Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 10
1Publication Order Number:
MURD620CT/D
MURD620CTG,
NRVUD620CTG,
MURD620CTT4G,
NRVUD620CTT4G,
SUR620CTT4G,
SWITCHMODE
Power Rectifier
DPAK Surface Mount Package
These state−of−the−art devices are designed for use in switching
power supplies, inverters and as free wheeling diodes.
Features
Ultrafast 35 Nanosecond Recovery Time
Low Forward Voltage Drop
Low Leakage
ESD Rating:
Human Body Model = 3B (> 8 kV)
Machine Model = C (> 400 V)
AEC−Q101 Qualified and PPAP Capable
NRVUD and SUR Prefixes for Automotive and Other Applications
Requiring Unique Site and Control Change Requirements
Pb−Free Packages*
Mechanical Characteristics:
Case: Epoxy, Molded
Weight: 0.4 Gram (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260C Max. for 10 Seconds
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
ULTRAFAST RECTIFIER
6.0 AMPERES
200 VOLTS
1
3
4
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DPAK
CASE 369C
MARKING DIAGRAM
Device Package Shipping†
ORDERING INFORMATION
MURD620CTT4G DPAK
(Pb−Free)
2,500 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MURD620CTG DPAK
(Pb−Free)
75 Units/Rail
A = Assembly Location
Y = Year
WW = Work Week
U620T = Device Code
G = Pb−Free Package
AYWW
U
620TG
NRVUD620CTG DPAK
(Pb−Free)
75 Units/Rail
NRVUD620CTT4G DPAK
(Pb−Free)
2,500 /
Tape & Reel
SUR620CTT4G DPAK
(Pb−Free)
2,500 /
Tape & Reel
MURD620CTG, NRVUD620CTG, MURD620CTT4G, NRVUD620CTT4G, SUR620CTT4G,
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2
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
200 V
Average Rectified Forward Current
(Rated VR, TC = 140C)
Per Diode
Per Device
IF(AV)
3.0
6.0
A
Peak Repetitive Forward Current
(Rated VR, Square Wave, 20 kHz, TC = 145C)
Per Diode
IF
6.0
A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, 60 Hz)
IFSM 50
A
Operating Junction and Storage Temperature Range TJ, Tstg −65 to +175 C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS (Per Diode)
Characteristics Symbol Value Unit
Thermal Resistance, Junction−to−Case RqJC 9C/W
Thermal Resistance, Junction−to−Ambient (Note 1) RqJA 80 C/W
1. Rating applies when surface mounted on the minimum pad sizes recommended.
ELECTRICAL CHARACTERISTICS (Per Diode)
Characteristics Symbol Value Unit
Maximum Instantaneous Forward Voltage Drop (Note 2)
(iF = 3 Amps, TC = 25C)
(iF = 3 Amps, TC = 125C)
(iF = 6 Amps, TC = 25C)
(iF = 6 Amps, TC = 125C)
vF1
0.96
1.2
1.13
V
Maximum Instantaneous Reverse Current (Note 2)
(TJ = 25C, Rated dc Voltage)
(TJ = 125C, Rated dc Voltage)
iR5
250
mA
Maximum Reverse Recovery Time
(IF = 1 Amp, di/dt = 50 Amps/ms, VR = 30 V, TJ = 25C)
(IF = 0.5 Amp, iR = 1 Amp, IREC = 0.25 A, VR = 30 V, TJ = 25C)
trr 35
25
ns
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%.
