BAS70... / BAS170W Silicon Schottky Diode * General-purpose diode for high-speed switching * Circuit protection * Voltage clamping * High-level detecting and mixing BAS170W BAS70-02L BAS70-02W BAS70 BAS70-04 BAS70-04W 3 BAS70-04S 6 3 4 5 D 3 1 2 D 1 BAS70-06 BAS70-06W 2 4 D 2 1 2 Type BAS170W BAS70 BAS70-02L* BAS70-02W BAS70-04 BAS70-04S BAS70-04W BAS70-05 BAS70-05W BAS70-06 BAS70-06W BAS70-07 BAS70-07L4* BAS70-07W D 4 2 D 2 D 1 D 2 1 2 3 1 2 BAS70-07 BAS70-07W BAS70-07L4 3 D 1 1 3 D 2 D 1 1 BAS70-05 BAS70-05W 3 1 D 1 D 2 2 Package SOD323 SOT23 TSLP-2-1 SCD80 SOT23 SOT363 SOT323 SOT23 SOT323 SOT23 SOT323 SOT143 TSLP-4-4 SOT343 Configuration single single single, leadless single series dual series series common cathode common cathode common anode common anode parallel pair parallel pair, leadless parallel pair LS(nH) 1.8 1.8 0.4 0.6 1.8 1.6 1.4 1.8 1.4 1.8 1.4 2 0.4 1.8 Marking white 7 73s F 73 74s 74s 74s 75s 75s 76s 76s 77s E 77s * Preliminary 1 2005-05-24 BAS70... / BAS170W Maximum Ratings at TA = 25C, unless otherwise specified Parameter Symbol Diode reverse voltage VR 70 V Forward current IF 70 mA Non-repetitive peak surge forward current IFSM 100 Value Unit t 10ms Total power dissipation mW Ptot BAS70, BAS70-07, TS 72 C 250 BAS70-02L, BAS70-07L4, TS 117 C 250 BAS70-02W, TS 107 C 250 BAS70-04, BAS70-06, TS 48 C 250 BAS70-04S/W/-06W, BAS170W, TS 97 C 250 BAS70-05, TS 22 C 250 BAS70-05W, TS 90 C 250 BAS70-07W, TS 114 C 250 150 Junction temperature Tj Operating temperature range Top -55 ... 125 Storage temperature Tstg -55 ... 150 C Thermal Resistance Parameter Symbol Junction - soldering point 1) RthJS Value K/W BAS70, BAS70-07 310 BAS70-02L, BAS70-07L4 130 BAS70-02W 170 BAS70-04, BAS70-06 410 BAS70-04S/W, BAS70-06W 210 BAS70-05 510 BAS70-05W 240 BAS70-07W 145 BAS170W 190 1For Unit calculation of RthJA please refer to Application Note Thermal Resistance 2 2005-05-24 BAS70... / BAS170W Electrical Characteristics at TA = 25C, unless otherwise specified Symbol Parameter Values Unit min. typ. max. 70 - - V - - 0.1 A DC Characteristics Breakdown voltage V(BR) I (BR) = 10 A Reverse current IR VR = 50 V Forward voltage mV VF I F = 1 mA 300 375 410 I F = 10 mA 600 705 750 I F = 15 mA 720 880 1000 VF - - 20 CT - 1.5 2 pF rf - 34 - rr - - 100 ps Forward voltage matching1) I F = 10 mA AC Characteristics Diode capacitance VR = 0 , f = 1 MHz Forward resistance IF = 10 mA, f = 10 kHz Charge carrier life time IF = 25 mA 1V F is the difference between lowest and highest VF in a multiple diode component. 