Product Family: High Power Chip Resistor Construction: * 99.5% BeO or 99.6% Alumina Ceramic * Nickel alloy thin film resistive element * Epoxy-resin overcoat * Pre-tinned (Sn100, matte) terminations over Ni barrier Features: * TCR's to 25ppm * Tolerances less than 1% * Custom and standard sizes available * High volume production, suitable for commercial and special applications Description: These power resistors are designed to tolerate high current and establish a low thermal resistance interface with the circuit board. A lower thermal resistance more efficiently sinks heat to the board, enabling a larger effective area for heat dissipation. As a result, much lower surface temperatures are achievable in comparison to standard chip resistors for the same chip size and applied power. The BP series effectively integrates the power resistor with the board, providing a thermal resistance comparable with aluminum heat-sinks. Dimensions: Size Inch 2512 Metric 6332 L 6.3 0.2 2525 6363 6.3 0.2 Dimensions (mm) H 1.1 0.1 (BP) 0.7 0.1 (CP) 6.3 0.2 1.1 0.1 (BP) 0.7 0.1 (CP) W 3.2 0.2 T-top 0.9 0.2 T-btm 2.0 0.2 0.9 0.2 2.0 0.2 Call for other sizes Electrical Specifications: Size: Inch (Metric) Rated Power at 70C 1 (BeO) Rated Power at 70C 1 (Alumina) Rated Voltage Resistance Tolerance Resistance Values TCR (ppm/C) 2 Operating Temperature Range 3 Insulation Resistance (100V, 1min) 4 Derating Curve: 2512 (6332) 2525 (6363) Up to 5W 1 Up to 8W 1 1 Up to 2W Up to 3W 1 (PxR) 1 to 5% 5 to 200 , call for other values 25 to 200 -55 to 150C > 1G Notes: 1. Dependent on effective thermal conductivity of board construction/land design and size of board - greater power capability for board/land with lower thermal resistance. For relatively high thermal resistance mountings, the power resistors are capable of reflowing solder bonds before device damage occurs. 2. Per MIL-PRF-55342 (-55/25/125C). 3. Per MIL-PRF-55342, see derating curve. 4. Per IEC 60115-1. Environmental Performance Specifications: Test Life Thermal Shock High Temperature Exposure Short Time Overload Moisture Resistance Resistance to Soldering Heat 1 Solderability 2 Board Flex Terminal Strength Reference MIL-PRF-55342, MIL-STD-202 Method 108A MIL-PRF-55342, MIL-STD-202 Method 107G MIL-PRF-55342 MIL-PRF-55342 MIL-PRF-55342, MIL-STD-202 Method 106G MIL-PRF-55342, MIL-STD-202 Method 210F MIL-PRF-55342, MIL-STD-202 Method 208H IEC 60115-1 / JIS C 5202 Conditions of Test 70C, 2000h, rated power, 1.5h on, 0.5h off Requirement 0.5% + 0.01 Condition F-3, -65C/0.25h to 150C/0.25h, 100 cycles 0.1% + 0.01 150C, 100h 6.25x rated power, 5 sec. 25/65/25/65/25/-10C, 90% to 98%RH, 10 cycles, 24h/cycle, with and without bias, bias = 1.5h on, 0.5h off @ 1/10th rated power 260C for 15 sec., over 220C for 60 sec., 3 cycles 0.1% + 0.01 0.1% + 0.01 0.1% + 0.01 Precondition E: 150C dry bake for 16h, Method 1 "Dip and Look Test", 245C, 5 sec., Pb-free (SnAgCu) Solder Bend amount of 3mm, measurements during and after bend Min 95% coverage of critical area 0.1% + 0.01, No mechanical damage No mechanical damage MIL-PRF-55342 Force of 3kg for 30 sec. 0.1% + 0.01 Notes: 1. Test conditions modified to represent the high temperature Pb-free reflow conditions and an extra cycle is added. 2. JESD22-B102D adds test conditions for Pb-free and is aligned with J-STD-002B referenced in MIL-STD-202 Method 208H. JESD22-B102D procedure comes from EIA-638, "Surface Mount Solderability Test". Recommended Solder Pad Dimensions: Size: Metric (Inch) A B C Dimensions (mm) 2512 (6332) 2525 (6363) 1.6 1.6 7.7 7.7 3.5 6.7 Notes on board construction and land design: 1. A multi-layer board with several ground or power planes significantly reduces thermal resistance. 2. Plated via holes around the power resistor further reduces thermal resistance. 3. Maximize land area beyond solder pad area in both width and length to further reduce thermal resistance. 4. Optimizing the thermal resistance of the board helps dissipate heat, enabling higher power handling and lower surface temperatures. Part Numbering: (Ex. BP2512S27R0J) BP Product Designator BP for BeO CP for Alumina 2512 Size, Inch Refer to table above S TCR E = 25 ppm/C H = 50 ppm/C K = 100 ppm/C S = 200 ppm/C 27R0 Resistance Value Ex. 27R0 = 27.0 J Tolerance F = 1% G = 2% J = 5% Thin Film Technology Corp., 1980 Commerce Drive, North Mankato, MN 56003, (507) 625-8445 www.thin-film.com