May 2008 Rev 2 1/19
19
GS-BT2416C1.H
Bluetooth® class 1 module with embedded HCI FW
Features
■Bluetooth® specification V.1.2 compliant
■Transmission rate up to 721 Kbps
■Output power class 1 ( 20 dBm max)
■Working distance up to 100 meters
■ACL and SCO links
■AFH interference resistance
■Supports USB (1.1) /UART/PCM (pulse code
modulation)/SPI/ I²C interfaces
■Optimized link manager and control
■Support wireless LAN coexistence in
collocated scenario
■Integrated 4 Mbit Flash, 64 Kbytes RAM,
4 Kbytes ROM
■3.3 V single supply voltage
■Hardware based UART flow control
Applications
■Serial cable replacement
■Industrial control
■Laptops
■POS terminals
■Data acquisition equipment
■Internet access points
■Machine control
■Sensor monitoring
■Robotic and bionic control
■Security control
■Patient monitoring
■Audio gateway applications
■Hands-free sets
■Wireless printers
■Cordless terminals
■Laptops, PCs and accessories
■Hand held devices and accessories
■HID devices (keyboard, mouse, joystick, game
controller...)
Description
ST Bluetooth® modules are highly integrated for
easy implementation in embedded applications.
Class 1 modules enable wireless communication
with other Bluetooth® enabled devices up to
100 m away. The GS-BT2416C1.H integrates on
a unique FR4 PCB support: BT 1.2 radio and
baseband, memory, 32 kHz and 13 MHz
oscillator, Vreg as well PA function. The module
embeds customer framework up to HCI level
allowing interoperability with HCI top resident on
Host. The antenna has not been included in order
to grant a degree of freedom to the user in
selecting the most suitable design and placement
between external and integrated antenna that
could be SMA aerial or a low cost antenna trace
designed on PCB. For more details pleas refer to
GS-BT2416C1DB application note. The
GS-BT2416C1.H is the HCI module of the
GS-BT2416C1.xx series. GS-BT2416C1.H is
BQB pre-qualified. Conformance testing through
Bluetooth® qualification program enables a fast
time to market after system integration by
ensuring a high degree of compliance and
interoperability.
www.st.com
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Contents GS-BT2416C1.H
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Contents
1 Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1 DC I/O specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 Bluetooth® section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4.1 RF performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5 Integrate firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.2 Command interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.3 Usage scenarios . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6.1 Antenna reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
8 Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
8.1 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
8.2 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
10 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
11 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
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GS-BT2416C1.H Certifications
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1 Certifications
●CE compliant (IMQ Exp. opinion 0081-AREF00017)
– Safety EN60950-1 (2001)
– EMC EN301 489 17V1.2.1
– Radio ES 300 328 V1.6.
– FCC certified on GS-BT2416C1DB (for a more exhaustive explanation, please
refer to GS-BT2416C1DB application note)
– FCC ID: S9NBT2416C1DB
●BQB compliant
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Maximum ratings GS-BT2416C1.H
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2 Maximum ratings
2.1 Absolute maximum ratings
Absolute maximum ratings (see Ta b l e 1 ) indicate limits beyond which damage to the device
may occur. Sustained exposure to these limits will adversely affect device reliability.
Operating ranges (see Table 2) define the limits for functional operation and parametric
characteristics of the module. Functionality outside these limits is not implied.
2.2 Operating ranges
Table 1. Absolute maximum ratings
Symbol Parameter
Values
Unit
Min Max
VDD Module supply voltage 4 V
VIN Input voltage on any digital pin Vss1-0.5 Vdd+0.3 V
Tstg Storage temperature -40 +85 °C
Tsold Soldering temperature 240
Table 2. Operating ranges
Symbol Parameter Conditions
Values
Unit
Min Typ Max
VDD Module supply voltage - 20 °C < T < 70 °C 3.13 3.3 3.47 V
Tstg
Operating ambient
temperature -20 +70 °C
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GS-BT2416C1.H Electrical characteristics
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3 Electrical characteristics
3.1 DC I/O specification
4 Bluetooth® section
Table 3. DC input / output specification
Symbol Parameter Conditions
Values
Unit
Min Typ Max
Vil Low level input voltage 3.13 V < VDD < 3.47 V 0.8 V
Vih High level input voltage 3.13 V < VDD < 3.47 V 2 V
Vhyst Schmitt trigger hysteresis 3.13 V < VDD < 3.47 V 0.4 V
Vol Low level output voltage Io load = pin drive
capability 0.15 V
Voh High level output voltage Io load = pin drive
capability
VDD-
0.15 V
Table 4. Bluetooth® section
