Applications
•Buck or boost inductor
•Cellular phones/ PDAs
•LED Photo flash
•LCD Displays
•Handheld/Mobile devices
•GPS Systems
•Digital cameras
• MP3 Players
Environmental Data
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
(ambient plus self-temperature rise)
• Solder reflow temperature: J-STD-020D compliant
Packaging
• Supplied in tape and reel packaging, 4,500 parts per reel
13” diameter reel
Pb
HALOGEN
HF
FREE
Description
• Halogen Free
• 125°C maximum total temperature operation
• 3.2 x 3.0 x 1.2mm maximum shielded drum core
• Ferrite core material
• High power density, ultra-compact footprint
• Inductance range from 1.02μH to 97.7μH
• Current range from 0.217 to 1.95 Amps
• Magnetically shielded, low EMI
• RoHS compliant
Low Profile, High Power, Shielded Drum Inductors
SDH2812 Series
1209 BU-SB091134 Page 1 of 4 Data Sheet: 4354
SMD Device
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2I
rms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
3I
sat: Peak current for approximately 30% rolloff at +25°C.
4 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K *L *ΔI. Bp-p (Gauss),
K: (K-factor from table), L: (inductance in μH), ΔI (peak-to-peak ripple current in amps).
5 Part Number Definition: SDH2812-xxx-R
• SDH2812 = Product code and size
• xxx= Inductance value in μH, R = decimal point,
If no R is present then 3rd digit equals number of zeros.
• “-R” suffix = RoHS compliant
Product Specifications
Part OCL1Part Marking Irms2Isat3 @ 25°C DCR (Ω) @ 20°C DCR (Ω) @ 20°C
Number5(μH) Designator (Amps) (Amps) (Typical) (Maximum) K-factor4
SDH2812-1R0-R 1.02±30% O 1.45 1.95 0.062 0.083 1212
SDH2812-1R5-R 1.50±30% A 1.33 1.71 0.082 0.102 1070
SDH2812-2R2-R 2.20±20% B 1.26 1.53 0.095 0.114 866
SDH2812-3R3-R 3.20±20% C 1.08 1.16 0.138 0.154 673
SDH2812-4R7-R 4.20±20% D 0.900 1.000 0.200 0.224 587
SDH2812-6R8-R 6.60±20% E 0.730 0.830 0.270 0.336 466
SDH2812-8R2-R 8.17±20% F 0.660 0.780 0.380 0.417 404
SDH2812-100-R 9.67±20% G 0.620 0.710 0.389 0.467 387
SDH2812-150-R 14.7±20% H 0.500 0.570 0.620 0.721 308
SDH2812-220-R 21.6±20% I 0.440 0.460 0.870 0.922 264
SDH2812-330-R 33.2±20% J 0.350 0.380 1.37 1.43 209
SDH2812-470-R 46.7±20% K 0.300 0.320 1.72 1.99 173
SDH2812-680-R 68.0±20% L 0.270 0.270 2.46 2.70 148
SDH2812-820-R 82.2±20% M 0.230 0.240 3.15 3.47 135
SDH2812-101-R 97.7±20% N 0.217 0.218 3.61 3.97 122
Top View Side View Bottom View Recommended Pad Layout Schematic
1
2
X X
2.8
±0.2
3.0
±0.2
1
2
1.54
±0.2
1.54
±0.2
0.73
±0.2
1.54
Typ.
1.2 Max.
2
1
2.0
(2Plcs)
1.60
1.0
(2plcs)
Dimensions - mm
X X
1.2 dia.
A
ABB
1
2
A-A View
12.0±0.30
5.5
10.2
4.0
8.0
3.10
3.30
1.30
2.0
B-B View
Direction of feed
1.5 dia.
0
10
20
30
40
50
0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40
Total Loss (W)
Temperature Rise (ºC)
Two-digit (2) Part Marking:
1st Digit indicates inductance value per “Part Marking Designator” column in Product Specifications table
2nd Digit indicates bi-weekly production date code
Supplied in tape-and-reel packaging, 4,500 parts per reel, 13” diameter reel.
Packaging Information - mm
Temperature Rise vs. Total Loss
1209 BU-SB091134 Page 2 of 4 Data Sheet: 4354
1209 BU-SB091134 Page 3 of 4 Data Sheet: 4354
Core Loss Vs. B
0.00001
0.0001
0.001
0.01
0.1
1
10
100 1000 10000
B (G u a ss)
Core Loss (W)
100kHz
200kHz
300kHz
500kHz
1M Hz
p-p
p-p
% of OCL vs. % of I
sa t
0%
20%
40%
60%
80%
100%
0% 20% 40% 60% 80% 100% 120% 140% 160%
% of I
sa t
% of OCL
+25°C
+85°C
-40°C
Inductance Characteristics
Core Loss
1209 BU-SB091134 Page 4 of 4 Data Sheet: 4354
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This
bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, with-
out notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any
technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company.
Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably
expected to result in significant injury to the user.
North America
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Suite F
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Cooper Bussmann
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Europe
Cooper Electronic Technologies
Cooper (UK) Limited
Burton-on-the-Wolds
Leicestershire • LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Fax: +34 937 362 719
Asia Pacific
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Tel: +65 278 6151
Fax: +65 270 4160
© 2009 Cooper Bussmann
St. Louis, MO 63178
www.cooperbussmann.com
Solder Reflow Profile
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
Ta
ab
bl
le
e
1
1
-
-
S
St
ta
an
nd
da
ar
rd
d
S
Sn
nP
Pb
b
S
So
ol
ld
de
er
r
(
(T
Tc
c)
)
Volume Volume
Packagemm
3mm3
Thickness <350 >
_350
<2.5mm 235°C220°C
>
_2.5mm 220°C220°C
T
Ta
ab
bl
le
e
2
2
-
-
L
Le
ea
ad
d
(
(P
Pb
b)
)
F
Fr
re
ee
e
S
So
ol
ld
de
er
r
(
(T
Tc
c)
)
Volume Volume Volume
Packagemm
3mm3mm3
Thickness <350 350 - 2000 >2000
<1.6mm 260°C260°C260°C
1.6 – 2.5mm 260°C250°C245°C
>2.5mm 250°C245°C245°C
Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak• Temperature min. (Tsmin) 100°C150°C
• Temperature max. (Tsmax) 150°C200°C
• Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds
Average ramp up rate Tsmaxto Tp3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (T
L
) 183°C217°C
Time at liquidous (tL) 60-150 Seconds 60-150 Seconds
Peak package body temperature (TP)*Table 1Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds**
Average ramp-down rate (Tpto Tsmax)6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
