Application Specification 114-2048 AMF Modular Jacks 25 FEB98 Rev M Nena All numerical values are in metric units [with U.S. customary units in brackels}. Dimensions are in millimeters [and inches]. Uniess otherwise specified, dimensions have a tolerance of +0.13 [005] and angles have a tolerance of 2. Figures and illustrations are for identification only and are not drawn fo scale. 1. INTRODUCTION This specification covers the requirements for application of AMP* Modular Jacks designed to be mounted to a printed circuit (oc) board. The jacks are available as unshielded, shielded, and filtered designs to accommodate specific application requirements. There are 4 position handset jacks and there are 4, 6, 8, and 10 position line jacks. This specification pertains to all shielded and unshielded jacks with top and side entry ports, and with single or multiple ports. When corresponding with AMP personnel, use the terminology provided on this specification to help facilitate assistance. Basic terms and features of components are provided in Figure 1. Unshielded - { Port Locking oc, Jack Contact (Ref) Rib . Housing | U Bifurcated Boardlock | | UL (Mounting Leg) Top-Eniry Feed-Through Jack Flangeless TopEniry Bridging With Panel Stop Jack Without Panel Stop Single Port Top-Entry Flange Cs 2 Ports Solid Post Guide Pin Panel Stop (Ref) (Round Mounting Leg) Flanged Side-Entry Jack Flangeless Side-Entry Multi-Port Side-Eniry Without Panel Stop Jack With Panel Stop (Ref) Cs | [ fl |e \ i HIN Standoff Shield Solder Tine Contact Solid Post Boardlock (PC Board Ground} Solder Tine (Star-Type Mounting Leg } Low-Profile Side-Eniry Low-Profife Side-Eniry Low-Profile Side-Eniry Jacks Jack With Panel Stop Jack With Panel Stop Without Panel Stop Typical Modular Jack Designs Figure 1 AMP Incorporated, Harrisburg, PA 17105 TOOLING ASSISTANCE CENTER 1-800-722-1111 AMP FAX*/PRODUCT INFO 1-800-522-6752 4 of 14 This AMP controlled document is subject to change. For latest revision call the AMP FAX number. Copyright 1998 by AMP Incorporated. All Rights Reserved. Trademark LOC B Form 404-32 1/98AMF Modular Jacks 114-2048 2. REFERENCE MATERIAL 2.1. Revision Summary This paragraph is dedicated to a revision summary of changes and additions since the previous release of this application specification. The following changes were mace for this revision (Rev M). Per EG 09901094-97: Replaced pc board layout of unshielded 6 position jacks Replaced pc board layout of shielded 6 position jacks Replaced pc board layout of shielded 8 position top entry jack Added pc board layout for unshielded 10 position jacks Added pc board layout for shielded 10 position jacks Changed some text and layouts for terminology consistency and clarity * @ @ @ 6 2.2. Customer Assistance Reference Part Number 520250 and Product Gode 1055 identify the pc board mounted modular jacks. These numbers are used in the AMP network of customer service to access tooling and product application information. This service is provided by your local AMP Representative (Field Sales Engineer, Field Applications Engineer, etc} or, after purchase, by calling the Tooling Assistance Genter or AMP FAX/Product information number at the bottom of page 1. 