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Product Data Sheet
Amphenol® HDB3 Series High Density
Mother Board & Daughter Board Connectors
No. 201-3
Rectangular Interconnects with
.070” X .060” Grid Spacing
This new connector series incorporates a higher
density contact pattern and lower mated height
than Amphenol’s original Low Mating Force rectan-
gular connectors while utilizing the same durable
and reliable B3 contact.
The B3 brush (bristle brush bunch) contact is
comprised of multiple strands of high tensile wire
that intermesh to create an electrical connection.
Amphenol
HDB 3 Mother Board
Connector
HDB 3 Daughter Board
Connector
BENEFITS OF THE BRUSH CONTACT
• Redundant current paths: 14-70 gas tight points
of contact per mated bunch
• Very smooth low friction interface
• Low mating forces: 1.5 oz. typical per contact,
70-90% lower than conventional contacts
• Long contact life: 100,000 cycles of mating and
unmating without performance degradation
• Documented intermittency free performance: No
10 nano-second discontinuities during
50,000,000 cycles of 0.010” displacement
• Impervious to fretting
• Contact interface meets M55302/166 thru /171
@2009 Amphenol Corporation Printed in U.S.A. 1/8/2009
HDB3 FEATURES
Polarization: “D” shaped design
Keying: Optional keys offer 36 unique
keying combinations
Guide Pins Optional guide pins provide
additional alignment
Radial Misalignment: Capable of correcting up to a
.020" initial radial misalign-
ment
Angular Misalignment: Capable of mating with up to a
2° initial angular misalignment
HDB3 CONNECTOR PERFORMANCE
Durability: 100,000 mating cycles
Insertion/Extraction Force: 1.5 ounce typical per contact
Operating Temperature: -65° to 150°C
Current Rating: 2 amperes
Hot swap 1 ampere maximum
(load dependent)
Insulation Resistance: 5 gigaohms minimum
Dielectric Withstanding
Voltage: 750 volts, 60 hertz, rms @ Sea
Level 250 volts, 60 hertz,
rms @ 70,000 feet Elevation
Solderability: MIL-STD-202, Method 208
Salt Fog: 48 Hours IAW MIL-STD-1344,
method 1001, test condition B
Humidity: IAW MIL-STD-1344, method
1002, type II
Vibration: 4 hours in each of 3 mutually
perpendicular axes IAW MIL-ST
1344, method 2005,
test condition V, letter H
Shock: 1 shock along each of three
mutually perpendicular axes IAW
MIL-STD-1344, method 2004,
test condition G
Data Rate: Capable of 3.125 Gbps (consult
Amphenol for arrangement)
2
.350 .350 .325
.086 MIN. DIA.
THRU HOLE
(USE NO. 2 SCREW)
PIN 1 PIN 1
BA
.086 MIN. DIA.
THRU HOLE
(USE NO. 2 SCREW)
CB
A
.335 MAX.
.150 ±.005
.150 ±.020
TYP.
.150 ±.020
TYP.
.016 ±.001
DIA. TYP.
.016 ±.001
TYP.
.195 MIN. HEX
.070 MIN DEEP
(USE 3/16 HEX HEAD)
.090 TYP .
.030 TYP .
.035
TYP.
.070
TYP.
.060 TYP . .025
.540
.420
.350
.410
.470
.530
4
65
123
D
FE
ABC
123
654ABC
FED
HDB3 MATERIALS
Insulator: Liquid crystal polymer, 30% glass filled
Contact: Wire: Beryllium copper per ASTM B197; finish is gold per ASTM B488
over nickel per AMS-QQ-N-290.
Holder: Brass similar to UNS C33500; finish is gold per MIL-G-45204 or tin-lead per
MIL-P-81728 or tin per MIL-T-10727 (RoHS Compliant).
Sleeve: Stainless Steel per AMS-5514, passivated IAW QQ-P-35
(Daughter Board connector only)
Keys/Guide Pins: Stainless Steel
MOTHER BOARD DAUGHTER BOARD
All dimensions for reference only.
CUSTOM CONFIGURATIONS
• Hybrid configurations are available with any combination
of brush and power, coax, and/or fiber optic contacts
• Partially populated arrangements for high voltage or high
speed data transfer up to 3.125 Gbps. (shown at right)
Consult Amphenol Aerospace with your design requirements.
Number of Dimension Dimension Dimension
Contacts A B C
040 40 1.375 0.800 1.075
08080 2.075 1.500 1.775
120 120 1.775 2.200 2.475
160 160 3.475 2.900 3.175
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HDB3 MOTHER BOARD CONNECTOR HOW TO ORDER
HDB-M4 - 040 M 20 2 X
HDB-M4 Designates HDB3 Mother Board Connectors
Number of Contacts
Number of Dimension Dimension Dimension
Contacts A B C
040 40 1.375 0.800 1.075
08080 2.075 1.500 1.775
120 120 1.775 2.200 2.475
160 160 3.475 2.900 3.175
Brush Wire Plating
M 0.000050 Au Min. thick over Nickel
C 0.000020 Au Min. thick over Nickel
Termination
Example part number: Hardware Type Stickout
(Dim. K)
XNo Hardware N/A
GPolarization Key 0.250
Qty. 2
HPolarization Key 0.500
Qty. 2
JPolarization Key 0.750
Qty. 2
TGuide Pin 0.250
Qty. 2
UGuide Pin 0.500
Qty. 2
VGuide Pin 0.750
Qty. 2
Type Stickout
(Dim. E)
20 PCB, Straight, .016 Dia. 0.060
21 PCB, Straight, .016 Dia 0.090
22 PCB, Straight, .016 Dia 0.120
23 PCB, Straight, .016 Dia 0.150
24 PCB, Straight, .016 Dia 0.180
25 PCB, Straight, .016 Dia 0.210
Contact Terminition Finish
2Gold plated in accordance with
MIL-G-45204, Type II, .00030 Min.
thick Gold over .000050 Min. thick
Nickel
5Tin plated in accordance with
ASTM B545, .00010 Min. thick
Matte Tin over .00010 Min. thick
Nickel
6Tin-Lead plated in accordance with
SAE-AMS-P-81728, .00010 Min.
thick Tin-Lead over .00010 Min.
thick Copper
HDB-M4-XXXXXXXX drawing is available on-line at
www.amphenol-aerospace.com. Then go to board level, then go to HDB3.
