CHARACTERISTICS SM2 D-Sub connectors - Stamped and Formed Contacts SURFACE MOUNT CONNECTORS Specifications Connectors according to MIL C24308 - NFC 93425-HE5 Materials and Platings Shells Insulator Steel with tin plating High temperature (peak at 260C) glass-filled thermoplastic, UL 94V-0 Stamped and formed brass, selected gold in mating area; 2.54um (100u) min. tin on termination area, with entire contact under-plated 1.27um (50y) min. nickel Socket contact Rear insert Brass, 3um up to 5um (118u up to 197y) tinned over nickel 2um up to 3 um (78u to 118y) Boardlock Tin plating 4um up to 6um (157y up to 236u) over nickel 2um up to 3um (78u up to 118), insertion force: Low Insertion Force = LIF (bronze) Zero Insertion Force = ZeFo (bronze) Screwlock Brass, Gum up to 10um (236y up to 394) tinned over nickel 2um up to 3yum (78u up to 118y) Grounding Grounding strap: brass, 4um up to 6um tin plating over nickel 2um up to 3um (78y up to 118y) Electrical Data Current rating 3A Voltage rating 300V AC/rms 50Hz Withstanding voltage 1000V AC/rms 50Hz for one minute Insulation resistance 5000MQ Contact resistance 10mQ max Climatic Data Operating temperature 85C, peak at 105C Damp heat 56 days (40C - 95% HR) Mechanical Data 1.2N<F <2.5N 0.4N min 8N max per connector 0.2mm (.008) max Single contact insertion force Single contact withdrawal force LIF boardlock Coplanarity of contacts Mating and unmating force Unit: N No. of Cts Mate (max) Unmate (min) 9 (size E) 30 35 15 (size A) 50 4.5 25 (size B) 83 8.0 Amphenol SMT D-Sub is offered in right angle, receptacle with brackets, as an industry standard for |/ O connections. DESCRIPTION Boardlock features: -LIF (Low Insertion Force) boardlock especially designed to be fully compatible with pick and place machine. -ZeFo (Zero Force Insertion) boardlock has been designed so that once placed and expanded, secures a safe locking. Industrial * Telecom * Any industry standard |/.O connections APPLICATIONS SM2/E2 (\O\C \ fi Amphenol OVERALL DIMENSIONS Shell Size Dimensions o S co & g 6.4 (.252) 12.7 (.500)__ ~N Oo z _ a cO qi 2 the | | f 1 TM see panel fmm mounting options 9.62 (.379) PCB LAYOUT 93.3 (.130 1 (.039) ie 4.95 (195) 0.94 (.037) 1/2 Pitch Pitch SHELL mm (inch) SIZE A B Cc D PITCH F K +0.05 (.002) 0 0.1 (.004) 0 1 (.004) -0.2 (.008) -0.25 (.01) E | 31.15 (1.226) 16.4 (.645) | 25(.984) | 8.03(.316) | 2.74 (.1078) | 10.97 (.432) | 16.3 (.642) A | 39.4(1.551) | 24.8 (.976) | 33.3 (1.311) | 8.03 (.316) | 2.74(.1078) | 19.2(.756) | 24.6 (.968) B | 53.3 (2.098) | 38.5 (1.515) | 47 (1.850) | 8.03(.316) | 2.76 (.1086) 33.12 (1.304)| 38.3 (1.508) Panel mounting option GROUNDING TABS: V1 grounding tab V2 grounding tab BOARDLOCKS: 3.4 ZeFo boardlocks LIF boardlocks ZeFo operation 2 1 , Z L- a. oO; Z2 Cr REN = a FLANGES ACCESSORIES: +0.2 +.008 93.8 (.150) M3 or #4-40 rear insert 6.4 0 (252 9 ) 5.85 (.230) cs installed #4-40 screwlock fixed #4-40 screwlock Ke) = 2 Theaded Rear Installed Front Fixed Front Female 6 = Female <9 1/2 5 6 TECHNICAL DATA SM2/E2 ( \( \( \ Mie NOTES How to order L 17SM2 .. Soo ue we oe RoHS Compliant packaging: R = reel (100 / reel, 9 Pos only) ; . T = tube configuration: 09 15 - 25 contact plating: 1 = 0.2um Au (7.9u) 2 = 0.4um Au (15.7y) 3 = 0.5um Au (19.7y) . . 4 =0.8yum Au (31.5) board locks / grounding tab: 6 = 1.27pm Au (50) 1 = V1 grounding tab +ZeFo boardlocks (PCB = 1.6) - 4= ZeFo boardlocks only mounting options: (PCB = 1.6) 1 = rear insert 4-40 7 = V1 grounding tab only 2 = rear insert M3 8 = no grounding tab and no 5 = installed front screwlock boardlocks 4-40 B = V2 grounding tab + LIF 6 = fixed front screwlock 4-40 boardlocks (PCB = 1.6) : Standard options For special request, please consult factory Memo Do not hesitate to contact us for further information Am p h enol Amphenol IT & Communication Products Block A3/A4, The 4th Industrial District of Industrial Headquarters, Dong Keng Road Gong Ming Town, Shen Zhen China Fax:+86(0)755 2754 9955 Technical Support Tel:+86(0)755 2717 7945 Info-dsub@amphenol.com.cn http://www.dsubconnector.com The information given in this document are as a guideline only. We reserve the right to modify our products in any way we deem necessary. Any duplication is prohibited, unless approved in writing. E13/B