PHASE SHIFTERS - ANALOG - CHIP
3
3 - 2
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC247
400° ANALOG PHASE SHIFTER
5 - 18 GHz
v03.0809
General Description
Features
Functional Diagram
The HMC247 is an Analog Phase Shifter die which
is controlled via an analog control voltage from 0 to
+10V. The HMC247 provides a continuously variable
phase shift of 0 to 300 degrees at 9 GHz, and 0 to
100 degrees at 18 GHz, with consistent insertion loss
versus phase shift. The phase shift is monotonic with
respect to the control voltage. The control port has a
modulation bandwidth of 50 MHz. The low insertion
loss and compact size enable this part to be used
in a wide range of applications, including the phase
adjustment of clocks in  ber optic systems and test
equipment. All data is measured with the chip in a 50
ohm test  xture, connected via 0.076 mm (3 mil) ribbon
bonds of minimal length <0.31 mm (<12 mils).
Wide Bandwidth: 5 - 18 GHz
Phase Shift: >400°
Single Positive Voltage Control
Small Size: 2.3 x 1.6 x 0.1 mm
Electrical Speci cations, TA = +25° C, 50 Ohm System
Typical Applications
The HMC247 is ideal for:
• Fiber Optics
• Military
• Test Equipment
Parameter Frequency (GHz) Min. Typ. Max. Units
Phase Shift Range:
5 - 10 GHz
10 - 13 GHz
13 - 18 GHz
180
135
45
400
200
120
degrees
degrees
degrees
Insertion Loss 5 - 10 GHz
10 - 18 GHz
8
4
12
7
dB
dB
Return Loss (Input and Output) 5 - 18 GHz 8 dB
Control Voltage Range 5 - 18 GHz 0 - 10 Volt
Modulation Bandwidth 5 - 18 GHz 50 MHz
Phase Voltage Sensitivity 5 - 18 GHz 40 deg /Volt
Insertion Phase Temperature Sensitivity 5 - 18 GHz 0.5 deg /°C
PHASE SHIFTERS - ANALOG - CHIP
3
3 - 3
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Phase Shift vs. Control Voltage
Insertion Loss vs. Frequency
Phase Shift vs. Frequency @ Vctl = 10V
(Relative to Vctl = 0V)
Input Return Loss vs. Frequency,
Vctl = 0 to +10V
Output Return Loss vs. Frequency,
Vctl = 0 to +10V
Insertion Loss vs. Control Voltage @ 12 GHz
0
100
200
300
400
500
600
5 6 7 8 9 101112131415161718
+25C
+85C
-55C
NORMALIZED PHASE SHIFT (degrees)
FREQUENCY (GHz)
-20
-15
-10
-5
0
5 6 7 8 9 101112131415161718
RETURN LOSS (dB)
FREQUENCY (GHz)
-20
-15
-10
-5
0
5 6 7 8 9 101112131415161718
RETURN LOSS (dB)
FREQUENCY (GHz)
0
100
200
300
400
500
012345678910
6 GHz
12 GHz
18 GHz
NORMALIZED PHASE SHIFT (degrees)
Vctl (V)
-14
-12
-10
-8
-6
-4
-2
0
5 6 7 8 9 101112131415161718
0V
2V
4V
6V
8V
10V
INSERTION LOSS (dB)
FREQUENCY (GHz)
-10
-8
-6
-4
-2
0
012345678910
+25C
+85C
-55C
INSERTION LOSS (dB)
Vctl (V)
HMC247
v03.0809
400° ANALOG PHASE SHIFTER
5 - 18 GHz
PHASE SHIFTERS - ANALOG - CHIP
3
3 - 4
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Input IP3 vs. Control Voltage
Insertion Loss vs. Pin @ 12 GHz
Insertion Loss vs. Pin @ 7 GHz
Second Harmonics vs. Control
Voltage, Pin = -10 dBm
Insertion Loss vs. Pin @ 18 GHz
-10
-8
-6
-4
-2
0
-15 -10 -5 0 5 10 15 20 25
0V
5V
10V
INSERTION LOSS (dB)
INPUT POWER (dBm)
-10
-8