Type Stickout
(Dim. E)
26 PCB, Straight, .016 Dia 0.240
27 PCB, Straight, .016 Dia 0.270
28PCB, Straight, .016 Dia 0.300
29 PCB, Straight, .016 Dia 0.360
30 PCB, Straight, .016 Dia 0.420
HDB3 DAUGHTER BOARD CONNECTOR HOW TO ORDER
HDB-D4 - 040 M 02 2 X
HDB-D4 Designates HDB3 Daughter Board Connectors
Number of Contacts
Number of Dimension Dimension Dimension
Contacts A B C
040 40 1.375 0.800 1.075
08080 2.075 1.500 1.775
120 120 1.775 2.200 2.475
160 160 3.475 2.900 3.175
Brush Wire Plating
M0.000050 Au Min. thick over Nickel
C0.000020 Au Min. thick over Nickel
Termination
Example part number:
Hardware Type
XNo Hardware
PPolarization Key
Qty. 2
LPolarization Key
Qty. 2
Type Stickout
(Dim. E)
00 PCB, Right Angle, .016 Dia. 0.060
01 PCB, Right Angle, .016 Dia. 0.090
02 PCB, Right Angle, .016 Dia. 0.120
03 PCB, Right Angle, .016 Dia. 0.150
04 PCB, Right Angle, .016 Dia. 0.180
05 PCB, Right Angle, .016 Dia. 0.210
06 PCB, Right Angle, .016 Dia. 0.300
HDB-D4-XXXXXXXX drawing is available on-line at
www.amphenol-aerospace.com. Then go to board level, then go to HDB3.
Contact Terminition Finish
2Gold plated in accordance with
MIL-G-45204, Type II, .00030 Min.
thick Gold over .000050 Min. thick
Nickel
5Tin plated in accordance with
ASTM B545, .00010 Min. thick
Matte Tin over .00010 Min. thick
Nickel
6Tin-Lead plated in accordance with
SAE-AMS-P-81728, .00010 Min.
thick Tin-Lead over .00010 Min.
thick Copper
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Recommended Mother Board Layout Recommended Daughter Board Layout
No. of Contacts B
40 1.075
80 1.775
120 2.475
160 3.175
Dimensions
B
.070
.060
.205
.035 .030
FINISHED HOLE SIZE PER
CUSTOMER STANDARDS FOR
A.016 PCB TAIL
.005 M
.110 ±.005
B
.025
.
300
.150
.205
.070.035
.060
FINISHED HOLE SIZE PER
CUSTOMER STANDARDS FOR
A.016 PCB TAIL
BOARD
EDGE
.005
M
.110 ±.005
Mother Board Connector Keying (Optional)
Daughter Board Connector Keying (Optional)
.680
.620
.560
.500
MOTHER
BOARD
DAUGHTER
BOARD
MOTHER
BOARD
CONNECTOR DAUGHTER
BOARD
CONNECTOR
Mated Connector Pair Assembled
to Boards (0.680” Total Mated Height)
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CONNECTOR COMPARISON
The Amphenol HDB3 Connector offers advantages over competitive connectors:
• Higher density contact pattern
• Uses less board space
• Allows for shorter mated height
• Provides the durability and performance of the Brush contact
• Low cost
Contact System Brush Hyperboloid Pin & Socket
Durability, Mating Cycles 100,000 2,000 500
Contact Mating Forces, Ounces 1.5 1.5 2 .5
Mother Board .070 X .060 .075 X .075 .075 X .070
Daughter Board .070 X .060 .075 X .100 .075 X .100
Connector Width .350 .443 .400
Mated Height, MB to 4th row of DB . 680 .986 .915
Contacts
40 29
80 38
86 37
102 37
120 43
110 40
160 46
164 40
Amphenol Hypertronics Airborn
HDB 3 HPH RM4
Notice: Specifications are subject to change without notice. Contact your nearest Amphenol Corporation Sales Office for the latest specifications. All statements, information and data given herein are believed to be accurate
and reliable but are presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements or suggestions concerning possible use of our products are made without representation or warranty
that any such use is free of patent infringement and are not recommendations to infringe any patent. The user should assume that all safety measures are indicated or that other measures may not be required. Specifications
are typical and may not apply to all connectors.
AMPHENOL is a registered trademark of Amphenol Corporation.
For additional information on this product or other Amphenol products contact:
Amphenol Corporation
Amphenol Aerospace
40-60 Delaware Avenue
Sidney, New York 13838-1395
Phone: 800-678-0141 and ask for BLP (Board Level Product) Marketing
Email: blp-marketing @amphenol-aerospace.com
Web: www.amphenol-aerospace.com
See Amphenol Low Mating Force Rectangular Connectors Catalog, 12-035.
Contact Arrangement
Contacts per Linear
Inch (Contacts/
Connector Length)
