Synchronous Step-Down MOSFET Drivers ZL1505 Features The ZL1505 is an integrated high-speed, high-current N-channel MOSFET driver for synchronous step-down DC/DC conversion applications. When used with Zilker Labs DigitalDCTM PWM controllers, the ZL1505 enables dynamically adaptive dead-time control that optimizes efficiency under all operating conditions. A dual input PWM configuration enables this efficiency optimization while minimizing complexity within the driver. * High-speed, high-current drivers for synchronous N-channel MOSFETs Operating from a 4.5V to 7.5V input, the ZL1505 combines a 5A, 0.5W low-side driver and a 3A, 0.8W high-side driver to support high step-down buck applications. A unique adjustable gate drive current scheme allows the user to adjust the drive current on both drivers to optimize performance for a wide rage of input/output voltages, load currents, power MOSFETs and switching frequencies up to 1.4MHz. An integrated 30V bootstrap Schottky diode is used to charge the external bootstrap capacitor. An internal watchdog circuit prevents excessive shoot-through currents and protects the external MOSFET switches. The ZL1505 is specified over a wide -40C to +125C junction temperature range and is available in an exposed pad DFN-10 package. * Adaptive dead-time control optimizes efficiency when used with Digital-DC controllers * Integrated 30V bootstrap Schottky diode * Capable of driving 40A per phase * Supports switching frequency up to 1.4MHz - >4A source, >5A sink low-side driver - >3A source/sink high-side driver - <10ns rise/fall times, low propagation delay * Adjustable gate drive strength optimizes efficiency for different VIN, VOUT, IOUT, FSW and MOSFET combinations * Internal non-overlap watchdog prevents shoot-through currents Applications*(see page 12) * High efficiency, high-current DC/DC buck converters with digital control and PMBusTM * Multi-phase digital DC/DC converters with phase adding/dropping * Power train modules * Synchronous rectification for secondary side isolated power converters Related Literature*(see page 12) * ZL2004 Adaptive Digital DC/DC Controller with Current Sharing HSEL BST VDD GH PWMH LEVEL SHIFT SHOOTTHROUGH PROTECTION SW VDD PWML GL ZL1505 GND LSEL FIGURE 1. ZL1505 BLOCK DIAGRAM February 25, 2011 FN6845.3 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2009-2011. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. ZL1505 Typical Application Circuit The following application circuit represents the typical implementation of the ZL1505 (Notes 1, 2). VIN 4.5-14V VDD VMON PWML XTEMP SGND PWMH PWML GH PWMH ZL1505 PWML GND ZL2004 Power Train Module VDD PWMH VIN LSEL HSEL BST VIN VBIAS 4.5-7.5V VOUT SW GL GND TEMP+ VSEN- VSEN+ TEMP- GND CS+ CS- ISENA ISENB FIGURE 2. POWER TRAIN MODULE USING ZL2004 PWM CONTROLLER NOTES: 1. For VDD of 4.5V to 7.5V, the maximum VIN of the ZL1505 is 22.5V to 25.5V. ZL1505 input supply voltage range (VIN) is specified in Figure 2. 2. VIN for this application circuit is limited by the ZL2004 VIN of 4.5V to 14V. 2 FN6845.3 February 25, 2011 ZL1505 Pin Configuration ZL1505 (10 LD DFN) TOP VIEW HSEL 1 10 BST GH 2 9 VDD EPAD* SW 3 8 GL PWMH 4 7 GND PWML 5 6 LSEL *CONNECT TO GND Pin Descriptions PIN NUMBER PIN NAME TYPE (Note 3) 1 HSEL I DESCRIPTION High-side gate drive current selector. Connect to BST for maximum gate drive current; connect to SW for 50% of maximum gate drive current. 