SKM150GB12T4 Absolute Maximum Ratings Symbol Conditions Values Unit IGBT VCES IC Tj = 175 C 1200 V Tc = 25 C 232 A Tc = 80 C 179 A 150 A ICnom ICRM SEMITRANS(R)2 Fast IGBT4 Modules ICRM = 3xICnom 450 A -20 ... 20 V 10 s -40 ... 175 C Tc = 25 C 189 A Tc = 80 C 141 A 150 A VGES tpsc VCC = 800 V VGE 15 V VCES 1200 V Tj = 150 C Tj Inverse diode IF SKM150GB12T4 Tj = 175 C IFnom Features * VCE(sat) with positive temperature coefficient * High short circuit capability, self limiting to 6 x Icnom * Fast & soft inverse CAL diodes * Large clearance (10 mm) and creepage distances (20 mm) * Isolated copper baseplate using DBC Technology (Direct Copper Bonding) IFRM IFRM = 3xIFnom 450 A IFSM tp = 10 ms, sin 180, Tj = 25 C 900 A -40 ... 175 C Tj Module It(RMS) Tstg Visol * AC inverter drives * UPS * Electronic welders at fsw up to 20 kHz 4000 V Conditions min. typ. max. Unit Tj = 25 C 1.8 2.05 V Tj = 150 C 2.2 2.4 V VCE0 Tj = 25 C 0.8 0.9 V Tj = 150 C 0.7 0.8 V rCE Tj = 25 C 6.7 7.7 m 10.0 10.7 m 5.8 6.5 V 0.1 0.3 mA IGBT VCE(sat) IC = 150 A VGE = 15 V chiplevel Remarks * Case temperature limited to Tc = 125C max, recomm. Top = -40 ... +150C, product rel. results valid for Tj = 150 A C Characteristics Symbol Typical Applications AC sinus 50Hz, t = 1 min 200 -40 ... 125 VGE = 15 V VGE(th) VGE=VCE, IC = 6 mA ICES VGE = 0 V VCE = 1200 V Cies Coes Cres VCE = 25 V VGE = 0 V QG VGE = - 8 V...+ 15 V RGint Tj = 25 C td(on) Eoff VCC = 600 V IC = 150 A VGE = 15 V RG on = 1 RG off = 1 di/dton = 3400 A/s di/dtoff = 1750 A/s Rth(j-c) per IGBT tr Eon td(off) tf Tj = 150 C 5 Tj = 25 C Tj = 150 C mA f = 1 MHz 9.3 nF f = 1 MHz 0.58 nF f = 1 MHz 0.51 nF 850 nC Tj = 150 C 5.0 180 ns Tj = 150 C 42 ns Tj = 150 C 19.2 mJ Tj = 150 C 410 ns Tj = 150 C 72 ns Tj = 150 C 15.8 mJ 0.19 K/W GB (c) by SEMIKRON Rev. 2 - 16.06.2009 http://store.iiic.cc/ 1 SKM150GB12T4 Characteristics Symbol SEMITRANS(R)2 rF IRRM Qrr Fast IGBT4 Modules Conditions Inverse diode VF = VEC IF = 150 A VGE = 0 V chip VF0 Err Rth(j-c) min. typ. max. Unit Tj = 25 C 2.14 2.46 V Tj = 150 C 2.07 2.38 V Tj = 25 C 1.3 1.5 V Tj = 150 C 0.9 1.1 V Tj = 25 C 5.6 6.4 m 7.8 8.5 m Tj = 150 C IF = 150 A Tj = 150 C di/dtoff = 3100 A/s T = 150 C j VGE = 15 V T j = 150 C VCC = 600 V per diode 31.3 C 13 mJ TC = 25 C 0.65 m TC = 125 C 1 m 120 A 0.31 K/W Module SKM150GB12T4 LCE RCC'+EE' Features * VCE(sat) with positive temperature coefficient * High short circuit capability, self limiting to 6 x Icnom * Fast & soft inverse CAL diodes * Large clearance (10 mm) and creepage distances (20 mm) * Isolated copper baseplate using DBC Technology (Direct Copper Bonding) 30 terminal-chip Rth(c-s) per module Ms to heat sink M6 Mt 0.04 to terminals M5 0.05 nH K/W 3 5 Nm 2.5 5 Nm Nm w 160 g Typical Applications * AC inverter drives * UPS * Electronic welders at fsw up to 20 kHz Remarks * Case temperature limited to Tc = 125C max, recomm. Top = -40 ... +150C, product rel. results valid for Tj = 150 GB 2 Rev. 2 - 16.06.2009 http://store.iiic.cc/ (c) by SEMIKRON SKM150GB12T4 Fig. 1: Typ. output characteristic, inclusive RCC'+ EE' Fig. 2: Rated current vs. temperature IC = f (TC) Fig. 3: Typ. turn-on /-off energy = f (IC) Fig. 4: Typ. turn-on /-off energy = f (RG) Fig. 5: Typ. transfer characteristic Fig. 6: Typ. gate charge characteristic (c) by SEMIKRON Rev. 2 - 16.06.2009 http://store.iiic.cc/ 3 SKM150GB12T4 Fig. 7: Typ. switching times vs. IC Fig. 8: Typ. switching times vs. gate resistor RG Fig. 9: Transient thermal impedance Fig. 10: CAL diode forward characteristic Fig. 11: CAL diode peak reverse recovery current Fig. 12: Typ. CAL diode peak reverse recovery charge 4 Rev. 2 - 16.06.2009 http://store.iiic.cc/ (c) by SEMIKRON SKM150GB12T4 Semitrans 2 GB This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX. This technical information specifies semiconductor devices but promises no characteristics. No warranty or guarantee expressed or implied is made regarding delivery, performance or suitability. (c) by SEMIKRON Rev. 2 - 16.06.2009 http://store.iiic.cc/ 5