Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
NTC Thermistors for automotive devices (chip type)
E
1
R
2
TJ0EG103FM
3 4 5 6 789 10 11 12
Common Code
ERT J
Product Code Type Code
NTC
Thermistors
Chip Type (SMD)
Multilayer Type
Size Code
“0402”
“0603”
0
1
Packaging
Style Code
E
V
±1%
±2%
±3%
±5%
F
G
H
J
Resistance Tolerance
Code
Nominal Resistance
R25 (Ω)
The first two digits
are significant figures
of resistance and the
third one denotes
the number of zeros
following them.
(Example)
B Value Class Code
2701 to 2800
3301 to 3400
3801 to 3900
4001 to 4100
4201 to 4300
4301 to 4400
4401 to 4500
4601 to 4700
A
G
M
P
R
S
T
VAutomotive
component
“0402”
Pressed Carrier
Taping
Punched Carrier
Taping
(Pitch : 2 mm)
“0603”
Punched Carrier
Taping
(Pitch : 4 mm)
Narrow
Tolerance
Type
Standard
Type
M
5
4
3
2
1
Multilayer NTC Thermistors
Series: ERTJ
Explanation of Part Numbers
Construction
Features
Recommended Applications
Surface Mount Device (0402, 0603)
Highly reliable multilayer / monolithic structure
Wide temperature operating range (–40 to 150 °C)
Environmentally-friendly lead-free
AEC-Q200 qualifi ed
RoHS compliant
For car audio system
For ECUs
For electric pumps and compressors
For LED lights
For batteries
For temperature detection of various circuits
No. Name
ASemiconductive Ceramics
BInternal electrode
CTerminal
electrode
Substrate electrode
DIntermediate electrode
EExternal electrode
Mar. 201702
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
NTC Thermistors for automotive devices (chip type)
Ratings
0402(EIA) 0603(EIA)
Temperature and Resistance value (the resistance value at 25 °C is set to 1)/ Reference values
1 Rated Maximum Power Dissipation : The maximum power that can be continuously applied at the rated ambient temperature.
· The maximum value of power, and rated power is same under the condition of ambient temperature 25 °C or less. If the temperature exceeds
25 °C, rated power depends on the decreased power dissipation curve.
· Please see “Operating Power” for details.
2
Dissipation factor : The constant amount power required to raise the temperature of the Thermistor 1 °C through self heat generation under stable temperatures.
· Dissipation factor is the reference value when mounted on a glass epoxy board (1.6 mmT).
: Resistance Tolerance Code (F : ±1%, G : ±2%, H : ±3%, J : ±5%)
: Resistance Tolerance Code (F : ±1%, G : ±2%, H : ±3%, J : ±5%)
Size code (EIA) 0(0402) 1(0603)
Operating Temperature Range
–40 to 150 °C
Rated Maximum Power Dissipation
166 mW 100 mW
Dissipation
Factor2
Approximately 2 mW/°C Approximately 3 mW/°C
R25=Resistance at 25.0±0.1 °C
R50=Resistance at 50.0±0.1 °C
R85=Resistance at 85.0±0.1 °C
B25/50=kn (R25/R50)
1/298.15–1/323.15 B25/85=kn (R25/R85)
1/298.15–1/358.15
Part Number List
ERTJ□□G~ ERTJ0EP~ ERTJ1VP~ ERTJ0ER~ ERTJ1VR~ ERTJ□□T~ ERTJ□□V~
B25/50 (3380 K) 4050 K 4100 K 4250 K 4200 K 4485 K 4700 K