3 2005-05-24 BAS70... / BAS170W Diode capacitance CT = (VR) Forward resistance rf = (I F) f = 1MHz f = 10 kHz BAS 70W/BAS 170W 2.0 CT EHB00044 BAS 70W/BAS 170W 10 3 pF rf EHB00045 1.5 10 2 1.0 10 1 0.5 0.0 0 20 40 60 V 10 0 0.1 80 1 10 mA 100 F VR Reverse current IR = (VR) Forward current IF = (VF) TA = Parameter TA = Parameter 10 2 R BAS 70W/BAS 170W EHB00043 A 10 2 F TA = 150 C 10 1 BAS 70W/BAS 170W EHB00042 mA 10 1 85 C 10 0 10 0 TA = -40 C 25 C 85 C 150 C 10 -1 10 -3 10 -1 25 C 10 -2 0 20 40 60 V 10 -2 80 VR 0.0 0.5 1.0 V 1.5 VF 4 2005-05-24 BAS70... / BAS170W Forward current IF = (T S) Forward current IF = (T S) BAS70, BAS70-07 BAS70-02L, BAS70-07L4 80 80 mA 60 60 50 50 IF IF mA 40 40 30 30 20 20 10 10 0 0 15 30 45 60 75 90 105 120 C 0 0 150 15 30 45 60 75 90 105 120 C TS Forward current IF = (T S) Forward current IF = (T S) BAS70-02W BAS70-04, BAS70-06 80 80 mA mA 60 60 50 50 IF IF 150 TS 40 40 30 30 20 20 10 10 0 0 15 30 45 60 75 90 105 120 C 0 0 150 TS 15 30 45 60 75 90 105 120 C 150 TS 5 2005-05-24 BAS70... / BAS170W Forward current IF = (T S) Forward current IF = (T S) BAS70-04S/W, BAS70-06W, BAS170W BAS70-05 80 80 mA 60 60 50 50 IF IF mA 40 40 30 30 20 20 10 10 0 0 15 30 45 60 75 90 105 120 C 0 0 150 15 30 45 60 75 90 105 120 C TS Forward current IF = (T S) Forward current IF = (T S) BAS70-05W BAS70-07W 80 80 mA mA 60 60 50 50 IF IF 150 TS 40 40 30 30 20 20 10 10 0 0 15 30 45 60 75 90 105 120 C 0 0 150 TS 15 30 45 60 75 90 105 120 C 150 TS 6 2005-05-24 BAS70... / BAS170W Forward current IF = (T S) Permissible Puls Load R thJS = (tp) BAS170W BAS70 10 3 80 mA K/W RthJS IF 60 50 10 2 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 40 30 10 1 20 10 0 0 15 30 45 60 90 105 120 C 75 10 0 -6 10 150 10 -5 10 -4 10 -3 10 -2 TS s 10 0 10 0 tp Permissible Pulse Load Permissible Puls Load R thJS = (tp) IFmax / I FDC = (tp ) BAS70-02L, BAS70-07L4 BAS70 10 2 10 3 - RthJS IFmax/IFDC K/W D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 1 10 0 -6 10 10 -5 10 -4 10 -3 10 2 10 10 -2 s 10 10 0 -6 10 0 tp 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 1 10 -5 10 -4 10 -3 10 -2 s tp 7 2005-05-24 BAS70... / BAS170W Permissible Pulse Load Permissible Puls Load R thJS = (tp) IFmax / I FDC = (tp ) BAS70-02W BAS70-02L, BAS70-07L4 10 1 10 3 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 - 10 0 -6 10 RthJS I Fmax/IFDC K/W 10 -5 10 -4 10 10 2 D=0.5 0.2 0.1 0.05 0.02 0.01 0.005 0 10 1 -3 10 -2 s 10 10 0 -6 10 0 10 -5 10 -4 10 -3 10 -2 tp s 10 0 10 0 tp Permissible Pulse Load Permissible Puls Load R thJS = (tp) IFmax / I FDC = (tp ) BAS70-04, BAS70-06 BAS70-02W 10 1 10 3 IFmax/IFDC K/W RthJS D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 2 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 10 1 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 10 0 -6 10 0 tp 10 -5 10 -4 10 -3 10 -2 s tP 8 2005-05-24 BAS70... / BAS170W Permissible Pulse Load Permissible Puls Load R thJS = (tp) IFmax / I FDC = (tp ) BAS70-04S BAS70-04, BAS70-06 10 2 10 3 - D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 1 RthJS I Fmax/IFDC K/W 10 2 10 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 10 0 -6 10 0 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 1 10 -5 10 -4 10 -3 10 -2 tP s 10 0 10 0 tp Permissible Pulse Load Permissible Puls Load R thJS = (tp) IFmax / I FDC = (tp ) BAS70-04W, BAS70-06W BAS70-04S 10 2 10 3 - RthJS IFmax/IFDC K/W