2.3. Drawings AMP Customer Drawings for product numbers are available from the service network. The information on the customer drawing and this specification takes priority over any other document supplied by AMP Incorporated. If there is a conflict with the information on the customer drawing and this specification call either of the customer service numbers at the bottom of page 1 for assistance. 2.4. Product Specifications AMP Product Specifications 108-1163 (shielded and unshielded modular jacks), 108-1721 (unshielded bridging jacks), and 108-1432 (filtered modular jacks } cover test and performance requirements. 2.5. Instructional Material AMP Corporate Bulletin No. 401-52 is available from the service network. This bulletin provides information on various flux types and characteristics along with the commercial designation and flux removal procedures. A checklist is attached to the bulletin as required for information on soldering problems. 3. REQUIREMENTS 3.1. Storage A. Ultraviolet Light Prolonged exposure to ultraviolet lignt may deteriorate the chemical composition used in the modular jack housings. B. Shelf Life Modular jacks should remain in the shipping containers until ready for use to prevent damage. The products should be used on a first in, first out basis to avoid storage contamination that could adversely affect signal transmissions. C. Chemical Exposure Do not store modular jacks near any chemicals listed below, as they may cause stress corrosion cracking in the components. Alkalies Ammonia Cittrates Phosphates Citrates Sulfur Compounds Amines CGarbonates Nitrites Sulfur Nitrites Tartrates 20114 Rev M Form 404-33 1/98AMF Modular Jacks 114-2048 3.2. Panel Cutout The flanged jacks will require a panel cutout that will allow the jack flange to be on the outside of the panel. This may be accomplished with threesided panel cutout (Option 1) or a split panel cutout (Option 2). The flangeless jacks with panel stops are designed to be back mounted to a panel connected on all four sides. The suggested panel cutout for each style of modular jack is provided in Figure 2. Split Located at customers 4 Pos 11.56 [.455] @ preference 4 Pos 13.59 [.535] 6 Pos 13.59 [.535) B Pos 15.62 [.615) +0.38-9 [,.015-.0001 Typ | 17. 65+0.38-.0 - .695+.015-.0001 ey 1.02 C.040] 0.64 [.025] 1.397+0.13 C.005+,.005] Panel R Max Typ {\ Flange 16.13 [.635] Min Mm Top of Pa Board Option 1 Option 2 A a ; Solder TalLs 9.52 ae c. 375] @ Handset jack; all others are line jacks. Unshielded 4 Position Handset, and 4, 6, and 8 Position Line Side-Entry Jacks with Flange 4 Pos 11.56 [.455] gs 4 Pos 13.593 (.535] 6 Pos 13.59 [.5351 Cutout @ Pos 15.62 [.615] +0.3B-O [+,015-.000] Typ I 2 583, Pane L Panel WH a Stop | i Panel 0.64[.025] R Max | ' |___] (4 PLaces> | 16.368 +0.38-0 [.645+.015-.000] | a | | : co 1 a am SI solder ff L 8.18 Top of Pe 0.6440.13 Talls ~ P [. 025+. 