SLLS094C − SEPTEMBER 1983 − REVISED MAY 2004
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DMeet or Exceed the Requirements of ANSI
TIA/EIA-232-E and ITU Recommendation
V.28
DCurrent-Limited Output: 10 mA Typical
DPower-Off Output Impedance: 300 Ω
Minimum
DSlew Rate Control by Load Capacitor
DFlexible Supply-Voltage Range
DInput Compatible With Most TTL Circuits
description/ordering information
The MC1488, SN55188, and SN75188 are
monolithic quadruple line drivers designed to
interface data terminal equipment with data
communications equipment in conformance with
ANSI TIA/EIA-232-E, using a diode in series with
each supply-voltage terminal as shown under
typical applications.
The SN55188 is characterized for operation over
the full military temperature range of −55°C to
125°C. The MC1488 and SN75188 are
characterized for operation from 0°C to 70°C.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
PDIP (N)
Tube of 25 MC1488N MC1488N
PDIP (N) Tube of 25 SN75188N SN75188N
0°C to 70°C
SOIC (D)
Tube of 50 SN75188D
SN75188
0C to 70 C
SOIC (D) Reel of 2500 SN75188DR SN75188
SOP (NS) Reel of 2000 SN75188NSR SN75188
CDIP (J)
Tube of 25
SN55188J SN55188J
−55°C to 125°C
CDIP (J)
Tube of 25
SNJ55188J SNJ55188J
−55
°
C to 125
°
C
CFP (W) Tube of 150 SNJ55188W SNJ55188W
LCCC (FK) Tube of 55 SNJ55188FK SNJ55188FK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Copyright 2004, Texas Instruments Incorporated
!"# $"%&! '#(
'"! ! $#!! $# )# # #* "#
'' +,( '"! $!#- '# #!#&, !&"'#
#- && $##(
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
2
3
4
5
6
7
14
13
12
11
10
9
8
VCC−
1A
1Y
2A
2B
2Y
GND
VCC +
4B
4A
4Y
3B
3A
3Y
SN55188 ...J OR W PACKAGE
SN75188 . . . D, N, OR NS PACKAGE
MC1488 ...N PACKAGE
(TOP VIEW)
3212019
910111213
4
5
6
7
8
18
17
16
15
14
4A
NC
4Y
NC
3B
1Y
NC
2A
NC
2B
SN55188 . . . FK PACKAGE
(TOP VIEW)
1A
NC
3Y
3A 4B
2Y
GND
NC
NC − No internal connection
CC+
V
CC −
V
$'"! !$& ./.00 && $## # ##'
"&# )#+# #'( && )# $'"! $'"!
$!#- '# #!#&, !&"'# #- && $##(
SLLS094C − SEPTEMBER 1983 − REVISED MAY 2004
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FUNCTION TABLE
(drivers 2−4)
ABY
H H L
LXH
X L H
H = high level, L = low level,
X = irrelevant
logic diagram (positive logic)
9
5
4
2
10
12
13 4Y
3Y
2Y
1Y1A
2A
2B
3A
3B
4A
4B 11
8
6
3
Positive logic
Y = A (driver 1)
Y = AB or A + B (drivers 2 thru 4)
schematic (each driver)
Output
300 Ω
70 Ω3.7 kΩ
10 kΩ
To Other Drivers
VCC−
Drivers
Other
To
GND
3.6 kΩ
Input(s) B
A
VCC+
70 Ω
6.2 kΩ8.2 kΩ
Drivers
To Other
Resistor values shown are nominal.
SLLS094C − SEPTEMBER 1983 − REVISED MAY 2004
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage, VCC+ at (or below) 25°C free-air temperature (see Notes 1 and 2) 15 V. . . . . . . . . . . . . . . . .
Supply voltage, VCC− at (or below) 25°C free-air temperature (see Notes 1 and 2) −15 V. . . . . . . . . . . . . . . .