D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 1 10 0 -6 10 10 -5 10 -4 10 -3 10 2 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 10 1 10 -2 s 10 10 0 -6 10 0 tp 10 -5 10 -4 10 -3 10 -2 s tp 9 2005-05-24 BAS70... / BAS170W Permissible Pulse Load Permissible Puls Load R thJS = (tp) IFmax / I FDC = (tp ) BAS70-05 BAS70-04W, BAS70-06W 10 1 10 3 I Fmax/IFDC K/W - 10 0 -6 10 10 -5 10 -4 10 -3 RthJS D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 2 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 10 1 10 -2 s 10 10 0 -6 10 0 10 -5 10 -4 10 -3 10 -2 tp s 10 0 10 0 tp Permissible Pulse Load Permissible Puls Load R thJS = (tp) IFmax / I FDC = (tp ) BAS70-05W BAS70-05 10 2 10 3 - D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 1 10 0 -6 10 RthJS IFmax/IFDC K/W 10 -5 10 -4 10 -3 10 2 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 10 1 10 -2 s 10 10 0 -6 10 0 tp 10 -5 10 -4 10 -3 10 -2 s tp 10 2005-05-24 BAS70... / BAS170W Permissible Pulse Load Permissible Puls Load R thJS = (tp) IFmax / I FDC = (tp ) BAS70-07W BAS70-05W 10 1 10 3 I Fmax/IFDC K/W - RthJS D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 2 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 10 1 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 10 0 -6 10 0 10 -5 10 -4 10 -3 10 -2 s tp 10 0 10 0 tp Permissible Pulse Load Permissible Puls Load R thJS = (tp) IFmax / I FDC = (tp ) BAS170W BAS70-07W 10 3 - D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 1 RthJS IFmax/IFDC 10 2 10 2 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 10 1 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 10 0 -7 10 0 tp 10 -6 10 -5 10 -4 10 -3 10 -2 s tp 11 2005-05-24 BAS70... / BAS170W Permissible Pulse Load IFmax / I FDC = (tp ) BAS170W I Fmax/IFDC 10 1 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 tp 12 2005-05-24 Package SCD80 BAS70... / BAS170W Package Outline 0.2 M A +0.05 0.13 -0.03 0.8 0.1 0.2 0.05 10MAX. 1.7 0.1 1 0.3 0.05 Cathode marking 7 1.5 1.3 0.1 A 2 0.7 0.1 1.45 0.35 Foot Print 0.35 Marking Layout Date code 2003, July Type code BAR63-02W Laser marking Cathode marking Example Packing Code E6327: Reel o180 mm = 3.000 Pieces/Reel Code E6433: Reel o330 mm = 10.000 Pieces/Reel 0.2 2.5 8 1.45 4 Cathode marking 0.7 0.4 0.9 13 2005-05-24 Package SOD323 BAS70... / BAS170W Package Outline 0.9 +0.2 -0.1 1.25 +0.2 -0.1 0 0.05 A 2 1.7 +0.2 -0.1 2.5 0.2 +0.15 acc. to DIN 6784 Cathode marking 1 0.3 +0.1 -0.05 0.25 M 0.3 +0.05 -0.2 0.15 +0.1 -0.06 A 0.8 1.7 0.8 Foot Print 0.6 Marking Layout Type code BAR63-03W Laser marking Cathode marking Example Packing Code E6327: Reel o180 mm = 3.000 Pieces/Reel Code E6433: Reel o330 mm = 10.000 Pieces/Reel 0.2 2 Cathode marking 0.65 8 2.9 4 1 1.35 14 2005-05-24 Package SOT143 Package Outline 1 0.1 0.15 MIN. 2.9 0.1 1.9 10 MAX. 1 2 0.2 0.08...0.1 1.3 0.1 3 2.5 0.1 4 0.1 MAX. 10 MAX. B A 5 +0.1 0.8 -0.05 0...8 +0.1 0.4 -0.05 0.25 M 0.2 B M A (1.7) Foot Print 1.2 0.8 0.9 1.1 0.9 0.8 1.2 0.8 0.8 Marking Layout Manufacturer Pin 1 Date code (Year/Month) 2003, July Type code BFP181 Example Packing Code E6327: Reel o180 mm = 3.000 Pieces/Reel Code E6433: Reel o330 mm = 10.000 Pieces/Reel 0.2 2.6 8 4 Pin 1 3.15 1.15 Package SOT23 BAS70... / BAS170W Package Outline 1.1 MAX. 2.9 0.1 2 2.6 MAX. 10 MAX. 1.3 0.1 1 +0.2 acc. to DIN 6784 10 MAX. 3 0.4 +0.1 -0.05 0.1 MAX. B A 0.08...0.15 C 0.95 2... 