B25/85 3435 K (4100 K) (4150 K) (4300 K) (4250 K) (4550 K) (4750 K)
T(°C)
-40 20.52 33.10 34.56 42.40 40.49 46.47 59.76
-35 15.48 24.03 24.99 29.96 28.81 32.92 41.10
-30 11.79 17.63 18.26 21.42 20.72 23.55 28.61
-25 9.069 13.06 13.48 15.50 15.07 17.00 20.14
-20 7.037 9.761 10.04 11.33 11.06 12.38 14.33
-15 5.507 7.362 7.546 8.370 8.198 9.091 10.31
-10 4.344 5.599 5.720 6.244 6.129 6.729 7.482
-5 3.453 4.291 4.369 4.699 4.622 5.019 5.481
0 2.764 3.312 3.362 3.565 3.515 3.772 4.050
5 2.227 2.574 2.604 2.725 2.694 2.854 3.015
10 1.806 2.013 2.030 2.098 2.080 2.173 2.262
15 1.474 1.584 1.593 1.627 1.618 1.666 1.710
20 1.211 1.255 1.258 1.271 1.267 1.286 1.303
251111111
30 0.8309 0.8016 0.7994 0.7923 0.7944 0.7829 0.7734
35 0.6941 0.6461 0.6426 0.6318 0.6350 0.6168 0.6023
40 0.5828 0.5235 0.5194 0.5069 0.5108 0.4888 0.4721
45 0.4916 0.4266 0.4222 0.4090 0.4132 0.3896 0.3723
50 0.4165 0.3496 0.3451 0.3320 0.3363 0.3123 0.2954
55 0.3543 0.2881 0.2837 0.2709 0.2752 0.2516 0.2356
60 0.3027 0.2386 0.2344 0.2222 0.2263 0.2037 0.1889
65 0.2595 0.1985 0.1946 0.1831 0.1871 0.1658 0.1523
70 0.2233 0.1659 0.1623 0.1516 0.1554 0.1357 0.1236
75 0.1929 0.1393 0.1359 0.1261 0.1297 0.1117 0.1009
80 0.1672 0.1174 0.1143 0.1054 0.1087 0.09236 0.08284
85 0.1451 0.09937 0.09658 0.08843 0.09153 0.07675 0.06834
90 0.1261 0.08442 0.08189 0.07457 0.07738 0.06404 0.05662
95 0.1097 0.07200 0.06969 0.06316 0.06567 0.05366 0.04712
100 0.09563 0.06166 0.05957 0.05371 0.05596 0.04518 0.03939
105 0.08357 0.05306 0.05117 0.04585 0.04786 0.03825 0.03308
110 0.07317 0.04587 0.04415 0.03929 0.04108 0.03255 0.02791
115 0.06421 0.03979 0.03823 0.03378 0.03539 0.02781 0.02364
120 0.05650 0.03460 0.03319 0.02913 0.03059 0.02382 0.02009
125 0.04986 0.03013 0.02886 0.02519 0.02652 0.02043 0.01712
Part Number
Nominal Resistance
at 25 °C
B Value
at 25/50(K)
B Value
at 25/85(K)
ERTJ0EG103M
10 kΩ
3380 K±1 % 3435 K±1 %
ERTJ0EP473M
47 kΩ
4050 K±1 % (4100 K)
ERTJ0ER104M
100 kΩ
4250 K±1 % (4300 K)
ERTJ0ET104M
100 kΩ
4485 K±1 % (4550 K)
ERTJ0EV104M
100 kΩ
4700 K±1 % (4750 K)
ERTJ0EV474M
470 kΩ
4700 K±1 % (4750 K)
Part Number
Nominal Resistance
at 25 °C
B Value
at 25/50(K)
B Value
at 25/85(K)
ERTJ1VG103M
10 kΩ
3380 K±1 % 3435 K±1 %
ERTJ1VP473M
47 kΩ
4100 K±1 % (4150 K)
ERTJ1VR104M
100 kΩ
4200 K±1 % (4250 K)
ERTJ1VV104M
100 kΩ
4700 K±1 % (4750 K)
ERTJ1VT224M
220 kΩ
4485 K±1 % (4550 K)
Mar. 201702
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
NTC Thermistors for automotive devices (chip type)
1.0
Test Sample
0.5R 0.5
Board
1.0
Test
Sample Unit : mm
20
45±2 45±2
Bending
distance
Unit : mm
R340
Item Specifi cation Test Method
Rated Zero-power
Resistance (R25)
Within the specifi ed tolerance.
The value is measured at a power that the infl uence
of self-heat generation can be negligible (0.1mW or
less), at the rated ambient temperature of 25.0±0.1°C.
B Value Shown in each Individual Specifi cation.
Individual Specifi cation shall specify B25/50 or
B25/85.