Input voltage, VI −15 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage, VO −15 V to 15 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total power dissipation (see Note 2) See Dissipation Rating Table. . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Notes 3 and 4): D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature, TJ 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Case temperature for 60 seconds, FK package 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: J or W package 300°C. . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to the network ground terminal.
2. For operation above 25°C free-air temperature, refer to the maximum supply voltage curve, Figure 6. In the J package, SN55188
chips are alloy mounted.
3. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Selecting the maximum of 150°C can affect reliability.
4. The package thermal impedance is calculated in accordance with JESD 51-7.
DISSIPATION RATING TABLE
PACKAGE
T
A
≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE T = 25 C
T
A
= 70°C
POWER RATING
T
A
= 125°C
POWER RATING
PACKAGE
TA ≤ 25 C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 70 C
POWER RATING
TA = 125 C
POWER RATING
FK 1375 mW 11.0 mW/°C880 mW 275 mW
J1375 mW 11.0 mW/°C 880 mW 275 mW
W1000 mW 8.0 mW/°C640 mW 200 mW
recommended operating conditions
SN55188 MC1488, SN75188
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC+ Supply voltage 7.5 9 15 7.5 9 15 V
VCC− Supply voltage −7.5 −9 −15 −7.5 −9 −15 V
VIH High-level input voltage 1.9 1.9 V
VIL Low-level input voltage 0.8 0.8 V
TAOperating free-air temperature −55 125 0 70 °C
SLLS094C − SEPTEMBER 1983 − REVISED MAY 2004
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over operating free-air temperature range, VCC± = ±9 V (unless otherwise
noted)
PARAMETER
TEST CONDITIONS
SN55188 MC1488, SN75188
UNIT
PARAMETER
TEST CONDITIONS
MIN TYP†MAX MIN TYP†MAX
UNIT
VCC+ = 9 V,
6
7
6
7
VOH
High-level output voltage
VIL = 0.8 V,
VCC+ = 9 V,
V
CC−
= −9 V
6
7
6
7
V
V
OH
High-level output voltage
VIL = 0.8 V,
R
L
= 3 kΩ
VCC+ = 13.2 V,
9
10.5
9
10.5
V
RL = 3 kΩ
VCC+ = 13.2 V,
V
CC−
= −13.2 V
9
10.5
9
10.5
VCC+ = 9 V,
−7‡
−6
−7
−6
VOL
Low-level output voltage
VIH = 1.9 V,
VCC+ = 9 V,
V
CC−
= −9 V
−7‡
−6
−7
−6
V
V
OL
Low-level output voltage
VIH = 1.9 V,
R
L
= 3 kΩ
VCC+ = 13.2 V,
−10.5‡
−9
−10.5
−9
V
RL = 3 kΩ
VCC+ = 13.2 V,
V
CC−
= −13.2 V
−10.5‡
−9
−10.5
−9
IIH High-level input current VI = 5 V 10 10 µA
IIL Low-level input current VI = 0 −1 −1.6 −1 −1.6 mA
IOS(H)
Short-circuit output §
VI = 0.8 V,
VO = 0
−4.6
−9
−13.5
−6
−9
−12
mA
I
OS(H
)
Short-circuit output
current at high level§
V
I
= 0.8 V,
V
O
= 0
−4.6
−9
−13.5
−6
