2SK3564
2011-05-06
1
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (π-MOSIV)
2SK3564
Switching Regulator Applications
Low drain-source ON-resistance: RDS (ON) = 3.7 (typ.)
High forward transfer admittance: |Yfs| = 2.6 S (typ.)
Low leakage current: IDSS = 100 μA (max) (VDS = 720 V)
Enhancement mode: Vth = 2.0 to 4.0 V (VDS = 10 V, ID = 1 mA)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit
Drain-source voltage VDSS 900 V
Drain-gate voltage (RGS = 20 kΩ) VDGR 900 V
Gate-source voltage VGSS ±30 V
DC (Note 1) ID 3
Drain current
Pulse (Note 1) IDP 9
A
Drain power dissipation (Tc = 25°C) PD 40 W
Single pulse avalanche energy
(Note 2)
EAS 408 mJ
Avalanche current IAR 3 A
Repetitive avalanche energy (Note 3) EAR 4.0 mJ
Channel temperature Tch 150 °C
Storage temperature range Tstg -55 to 150 °C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and
Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Thermal Characteristics
Characteristics Symbol Max Unit
Thermal resistance, channel to case Rth (ch-c) 3.125 °C/W
Thermal resistance, channel to ambient Rth (ch-a) 62.5 °C/W
Note 1: Ensure that the channel temperature does not exceed 150°C.
Note 2: VDD = 90 V, Tch = 25°C, L = 83 mH, IAR = 3.0 A, RG = 25 Ω
Note 3: Repetitive rating: pulse width limited by maximum channel temperature
This transistor is an electrostatic-sensitive device. Please handle with caution.
Unit: mm
1: Gate
2: Drain
3: Source
JEDEC
JEITA SC-67
TOSHIBA 2-10U1B
Weight : 1.7 g (typ.)
1
3
2
2SK3564
2011-05-06
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Electrical Characteristics (Ta = 25°C)
Characteristics Symbol Test Condition Min Typ. Max Unit
Gate leakage current IGSS V
GS = ±25 V, VDS = 0 V ±10 μA
Gate-source breakdown voltage V (BR) GSS IG = ±10 μA, VDS = 0 V ±30 V
Drain cut-off current IDSS V
DS = 720 V, VGS = 0 V 100 μA
Drain-source breakdown voltage V (BR) DSS ID = 10 mA, VGS = 0 V 900 V
Gate threshold voltage Vth V
DS = 10 V, ID = 1 mA 2.0 4.0 V
Drain-source ON-resistance RDS (ON) V
GS = 10 V, ID = 1.5 A 3.7 4.3 Ω
Forward transfer admittance Yfs V
DS = 20 V, ID = 1.5 A 0.65 2.6 S
Input capacitance Ciss 700
Reverse transfer capacitance Crss 15
Output capacitance Coss
VDS = 25 V, VGS = 0 V, f = 1 MHz
75
pF
Rise time tr 20
Turn-on time ton 60
Fall time tf 35
Switching time
Turn-off time toff
125
ns
Total gate charge Qg 17
Gate-source charge Qgs 10
Gate-drain charge Qgd
VDD 400 V, VGS = 10 V, ID = 3 A
7
nC
Source-Drain Ratings and Characteristics (Ta = 25°C)
Characteristics Symbol Test Condition Min Typ. Max Unit
Continuous drain reverse current (Note 1) IDR 3 A
Pulse drain reverse current (Note 1) IDRP 9 A
Forward voltage (diode) VDSF I
DR = 3 A, VGS = 0 V 1.9
V
Reverse recovery time trr 850 ns
Reverse recovery charge Qrr
IDR = 3 A, VGS = 0 V,
dIDR/dt = 100 A/μs 4.7 μC
Marking
Note 4: A line under a Lot No. identifies the indication of product
Labels.
Not underlined: [[Pb]]/INCLUDES > MCV
Underlined: [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]]
Please contact your TOSHIBA sales representative for details as to
environmental matters such as the RoHS compatibility of Product.
The RoHS is the Directive 2002/95/EC of the European Parliament
and of the Council of 27 January 2003 on the restriction of the use of
certain hazardous substances in electrical and electronic equipment.
Lot No.