005] C. 3221 Board @ Handset jack; all others are line jacks. Unshielded 4 Position Handset, and 4, 6, and 8 Position Line Flangeless Side-Entry Jacks with Panel Stop Figure 2 (cont'd) Rev M 3 of 14 Form 404-40 1/98AMF Modular Jacks 114-2048 4 Pos 11.81 [.4651 5 P L 4 Pos 13.84 (.545)] | Cutout 6 Pos 13.84 (C.545] 68 Pos 15.868 ([(.625)] +0.38-0 [4015-.000] Typ l~aa f ] Panel Ww 3.18 ee C.125] s - , i. Panel Panel j Stop 13.21 [.520] Pe Board 16.13+0.38-0 0.64[.0251R Max Y U Va [.635+.015-.000] C4 Places) KSNBBSA BSA Solder ~ @ Handset jack; all others are line jacks. Tines BoardL ocl< Unshielded 4 Position Handset, and 4, 6, and 8 Position Line Top-Entry Jacks 4 Pos 13.60 ([.535] 6 Pos 13,60 [,535] 8 Pos 15.62 [.615] PaneL +0.38-0 .015-.000] Typ + 2.36 [.9093] Panel i Step , O.640,025]R M = Panel Panel _- ax | Cutout I | Top of Pec 13.08 +0.38-0 Board C.515+.015-. 000] ee t v PEK AMNA (eee : | Solder 94 ~~ 0.25 +0.13 Tines lL [.010+4,.005] BeardLacl< -m 5,51 0.217] Unshielded 4, 6, and 8 Position Line Low-Profile Side-Entry Jacks a ]]4.8 +, 38-074.520,015-.0001Typ (8} p$- 100.8 [3.97] ?} _ ha - 86.9 [3.42] C(B) ka__ Y2.9 [2.87] S> w mt 58.9 [2.32] 43 ht45,.0 01.77] C3) h 31.0 [1.22] 2) 15.62 <a i c.615112 | | i ee . L f | | Top of Pc | | Board , | | LELMLLLLLILLLLLL LLAMA ALLA AAA AAA AAA AAA ALAA AA AML ALAA? N 13.84 +0.38 -0(.545+ 015-,000] Unshielded 8 Position Multi-Port Jacks Figure 2 (conta) Umber n parenthesis) = Number of Forts 4of 14 Rev M Form 404-33 1/98AMF Modular Jacks 114-2048 Panel Cutout 1 17.15-16.76 Panel [.675-.660] 17.40- 17.02 RO.64 [.025] L_- Panel Max imum C4 Places) [C.685-.670] Solder f PC Board , - Tine Shielded 8 Position Top-Entry Jacks 6 Pos 14.22 [.560] G8 Pos 16.26 [.6401 +9.38-0 [,015-.000]1 Typ . . a a 2.36 [.0993] Panel Cutout 0.64[0.0251R Max Panel Panel ie C2 places) \ Top of Pc 13.7240.13 Board i .540+.005] V7Z qi A Z ae Y S7/VV7AL 0.51+0.13 [.020+.005] Solder __44 nes ~~ le 5.51 [.217] Shielded 6 and 8 Position Side-Entry Low-Profile Jacks 14.484+0.38-0 [.570+.015 -.000] fa 115.6 +0.38-014.55+.015 .000] Typ (8) ei 87.7% [3.45] 6)_m w#H59.7% 2.35] 4)3w Top of wi 31.8 Pc Board 16.51 [1.25] C2) [.-65011 > a Lee TT i WLIGLLEPELEPLLLPLLELLELLLELZLLELLELLLELLLEL 1 DLL LS 0.25 .010] Shielded 8 Position Multi-Port Modular Jacks (Number in parenthesis) = Number of Ports Figure 2 (end) Rev M 5of 14 Form 404-40 1/98AMP 3.3. PC Board Layout The solder tine hole layout for all 4, 6, and 8 position singleport jacks is typical for all jacks with comparable positions, and each port of a multi-port jack is identical to the hole pattern for comparable singleport jacks. The mounting hole location will depend of the number of ports and contact positions. The pc board layout views shown represent the component side of the pc board. Modular Jacks 114-2048 Rens Mounting holes in pe board should be made with 3.25 [128 (No. 30) drill, Do NOT use a 3.18 [125 (1/8) } drill bit. A. Unshielded Jacks The hole patterns that apply to all unshielded sideentry and topentry jacks are provided in Figure 3. 1.27+0.05 m [.050+,.002] 3 PLACES g0.69+0.06 [.0354,003] 4 HOLES POSITION NO.1 <b 7.62 40.05 Component Side of PC Board 1.91 +0,05 C.075+.002] L 6.89+0.05 [. 3504. 002] >) (Ty CA &.35+ 0.05 Pr. 2504 ,0077 [. 300+. 0021 Unshielded 4 Position Handset Jacks POSITION NO. 1 FOR 6/6 1.91490.05 C.o75+.002] POSITION NO. 1 FOR 6/2 ~ | 83.25 40.08 [ .128+.003 .002] 2 Mounting Holes (See also Figure 5) Component Side of PC Board 1.2720.05 [. 050+ .602] TYPICAL cl #@ 0.49+0,08 | > o .035+.003] Ae TYPICAL 8.89+0,05 [. 