2 GH O 3 SW I/O Output of high-side gate driver. Connect to the gate of high-side FET. 4 PWMH I High-side PWM control input. 5 PWML I Low-side PWM control input. 6 LSEL I Low-side gate drive current selector. Connect to VDD for maximum gate drive current; connect to GND for 50% of maximum gate drive current. 7 GND PWR Phase node. Return path for high-side driver. Connect to source of high-side FET and drain of low-side FET. Ground. All signals return to this pin. 8 GL O 9 VDD PWR Gate drive bias supply. Connect a high-quality bypass capacitor from this pin to GND. Output of low-side gate driver. Connect to the gate of low-side FET. 10 BST PWR Bootstrap supply. Connect external capacitor to SW node. EPAD GND PWR Ground. NOTE: 3. I = Input, O = Output, PWR = Power OR Ground. Ordering Information PART NUMBER (Notes 4, 7) PART MARKING TEMP RANGE (C) PACKAGE Tape and Reel (Pb-free) PKG. DWG. # ZL1505ALNNT (Note 5) 1505 -40 to +125 10 Ld 3x3 DFN L10.3x3D ZL1505ALNNT1 (Note 5) 1505 -40 to +125 10 Ld 3x3 DFN L10.3x3D ZL1505ALNNT6 (Note 5) 1505 -40 to +125 10 Ld 3x3 DFN L10.3x3D ZL1505ALNFT (Note 6) 1505 -40 to +125 10 Ld 3x3 DFN L10.3x3D ZL1505ALNFT1 (Note 6) 1505 -40 to +125 10 Ld 3x3 DFN L10.3x3D ZL1505ALNFT6 (Note 6) 1505 -40 to +125 10 Ld 3x3 DFN L10.3x3D NOTES: 4. Please refer to Tech Brief TB347 for details on reel specifications. 5. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 6. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pbfree products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 7. For Moisture Sensitivity Level (MSL), please see device information page for ZL1505. For more information on MSL please see Tech Brief TB363. 3 FN6845.3 February 25, 2011 ZL1505 Absolute Maximum Ratings Thermal Information Voltage Measured with Respect to GND DC Supply Voltage for VDD Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 8V High-Side Supply Voltage for BST Pin. . . . . . . . . . . . . . . . . . . . . -0.3V to 30V High-Side Drive Voltage for GH Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (VSW - 0.3V) to (VBST + 0.3V) Low-Side Drive Voltage for GL Pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (GND - 0.3V) to (VDD + 0.3V) Boost to Switch Differential (VBST - VSW) for BST, SW Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 8V Switch Voltage for SW Pin Continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (GND - 0.3V) to 30V <100ns . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (GND - 5V) to 30V Logic I/O Voltage for PWMH, PWML, LSEL Pins . . . . . . . . . . . . . -0.3V to 6V HSEL Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . (VSW - 0.3V) to (VBST + 0.3V) ESD Rating Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2kV GL Pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5kV Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500V Latch Up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tested to JESD78 Thermal Resistance (Typical) JA (C/W) JC (C/W) 10 Ld DFN (Notes 8, 9) . . . . . . . . . . . . . . . . 50 7 Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . .-55C to +150C Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . .-55C to +150C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Recommended Operating Conditions Gate Drive Bias Supply Voltage Range VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5V to 7.5V Input Supply Voltage Range, VIN . . . . . . . . . . . . . . . . . . . . . 3V to 30V - VDD Operating Junction Temperature Range, TJ . . . . . . . . . . . . .-40C to +125C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 8. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with "direct attach" features. See Tech Brief TB379. 9. For JC, the "case temp" location is the center of the exposed metal pad on the package underside. Electrical Specifications VDD = 6.5V, TJ = -40C to +125C unless otherwise noted. Typical values are at TA = +25C. Boldface limits apply over the operating temperature range, -40C to +125C. MIN (Note 10) TYP MAX (Note 10) UNIT Not switching - 110 180 A VPWM = 5 V - 5 - A VPWM = 0 V - - 1 A - - 1.7 V PARAMETER CONDITIONS BIAS CURRENT CHARACTERISTICS IDD supply current PWM INPUT CHARACTERISTICS PWM Input Bias Current PWM Input Logic Low, VIL PWMH or PWML VDD = 6.5V VDD = 5.0V - - 1.4 V PWM Input Logic High, VIH PWMH or PWML VDD = 6.5V 3.4 - - V VDD = 5.0V 2.7 - - V VDD = 6.5V - 1.1 - V VDD = 5.0V - 0.8 - V Minimum PWMH On-time to Produce GH Pulse, CGH = 0 tPWMH,ON (Note 11) - 12 - ns Minimum GH On-time Pulse, tGH,ON (Note 12) CGH = 0 - 14 - ns CGH = 3 nF, VHSEL = VBST - 20 - ns CGH = 0 - 17 - ns Forward bias current 100 mA - 0.8 - V Hysteresis PWMH or PWML Minimum PWMH Off-time to Produce Valid GH Pulse, tPWMH,OFF BOOTSTRAP DIODE CHARACTERISTICS Forward Voltage (VF) 4 FN6845.3 February 25, 2011 ZL1505 Electrical Specifications VDD = 6.5V, TJ = -40C to +125C unless otherwise noted. Typical values are at TA = +25C. Boldface limits apply over the operating temperature range, -40C to +125C. (Continued) MIN (Note 10) TYP MAX (Note 10) UNIT Thermal Trip Point - 150 - C Thermal Reset Point - 134 - C - 6 - V HSEL connected to BST 2.0 3.2 - A HSEL connected to SW 1.0 1.7 - A HSEL connected to BST 2.0 3.2 - A HSEL connected to SW 1.0 1.6 - A HSEL connected to BST - 0.7 0.9 HSEL connected to SW - 0.9 1.2 HSEL connected to BST - 0.8 1.1 HSEL connected to SW - 1.1 1.5 - 6.5 - V LSEL connected to VDD 3.0 4.5 - A LSEL connected to GND 1.5 2.4 - A LSEL connected to VDD 3.5 5.4 - A LSEL connected to GND 1.8 2.8 - A LSEL connected to VDD - 0.7 0.9 LSEL connected to GND - 1.0 1.3 LSEL connected to VDD - 0.5 0.7 LSEL connected to GND - 0.7 1.0 HSEL connected to BST - 5.3 8.5 ns HSEL connected to SW - 10.5 16.5 ns PARAMETER CONDITIONS THERMAL PROTECTION UPPER GATE DRIVER CHARACTERISTICS Driver Voltage (VBST - VSW) High-side Driver Peak Gate Drive Current (Pull-up) (VGH - VSW) = 2.5V High-side Driver Peak Gate Drive Current (Pull-down) High-side Driver Pull-up Resistance High-side Driver Pull-down Resistance (VGH - VSW) = 2.5V (VBST - VGH) = 50mV (VGH - VSW) = 50mV LOWER GATE DRIVER CHARACTERISTICS Driver voltage (VDD) Low-side Driver Peak Gate Drive Current (Pullup) Low-side Driver Peak Gate Drive Current (Pulldown) Low-side Driver Pull-up Resistance Low-side Driver Pull-down Resistance (VGL - VGNG) = 2.5V (VGL - VGND) = 2.5V (VDD - VGL) = 50mV (VGL - GND) = 50mV SWITCHING CHARACTERISTICS GH rise time, tRH CGH = 3nF 5 FN6845.3 