−9
−12
mA
IOS(L)
Short-circuit output§
VI = 1.9 V,
VO = 0
4.6
9
13.5
6
9
12
mA
I
OS(L
)
Short-circuit output
current at low level§
V
I
= 1.9 V,
V
O
= 0
4.6
9
13.5
6
9
12
mA
ro
Output resistance,
VCC+ = 0,
VCC− = 0,
300
300
Ω
r
o
Output resistance,
power off
VCC+ = 0,
V
O
= −2 V to 2 V
VCC− = 0,
300
300
Ω
VCC+ = 9 V,
All inputs at 1.9 V 15 20 15 20
VCC+ = 9 V,
No load All inputs at 0.8 V 4.5 6 4.5 6
ICC+
Supply current from
VCC+ = 12 V,
All inputs at 1.9 V 19 25 19 25
mA
I
CC+
Supply current from
VCC+
VCC+ = 12 V,
No load All inputs at 0.8 V 5.5 7 5.5 7
mA
VCC+
VCC+ = 15 V,
All inputs at 1.9 V 34 34
VCC+ = 15 V,
No load, TA = 25°CAll inputs at 0.8 V 12 12
VCC− = −9 V,
All inputs at 1.9 V −13 −17 −13 −17
VCC− = −9 V,
No load All inputs at 0.8 V −0.5 −0.015
ICC−
Supply current from ICC−
VCC− = −12 V,
All inputs at 1.9 V −18 −23 −18 −23
mA
I
CC−
Supply current from I
CC−
VCC− = −12 V,
No load All inputs at 0.8 V −0.5 −0.015
mA
VCC− = −15 V,
All inputs at 1.9 V −34 −34
VCC− = −15 V,
No load, TA = 25°CAll inputs at 0.8 V −2.5 −2.5
VCC+ = 9 V,
VCC− = −9 V,
333
333
PD
Total power dissipation
VCC+ = 9 V,
No load
VCC− = −9 V,
333
333
mW
PDTotal power dissipation VCC+ = 12 V,
No load VCC− = −12 V, 576 576 mW
†All typical values are at TA = 25°C.
‡The algebraic convention, in which the less positive (more negative) limit is designated as minimum, is used in this data sheet for logic voltage
levels only, e.g., if −6 V is a maximum, the typical value is a more negative voltage.
§Not more than one output should be shorted at a time.
SLLS094C − SEPTEMBER 1983 − REVISED MAY 2004
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics, VCC± = ±9 V, TA = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH Propagation delay time, low- to high-level output 220 350 ns
tPHL Propagation delay time, high- to low-level output
RL = 3 k
Ω,
CL = 15 pF,
100 175 ns
tTLH Transition time, low- to high-level output†
RL = 3 kΩ
,
CL = 15 pF,
See Figure 1 55 100 ns
tTHL Transition time, high- to low-level output†
See Figure 1
45 75 ns
tTLH Transition time, low- to high-level output‡
RL = 3 k
Ω
to 7 k
Ω,
CL = 2500 pF,
2.5 µs
tTHL Transition time, high- to low-level output‡
RL = 3 kΩ to 7 kΩ
,
CL = 2500 pF,
See Figure 1 3.0 µs
†Measured between 10% and 90% points of output waveform
‡Measured between 3 V and −3 V points on the output waveform (TIA/EIA-232-E conditions)
PARAMETER MEASUREMENT INFORMATION
10%
50% 90%
Output 10%
50%
90%
1.5 V
Input
tPHL tPLH
1.5 V 3 V
0 V
VOH
VOL
tTLH
tTHL VOLTAGE WAVEFORMSTEST CIRCUIT
Output
(see Note B)
CL
RL
Input
Pulse
Generator
(see Note A)
NOTES: A. The pulse generator has the following characteristics: tw = 0.5 µs, PRR ≤ 1 MHz, ZO = 50 Ω.