350+. 0021 rere POSITION NO. 1 9 3,25+0,08_0.05 | { t FOR 6/4 c. 128+, 003 .002] ; a opi q 2 Mounting Holes (See also Figure 5} [, 205] MAXIMUM 10. 16+0.05 : a a [, 400,002] Unshielded 6 Position Jacks (6/2, 6/4, 6/6 Loaded Combinations) ee 4.45 1.27 [050] [.175) | 5.35 C.250] 8.89 [.350] Unshielded 6 Position Top-Entry Feed-Through Bridging Jack POSITION NO.1 Pi 10. 160.4001 Component Side of PC Board @ 0.89+0.07 [.O35+.0031 2HOLES #1.09+0. 07 C.0434,003] 2 HOLES 1.47 T, 056] 8 3.25+0,.07-0.05 C.128+. 603 -.0021 2 Mounting Holes (See also Figure 5) 31,118] Figure 3 (cont'd) Bof 14 Rev M Form 404-33 1/98Modular Jacks AMP 114-2048 5.08 40.05 [-200+, 002] 2.54+0.05 [.100 +.002 | a Component Side of PC Board 1.2740.05 [.050 +. 002] TYPICAL 2.54+0.05 [.100 +.002] TYPICAL +2 @ 6.35 0.05 \ NN yo.2020.08 [.250 +.002] POSITION NO. 1 [. 035+. 003] 1__{1) 8 HOLES 63.25+0,08-9.05 11.43+0.05 _ | [ .128+.003 .002 ] [.450 +.002] 2 Mounting Holes (See also Figure 5) Unshielded 8 Position Jacks Component Side of PC Board 5.08 40.05 + 1.27+0.05 -200+4,002 [ | [.050 +.002] TYPICAL 2.5420.05 2.54+0.05 [. 100 +.002] [.100 +.002] | POSITION "NS TYPICAL @ @ @ oN 8.35 40.05 [.250 +.002] CIN g0,89+0,.08 [.035+. 003] |Q HOLES $3.25+0,08-0.05 [ .128+.003 -.002] 11.43 0.05 [. 450 +.002] Unshielded 10 Position Jacks 2 Mounting Holes (See also Figure 5) Figure 3 (cont'd) Rev M Form 404-40 1/98 7 of 14AMF Modular Jacks 114-2048 Component Side of PC Board 24.19 40.13[.950+.005] 8.89 40.05 [,350+,002] Typ 38.140.13 (1.5004. 005] (Total Non-AccumuLlat! ve> {107.95 +0.13 [4,250+, 005]__ jat- 93.98 +0.13 (3.700+.005] Ve 80.01 40.13 [3.150+.005] Mi65.04 40.13 [2,6004.005] em 52.07 40.135 [2.050+.005) t-1. 2740.05 [. 050+, 002] Typ 1,400,005) t h >| Ht 2.54+0.05 rPeo0o0 986006 060605900 690060 6090090060 659009 8006 [OG O/0 [.106+.002] &oo0o 90000 0000 ao00 0009 9000 09090 a000 Typ 2.5420 os A [. 100+. 002] BS h- 4 6.35 +0.05 g 0.89+0.081.035+.0031 C. 2504. 002] POSITION NQ.1 Typ ra pt_ Din. A j<_________++# Dim. B @ 3.25+0.08_9.05 [. 128+, 003_.902] 2 or3 Mounting Holes Per Chart (See also Figure 5) MOUNTING HOLE LOCATIONS NUMBER OF PORTS DIM. A DIM. B 1 Not Required 11.4 [0.45] 2 Not Required 25.4 [1.00] 3 Not Required 39.4 [1.55] 4 Not Required 53.3 [2.10] 9 Not Required 67.3 [2.65] 6 Not Required 81.3 [3.20] 7 Not Required 95.2 [3.75] 8 54.61 [2.15] 109.2 [4.30] Unshielded 8 Position Multi-Port Jacks Figure 3 fend) 8 of 14 Rev M Form 404-33 1/98AMP Modular Jacks 114-2048 B. Shielded Jacks The hole patterns that apply to all shielded sideentry and topentry jacks are provided in Figure 4. All pc board layout views shown represent the component side of the pc board. POSITION NO. 1 1.9120.05 m [.075+.002] &.89+0,05 C.350+.002) 6.354+0,05 | nae 002] ! ri q 5.210.205] MAX THOM Component Side of PC Board 1.2740.05 [,050+,002] TYPICAL 0,8920.08 #7" 935+. 003] TYPICAL 6 3.25+0.08_6.05 C.128+.003_,.002) 2 Mounting Holes (See also Figure 5) g1.57+0.08 [.062+.003] 2 Shield Holes 3.05+0.05 m 10.16+0.05 1204.00 . +. r.12 21 1.78+0.05 [. 400+. 002] [.670+.0021] Shielded 6 Position Jacks 2 PLACES 1.9140.05 1.2740.05 Component Side of PC Boared [. 075+. 002] > [. 050+. 