February 25, 2011 ZL1505 Electrical Specifications VDD = 6.5V, TJ = -40C to +125C unless otherwise noted. Typical values are at TA = +25C. Boldface limits apply over the operating temperature range, -40C to +125C. (Continued) MIN (Note 10) TYP MAX (Note 10) UNIT HSEL connected to BST - 4.8 7.5 ns HSEL connected to SW - 9.5 15 ns LSEL connected to VDD - 4.0 6.0 ns LSEL connected to GND - 7.8 12 ns LSEL connected to VDD - 3.0 4.5 ns LSEL connected to GND - 5.5 8.5 ns - 30.0 - ns HSEL connected to SW - 31.5 - ns HSEL connected to BST - 37.5 - ns HSEL connected to SW - 39.0 - ns LSEL connected to VDD - 26.5 - ns LSEL connected to GND - 28.0 - ns LSEL connected to VDD - 30.0 - ns LSEL connected to GND - 31.5 - ns PARAMETER CONDITIONS GH fall time, tFH CGH = 3nF CGL = 3nF GL rise time, tRL GL fall time, tFL CGL = 3nF GH turn-on propagation delay, tDHR GH turn-off propagation delay, tDHF GL turn-on propagation delay, tDLR GL turn-off propagation delay, tDLF HSEL connected to BST NOTES: 10. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design. 11. The minimum PWMH on-time pulse (tPWMH,ON) is specified from VPWM = 2.5V on the rise edge to VPWM = 2.5V on the falling edge. 12. The minimum GH on-time pulse (tGH,ON) is specified at VGH = 2.5V. PWM 2.5V 2.5V tPWMH,ON tDLF tDLR GH 90% 90% 2.5V 2.5V tGH,ON 10% tRH 10% tFH FIGURE 3. TIMING DIAGRAM 6 FN6845.3 February 25, 2011 ZL1505 Typical Performance Curves +85C, +25C, and -25C. Performance curves with temperature are measured at ambient temperatures (TA) of 130 155 120 150 +85C 145 T (C) IVDD (A) 110 100 +25C 125 -25C 5.0 5.5 6.0 VDD (V) 6.5 7.0 120 4.5 7.5 5.0 5.5 6.0 6.5 7.0 7.5 VDD (V) FIGURE 4. IVDD vs VDD WITH TEMPERATURE (NO SWITCHING) FIGURE 5. THERMAL PROTECTION THRESHOLDS 16 22 +85C 15 20 CGH = 3nF, HSEL = SW 14 ON-TIME (ns) 18 16 14 CGH = 3nF, HSEL = BST 12 10 135 130 80 70 4.5 140 TFALLING 90 ON-TIME (ns) TRISING +25C 13 12 11 10 CGH = 0 9 -25C 8 4.5 8 5.0 5.5 6.0 6.5 7.0 4.5 7.5 5.0 5.5 VDD (V) 6.0 6.5 7.0 7.5 VDD (V) FIGURE 6. MINIMUM GH ON-TIME, tGH,ON (TA = +25C) FIGURE 7. tGH,ON WITH TEMPERATURE (CGH = 0) (see Figure 3 for tGH,ON timing) 16 30 14 +85C 26 +85C 10 -25C 8 OFF-TIME (ns) ON-TIME (ns) 12 22 +25C 18 6 -25C 14 4 +25C 2 4.5 5.0 5.5 6.0 6.5 7.0 7.5 VDD (V) FIGURE 8. MINIMUM PWMH ON-TIME, tPWMH,ON (CGH = 0) 7 10 4.5 5.0 5.5 6.0 6.5 7.0 7.5 VDD (V) FIGURE 9. MINIMUM PWMH OFF-TIME, tPWMH,OFF (CGH = 0) FN6845.3 February 25, 2011 ZL1505 Typical Performance Curves +85C, +25C, and -25C. (Continued) Performance curves with temperature are measured at ambient temperatures (TA) of 6.6 6.6 5.6 5.6 LSEL = VDD IGL (A) IGL (A) 4.6 3.6 LSEL = GND +25C 4.6 -25C +85C 3.6 2.6 2.6 1.6 0.6 4.5 5.0 5.5 6.0 6.5 7.0 1.6 7.5 4.5 5.0 5.5 6.0 6.5 7.0 7.5 VDD (V) VDD (V) FIGURE 10. LOW-SIDE DRIVER PULL-UP CURRENT (VGL = 2.5V, TA = +25C) FIGURE 11. LS PULL-UP CURRENT WITH TEMPERATURE (VGL = 2.5V, LSEL = VDD) 8 8 7 7 LSEL = VDD 5 IGL (A) IGL (A) 6 4 +25C 6 -25C 5 LSEL = GND 3 +85C 4 2 1 3 4.5 5.0 5.5 6.0 6.5 7.0 7.5 4.5 5.0 5.5 6.0 6.5 7.0 7.5 VDD (V) VDD (V) FIGURE 12. LOW-SIDE DRIVER PULL-DOWN CURRENT (VGL = 2.5V, TA = +25C) FIGURE 13. LS PULL-DOWN CURRENT WITH TEMPERATURE (VGL = 2.5V, LSEL = VDD) 12 6.5 11 +85C 6.0 10 5.5 LSEL = GND 8 tRISE (ns) tRISE (ns) 9 7 6 3.5 4 3 4.5 4.0 LSEL = VDD 5 +25C 5.