SPECIFICATIONS Mechanical Contact Retention Force: 1.36KGF min. Header Connector HS55 Series Vertical, SMT Type, Plug 2.00mm [.079"] Pitch Electrical Current Rating: 2.0A per pin min. Dielectric Withstanding Voltage: 125V AC Dielectric Withstanding Voltage: 1000V Insulation Resistance: 1000M min Physical Housing: High Temp. Thermoplastic, Glass Filled, UL94V-0 Contact: Copper Alloy Plating: See "ORDERING INFORMATION" Solder Pad: Copper Alloy Operating Temperature: -55 to +105 DRAWING ORDERING INF ORMATION Please see remark 1 Please see remark 2 All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information. Remark 1 PRODUCT NO.: H S 55 ** * - * * ** Header Series U3:19th POS. is Removed SMT Type Modification Code Termination & Contact Type None: Packing in Tray and without CAP T: Packing in Tube and without CAP R: Packing in Tube&Reel and with CAP No. of Pos. Post Code 04 = 8 Pos. None: with 2 Posts D: without Post 18 = 36 Pos. 22 = 44 Pos. 25 = 50 Pos. Contact Area Plating 1=Gold Flash 3=30u" MIN Gold 7=15u" MIN Gold F=Gold Flash with Lead Free "RoHS COMPLIANCE" H=30u"Gold with Lead Free "RoHS COMPLIANCE" V=15u"Gold with Lead Free "RoHS COMPLIANCE" Remark 2 All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.