002] POSITION NO.1 TYPICAL o Cees on3] $3,25+0,08-0.05 TYPICAL [ .128+.003 .002] 2 Mounting Holes (See also Figure 5) I 8.89+0.05 6.35+0,.05 [.3504,002] c. 250+. 002] | g1.57+0.08 +) (+) Y [. 062+.003] / V4 \ 5.21 [.205] 2 Shield Holes @B wis eain 2.16 40.05 | Lag f [.085+.002] T1143 0.05 FR P1354 0021 Shielded 8 Position Jacks [.450+,.002] . . 5.08 +0.05 1.2740.05 Component Side of PC Board [.2004.002] [.050+. 002] 2.54+0.05 TYPICAL 2.54+0.05 [.100 +.002] position No.1 [. 100 +.002] 7 TYPICAL | g0.89+0.08 [.035+, 003] TYPICAL @ 1.5740.08 [. 062+.003] 2 Shield Holes 3.25+0.08-9.05 C.128+. 003 -.0021 2 Mounting Holes (See also Figure 5} ; 6.35+0.05 [. 250+, 002] Oo I _ 3.05240.605 ( C.1204.002] mw) 11-4340.05 bag [.450+.0021 Shielded 10 Position Jacks 2.03 40.08 C.0680+4.003)] Figure 4 (cont'd) Rev M Form 404-40 1/98 9of 14AMF Modular Jacks 114-2048 Component Side of PC Board e_ 107.95 +0.13914.50+.005] __> je 93.98 +0.13 09. 700+.005] pt 80.01 +0.1903.150+,.005] ws 66.40 +0.13 [(2.500+,005] - 8.89 +0,05[1,3504,002) we) 52.07 40.19 02.0502.0051 be CTetal Non-AccumuLlat! ved 38.1 +0.1301.500+.605]\8 ~~ je 1.27 +0.050.050 +.002] Typ 24.13 40.130.950+. 005] 10.15 0, 13 __ | [. 400+, G05] r (Typ? leaooo oo0o0 G006 Gooc|aoac of00 oooo loan 7 [ BONO F000 O00 O00 jocoo 2oe0 8008 GOOD 4.57 +0.13 W we 2.54 40.05 [.100+.002] Typ 0.89 +0.08(.035+.003] 2.54 0.05 [.1802.,0051 1o0+.d021 $ hPOSITION NO.1 <5 Mounting Hole (Ref) | 1 235 +0,05 J T f SA A f.250%. 002) 10.41#0.13 Shield Tab Hole (Ref) 8. 1281. 3201 Mees -410+4,005) . Ground Shield Tab Hole Plane (Ref) pa 2.79 +0,13 [.110+.605] 2) PLle Dim. A } M$ $$$ aaa 2m Ba 41.57 40.08 @3.25+0.98-0.05 C.662+4.09031 (Typical for all shield tabs } P 128+. 003 .002] Shield Tab Hole 2 or 3 Mounting Holes Per Chart (See also Figure 5) + 3,0540.19 @ C.120+.0051 Not Required 81.3 [3.20] Not Required 95.3 [3.75] 54.61 [2.15] 109.2 [4.30] Shield Tab Hole Locations for the Various Multi-Port Jack Assemblies MOUNTING HOLE LOCATIONS - | Oreants | DIMA | DMB ee 3.6820.13 @ [.145+4.005] 4,5740.13 @ 1 Not Required 11.4 [0.45] r | P+ TBO 40082 2 Not Required | 25.4[1.00] g 3 Not Required 39.4 [1.55] 4 Not Required 53.3 [2.10] Shield Tab Holes 5 Not Required 67.3 [2.65] c a ~ 0051 6 8 # Shield tab hole for assembles with a center ground tab solder tine located at the rear of the shield. @ Hole location varies among multi-port assemblies and is determined by the dimension from the center of boardlock or guide pin mounting legs to the center of the shield tab solder tine. Shielded & Position Multi-Port Jacks Figure 4 (end) 10 of 14 Rev M Form 404-33 1/98AMF Modular Jacks 114-2048 3.4. PC Board Contact Tine Holes Plated through holes must be used for contact solder tines and, when applicable, shield solder tines. The drilled hole size, plating types, and plating thickness are dependent on your application requirements. The finished hole size must be as stated to provide unrestricted insertion, proper retention in the pc board, and to ensure adequate application of solder to the tines. See Figure 5. Board Thickness 1.57 [.062] ok Diameter of Finished Hole After Plating 0.89 [.035] for Contact Solder Tines 1.58 [.062] for Shield Solder Tines Finished Annular Ring Pad (As Required) Trace Width (As Required) ett tts te y Ah Pe a eae Drilled Hole Diameter (As Required} Contact Solder Tine Hole PC Board CG U/}) lf Boardlock/Guide Pin Mounting Hole Drilled Hole Diameter (Use 3.25 [.128 (No. 303] Drill Bit. Do NOT Use 3.18 [.125 (1/8)] Drill Bit.) Figure 5 3.5. Alignment The modular jack shall be flush and evenly seated on the pc board. A hold-down may be used to hold the jack in place during the soldering process. 