Note 4
K3564
Part No. (or abbreviation code)
RL =
133 Ω
0 V
10 V
VGS
VDD 200 V
ID = 1.5 A VOUT
50 Ω
Duty 1%, tw = 10 μs
2SK3564
2011-05-06
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DRAIN-SOURCE VOLTAGE VDS (V)
DRAIN-SOURCE VOLTAGE VDS (V)
ID – VDS
DRAIN-SOURCE VOLTAGE VDS (V)
ID – VDS
DRAIN CURRENT ID (A)
GATE-SOURCE VOLTAGE VGS (V)
ID – VGS
GATE-SOURCE VOLTAGE VGS (V)
VDS – VGS
DRAIN CURRENT ID (A)
Yfs – ID
DRAIN CURRENT ID (A)
RDS (ON) – ID
DRAIN-SOURCE ON RESISTANCE
RDS (ON) (Ω)
5
4
3
2
1
0
0 10 20 30 40
VGS = 4.5 V
COMMON SOURCE
Tc = 25°C
PULSE TEST
4.75
5
5.25
8 10
5.5
6
0.01
0.01
0.1
1
10
0.1 1 10
COMMON SOURCE
VDS = 20 V
PULSE TEST
25
100
Tc = 55°C
1
0.01 0.1 1 10
5
3
10
COMMON SOURCE
Tc = 25°C
PULSE TEST
VGS = 10 V
FORWARD TRANSFER ADMITTANCE
Yfs (S)
DRAIN CURRENT ID (A)
DRAIN CURRENT ID (A)
4
3
2
1
0
0 4 8 12 16 20
VGS = 4.5 V
COMMON SOURCE
Tc = 25°C
PULSE TEST
4.75
5
5.25
5.5
6
8
10
24
0
0 2 4 6 8 10
1
2
6
COMMON SOURCE
VDS = 20 V
PULSE TEST
Tc = 55°C
25
100
3
4
5
12
0
10
15
20
25
0
ID = 3 A
4 8 12 16 20
COMMON SOURCE
Tc = 25
PULSE TEST
0.8
1.5
5
2SK3564
2011-05-06
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GATE THRESHOLD VOLTAGE
Vth (V)
CASE TEMPERATURE Tc (°C)
RDS (ON) – Tc
DRAIN-SOURCE ON-RESISTANCE
RDS (ON) ( Ω)
DRAIN-SOURCE VOLTAGE VDS (V)
IDR – VDS
DRAIN REVERSE CURRENT
I
DR (A)
CASE TEMPERATURE Tc (°C)
Vth – Tc
GATE-SOURCE VOLTAGE VGS (V)
TOTAL GATE CHARGE Qg (nC)
DYNAMIC INPUT / OUTPUT
CHARACTERISTICS
DRAIN-SOURCE VOLTAGE VDS (V)
CAPACITANCE C (pF)
DRAIN-SOURCE VOLTAGE VDS (V)
CAPACITANCE – VDS
1
0.1
10
100
1000
10000
1 10 100
COMMON SOURCE
VGS = 0 V
f = 1 MHz
Tc = 25°C
Ciss
Coss
Crss
DRAIN POWER DISSIPATION
PD (W)
CASE TEMPERATURE Tc (°C)
PD – Tc
60
40
0
0 40 80 120 160
20
0
0.1
COMMON SOURCE
Tc = 25°C
PULSE TEST
0.4
0.3
0.5
1
3
5
10
0.8 1.2 1.6
VGS =1, 0, 1 V
10
3
160 40 0 40 80 120 80
20
COMMON SOURCE
PULSE TEST
16
12
8
4
0
ID = 3 A
0.8
1.5
VGS = 10 V
0
100
200
300
400
500
0
4
8
12
16
20
0 4 8 12
COMMON SOURCE
ID = 3 A
Tc = 25°C
PULSE TEST
VDD = 100 V
VDS
VGS
400200
16 20 24
0
1
2
3
4
80 40 0 40 80 120 160
COMMON SOURCE
VDS = 10 V
ID = 1 mA
PULSE TEST
5
2SK3564
2011-05-06
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SAFE OPERATING AREA
CHANNEL TEMPERATURE (INITIAL)
Tch (°C)
EAS – Tch
AVALANCHE ENERGY
EAS (mJ)
rth – tw
PULSE WIDTH tw (s)
NORMALIZED TRANSIENT THERMAL
IMPEDANCE rth (t)/Rth (ch-c)
0.01
1
1
10
0.1
100
10 1000 100 10000
* SINGLE NONREPETITIVE PULSE Tc = 2 5
CURVES MUST BE DERATED LINEARLY WITH
INCREASE IN TEMPERATURE.
ID max (PULSED) *
ID max (CONTINUOUS)
DC OPERATION
Tc = 25°C
100 μs *
1 ms *
15 V
15 V
TEST CIRCUIT WAVEFORM
IAR
BVDSS
VDD V
DS
RG = 25 Ω
VDD = 90 V, L = 83 mH
= VDD
BVDSS
BVDSS
2
IL
2
1
ΕAS
DRAIN CURRENT ID (A)
DRAIN-SOURCE VOLTAGE VDS (V)
500
400
300
200
100
0
25 50 75 100 125 150
0.01
10μ
0.1
1
10
100μ 1 101001 10
T
PDM
t
Duty = t/T
Rth (ch-c) = 3.125°C/W
Duty=0.5
0.2
0.1
SINGLE PULSE
0.05
0.02
0.01
0.001
VDSS max
2SK3564
2011-05-06
6
RESTRICTIONS ON PRODUCT USE
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all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
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