EPSA23BBHC-156.000MTR - Ecliptek Corporation

RoHS

EPSA23BBHC-156.000M TR

EPSA23 B B H C -156.000M TR

Series

RoHS Compliant (Pb-free) 3.3V 4 Pad 3.2mm x 5mm

Ceramic SMD LVCMOS Programmable Spread

Spectrum Oscillator

Frequency Tolerance/Stability

±50ppm Maximum

Operating Temperature Range

-40°C to +85°C

Packaging Options

Tape & Reel

Nominal Frequency

156.000MHz

Spread Spectrum

±0.75% Center Spread

Output Control Function

Tri-State

ELECTRICAL SPECIFICATIONS

Nominal Frequency 156.000MHz

Frequency Tolerance/Stability ±50ppm Maximum (Inclusive of all conditions: Frequency Stability over the Operating Temperature Range,

Supply Voltage Change, Output Load Change, First Year Aging at 25°C, Shock, and Vibration.)

Operating Temperature Range -40°C to +85°C

Supply Voltage 3.3Vdc ±10%

Maximum Supply Voltage -0.5Vdc to +4.2Vdc

Input Current 30mA Maximum

Output Voltage Logic High (Voh) 90% of Vdd Minimum (IOH=-8mA)

Output Voltage Logic Low (Vol) 10% of Vdd Maximum (IOL=+8mA)

Rise/Fall Time 3nSec Maximum (Measured at 10% to 90% of Waveform)

Duty Cycle 50% ±5(%) (Measured at 50% of waveform)

Load Drive Capability 15pF Maximum

Output Logic Type CMOS

Output Control Function Tri-State (Disabled Output: High Impedance)

Tri-State Input Voltage (Vih and Vil) 70% of Vdd Minimum or No Connection to Enable Output, 30% of Vdd Maximum to Disable Output

Tri-State Output Disable Time 100nSec Maximum

Tri-State Output Enable Time 100nSec Maximum

Disable Current 20mA Maximum (Unloaded; Pad 1=Ground)

Spread Spectrum ±0.75% Center Spread

Modulation Frequency 30kHz Minimum, 32kHz Typical, 45kHz Maximum

Period Jitter 100pSec Maximum (Cycle to Cycle; Spread Spectrum-On)

Start Up Time 10mSec Maximum

Storage Temperature Range -55°C to +125°C

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V

Fine Leak Test MIL-STD-883, Method 1014, Condition A

Flammability UL94-V0

Gross Leak Test MIL-STD-883, Method 1014, Condition C

Mechanical Shock MIL-STD-883, Method 2002, Condition B

Moisture Resistance MIL-STD-883, Method 1004

Moisture Sensitivity J-STD-020, MSL 1

Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K

Resistance to Solvents MIL-STD-202, Method 215

Solderability MIL-STD-883, Method 2003

Temperature Cycling MIL-STD-883, Method 1010, Condition B

Vibration MIL-STD-883, Method 2007, Condition A

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 1 of 6

EPSA23BBHC-156.000M TR

MECHANICAL DIMENSIONS (all dimensions in millimeters)

3.20

±0.20

5.00

±0.20 2.54

±0.15

1.3

MAX

1.00 ±0.20 (x4)

2.20

±0.15

1.20 ±0.20

1.20

±0.20

(x4)

PIN CONNECTION

1 Tri-State

2 Case/Ground

3 Output

4 Supply Voltage

LINE MARKING

1E156.00

E=Ecliptek Designator

2SXXXXX

S=Configuration Designator

XXXXX=Ecliptek

Manufacturing Identifier

All Tolerances are ±0.1

Suggested Solder Pad Layout

Solder Land

(X4)

All Dimensions in Millimeters

1.14

1.0

1.2 (x4)

1.4 (x4)

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 2 of 6

EPSA23BBHC-156.000M TR

OUTPUT DISABLE

(HIGH IMPED ANCE

STATE)

OUTPUT WAVEFORM & TIMING DIAGRAM

VOH

VOL

90% of Waveform

50% of Waveform

10% of Waveform

Fall

Time Rise

Time TW

Duty Cycle (%) = TW/T x 100

VIH

VIL

tPLZ tPZL

CLOCK OUTPUT TRI-STATE INPUT

Supply

Voltage

(VDD)

Test Circuit for CMOS Output

Output

Tri-State or

Power Down

Ground

+ +

Power

Supply

0.01µF

(Note 1) 0.1µF

(Note 1)

(Note 3)

Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass

capacitor close (less than 2mm) to the package ground and supply voltage pin is required.

Note 2: A low input capacitance (<12pF), 10X Attentuation Factor, High Impedance (>10Mohms), and

High bandwidth (>300MHz) passive probe is recommended.

Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. See applicable specification sheet

for ‘Load Drive Capability’.

Voltage

Meter

Current

Meter

Oscilloscope Frequency

Counter

Probe

(Note 2)

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 3 of 6

DIA 50 MIN

DIA 20.2 MIN

DIA 13.0 ±0.2

2.5 MIN Width

10.0 MIN Depth

Tape slot in Core

for Tape Start

DIA 40 MIN

Access Hole at

Slot Location

1.5 MIN

Tape & Reel Dimensions

*Compliant to EIA 481A

EPSA23BBHC-156.000M TR

16.0 ±0.3

7.50 ±0.15

6.75 ±0.15

4.0 ±0.1

2.00 ±0.05

8.0 ±0.1 B0*

DIA 1.5 +0.1/-0.0

A0*

0.3 ±0.1

K0*

22.4 MAX

360 MAX

Quantity Per Reel: 1,000 Units

16.4 +2.0/-0.0

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 4 of 6

T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

EPSA23BBHC-156.000M TR

High Temperature Infrared/Convection

TS MAX to TL (Ramp-up Rate) 3°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) 150°C

- Temperature Typical (TS TYP) 175°C

- Temperature Maximum (TS MAX) 200°C

- Time (tS MIN) 60 - 180 Seconds

Ramp-up Rate (TL to TP)3°C/second Maximum

Time Maintained Above:

- Temperature (TL)217°C

- Time (tL)60 - 150 Seconds

Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum

Target Peak Temperature (TP Target) 250°C +0/-5°C

Time within 5°C of actual peak (tp)20 - 40 seconds

Ramp-down Rate 6°C/second Maximum

Time 25°C to Peak Temperature (t) 8 minutes Maximum

Moisture Sensitivity Level Level 1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 5 of 6

T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

EPSA23BBHC-156.000M TR

Low Temperature Infrared/Convection 240°C

TS MAX to TL (Ramp-up Rate) 5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) N/A

- Temperature Typical (TS TYP) 150°C

- Temperature Maximum (TS MAX) N/A

- Time (tS MIN) 60 - 120 Seconds

Ramp-up Rate (TL to TP)5°C/second Maximum

Time Maintained Above:

- Temperature (TL)150°C

- Time (tL)200 Seconds Maximum

Peak Temperature (TP)240°C Maximum

Target Peak Temperature (TP Target) 240°C Maximum 1 Time / 230°C Maximum 2 Times

Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time

Ramp-down Rate 5°C/second Maximum

Time 25°C to Peak Temperature (t) N/A

Moisture Sensitivity Level Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 6 of 6