MURD620CTG, NRVUD620CTG, MURD620CTT4G, NRVUD620CTT4G, SUR620CTT4G,
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3
0.0001
0.001
0.01
0.1
1
10
100
0 20 40 60 80 100 120 140 160 180 200
Figure 1. Typical Forward Voltage (Per Leg)
vF, INSTANTANEOUS VOLTAGE (V)
0 0.60.2 0.8
30
0.1
0.3
0.2
2.0
1.0
100
20
7.0
3.0
0.5
5.0
50
, INSTANTANEOUS FORWARD CURRENT (AMPS)
F
1.4
VR, REVERSE VOLTAGE (V)
TJ = 175C
Figure 2. Typical Leakage Current* (Per Leg)
IF(AV), AVERAGE FORWARD CURRENT (A)
0 3.02.0
0
2.0
1.0
3.0
5.0
4.0
14
7.0
6.0
P
1.0 10
Figure 3. Average Power Dissipation (Per Leg)
0.4
0.7
10
70
1.0 1.2
100C
TJ = 25C175C
100C
25C
6.05.04.0 9.08.07.0
9.0
8.0
* The curves shown are typical for the highest voltage device in the
voltage grouping. Typical reverse current for lower voltage selections
can be estimated from these curves if VR is sufficiently below rated
VR.
i
150C
11
10
13
12
, AVERAGE POWER DISSIPATION (WATTS)
F(AV)
TJ = 175C
IPK/IAV = 20
SINE
WAVE
SQUARE
WAVE
dc
10
5.0
150C
IR, REVERSE CURRENT (mA)
TC, CASE TEMPERATURE (C)
100
1.0
2.0
3.0
4.0
5.0
IF(AV)
0
6.0
7.0
8.0
110 120 130 140 150 160 170 180
Figure 4. Current Derating, Case (Per Leg)
020
1.0
1.5
2.5
3.5
4.0
0
40 60 80 100
TA, AMBIENT TEMPERATURE (C)
IF(AV)
Figure 5. Current Derating, Ambient (Per Leg)
RATED VOLTAGE APPLIED
RqJC = 9C/W
, AVERAGE FORWARD CURRENT (AMPS)
SINE WAVE
OR
SQUARE WAVE
dc
, AVERAGE FORWARD CURRENT (AMPS)
TJ = 175C
120 140 160 180 200
0.5
2.0
3.0
SINE WAVE
OR
SQUARE WAVE
SURFACE MOUNTED ON
MIN. PAD SIZE RECOMMENDED
RATED VOLTAGE APPLIED
RqJA = 80C/W
dc
TJ = 175C
MURD620CTG, NRVUD620CTG, MURD620CTT4G, NRVUD620CTT4G, SUR620CTT4G,
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4
VR, REVERSE VOLTAGE (V)
Figure 6. Typical Capacitance (Per Leg)
C, CAPACITANCE (pF)
1
10
100
0 102030405060708090100
TJ = 25C
MURD620CTG, NRVUD620CTG, MURD620CTT4G, NRVUD620CTT4G, SUR620CTT4G,
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5
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C−01
ISSUE D
b
D
E
b3
L3
L4
b2
eM
0.005 (0.13) C
c2
A
c
C
Z
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
D0.235 0.245 5.97 6.22
E0.250 0.265 6.35 6.73
A0.086 0.094 2.18 2.38
b0.025 0.035 0.63 0.89
c2 0.018 0.024 0.46 0.61
b2 0.030 0.045 0.76 1.14
c0.018 0.024 0.46 0.61
e0.090 BSC 2.29 BSC
b3 0.180 0.215 4.57 5.46
L4 −−− 0.040 −−− 1.01
L0.055 0.070 1.40 1.78
L3 0.035 0.050 0.89 1.27
Z0.155 −−− 3.93 −−−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
MENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
12 3
4
5.80
0.228
2.58
0.102
1.60
0.063
6.20
0.244
3.00
0.118
6.17
0.243
ǒmm
inchesǓ
SCALE 3:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
H0.370 0.410 9.40 10.41
A1 0.000 0.005 0.00 0.13
L1 0.108 REF 2.74 REF
L2 0.020 BSC 0.51 BSC
A1
H
DETAIL A
SEATING
PLANE
A
B
C
L1
L
H
L2 GAUGE
PLANE
DETAIL A
ROTATED 90 CW5
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
MURD620CT/D
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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