Symbol Parameter Conditions
Values
Unit
Min Typ Max
CHs Channel space 1 MHz
Hop Hopping 1600 Hops/
sec
13M CK System clock 13 MHZ
System clock stability - 20 °C to 70 °C - 20 20 ppm
LP CK Low power clock 32 kHz
Low power clock accuracy - 200 200 ppm
Tra Transmission rate
asynchronous 721 Kbits/
sec
Tr s Transmission rate
synchronous 432 Kbits/
sec
Iop Operation current TX mode 180 mA
Operation RX mode 60 mA
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Bluetooth® section GS-BT2416C1.H
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4.1 RF performance characteristics
In the performance characteristics table the following applies:
●Test condition: nominal
– Voltage typical Vdd 3.3 V
– Temperature typical TA = 25 °C
Parameters are given at antenna pin
Table 5. Transmitter and receiver performance characteristics
Symbol Parameter Conditions Min Typ Max Unit
TX Pout TX output power
2.402 GHz 18 20 dBm
2.441 GHz 18 20 dBm
2.480 GHz 18 20 dBm
ACP TX output spectrum adjacent
channel power
lM-Nl = 2 - 36 dBm
lM-Nl ≥ 3- 44dBm
RX sens Receiver sensitivity @BER 0.1 % - 84 dBm
Table 6. Synthesizer performance characteristics
Symbol Parameter Conditions Min Typ Max Unit
RF in
RF out Input and output frequency range 2402 2480 MHz
TX out TX output spectrum at -20 dB
Bandwidth 920 1000 kHz
∆FTX initial carrier frequency
tolerance - 75 75 kHz
l∆F –pn l TX carrier frequency drift
DH1 data
packet 25 kHz
DH3 data
packet 40 kHz
DH5 data
packet 40 kHz
l∆F/50µsl Drift rate 20 Hz
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GS-BT2416C1.H Integrate firmware
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5 Integrate firmware
The GS-BT2416C1.H includes customer framework up to HCI (host control interface)
Figure 1. HCI firmware implementation
5.1 Features
The module with HCI embedded is interoperable with qualified BT stack protocols and
suitable for any BT applications.
5.2 Command interface
The HCI commands are accessible through the serial port using the host control SW any
HCI SW for example bluesoleil (most popular Bluetooth® PC open SW).
5.3 Usage scenarios
The module with embedded HCI FW is completely open to any custom implementation,
strictly depending on the BT stack and profiles that will be added. Module can be configured
both as master or slave. Master can support point to point connection or standard point to
multi point Pico net up to seven points.
HCI To
p
resident on the Host
B
BA
AS
SE
EB
BA
AN
ND
D
H
HW
W
R
R
F
F
H
HW
W
Serial Interface La y e r
UART, USB, …
Hardware Layer
Set up the physical
connection
L
LI
IN
NK
K
M
MA
AN
NA
AG
GE
ER
R
H
HC
CI
I
F
FI
IR
R
M
MW
WA
AR
R
E
E
A
AU
UD
DI
IO
O
Set up, manage and secure
the link: it’s responsible for
paging, including ACL, SCO,
inquiry, authe ntic atio n,
encryption, low
consumption...
Host Contro l In terf a ce
Between lower and
upper leve ls
SCO channels –
Synchronous Connection
Oriented
HCI Bottom resident on the Module
HCI Ph
y
sical
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Application information GS-BT2416C1.H
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6 Application information
Here below there are some suggestions to better implement the module in the final
application.
●Module is usually put on a motherboard, avoid that traces with switching signals are
routed below the module. The best would be to have a ground plane underneath the
module.
●Connect the supply voltage ground of the module with the other grounds present on the
motherboard in a star way.
●Keep the RF ground separate from the module supply voltage ground; the two grounds
are already connected inside the module in one point, see below a possible
implementation.
Figure 2. Module foot print
RF gnd
Module
foot print
Supply voltage GND
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6.1 Antenna reference
RF output pin must be connected to an antenna which could be:
●Antenna directly printed on the pcb (Figure 3.)
●Integrated antenna as, for example, antenova® 30-30-A5839-01, Murata
ANCV12G44SAA127, pulse W3008, Yageo CAN4311153002451K. (Figure 4.)
●External antenna connected by means a SMA connector (Figure 5.)
●Despite of the type of antenna chosen, the connection between the RF out pin and the
antenna must be executed in such a way that the connection trace must be matched to
have characteristic impedance (Z0) of 50 Ω to get the maximum power transfer.
●Matching for 50 Ω is depending on the various factors, elements to be taken into
consideration are:
– Type of material, i.e. FR4
– The electrical characteristics of the material, i.e. the εr, electric constant at
2.4 GHz
– Mechanical dimensions of the PCB and traces, i.e. PCB thickness, trace/
reference ground thickness, trace width, trace thickness.
– Just to give an example, using a 1 mm thick FR4 board, with an εr = 4.3 at
2.4 GHz, with Cu thickness of 41 µm, the resulted width of 50 Ω strip-line is
1.9 mm (Microstrip type calculation).
Figure 6. Parameters for trace matching
Tools for calculating the characteristic impedance, based on the physical and mechanical
characteristics of the PCB, can be easily found on the web.
