LM1458, LM1558
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SNOSBU4D –APRIL 1998–REVISED MARCH 2013
LM1458/LM1558 Dual Operational Amplifier
Check for Samples: LM1458,LM1558
1FEATURES
2• No Frequency Compensation Required • Low-Power Consumption
• Short-Circuit Protection • 8-Lead TO-99 and 8-Lead PDIP
• Wide Common-Mode and Differential Voltage • No Latch Up When Input Common Mode
Ranges Range is Exceeded
DESCRIPTION
The LM1458 and the LM1558 are general purpose dual operational amplifiers. The two amplifiers share a
common bias network and power supply leads. Otherwise, their operation is completely independent.
The LM1458 is identical to the LM1558 except that the LM1458 has its specifications guaranteed over the
temperature range from 0°C to +70°C instead of −55°C to +125°C.
Connection Diagram
Figure 1. TO-99 Package Figure 2. Dual-In-Line Package
(Top View) (Top View)
See Package Number LMC (O-MBCY-W8) See Package Number D (R-PDSO-G8) or
P (R-PDIP-T8)
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1998–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM1458, LM1558
SNOSBU4D –APRIL 1998–REVISED MARCH 2013
www.ti.com
Absolute Maximum Ratings(1)(2)(3)
Supply Voltage
LM1558 ±22V
LM1458 ±18V
Power Dissipation (4)
LM1558H/LM1458H 500 mW
LM1458N 400 mW
Differential Input Voltage ±30V
Input Voltage (5) ±15V
Output Short-Circuit Duration Continuous
Operating Temperature Range
LM1558 −55°C to +125°C
LM1458 0°C to +70°C
Storage Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 10 sec.) 260°C
Soldering Information
PDIP Package
Soldering (10 seconds) 260°C
SOIC Package
Vapor Phase (60 seconds) 215°C
Infrared (15 seconds) 220°C
See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices.
ESD tolerance (6) 300V
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits.
(2) Refer to RETS 1558V for LM1558J and LM1558H military specifications.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) The maximum junction temperature of the LM1558 is 150°C, while that of the LM1458 is 100°C. For operating at elevated temperatures,
devices in the LMC package must be derated based on a thermal resistance of 150°C/W, junction to ambient or 20°C/W, junction to
case. For the PDIP the device must be derated based on a thermal resistance of 187°C/W, junction to ambient.
(5) For supply voltages less than ±15V, the absolute maximum input voltage is equal to the supply voltage.
(6) Human body model, 1.5 kΩin series with 100 pF.
Electrical Characteristics (1)
Parameter Conditions LM1558 LM1458 Units
Min Typ Max Min Typ Max
Input Offset Voltage TA= 25°C, RS≤10 kΩ1.0 5.0 1.0 6.0 mV
Input Offset Current TA= 25°C 80 200 80 200 nA
Input Bias Current TA= 25°C 200 500 200 500 nA
Input Resistance TA= 25°C 0.3 1.0 0.3 1.0 MΩ
Supply Current Both TA= 25°C, VS= ±15V 3.0 5.0 3.0 5.6 mA
Amplifiers
Large Signal Voltage Gain TA= 25°C, VS= ±15V 50 160 20 160 V/mV
VOUT = ±10V, RL≥2 kΩ
Input Offset Voltage RS≤10 kΩ6.0 7.5 mV
Input Offset Current 500 300 nA
Input Bias Current 1.5 0.8 μA
Large Signal Voltage Gain VS= ±15V, VOUT = ±10V 25 15 V/mV
RL≥kΩ
Output Voltage Swing VS= ±15V, RL= 10 kΩ±12 ±14 ±12 ±14 V
RL= 2 kΩ±10 ±13 ±10 ±13 V
(1) These specifications apply for VS= ±15V and −55°C ≤TA≤125°C, unless otherwise specified. With the LM1458, however, all
specifications are limited to 0°C ≤TA≤70°C and VS= ±15V.
2Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: LM1458 LM1558
LM1458, LM1558
www.ti.com
SNOSBU4D –APRIL 1998–REVISED MARCH 2013
Electrical Characteristics (1) (continued)
Parameter Conditions LM1558 LM1458 Units
Min Typ Max Min Typ Max
Input Voltage Range VS= ±15V ±12 ±12 V
Common Mode RS≤10 kΩ70 90 70 90 dB
Rejection Ratio
Supply Voltage RS≤10 kΩ77 96 77 96 dB
Rejection Ratio
SCHEMATIC DIAGRAM
Numbers in parentheses are pin numbers for amplifier B.
Copyright © 1998–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LM1458 LM1558
LM1458, LM1558
SNOSBU4D –APRIL 1998–REVISED MARCH 2013
www.ti.com
REVISION HISTORY
Changes from Revision C (March 2013) to Revision D Page
• Changed layout of National Data Sheet to TI format ............................................................................................................ 3
4Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: LM1458 LM1558
PACKAGE OPTION ADDENDUM
www.ti.com 22-Feb-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM1458 MWC ACTIVE WAFERSALE YS 0 1 Green (RoHS
& no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 85
LM1458M NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM
1458M
LM1458M/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM
1458M
LM1458MX NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 70 LM
1458M
LM1458MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM
1458M
LM1458N/NOPB ACTIVE PDIP P 8 40 Green (RoHS
& no Sb/Br) Call TI | SN Level-1-NA-UNLIM 0 to 70 LM1458N
LM1558H ACTIVE TO-99 LMC 8 500 TBD Call TI Call TI -55 to 125 ( LM1558H, LM1558H
)
LM1558H/NOPB ACTIVE TO-99 LMC 8 500 Green (RoHS
& no Sb/Br) Call TI Level-1-NA-UNLIM -55 to 125 ( LM1558H, LM1558H
)
MC1558G ACTIVE TO-99 LMC 8 500 TBD Call TI Call TI -55 to 125 ( LM1558H, LM1558H
)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
PACKAGE OPTION ADDENDUM
www.ti.com 22-Feb-2020
Addendum-Page 2
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM1458MX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM1458MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM1458MX SOIC D 8 2500 367.0 367.0 35.0
LM1458MX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 2
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PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
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EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
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EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
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