MIXERS - I/Q MIXERS / IRM - CHIP
3
3 - 154
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC620
GaAs MMIC I/Q MIXER
3 - 7 GHz
v01.1007
General Description
FeaturesTypical Applications
The HMC620 is a compact I/Q MMIC mixer which can
be used as either an Image Reject Mixer (IRM) or a
Single Sideband Upconverter. The chip utilizes two
standard Hittite double balanced mixer cells and a 90
degree hybrid fabricated in a GaAs MESFET process.
All data shown below is taken with the chip mounted
in a 50 Ohm test  xture and includes the effects of
1 mil diameter x 20 mil length bond wires on each
port. A low frequency quadrature hybrid was used to
produce a 100 MHz upper side band (USB) IF output.
This product is a much smaller and more consistent
alternative to hybrid style Image Reject Mixers and
Single Sideband Upconverter assemblies.
Electrical Speci cations, TA = +25° C, IF= 100 MHz, LO = +15 dBm*
Parameter Min. Typ. Max. Min. Typ. Max. Units
Frequency Range, RF/LO 3.0 - 7.0 4.5 - 6.5 GHz
Frequency Range, IF DC - 3.5 DC - 3.5 GHz
Conversion Loss (As IRM) 7.5 8.5 7.5 9 dB
Image Rejection 25 28 31 33 dB
1 dB Compression (Input) +13 +13 dBm
LO to RF Isolation 35 45 35 45 dB
LO to IF Isolation 35 40 35 40 dB
IP3 (Input) 23 23 dBm
Amplitude Balance 0.1 0.2 dB
Phase Balance 3 3 Deg
* Unless otherwise noted, all measurements performed as downconverter.
Functional Diagram
The HMC620 is ideal for:
• Point-to-Point Radios
• Point-to-Multi-Point Radios
• WiMAX & Fixed Wireless
• VSAT
Wide IF Bandwidth: DC - 3.5 GHz
High Image Rejection: 33 dB
High LO to RF Isolation: 45 dB
High Input IP3: +23 dB
Die Size: 1.49 x 1.15 x 0.10 mm
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
MIXERS - I/Q MIXERS / IRM - CHIP
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Conversion Gain vs. Temperature Image Rejection vs. Temperature
Conversion Gain vs. LO Drive Return Loss
Data taken As IRM With External IF 90˚ Hybrid
Input P1dB vs. Temperature Input IP3 vs. LO Drive
-20
-15
-10
-5
0
2.5 3.5 4.5 5.5 6.5 7.5
+25 C
+85 C
-55 C
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
5
10
15
20
25
30
2.5 3.5 4.5 5.5 6.5 7.5
LO = +11 dBm
LO = +15 dBm
LO = +19 dBm
IP3 (dBm)
RF FREQUENCY (GHz)
6
8
10
12
14
16
18
20
2.5 3.5 4.5 5.5 6.5 7.5
+25 C
+85 C
-55 C
P1dB (dBm)
RF FREQUENCY (GHz)
-40
-30
-20
-10
0
2.5 3.5 4.5 5.5 6.5 7.5
+25 C
+85 C
-55 C
IMAGE REJECTION (dB)
RF FREQUENCY (GHz)
-30
-25
-20
-15
-10
-5
0
2.5 3.5 4.5 5.5 6.5 7.5
+11 dBm
+13 dBm
+15 dBm
+17 dBm
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
-30
-25
-20
-15
-10
-5
0
2.5 3.5 4.5 5.5 6.5 7.5
RF
LO
RETURN LOSS (dB)
FREQUENCY (GHz)
HMC620
v01.1007 GaAs MMIC I/Q MIXER
3 - 7 GHz
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
MIXERS - I/Q MIXERS / IRM - CHIP
3
3 - 156
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Isolations
Amplitude Balance vs. LO Drive
IF Bandwidth*
Phase Balance vs. LO Drive
Upconverter Performance Conversion
Gain vs. LO Drive
Upconverter Performance Sideband
Rejection vs. LO Drive
* Conversion gain data taken with external IF 90˚ hybrid
-2
-1
0
1
2
2.5 3.5 4.5 5.5 6.5 7.5
LO = 13 dBm
LO = 15 dBm
LO = 17 dBm
AMPLITUDE BALANCE (dB)
RF FREQUENCY (GHz)
-20
-15
-10
-5
0
5
10
2.5 3.5 4.5 5.5 6.5 7.5
LO = +13 dBm
LO = +15 dBm
LO = +17 dBm
PHASE BALANCE (degrees)
RF FREQUENCY (GHz)
-30
-25
-20
-15
-10
-5
0
0.5 1 1.5 2 2.5 3 3.5
CONVERSION GAIN
RETURN LOSS
RESPONSE (dB)
IF FREQUENCY (GHz)
-60
-50
-40
-30
-20
-10
0
2.5 3.5 4.5 5.5 6.5 7.5
LO = +13 dBm
LO = +15 dBm
LO = +17 dBm
SIDEBAND REJECTION (dBc)
RF FREQUENCY (GHz)
-20
-15
-10
-5
0
2.5 3.5 4.5 5.5 6.5 7.5
LO = +13 dBm
LO = +15 dBm
LO = +17 dBm
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
-80
-70
-60
-50
-40
-30
-20
-10
2.5 3.5 4.5 5.5 6.5 7.5
LO/RF
RF/IF1
LO/IF1
RF/IF2
LO/IF2
ISOLATION (dB)
RF FREQUENCY (GHz)
HMC620
v01.1007 GaAs MMIC I/Q MIXER
3 - 7 GHz
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
MIXERS - I/Q MIXERS / IRM - CHIP
3
3 - 157
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Harmonics of LO
LO Freq. (GHz) nLO Spur at RF Port
1234
2.5 29 35 48 30
326335139
428323943
528364552
636446041
740365834
846375546
LO = +15 dBm
Values in dBc below input LO level measured at RF Port.