3.6. Shielding Shielded modular jacks feature tin/lead plated brass shells which provide continuity for EMG (Electromagnetic Compatibility) applications. When mated with corresponding shielded modular plugs, shielding and grounding continuity are achieved. When the shield solder tines are soldered to the pc board they provide electrical continuity to any ground path on the pc board and, where applicable, panel ground tabs on the shield provide electrical continuity to any ground path through the equipment panel. 3.7. Jack Placement The modular jacks should be handled only by the housing to avoid deformation, contamination, or other damage to CAUTION , : . : the coniact solder tines and, where applicable, shield solder tines. Determine which hole in the pc board is to receive the number one contact tine, then orient the jack so the number one solder tine is aligned with the hole. Start all solder tines into the board, then press on the top of the jack until it seats on the pc board. Rev M 11 of 14 Form 404-40 1/98AMP Modular Jacks 114-2048 3.8. Soldering A. Flux Selection Contact solder tines must be fluxed prior to soldering with a mildly active, rosin base flux. Selection of the flux will depend on the type of pc board and other components mounted on the board. Additionally, the flux must be compatible with the wave solder line, manufacturing, health, and safety requirements. Call the Product Information phone number at the bottom of page 1 for consideration of other types of flux. Some fluxes that are compatible with these modular jacks are provided in Figure 6. COMMERCIAL DESIGNATION FLUX TYPE ACTIVITY RESIDUE KESTERT ALPHA (le Activate d) Mild Noncorrosive 186 611 Tt Product of Kester Solder Co. B. Soldering Guidelines } Product of Alphameials Inc. Figure 6 Modular jacks can be soldered using wave or equivalent soldering techniques. We recommend using SN60 or SN62 solder for these connectors. The temperatures and exposure time shall be within the ranges specified in Figure 7. The unshielded, 6 position, lopeniry, feed through bridging jacks must have an un-terminated plug insialled to eliminate preload siress and prevent movement of the conlacis during the wave soldering process. SOLDERING TEMPERATURE TIME PROCESS CELSIUS FAHRENHEIT (At Max Temp) WAVE SOLDERING 26088 50088 5 Seconds 88 Wave Temperature Figure 7 C. Cleaning After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the solder and flux for recommended cleaning solvents. The following is a listing of common cleaning solvents that will not affect the modular jacks for the time and temperature specified. See Figure 8. CLEANER TEMPERATURES TIME (Maximum) (Minutes) NAME TYPE CELSIUS FAHRENHEIT Alpha 2710m Aqueous 1 132 270 Bioact EC-7@ Solvent 5 100 212 Butyl Carbitole Solvent 1 Room Ambient Isopropyl