Technical Data 4348
Effective July 2017
Supersedes February 2009
HCP0704
High current power inductors
Product features
•6.8 x 6.8 x 4.2 mm surface mount package
•Iron powder core material
•Magnetically shielded, low EMI
•High temperature core material eliminates
thermal aging issues
•High current carrying capacity, low core losses
•Tight DCR tolerance for sensing circuits
•Inductance range from 0.40 µH to 4.7 µH
•Current range from 5.0 A to 27 A
•Frequency range up to 2 MHz
•Halogen free, lead free, RoHS compliant
Applications
•Voltage Regulator Module (VRM)
•Multi-phase regulators
•Desktop and servers
•Base station equipment
•Notebook and laptop regulators
•Data networking and storage systems
•Point-of-load modules (POL)
•Battery power systems
•DCR sensing circuits
Environmental Data
•Storage temperature range (Component):
-40 °C to +155 °C
•Operating temperature range: -40 °C to +155 °C
(ambient plus self-temperature rise)
•Solder reflow temperature:
J-STD-020 (latest revision) compliant
Pb
HALOGEN
HF
FREE
2
Technical Data 4348
Effective July 2017
HCP0704
High current power inductors
www.eaton.com/electronics
Product Specifications
Dimensions (mm)
Do not route traces or vias underneath the inductor
1 Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.10 Vrms, 0.0 Adc
2 Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.1 Vrms,Isat1
3Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating
is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat
generating components will affect the temperature rise. It is recommended the part temperature not exceed
+125 °C under worst case operating conditions verified in the end application.
4Isat: Peak current for approximately 20% rolloff at +25 °C.
5 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI : (Gauss), K: (K-factor
from table), L: (inductance in μH), ΔI (peak-to-peak ripple current in amps).
6 Part Number Definition: HCP0704-xxx-R
• HCP0704 = Product code and size
• xxx= Inductance value in μH, R = decimal point. If no “R” is present, then third
character = # of zeros
•“-R” suffix = RoHS compliant
Part Number6OCL1± 25% (μH) FLL2Min. (μH) Irms3 (A) Isat4 @ +25 °C (A) DCR (mΩ) @ +20 °C K-factor5
HCP0704-R40-R 0.40 0.28 17 27 3.2 ±10% 383.1
HCP0704-R60-R 0.60 0.42 14 21 4.5 ±10% 313.5
HCP0704-1R0-R 1.00 0.7 12 17 6.2 ±10% 265.3
HCP0704-1R8-R 1.80 1.26 8.5 13 11.0 ±10% 202.8
HCP0704-2R3-R 2.30 1.56 7.5 11.5 16.5 ±10% 164.2
HCP0704-3R3-R 3.30 2.31 6.0 9.5 25.0 ±10% 149.9
HCP0704-4R7-R 4.70 3.29 5.0 8.0 29.5 ±10% 127.7
Top View Bottom View Recommended Pad Layout Schematic
1
2
12
HCP0704
wwllyy R
6.80 Max
6.80 Max
3.3±0.3
HCP0704-R40 to 2R3= 1.20 +/- 0.2
HCP0704-3R3 to 4R7= 1.00 +/- 0.2
xxx
Side View
HCP0704-R40 to 1R0= 4.20 max
HCP0704-1R8 to 4R7= 4.00 max
7.60
2.50(2x)
4.00(2x)
21
Part Marking: HCP0704 xxx = Inductance value in μH. (R = Decimal point). If no “R” is present, then last character is # of zeros wwllyy = Date code R = Revision level
The nominal DCR test point is in the middle of the terminal
Packaging information (mm)
Supplied in tape and reel packaging, 1000 parts per 13” diameter reel.
User direction of feed
HCP0704-R40 to 1R0= 4.2
HCP0704-1R8 to 4R7= 4.0
Section A-A
1.5 Dia
min.
7.50
6.9
12.0
4.0
2.0
1.5 Dia.
+0.1/-0.0
A
A
1.75
7.5 16.0
±0.3
1
2
HCP0704
wwllyy R
xxx
3
Technical Data 4348
Effective July 2017
www.eaton.com/electronics
HCP0704
High current power inductors
Temperature rise vs. total loss
0
10
20
30
40
50
60
0 0.2 0.4 0.6 0.8 1 1.2 1.4
Tota l Los s (W)
Tempetature Rise(° C)
Core loss vs. Bp-p
0.001
0.01
0.1
1
10
10 100 1000 10000
Core Loss (W)
1MHz
250 kHz
500 kHz 100 kHz
Bp-
(
pG a us s )
4
Technical Data 4348
Effective July 2017
HCP0704
High current power inductors
www.eaton.com/electronics
Inductance characteristics
% of OCL vs % of I
0%
20%
40%
60%
80%
100%
0% 20% 40% 60% 80% 100% 120% 140% 160%
% of I
% of OCL
25°C
sat
sat
© 2017 Eaton
All Rights Reserved
Printed in USA
Publication No. 4348 BU-SB09086
July 2017
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
HCP0704
High current power inductors
Technical Data 4348
Effective July 2017
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25
°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Solder reflow profile
Reference JDEC J-STD-020
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C
• Temperature max. (Tsmax) 150°C 200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds 60-120 Seconds
Average ramp up rate Tsmax to Tp3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (Tl)
Time at liquidous (tL)
183°C
60-150 Seconds
217°C
60-150 Seconds
Peak package body temperature (TP)* Table 1 Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc)20 Seconds** 30 Seconds**
Average ramp-down rate (Tp to Tsmax)6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm) 235°C 220°C
≥2.5mm 220°C 220°C
Table 2 - Lead (Pb) Free Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
350 - 2000
Volume
mm3
>2000
<1.6mm 260°C 260°C 260°C
1.6 – 2.5mm 260°C 250°C 245°C
>2.5mm 250°C 245°C 245°C