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 VDD (V) FIGURE 14. LOW-SIDE DRIVER RISE TIME, tRL (CGL = 3nF, TA = +25C) 8 3.0 4.5 -25C 5.0 5.5 6.0 6.5 7.0 7.5 VDD (V) FIGURE 15. tRL WITH TEMPERATURE (CGL = 3nF, LSEL = VDD) FN6845.3 February 25, 2011 ZL1505 Typical Performance Curves +85C, +25C, and -25C. (Continued) Performance curves with temperature are measured at ambient temperatures (TA) of 7 4.5 +85C 4.0 LSEL = GND 5 tFALL (ns) tFALL (ns) 6 4 LSEL = VDD 3 3.5 +25C 3.0 2.5 -25C 2 4.5 5.0 5.5 6.0 6.5 7.0 2.0 4.5 7.5 5.0 5.5 VDD (V) 6.0 6.5 7.0 7.5 VDD (V) FIGURE 16. LOW-SIDE DRIVER FALL TIME, tFL (CGL = 3nF, TA = +25C) FIGURE 17. tFL WITH TEMPERATURE (CGL = 3nF, LSEL = VDD) 5.0 5 4.5 4.0 -25C 3.5 3 IGH (A) IGH (A) 4 HSEL = BST 2 +85C 3.0 2.5 HSEL = SW 2.0 1 1.5 0 4.5 5.0 5.5 6.0 6.5 7.0 1.0 7.5 +25C 4.5 5.0 5.5 VDD (V) 6.0 6.5 7.0 7.5 VDD (V) FIGURE 18. HIGH-SIDE DRIVER PULL-UP CURRENT (VGH - VSW = 2.5V, TA = +25C) FIGURE 19. HS PULL-UP CURRENT WITH TEMPERATURE (VGH - VSW = 2.5V, HSEL = BST) 5.0 5 4.5 4 3 HSEL = BST IGH (A) IGH (A) 4.0 2 HSEL = SW +25C 3.5 -25C 3.0 +85C 2.5 1 2.0 1.5 0 4.5 5.0 5.5 6.0 6.5 7.0 VDD (V) FIGURE 20. HIGH-SIDE DRIVER PULL-DOWN CURRENT (VGH - VSW = 2.5V, TA = +25C) 9 7.5 4.5 5.0 5.5 6.0 6.5 7.0 7.5 VDD (V) FIGURE 21. HS PULL-DOWN CURRENT WITH TEMPERATURE (VGH - VSW = 2.5V, HSEL = BST) FN6845.3 February 25, 2011 ZL1505 Typical Performance Curves +85C, +25C, and -25C. (Continued) Performance curves with temperature are measured at ambient temperatures (TA) of 17.5 8.5 +25C 15.5 7.5 11.5 tRISE (ns) tRISE (ns) 13.5 HSEL = SW 9.5 7.5 +85C 5.5 HSEL = BST -25C 4.5 5.5 3.5 4.5 6.5 3.5 5.0 5.5 6.0 6.5 7.0 7.5 4.5 5.0 5.5 VDD (V) FIGURE 22. HIGH-SIDE DRIVER RISE TIME, tRH (CGH = 3nF, TA = +25C) 6.5 7.0 7.5 FIGURE 23. tRH WITH TEMPERATURE (CGH = 3nF, HSEL = BST) 11.5 7.5 +85C HSEL = SW 6.5 tFALL (ns) 9.5 tFALL (ns) 6.0 VDD (V) 7.5 5.5 +25C HSEL = BST 5.5 4.5 -25C 3.5 4.5 5.0 5.5 6.0 6.5 7.0 7.5 VDD (V) FIGURE 24. HIGH-SIDE DRIVER FALL TIME, tFH (CGH = 3nF, TA = +25C) ZL1505 Overview Theory of Operation The ZL1505 is a synchronous N-channel MOSFET driver that is intended for use with Zilker Labs Digital-DC PWM controllers to enable a high-efficiency DC/DC conversion scheme. The patented Digital-DC control scheme utilizes a closed-loop algorithm to optimize the dead-time applied between the gate drive signals for the high-side and low-side MOSFETs. By monitoring the duty cycle of the resulting DC/DC converter circuit, this dynamic routine continuously varies the MOSFET dead times to optimize conversion efficiency in response to varying circuit conditions. The ZL1505's dual PWM input configuration enables this optimization scheme to be applied while minimizing the complexity within the driver device. Please refer to the ZL2004 data sheet for details on the dynamic dead-time optimization routine. The ZL1505 integrates two powerful gate drivers that have been optimized for step-down DC/DC conversion circuit configurations 10 3.5 4.5 5.0 5.5 6.0 6.5 7.0 7.5 VDD (V) FIGURE 25. tFH WITH TEMPERATURE (CGH = 3nF, HSEL = BST) whose output current can exceed 40A per phase. The ZL1505 also integrates a 30V bootstrap Schottky diode to minimize the external components and provide a high drive voltage to the