B. CL includes probe and jig capacitance.
Figure 1. Test Circuit and Voltage Waveforms
SLLS094C − SEPTEMBER 1983 − REVISED MAY 2004
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS†
Figure 2
VO − Output Voltage − V
VOLTAGE TRANSFER CHARACTERISTICS
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
VCC+ = 6 V, VCC− = −6 V
9
6
3
0
−3
−6
−9
1.81.61.41.210.80.60.40.2
−12 2
12
0
ÎÎÎÎÎÎÎÎÎ
VCC+ = 12 V, VCC− = −12 V
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
VCC+ = 9 V, VCC− = −9 V
ÎÎÎ
ÎÎÎ
RL = 3 kΩ
TA = 25°C
VO
VI − Input Voltage − V
Figure 3
IO − Output Current − mA
OUPUT CURRENT
vs
OUTPUT VOLTAGE
Load Line
VOH(VI = 0.8 V)
VCC− = −9 V
16
12
8
4
0
−4
−8
−12
−16
12840−4−8−12
−20 16
20
VO − Output Voltage − V
−16
ÎÎÎÎÎ
VOL(VI = 1.9 V)
ÎÎÎÎ
ÎÎÎÎ
3-kΩ
ÎÎÎÎÎ
ÎÎÎÎÎ
VCC+ = 9 V
ÎÎÎÎ
ÎÎÎÎ
TA = 25°C
IO
Figure 4
IOS − Short-Circuit Output Current − mA
SHORT-CIRCUT OUTPUT CURRENT
vs
FREE-AIR TEMPERATURE
IOS(L) (VI = 1.9 V)
ÎÎÎÎ
ÎÎÎÎ
VO = 0
ÎÎÎÎÎ
ÎÎÎÎÎ
VCC− = −9 V
1251007550250−25−50−75
9
6
3
0
−3
−6
−9
−12 150
12
TA − Free-Air Temperature − °C
−100
ÎÎÎÎÎ
ÎÎÎÎÎ
VCC+ = 9 V
ÁÁ
ÁÁ
IOS
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
IOS(H) (VI = 0.8 V)
Figure 5
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
SR − Slew Rate − V/
SLEW RATE
vs
LOAD CAPACITANCE
ÎÎÎÎÎ
ÎÎÎÎÎ
TA = 25°C
RL = ∞
VCC− = −9 V
VCC+ = 9 V
100
10
1000100
110000
1000
CL − Load Capacitance − pF
10
µs
†Data for temperatures below 0°C and above 70°C are applicable to SN55188 circuit only.
SLLS094C − SEPTEMBER 1983 − REVISED MAY 2004
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
THERMAL INFORMATION†
− Maximum Supply Voltage − V
MAXIMUM SUPPLY VOLTAGE
vs
FREE-AIR TEMPERATURE
RL ≥ 3 kΩ (from each output to GND)
14
12
10
8
6
4
2
1007550250−25−50
0125
16
TA − Free-Air Temperature − °C
−75
CC
V
Figure 6
†Data for temperatures below 0°C and above 70°C are applicable to the SN55188 circuit only.
APPLICATION INFORMATION
Diodes placed in series with the VCC+ and VCC− leads protect
the SN55188/SN75188 in the fault condition in which the device
outputs are shorted to ±15 V, and the power supplies are at low
voltage and provide low-impedance paths to ground.
VCC+
VCC−
±15 V
Output VCC+
VCC−
’188’188
10 kΩ
1 kΩ−10 V to 0 V
Output to MOS
or SN75188
1/4 SN55188
−0.7 V to 10 V
Output to HNIL
1/4 SN55188
or SN75188
−0.7 V to 5.7 V
Output to DTL
5 V
1/4 SN55188
or SN75188
or SN75188
1/4 SN55188 −0.7 V to 3.7 V
Output to RTL
3 V
−12 V
VCC+ = 12 V
VCC− = −12 V
Input From
TTL or DTL
Figure 7. Logic Translator Applications
Figure 8. Power-Supply Protection to Meet
Power-Off Fault Conditions of
ANSI TIA/EIA-232-E
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-86889012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-8688901CA ACTIVE CDIP J 14 1 TBD Call TI Call TI
5962-8688901DA ACTIVE CFP W 14 1 TBD Call TI Call TI
MC1488N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
MC1488NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN55188J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SN75188D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75188DE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75188DG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75188DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75188DRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75188DRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75188N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN75188NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN75188NSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75188NSRE4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN75188NSRG4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SNJ55188FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ55188J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SNJ55188W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 2
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN55188, SN75188 :
•Catalog: SN75188
•Military: SN55188
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN75188DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN75188NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN75188DR SOIC D 14 2500 367.0 367.0 38.0
SN75188NSR SO NS 14 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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