Figure 3. Antenna on PCB Figure 4. Antenna examples Figure 5. SMA connector for
external antenna
εr (Dielect ri c cons tant )
PCB
thickness
Tra c e wi d t h
Refe rence ground
Trace thickness
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Block diagram GS-BT2416C1.H
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7 Block diagram
Figure 7. Block diagram
32kHz
XTAL
32kHz
XTAL
STLC2416
Baseband
ARM7 proc
STLC2150
Radio chip
RF antenna
FilterSW
LNA
PA
UART
USB
PCM
SPI
I²C
GPIO
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GS-BT2416C1.H Pin settings
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8 Pin settings
8.1 Pin connections
Figure 8. Pin connection diagram
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Pin settings GS-BT2416C1.H
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8.2 Pin descriptions
Table 7. Pin descriptions
Pin N° Name I/O Description
Power, ground and system signal
1Vss
1 --- GND
2 Vdd --- Module supply voltage- single 3.3 V
41 1V8 O 1.8 V digital supply out (test purpose) to be left not connected
42 3V3 O 3.3 V I/O power supply out (test purpose) to be left not connected
43 Vss1 --- GND (test purpose) to be left not connected
44 2V7 O 2.7 digital core supply out (test purpose) to be left not connected
45 RESET I Reset pin (active low)
46 BOOT I External downloading enable (active low) internally pull-upped to 1.8 V by 10 kΩ
13 LP CLOCK
OUT O 32 kHz out
26 INT1 I External Interrupt signal internally connected to VSS1 with 10 kΩ / If not used
connect to VSS1
General purpose signals
3 GPIO0 I/O General purpose I/O line
4 GPIO1 I/O General purpose I/O line
5 GPIO2 I/O General purpose I/O line
6 GPIO3 I/O General purpose I/O line
7 GPIO4 I/O General purpose I/O line
8 GPIO5 I/O General purpose I/O line
10 GPIO7 I/O General purpose I/O line
11 GPIO8 I/O General purpose I/O line
12 GPIO9 I/O General purpose I/O line
14 GPIO11 I/O General purpose I/O line
No connect signals
9 ---- I/O Not to be used internally used for RX/TX switch
15 ---- I/O Not to be used internally used for TX gain setting
16 ---- I/O Not to be used internally used for TX gain setting
17 ---- I/O Not to be used internally used for TX gain setting
18 ---- I/O Not to be used internally used for TX gain setting
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Pin N° Name I/O Description
Test interface signals
19 TDI --- JTAG pin
20 TDO --- JTAG pin
21 TMS --- JTAG pin
22 NTRST --- JTAG pin
23 TCK --- JTAG pin If not used connect to VSS1
I2C interface signals
24 I2C_dat I/O I2C bus interface data to be connected to VDD with 10 kΩ resistor
25 I2C_clk I/O I2C bus interface clock to be connected to VDD with 10 kΩ resistor
PCM interface signals
27 PCM_SYNC I/O PCM 8 kHz synch
28 PCM_CLK I/O PCM clock
29 PCM_A I/O PCM data in/out
30 PCM_B I/O PCM data in//out
USB interface signals
31 USB_DN I/O USB data - If not used connect to VSS1
32 USB_DP I/O USB data + If not used connect to VSS1
UART interface signals
33 UART2_RXD I UART2 data input If not used connect to VDD
34 UART2_TXD O UART2 data output
35 UART2_I1 I UART2 clear to send input If not used connect to VDD
36 UART2_02 O UART2 ready to send output
47 UART10_TXD O UART1 data output
48 UART11_RXD I UART1 data input If not used connect to VDD
SPI interface signals
37 SPI_FRM I/O Synchronous serial interface frame synch
38 SPI_CLK I/O Synchronous serial Interface clock
39 SPI_TXD O/T Synchronous serial Interface transmit data
40 SPI_RXD I Synchronous serial Interface receive data If not used connect to VSS1
Antenna signals
49 Vss2 ( RF GND) --- RF GND
50 +ANTENNA --- Antenna out
51 Vss2 (RF GND) --- RF GND
Table 7. Pin descriptions (continued)
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Soldering GS-BT2416C1.H
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9 Soldering
Soldering phase has to be execute with care: in order to avoid undesired melting
phenomenon, particular attention has to be take on the set up of the peak temperature.
Here following some suggestions for the temperature profile based on
IPC/JEDEC J-STD-020C, July 2004 recommendations.
Figure 9. Soldering
Table 8. Soldering
Profile feature PB free assembly
Average ramp up rate (TSMAX to TP) 3 °C / sec max
Preheat
Temperature min (TS min)
Temperature max (TS max)
Time (tS min to tS max) (tS)
150 °C
200 °C
60 – 100 sec
Time maintained above:
Temperature TL
Time tL
217 °C
40 – 70 sec
Peak temperature (Tp) 240 + 0 °C
Time within 5 °C of actual peak temperature (tP) 10 – 20 sec
Ramp down rate 6 °C / sec
Time from 25 °C to peak temperature 8 minutes max
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GS-BT2416C1.H Mechanical dimensions
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10 Mechanical dimensions
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 10. Mechanical dimensions
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Mechanical dimensions GS-BT2416C1.H
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Figure 11. Land pattern
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GS-BT2416C1.H Ordering information scheme
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11 Ordering information scheme
Table 9. Ordering information scheme
GS-BT 2416 C1 H
Bluetooth® modules
V 1.2 compliant
Class 1
Embedded HCI
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GS-BT2416C1.H
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