high-side driver device. Variable Gate Drive Current The ZL1505 incorporates an innovative variable drive current scheme that enables the user to optimize the gate drive current levels to the requirements of the external MOSFETs used over a wide range of operating frequencies. Each of the gate drivers incorporates a logic input (HSEL and LSEL) that allows the user to select the gate drive strength to 50% or 100% of the total rated drive current. With the HSEL pin connected to the BST pin, the high-side driver can deliver the full rated gate drive current; with the HSEL pin connected to the SW pin, the output current will be limited to 50% of the full rated output capability. With the LSEL pin connected to VDD, the low-side driver can deliver the full rated gate drive current; with the LSEL pin connected to GND, the FN6845.3 February 25, 2011 ZL1505 output current will be limited to 50% of the full rated output capability. Using HSEL and LSEL, the ZL1505 can be used across a wide range of applications using only a simple PCB layout change. Also, the VDD pin is the gate drive bias supply for the external MOSFETs. VDD can be used to vary the gate drive strength as shown for the low-side driver in Figures 9 through 12 and for the high-side driver in Figures 17 through 20. Overlap Protection Circuit The ZL1505 includes an internal watchdog circuit that prevents excessive shoot-through current from occurring in the unlikely event that the PWM converter places both switches in the ON position. If the overlap time between the PWMH and PWML pulses exceeds 30ns, the PWMH signal will be forced to the LOW state until the overlap condition ceases, allowing normal switching operation to continue. 11 Start-up Requirements During power-up, the ZL1505 maintains both GH and GL outputs in the LOW state while the VIN voltage is ramping up. Once the VDD supply is within specification, the GH and GL pins may be operated using the PWMH and PWML logic inputs respectively. In the case where the PWM controller is powered from a supply other than the ZL1505's VDD supply, and the PWM controller is powered up first, the PWM controller gate outputs should be kept in low or in high-impedance state until the VDD supply is within specification. Additionally, if the ZL1505 begins its power-down sequence prior to the PWM controller then the PWM controller gate outputs should be set in low or in high-impedance state before the VDD voltage supply drops below its specified range. Thermal Protection When the junction temperature exceeds +150C the high-side driver output GH is forced to logic low state. The driver output is allowed to switch logic states again once the junction temperature drops below +134C. FN6845.3 February 25, 2011 ZL1505 Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest Rev. DATE 2/15/11 REVISION CHANGE FN6845.3 Added ZL1505ALNFT, ZL1505ALNFT1 and ZL1505ALNFT6 to "Ordering Information" on page 3. Added applicable lead finish note (note 6). 