30 1.9 0.25 M B C 0.20 M A Foot Print 0.9 1.1 0.9 0.8 0.8 1.2 Marking Layout Manufacturer Pin 1 Date code (Year/Month) 2003, July Type code BCW66 Example Packing Code E6327: Reel o180 mm = 3.000 Pieces/Reel Code E6433: Reel o330 mm = 10.000 Pieces/Reel 4 0.2 Pin 1 8 2.65 2.13 0.9 3.15 1.15 16 2005-05-24 Package SOT323 BAS70... / BAS170W Package Outline 2 -0.2 0.9 -0.1 0.3 +0.1 -0.05 3x 0.1 0.1 MAX. M 1 2 1.25 -0.1 0.1 0.1 MIN. +0.2 acc. to DIN 6784 2.1 -0.1 A 3 0.15 +0.1 -0.05 0.65 0.65 0.2 M A Foot Print 0.8 1.6 0.6 0.65 0.65 Marking Layout Manufacturer Pin 1 Month May Year 2005 Type code BCR108W Example Packing Code E6327: Reel 180 mm = 3.000 Pieces/Reel Code E6433: Reel 330 mm = 10.000 Pieces/Reel 0.2 2.3 8 4 Pin 1 2.15 1.1 17 2005-05-24 Package SOT343 BAS70... / BAS170W Package Outline 0.9 -0.1 2 -0.2 1.3 0.1 MAX. 1 2 0.1 1.25 -0.1 0.15 A 0.1 MIN. +0.2 acc. to DIN 6784 3 2.1 -0.1 4 0.3 +0.1 -0.05 +0.1 0.15 -0.05 +0.1 0.6 -0.05 4x 0.1 0.2 M M A Foot Print 1.6 0.8 0.6 1.15 0.9 Marking Layout Manufacturer Pin 1 Month May Year 2005 Type code BGA420 Example Packing Code E6327: Reel 180 mm = 3.000 Pieces/Reel Code E6433: Reel 330 mm = 10.000 Pieces/Reel 0.2 2.3 8 4 Pin 1 2.15 1.1 18 2005-05-24 Package TSLP-2-1 BAS70... / BAS170W Package Outline Top view Bottom view 0.4 +0.05 S 0.6 A 0.05 MAX. 0.03 S 0.5 0.035 1) 2x 0.05 0.1 M A B 0.05 2x 0.1 M A B Cathode marking 1 0.5 0.035 1) 1 0.25 0.035 1) 2 1 0.25 0.035 1) 0.65 2 B 0.1 M A B 0.1 M A B 1) Dimension applies to plated terminals 0.6 0.275 Foot Print Copper Solder mask 0.375 0.275 0.35 1 0.3 0.925 0.35 0.45 Stencil apertures Marking Layout Type code BAS16-02L Laser marking Cathode marking Example Packing Code E6327: Reel o180 mm = 15.000 Pieces/Reel 0.5 1.16 Cathode marking 8 4 0.76 19 2005-05-24 Package TSLP-4-4 BAS70... / BAS170W Package Outline Top view Bottom view 0.4 +0.05 S 0.8 0.05 MAX. 2x 0.05 0.03 S 3 1.2 0.75 2 1 4x Pin 1 mark area 0.1 M A B 0.25 4 0.35 0.035 1) 1 2x 0.05 2 3 4 A 0.45 0.035 1) 1) Dimension applies to plated terminals B 4x 0.1 M A B Foot Print 0.8 0.4 0.38 0.42 1.18 0.4 1.2 0.4 0.38 0.78 0.28 0.3 0.28 0.3 0.22 0.2 Copper Stencil apertures Solder mask Marking Layout Type code BAR90-07L4 Laser marking Pin 1 mark area Example Packing Code E6327: Reel o180 mm = 15.000 Pieces/Reel 0.5 1.45 Pin 1 mark area 8 4 1.05 20 2005-05-24 BAS70... / BAS170W Published by Infineon Technologies AG, St.-Martin-Strasse 53, 81669 Munchen (c) Infineon Technologies AG 2005. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.Infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 21 2005-05-24