MxN Spurious Outputs
nLO
mRF01234
0xx1152869
1150303950
26967786071
39595957395
4 9595959595
RF = 5.6 GHz @ -10 dBm
LO = 5.5 GHz @ +15 dBm
Data taken without IF 90˚ hybrid
All values in dBc with reference to output power at IF= 100 MHz
Absolute Maximum Ratings
RF / IF Input +20 dBm
LO Drive +27 dBm
Channel Temperature 150 °C
Continuous Pdiss (T=85°C)
(derate 14.2 mW/°C above 85°C) 925 mW
Thermal Resistance (RTH)
(channel to die bottom) 70.2 °C/W
Storage Temperature -65 to +150 °C
Operating Temperature -55 to +85 °C
Outline Drawing
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004” SQUARE
4. BACKSIDE METALIZATION: GOLD
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. CONNECTION NOT REQUIRED FOR
UNLABELED BOND PADS.
8. OVERALL DIE SIZE ±.002”
Die Packaging Information [1]
Standard Alternate
WP-3 (Waffle Pack) [2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
HMC620
v01.1007 GaAs MMIC I/Q MIXER
3 - 7 GHz
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
MIXERS - I/Q MIXERS / IRM - CHIP
3
3 - 158
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Pad Descriptions
Assembly Diagrams
Pad Number Function Description Interface Schematic
1RF This pad is DC coupled
and matched to 50 Ohms.
2 (5) IF2
This pad is DC coupled. For applications not requir-
ing operation to DC, this port should be DC blocked
externally using a series capacitor whose value has
been chosen to pass the necessary IF frequency
range. For operation to DC, this pad must not
source/sink more than 3mA of current or die non-
function and possible die failure will result. Pads 5
and 6 are alternate IF ports.
3 (6) IF1
4LO This pad is DC coupled
and matched to 50 Ohms.
GND The backside of the die must be connected
to RF/DC ground.
HMC620
v01.1007 GaAs MMIC I/Q MIXER
3 - 7 GHz
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
MIXERS - I/Q MIXERS / IRM - CHIP
3
3 - 159
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
The die should be attached directly to the ground plane eutectically or with
conductive epoxy (see HMC general Handling, Mounting, Bonding Note).
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin  lm
substrates are recommended for bringing RF to and from the chip (Figure 1). If
0.254mm (10 mil) thick alumina thin  lm substrates must be used, the die should
be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the
surface of the substrate. One way to accomplish this is to attach the 0.102mm
(4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab)
which is then attached to the ground plane (Figure 2).
Microstrip substrates should be brought as close to the die as possible in order
to minimize bond wire length. Typical die-to-substrate spacing is 0.076mm (3
mils).
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protective
containers, and then sealed in an ESD protective bag for shipment. Once the
sealed ESD protective bag has been opened, all die should be stored in a dry
nitrogen environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean
the chip using liquid cleaning systems.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is applied.
Use shielded signal and bias cables to minimize inductive pick-up.
General Handling: Handle the chip along the edges with a vacuum collet or with
a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and
should not be touched with vacuum collet, tweezers, or  ngers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms
or with electrically conductive epoxy. The mounting surface should be clean and
 a t .
Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature
of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO NOT expose the chip
to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for
attachment.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy  llet is observed around the
perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage
temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use
the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on
the package or substrate. All bonds should be as short as possible <0.31 mm (12 mils).
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
RF Ground Plane
0.127mm (0.005”) Thick Alumina
Thin Film Substrate
0.076mm
(0.003”)
Figure 1.
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
RF Ground Plane
0.254mm (0.010”) Thick Alumina
Thin Film Substrate
0.076mm
(0.003”)
Figure 2.
0.150mm (0.005”) Thick
Moly Tab
HMC620
v01.1007 GaAs MMIC I/Q MIXER
3 - 7 GHz
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
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Authorized Distributor
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