11 I/O General purpose I/O line ) s ( ct e t le o s b O - u d o r P e t e l o No connect signals 9 ---- I/O Not to be used internally used for RX/TX switch ---- I/O Not to be used internally used for TX gain setting 16 ---- I/O Not to be used internally used for TX gain setting 17 ---- I/O Not to be used internally used for TX gain setting 18 ---- I/O Not to be used internally used for TX gain setting s b O 15 12/19 o r P ) s t( GS-BT2416C1.H Table 7. Pin N Pin settings Pin descriptions (continued) Name I/O Description Test interface signals 19 TDI --- JTAG pin 20 TDO --- JTAG pin 21 TMS --- JTAG pin 22 NTRST --- JTAG pin 23 TCK --- JTAG pin If not used connect to VSS1 I2C interface signals 24 I2C_dat I/O I2C bus interface data to be connected to VDD with 10 k resistor 25 I2C_clk I/O I2C bus interface clock to be connected to VDD with 10 k resistor PCM interface signals 27 PCM_SYNC I/O PCM 8 kHz synch 28 PCM_CLK 29 PCM_A I/O PCM data in/out 30 PCM_B I/O PCM data in//out c u d I/O PCM clock USB interface signals e t le 31 USB_DN I/O USB data - If not used connect to VSS1 32 USB_DP I/O USB data + If not used connect to VSS1 UART interface signals o r P o s b O - 33 UART2_RXD I UART2 data input If not used connect to VDD 34 UART2_TXD O UART2 data output 35 UART2_I1 I UART2 clear to send input If not used connect to VDD 36 UART2_02 O UART2 ready to send output 47 UART10_TXD O UART1 data output 48 UART11_RXD I UART1 data input If not used connect to VDD ) s ( ct ) s t( u d o r P e SPI interface signals t e l o 37 SPI_FRM I/O Synchronous serial interface frame synch SPI_CLK I/O Synchronous serial Interface clock 39 SPI_TXD O/T Synchronous serial Interface transmit data 40 SPI_RXD bs 38 O I Synchronous serial Interface receive data If not used connect to VSS1 Antenna signals 49 Vss2 ( RF GND) --- RF GND 50 +ANTENNA --- Antenna out 51 Vss2 (RF GND) --- RF GND 13/19 Soldering 9 GS-BT2416C1.H Soldering Soldering phase has to be execute with care: in order to avoid undesired melting phenomenon, particular attention has to be take on the set up of the peak temperature. Here following some suggestions for the temperature profile based on IPC/JEDEC J-STD-020C, July 2004 recommendations. Table 8. Soldering Profile feature PB free assembly Average ramp up rate (TSMAX to TP) 3 C / sec max Preheat Temperature min (TS min) Temperature max (TS max) Time (tS min to tS max) (tS) 150 C 200 C 60 - 100 sec Time maintained above: Temperature TL Time tL 217 C 40 - 70 sec c u d Peak temperature (Tp) Time within 5 C of actual peak temperature (tP) 10 - 20 sec e t le Ramp down rate Time from 25 C to peak temperature Figure 9. Soldering ) s ( ct u d o r P e t e l o s b O 14/19 o r P 240 + 0 C o s b O - 6 C / sec 8 minutes max ) s t( GS-BT2416C1.H 10 Mechanical dimensions Mechanical dimensions In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 10. Mechanical dimensions c u d e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o s b O 15/19 Mechanical dimensions GS-BT2416C1.H Figure 11. Land pattern c u d e t le ) s ( ct u d o r P e t e l o s b O 16/19 o s b O - o r P ) s t( GS-BT2416C1.H 11 Ordering information scheme Ordering information scheme Table 9. Ordering information scheme GS-BT 2416 C1 H Bluetooth(R) modules V 1.2 compliant Class 1 Embedded HCI c u d e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o s b O 17/19 Revision history 12 GS-BT2416C1.H Revision history Table 10. Revision history Date Revision Changes 31-Aug-2006 1 First release 27-May-2008 2 Updated: Cover page Added: Section 9 on page 14 c u d e t le ) s ( ct u d o r P e t e l o s b O 18/19 o s b O - o r P ) s t( GS-BT2416C1.H Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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