-6
-4
-2
0
-15 -10 -5 0 5 10 15 20 25
0V
5V
10V
INSERTION LOSS (dB)
INPUT POWER (dBm)
-10
-8
-6
-4
-2
0
-15 -10 -5 0 5 10 15 20 25
0V
5V
10V
INSERTION LOSS (dB)
INPUT POWER (dBm)
0
5
10
15
20
25
30
35
0246810
6 GHz
12 GHz
18 GHz
IP3 (dBm)
Vctl (V)
0
20
40
60
80
100
012345678910
6 GHz
12 GHz
18 GHz
2nd HARMONICS (dBc)
Vctl (V)
Phase Shift vs. Pin @ 7 GHz
-5
-3
-1
1
3
5
-10 -5 0 5
0V
5V
10V
NORMALIZED PHASE SHIFT (degrees)
INPUT POWER (dBm)
HMC247
v03.0809
400° ANALOG PHASE SHIFTER
5 - 18 GHz
PHASE SHIFTERS - ANALOG - CHIP
3
3 - 5
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Absolute Maximum Ratings
Control Voltage (Vctl) +11 Vdc
Reverse Current 5 mA
Input Power (RFin) +30 dBm
Channel Temperature (Tc) 150 °C
Continuous Pdiss (T = 85 °C)
(derate 28 mW/°C above 85 °C) 1.83 W
Thermal Resistance
(junction to die bottom) 35.6 °C/W
Storage Temperature -65 to +150 °C
Operating Temperature -55 to +85 °C
Phase Shift vs. Pin @ 12 GHz Phase Shift vs. Pin @ 18 GHz
-0.5
-0.3
-0.1
0.1
0.3
0.5
-10 -5 0 5
0V
5V
10V
NORMALIZED PHASE SHIFT (degrees)
INPUT POWER (dBm)
-0.5
-0.3
-0.1
0.1
0.3
0.5
-10 -5 0 5
0V
5V
10V
NORMALIZED PHASE SHIFT (degrees)
INPUT POWER (dBm)
HMC247
v03.0809
400° ANALOG PHASE SHIFTER
5 - 18 GHz
PHASE SHIFTERS - ANALOG - CHIP
3
3 - 6
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Pad Number Function Description Interface Schematic
1, 2 RFIN Port is DC blocked.
3Vctl
Phase shift control pin. Application of voltage between 0 and 10 volts causes
the transmission phase to change. The DC equivalent circuit is a series con-
nected diode resistor
4, 5 RFOUT Port is DC blocked.
GND The backside of the die must be connected to RF / DC ground.
Pad Descriptions
Assembly Diagram
HMC247
v03.0809
400° ANALOG PHASE SHIFTER
5 - 18 GHz
PHASE SHIFTERS - ANALOG - CHIP
3
3 - 7
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag
for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize
inductive pick-up.
General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the
chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or  ngers.
Mounting
The chip is back-metallized and can be die mounted with electrically conductive epoxy. The mounting surface should be clean
and  at.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy  llet is observed around the
perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of
150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum
level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or
substrate. All bonds should be as short as possible <0.31mm (12 mils).
Outline Drawing
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. TIE ALL UNLABLED BOND PADS TO GROUND.
3. DIE THICKNESS IS .004”
4. TYPICAL BOND PAD IS .004” SQUARE.
5. BACKSIDE METALIZATION: GOLD.
6. BOND PAD METALIZATION: GOLD.
HMC247
v03.0809
400° ANALOG PHASE SHIFTER
5 - 18 GHz
Die Packaging Information [1]
Standard Alternate
WP-4 (Waffle Pack) [2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.