2/9/11 Pg. 4: under "Absolute Maximum Ratings," changed maximum voltage from 8V to 6V for the following pins: From: "Logic I/O Voltage for PWMH, PWML, LSEL Pins . . . -0.3V to 8V" To: "Logic I/O Voltage for PWMH, PWML, LSEL Pins . . . -0.3V to 6V" 10/19/10 FN6845.2 "PWM Input Logic Low, VIL" on page 4, changed Max spec from 2.2V to 1.7V for "VDD = 6.5V". Removed Min/Typ specs of 1.7/2 "PWM Input Logic Low, VIL" on page 4, changed Max spec from 1.9V to 1.4V for "VDD = 5.0V". Removed Min/Typ specs of 1.5/1.7 "PWM Input Logic High, VIH" on page 4, changed Min spec from 2.8V to 3.4V for "VDD = 6.5V". Removed Typ/Max specs of 3.1/3.4 "PWM Input Logic High, VIH" on page 4, changed Min spec from 2.2V to 2.7V for "VDD = 5.0V". Removed Typ/Max specs of 2.5/2.7 7/9/10 On page 4, Electrical Specifications Table, the parameter "Minimum GH On-time Pulse, tGH,ON (Note 12)", removed 14 and 20 from Max column. In TYP column, changed 10 to 14 and 14 to 20. On page 4, Electrical Specifications Table, the parameter "Minimum PWMH On-time to Produce GH Pulse, tPWMH,ON (Note 11)", removed 12 from Max column. In TYP column, changed 8.5 to 12. On page 4, Electrical Specifications Table, the parameter "Minimum PWMH Off-time to Produce Valid GH Pulse, tPWMH,OFF", removed 17 from Max column. In TYP column, changed 13 to 17. Replaced POD drawing with updated revisions and changes were as follows: Converted to new standards by adding land pattern and moving dimensions from table onto drawing 2/14/09 FN6845.1 Assigned file number FN6845 to datasheet as this will be the first release with an Intersil file number. Replaced header and footer with Intersil header and footer. Updated disclaimer information to read "Intersil and it's subsidiaries including Zilker Labs, Inc." No changes to datasheet content 12/4/09 FN6845.0 Converted to new Intersil template. Changed in Abs Max Ratings "Low-Side Drive Voltage for GL pin" from "(GND - 0.3) to (VIN + 0.3)" to "(GND - 0.3) to (VDD + 0.3)". Removed Bullet "Adjustable gate drive voltage: 4.5V to 7.5V" and "Exposed pad 3mmx3mm DFN-10 Package" from Features. Intersil Standards applied are: Added Related Information, Updated ordering information with Notes that includes MSL. Updated Abs Max Ratings with notes, added ESD Ratings and Latchup, added Boldface text in Electrical Spec Table. Added POD Products Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks. Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a complete list of Intersil product families. *For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on intersil.com: ZL1505 To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff FITs are available from our website at http://rel.intersil.com/reports/search.php For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 12 FN6845.3 February 25, 2011 ZL1505 Package Outline Drawing L10.3x3D 10 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE Rev 1, 3/10 3.00 A 2.0 REF 6 PIN 1 INDEX AREA 8X 0.50 BSC 6 PIN 1 B 5 1 10X 0 . 40 INDEX AREA 3.00 1.60 0.15 (4X) 10 0.10 M C A B 0.05 M C 5 4 10 X 0.25 TOP VIEW 2.30 ( 2.30 ) BOTTOM VIEW 1.00 MAX SEE DETAIL "X" 0.10 C C (2.80) SEATING PLANE 0.08 C (1.60) SIDE VIEW (10 X 0.60) 5 0 . 2 REF C ( 8X 0 .50 ) 0 . 00 MIN. 0 . 05 MAX. ( 10X 0.25 ) TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal 0.05 Angular: 2.50 4. Dimension applies to the metallized terminal and is measured between 0.015mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be 7. Compliant to JEDEC MO-229-WEED-3 except exposed pad length (2.30mm). either a mold or mark feature. 13 FN6845.3 February 25, 2011