SPEC NO: DSAM0801 REV NO: V.4B DATE: MAR/30/2013 PAGE: 1 OF 6
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.Cui ERP: 1201005740
3.5x3.5 mm SMD CHIP LED LAMP
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
Part Number: KA-3535ZG25Z4S Green
Features
zWhite SMD package, silicone resin.
zLow thermal resistance.
zCompatible with IR-reflow processes.
zESD protection.
zPackage: 2000pcs / reel.
zMoisture sensitivity level : level 2a.
zRoHS compliant.
Package Dimensions
Description
The Green source color devices are made with InGaN on
Al2O3 substrate Light Emitting Diode.
Static electricity and surge damage the LEDS.
It is recommended to use a wrist band or anti-electrostatic
glove when handling the LEDs.
All devices, equipment and machinery must be electrically
grounded.
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.
Applications
zSignal and symbol luminaire for orientation.
zMarker lights (e.g. steps, exit ways, etc).
zDecorative and entertainment lighting.
zCommercial and residential lighting.
zAutomotive interior lighting.
SPEC NO: DSAM0801 REV NO: V.4B DATE: MAR/30/2013 PAGE: 2 OF 6
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.Cui ERP: 1201005740
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might lead to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.
4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of
leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.
Detailed application notes are listed on our website.
http://www.kingbright.com/application_notes
SPEC NO: DSAM0801 REV NO: V.4B DATE: MAR/30/2013 PAGE: 3 OF 6
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.Cui ERP: 1201005740
Absolute Maximum Ratings at TA=25°C
Electrical / Optical Characteristics at TA=25°C
Notes:
1.Results from mounting on PC board FR4(pad size ≥70mm2), mounted on pc board-metal core PCB is recommend
for lowest thermal Resistance.
2.1/10 Duty Cycle, 0.1ms Pulse Width.
Parameter Symbol Value Unit
Power Dissipation PD 600 mW
Junction Temperature [1] TJ 110 °C
Operating Temperature Top -40 To +85 °C
Storage Temperature Ts tg -40 To +85 °C
DC Forward Current [1] IF 150 mA
Peak Forward Current [2] IFM 300 mA
Thermal Resistance [1]
(Junction/ambient) Rth j-a 170 °C/W
Thermal Resistance [1]
(Junction/solder point) Rth j-S 50 °C/W
8000 V Electrostatic Discharge Threshold (HBM)
Reverse Voltage VR 5 V
Selection Guide
Notes:
1.Wavelength: +/-1nm.
2. Forward Voltage: +/-0.1V.
3.Wavelength value is traceable to the CIE127-2007 compliant national standards.
Parameter Symbol Value Unit
Wavelength at peak emission IF=150mA [Typ.] λpeak 515 nm
Dominant Wavelength IF=150mA [Typ.] λ dom [1] 525 nm
Spectral Line Half-width IF=150mA [Typ.] Δλ 30 nm
Forward Voltage IF=150mA [Min.]
VF [2]
2.9
V Forward Voltage IF=150mA [Typ.] 3.5
Forward Voltage IF=150mA [Max.] 4.0
Temperature coefficient of λpeak
IF=150mA, -10 °C≤ T≤100 °C [Typ.] TC λpeak 0.09 nm/°C
Temperature coefficient of λdom
IF=150mA, -10 °C≤ T≤100 °C [Typ.] TC λdom 0.03 nm/°C
Temperature coefficient of VF
IF=150mA, -10 °C≤ T≤100 °C [Typ.] TCV -2.7 mV/°C
Allowable Reverse Current [Max.] IR 85 mA
Part No. Dice Lens Type
Iv (cd) [2]
@ 150mA
V
iewing
Angle [1]
Min. Typ. Min. Typ. 2θ1/2
KA-3535ZG25Z4S Green (InGaN) Water Clear 4.2 6 14 20 120 °
Φv (lm) [2]
@ 150mA*
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity/ luminous Flux: +/-15%.*LEDs are binned according to their luminous flux.
3. Luminous intensity/ luminous Flux value is traceable to the CIE127-2007 compliant national standards.
SPEC NO: DSAM0801 REV NO: V.4B DATE: MAR/30/2013 PAGE: 4 OF 6
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.Cui ERP: 1201005740
Green KA-3535ZG25Z4S
SPEC NO: DSAM0801 REV NO: V.4B DATE: MAR/30/2013 PAGE: 5 OF 6
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.Cui ERP: 1201005740
KA-3535ZG25Z4S
Reflow soldering is recommended and the soldering profile is shown below.
Other soldering methods are not recommended as they might cause damage to the product.
Recommended Soldering Pattern
(Units : mm; Tolerance: ±0.1)
Tape Specifications
(Units : mm)
Reel Dimension
SPEC NO: DSAM0801 REV NO: V.4B DATE: MAR/30/2013 PAGE: 6 OF 6
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.Cui ERP: 1201005740
PACKING & LABEL SPECIFICATIONS KA-3535ZG25Z4S
