MURD620CTG, NRVUD620CTG, MURD620CTT4G, NRVUD620CTT4G, SUR620CTT4G, SWITCHMODE Power Rectifier http://onsemi.com ULTRAFAST RECTIFIER 6.0 AMPERES 200 VOLTS DPAK Surface Mount Package These state-of-the-art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. Features Ultrafast 35 Nanosecond Recovery Time Low Forward Voltage Drop Low Leakage ESD Rating: Human Body Model = 3B (> 8 kV) Machine Model = C (> 400 V) AEC-Q101 Qualified and PPAP Capable NRVUD and SUR Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements Pb-Free Packages* DPAK CASE 369C 1 4 3 MARKING DIAGRAM AYWW U 620TG Mechanical Characteristics: Case: Epoxy, Molded Weight: 0.4 Gram (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds A Y WW U620T G ORDERING INFORMATION Package Shipping MURD620CTG DPAK (Pb-Free) 75 Units/Rail NRVUD620CTG DPAK (Pb-Free) 75 Units/Rail MURD620CTT4G DPAK (Pb-Free) 2,500 / Tape & Reel NRVUD620CTT4G DPAK (Pb-Free) 2,500 / Tape & Reel SUR620CTT4G DPAK (Pb-Free) 2,500 / Tape & Reel Device *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2012 January, 2012 - Rev. 10 = Assembly Location = Year = Work Week = Device Code = Pb-Free Package 1 For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: MURD620CT/D MURD620CTG, NRVUD620CTG, MURD620CTT4G, NRVUD620CTT4G, SUR620CTT4G, MAXIMUM RATINGS Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Rating VRRM VRWM VR 200 V Average Rectified Forward Current (Rated VR, TC = 140C) Per Diode Per Device IF(AV) A 3.0 6.0 Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz, TC = 145C) Per Diode IF A 6.0 Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, 60 Hz) IFSM Operating Junction and Storage Temperature Range TJ, Tstg 50 -65 to +175 A C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS (Per Diode) Characteristics Symbol Value Unit Thermal Resistance, Junction-to-Case RqJC 9 C/W Thermal Resistance, Junction-to-Ambient (Note 1) RqJA 80 C/W Symbol Value Unit 1. Rating applies when surface mounted on the minimum pad sizes recommended. ELECTRICAL CHARACTERISTICS (Per Diode) Characteristics Maximum Instantaneous Forward Voltage Drop (Note 2) (iF = 3 Amps, TC = 25C) (iF = 3 Amps, TC = 125C) (iF = 6 Amps, TC = 25C) (iF = 6 Amps, TC = 125C) vF Maximum Instantaneous Reverse Current (Note 2) (TJ = 25C, Rated dc Voltage) (TJ = 125C, Rated dc Voltage) iR Maximum Reverse Recovery Time (IF = 1 Amp, di/dt = 50 Amps/ms, VR = 30 V, TJ = 25C) (IF = 0.5 Amp, iR = 1 Amp, IREC = 0.25 A, VR = 30 V, TJ = 25C) trr 2. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%. http://onsemi.com 2 1 0.96 1.2 1.13 5 250 35 25 V mA ns MURD620CTG, NRVUD620CTG, MURD620CTT4G, NRVUD620CTT4G, SUR620CTT4G, 100 100 IR, REVERSE CURRENT (mA) 70 50 20 10 7.0 150C 1 100C 0.1 0.01 25C 0.001 0.0001 0 20 40 5.0 60 80 100 120 140 160 180 200 VR, REVERSE VOLTAGE (V) Figure 2. Typical Leakage Current* (Per Leg) 3.0 175C * The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these curves if VR is sufficiently below rated VR. TJ = 25C 2.0 150C 100C PF(AV) , AVERAGE POWER DISSIPATION (WATTS) i , INSTANTANEOUS FORWARD CURRENT (AMPS) F 30 TJ = 175C 10 1.0 0.7 0.5 0.3 0.2 0.1 0 0.2 0.4 0.6 1.0 0.8 1.2 1.4 vF, INSTANTANEOUS VOLTAGE (V) 14 13 12 11 10 9.0 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0 5.0 10 SINE WAVE IPK/IAV = 20 dc SQUARE WAVE TJ = 175C 1.0 0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10 IF(AV), AVERAGE FORWARD CURRENT (A) Figure 1. Typical Forward Voltage (Per Leg) IF(AV) , AVERAGE FORWARD CURRENT (AMPS) IF(AV) , AVERAGE FORWARD CURRENT (AMPS) Figure 3. Average Power Dissipation (Per Leg) 8.0 RATED VOLTAGE APPLIED RqJC = 9C/W 7.0 6.0 TJ = 175C 5.0 dc 4.0 SINE WAVE OR SQUARE WAVE 3.0 2.0 1.0 0 100 110 120 130 140 150 160 170 180 4.0 RATED VOLTAGE APPLIED RqJA = 80C/W 3.5 3.0 SURFACE MOUNTED ON MIN. PAD SIZE RECOMMENDED 2.5 2.0 dc TJ = 175C 1.5 SINE WAVE OR SQUARE WAVE 1.0 0.5 0 0 20 40 60 80 100 120 140 160 180 200 TC, CASE TEMPERATURE (C) TA, AMBIENT TEMPERATURE (C) Figure 4. Current Derating, Case (Per Leg) Figure 5. Current Derating, Ambient (Per Leg) http://onsemi.com 3 MURD620CTG, NRVUD620CTG, MURD620CTT4G, NRVUD620CTT4G, SUR620CTT4G, C, CAPACITANCE (pF) 100 TJ = 25C 10 1 0 10 20 30 40 50 60 70 80 VR, REVERSE VOLTAGE (V) Figure 6. Typical Capacitance (Per Leg) http://onsemi.com 4 90 100 MURD620CTG, NRVUD620CTG, MURD620CTT4G, NRVUD620CTT4G, SUR620CTT4G, PACKAGE DIMENSIONS DPAK (SINGLE GAUGE) CASE 369C-01 ISSUE D A E b3 c2 B Z D 1 L4 A 4 L3 b2 e 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. C H DETAIL A 3 c b 0.005 (0.13) M H C L2 GAUGE PLANE C L SEATING PLANE A1 L1 DETAIL A ROTATED 905 CW DIM A A1 b b2 b3 c c2 D E e H L L1 L2 L3 L4 Z INCHES MIN MAX 0.086 0.094 0.000 0.005 0.025 0.035 0.030 0.045 0.180 0.215 0.018 0.024 0.018 0.024 0.235 0.245 0.250 0.265 0.090 BSC 0.370 0.410 0.055 0.070 0.108 REF 0.020 BSC 0.035 0.050 --- 0.040 0.155 --- MILLIMETERS MIN MAX 2.18 2.38 0.00 0.13 0.63 0.89 0.76 1.14 4.57 5.46 0.46 0.61 0.46 0.61 5.97 6.22 6.35 6.73 2.29 BSC 9.40 10.41 1.40 1.78 2.74 REF 0.51 BSC 0.89 1.27 --- 1.01 3.93 --- SOLDERING FOOTPRINT* 6.20 0.244 2.58 0.102 5.80 0.228 3.00 0.118 1.60 0.063 6.17 0.243 SCALE 3:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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