Alcohol Solvent 5 100 212 Kester 57788 Aqueous 5 100 212 Kester 57798 Aqueous 5 100 212 Loncoterge 520@ Aqueous 5 100 212 Loncoterge 530 Aqueous 5 100 212 Terpene Solvent Solvent 5 100 212 @ Product of Frys Metals, Inc. @ Product of Petroferm, Inc. @ Product of Union Carbide Corp. Figure 8 #3 Produci of Litton Systems, Inc. Cleaners must be free of dissolved flux and other contaminants. We recommend cleaning with the pc board on its edge. If using an aqueous cleaner, we recommend standard equipment such as a soaktank or an automatic in-line machine. 12 of 14 Rev M Form 404-33 1/98AMF Modular Jacks 114-2048 | DANGER | Consideration must be given to loxicily and other safely requirements recommended by the solvent manufacturer. Refer to the manufacturers Material Safety Data Sheet (MSDS) for characteristics and handling of cleaners. Trichioroethylene and Methylene Chioride can be used with no harmful affect to the connectors; however AMP does not recommend them because of the harmful occupational and environmental effects. Both are carcinogenic (cancer-causing) and Trichloroethylene is harmful to the earths ozone layer. Nena Ifyou have a particular solvent that is not listed, coniact the Tooling Assistance Center or Product Information number al the bottom of page 1. D. Drying When arying cleaned assemblies and printed circuit boards, make certain that temperature limitations are not exceeded: 40 to 70C [40 to 158F]. Excessive temperatures may cause housing degradation. 3.9. Checking Installed Jack The modular jack must be seated on the pc board within the dimensions shown in Figure 9. Typical Modular Jack Jack Must Be Flush Against PC Board to 0.13 [.005] Max 4 Boardlosk Contact Solder Tines (Ref) PC Board a Figure 9 3.10. Repair/Removal If the jack should become damaged, it must be replaced. It may be removed from the pc board by normal desoldering methods and replaced with a new jack. tie = hen repairing or replacing a modular jack, be careful not to damage other pc board components during the desoldering process. 4, QUALIFICATIONS AMP Modular Jacks are recognized by Underwriters Laboratories Inc. (UL) under File Number E81956 and certified by the Canadian Standards Association (CSA) under File Number LR7189. 5. TOOLING No special tooling is required for hand placement of modular jacks onto a pc board. However, a backup support that provides relief for protruding components is needed to prevent deformation of contact solder tines and, when applicable, shield solder tines. Rev M 13 of 14 Form 404-40 1/98AMF Modular Jacks 6. VISUAL AID 114-2048 These illustrations show typical installation applications of AMP Modular Jacks and should be used by production personnel to ensure a correctly applied product. Applications which DO NOT appear correct should be inspected using the information in the preceding pages of this specification. PANEL MUST BE AGAINST PANEL STOP SIDE-ENTRY JACK (REF) HOUSING MUST BE SEATED ON PC SHOULDER OF BOARDLOCK BOARD MUST BE THROUGH PC BOARD HOUSING MUST NOT BE CRACKED CONTACTS MUST NOT BE DEFORMED OR DAMAGED IN ANY WAY SOLDER FILLETS MUST BE EVENLY FORMED AROUND SOLDER TINES TOP-ENTRY JACK (REF) FIGURE 10. VISUAL AID 14 of 14 Rev M Form 404-33 1/98