BP2525 - Thin Film Technology Corporation

Product Family: High Power Chip Resistor

Construction:

• 99.5% BeO or 99.6% Alumina Ceramic

• Nickel alloy thin film resistive element

• Epoxy-resin overcoat

• Pre-tinned (Sn100, matte) terminations

over Ni barrier

Features:

• TCR’s to ± 25ppm

• Tolerances less than ± 1%

• Custom and standard sizes available

• High volume production, suitable for

commercial and special applications

Description:

These power resistors are designed to tolerate high current and establish a low thermal resistance interface with the circuit board. A

lower thermal resistance more efficiently sinks heat to the board, enabling a larger effective area for heat dissipation. As a result,

much lower surface temperatures are achievable in comparison to standard chip resistors for the same chip size and applied power.

The BP series effectively integrates the power resistor with the board, providing a thermal resistance comparable with aluminum

heat-sinks.

Dimensions: Size Dimensions (mm)

Inch Metric L W H T-top T-btm

2512 6332 6.3 ± 0.2 3.2 ± 0.2 1.1 ± 0.1 (BP)

0.7± 0.1 (CP)

0.9 ± 0.2 2.0 ± 0.2

2525 6363 6.3 ± 0.2 6.3 ± 0.2 1.1 ± 0.1 (BP)

0.7± 0.1 (CP)

0.9 ± 0.2 2.0 ± 0.2

Call for other sizes

Electrical Specifications: Derating Curve:

Size: Inch (Metric) 2512 (6332) 2525 (6363)

Rated Power at 70ºC 1 (BeO) Up to 5W 1Up to 8W 1

Rated Power at 70ºC 1 (Alumina) Up to 2W 1Up to 3W 1

Rated Voltage √(PxR)

Resistance Tolerance ± 1 to 5%

Resistance Values 5 to 200 Ω, call for other

values

TCR (ppm/ºC) 2± 25 to 200

Operating Temperature Range 3-55 to 150ºC

Insulation Resistance (100V, 1min) 4> 1GΩ

Notes:

1. Dependent on effective thermal conductivity of board construction/land design and size of board - greater power capability for

board/land with lower thermal resistance. For relatively high thermal resistance mountings, the power resistors are capable of

reflowing solder bonds before device damage occurs.

2. Per MIL-PRF-55342 (-55/25/125ºC).

3. Per MIL-PRF-55342, see derating curve.

4. Per IEC 60115-1.

Environmental Performance Specifications:

Test Reference Conditions of Test Requirement

Life MIL-PRF-55342,

MIL-STD-202

Method 108A

70ºC, 2000h, rated power, 1.5h on, 0.5h off ± 0.5% + 0.01Ω

Thermal Shock MIL-PRF-55342,

MIL-STD-202

Method 107G

Condition F-3, -65ºC/0.25h to 150ºC/0.25h, 100 cycles ± 0.1% + 0.01Ω

High Temperature Exposure MIL-PRF-55342 150ºC, 100h ± 0.1% + 0.01Ω

Short Time Overload MIL-PRF-55342 6.25x rated power, 5 sec. ± 0.1% + 0.01Ω

Moisture Resistance MIL-PRF-55342,

MIL-STD-202

Method 106G

25/65/25/65/25/–10ºC, 90% to 98%RH, 10 cycles,

24h/cycle, with and without bias, bias = 1.5h on, 0.5h

off @ 1/10th rated power

± 0.1% + 0.01Ω

Resistance to Soldering Heat 1MIL-PRF-55342,

MIL-STD-202

Method 210F

260ºC for 15 sec., over 220ºC for 60 sec., 3 cycles ± 0.1% + 0.01Ω

Solderability 2MIL-PRF-55342,

MIL-STD-202

Method 208H

Precondition E: 150ºC dry bake for 16h,

Method 1 “Dip and Look Test”, 245ºC, 5 sec., Pb-free

(SnAgCu) Solder

Min 95%

coverage of

critical area

Board Flex IEC 60115-1 /

JIS C 5202

Bend amount of 3mm, measurements during and after

bend

± 0.1% + 0.01Ω,

No mechanical

damage

Terminal Strength MIL-PRF-55342 Force of 3kg for 30 sec. No mechanical

damage

Notes:

1. Test conditions modified to represent the high temperature Pb-free reflow conditions and an extra cycle is added.

2. JESD22-B102D adds test conditions for Pb-free and is aligned with J-STD-002B referenced in MIL-STD-202 Method 208H.

JESD22-B102D procedure comes from EIA-638, “Surface Mount Solderability Test”.

Recommended Solder Pad Dimensions:

Dimensions (mm)

Size: Metric (Inch) 2512 (6332) 2525 (6363)

A 1.6 1.6

B 7.7 7.7

C 3.5 6.7

Notes on board construction and land design:

1. A multi-layer board with several ground or power planes significantly reduces thermal resistance.

2. Plated via holes around the power resistor further reduces thermal resistance.

3. Maximize land area beyond solder pad area in both width and length to further reduce thermal resistance.

4. Optimizing the thermal resistance of the board helps dissipate heat, enabling higher power handling and lower surface

temperatures.

Part Numbering: (Ex. BP2512S27R0J)

BP 2512 S 27R0 J

Product Designator Size, Inch TCR Resistance Value Tolerance

BP for BeO

CP for Alumina

Refer to table above E = ± 25 ppm/C

H = ± 50 ppm/C

K = ± 100 ppm/C

S = ± 200 ppm/C

Ex. 27R0 = 27.0 Ω F = ± 1%

G = ± 2%

J = ± 5%

Thin Film Technology Corp., 1980 Commerce Drive, North Mankato, MN 56003, (507) 625-8445