The Zero-power resistances; R1 and R2, shall be
measured respectively at T1 (deg.C) and T2 (deg.C).
The B value is calculated by the following equation.
BT1/T2=kn (R1)–kn (R2)
1/(T1+273.15)–1/(T2+273.15)
T1T2
B25/50 25.0 ±0.1 °C 50.0 ±0.1 °C
B25/85 25.0 ±0.1 °C 85.0 ±0.1 °C
Adhesion The terminal electrode shall be free from peeling
or signs of peeling.
Applied force :
Size 0402, 0603 : 5 N
Duration : 10 s
Size : 0402
Size : 0603
Bending Strength There shall be no cracks and other mechanical
damage.
R25 change : within ±5 %
Bending distance : 2 mm
Bending speed : 1 mm/s
Resistance to
Vibration
There shall be no cracks and other mechanical
damage.
R25 change : within ±2 %
B Value change : within ±1 %
Solder samples on a testing substrate, then
apply vibration to them.
Acceleration : 5 G
Vibrational frequency : 10 to 2000 Hz
Sweep time : 20 minutes
12 cycles in three directions,
which are perpendicular to each other
Resistance to
Impact
There shall be no cracks and other mechanical
damage.
R25 change : within ±2 %
B Value change : within ±1 %
Solder samples on a testing substrate, then apply
impacts to them.
Pulse waveform : Semisinusoidal wave, 11 ms
Impact acceleration : 50 G
Impact direction :
X-X', Y-Y', Z-Z' In 6 directions,
three times each
Speci cation and Test Method
Mar. 201702
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
NTC Thermistors for automotive devices (chip type)
Item Specifi cation Test Method
Resistance to
Soldering Heat
There shall be no cracks and other mechanical
damage.
R25 change : within ±2 %
B Value change : within ±1 %
Soldering bath method
Solder temperature : 260 ±5 °C, 270 ±5 °C
Dipping period : 3.0 ±0.5 s, 10.0 ±0.5 s
Preheat condition :
Step Temp (°C) Period (s)
1 80 to 100 120 to 180
2 150 to 200 120 to 180
Solderability More than 95 % of the soldered area of both
terminal electrodes shall be covered with fresh
solder.
Soldering bath method
Solder temperature : 230 ±5 °C
Dipping period : 4 ±1 s
Solder : Sn-3.0Ag-0.5Cu
Temperature
Cycling
R25 change : within ±2 %
B Value change : within ±1 %
Conditions of one cycle
Step 1 : –55±3 °C, 30±3 min.
Step 2 : Room temp., 3 min. max.
Step 3 : 125±5 °C, 30±3 min.
Step 4 : Room temp., 3 min. max.
Number of cycles: 2000 cycles
Humidity R25 change : within ±2 %
B Value change : within ±1 %
Temperature : 85 ±2 °C
Relative humidity : 85 ±5 %
Test period : 2000 +48/0 h
Biased Humidity R25 change : within ±2 %
B Value change : within ±1 %
Temperature : 85 ±2 °C
Relative humidity : 85 ±5 %
Applied power : 10 mW(D.C.)
Test period : 2000 +48/0 h
Low Temperature
Exposure
R25 change : within ±2 %
B Value change : within ±1 %
Temperature : –40 ±3 °C
Test period : 2000 +48/0 h
High Temperature
Exposure 1
R25 change : within ±2 %
B Value change : within ±1 %
Temperature : 125 ±3 °C
Test period : 2000 +48/0 h
High Temperature
Exposure 2
R25 change : within ±3 %
B Value change : within ±2 %
Temperature : 150 ±3 °C
Test period : 1000 +48/0 h
Speci cation and Test Method
Mar. 201702
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
NTC Thermistors for automotive devices (chip type)
L
T
W
L1L2
E
C
D
A
W2
W1
B
100 min.
Vacant position
Top cover tape
400 min.
160 min.
Vacant position
t2Chip component
Feeding hole Chip pocket
fD0
P1P2P0Tape running direction
EF
W
B
A
t1
t1
P1P2P0Tape running direction
t2Chip component
Feeding hole Chip pocket
fD0
A
B
F
W
E
Size Code (EIA) L W T L1, L2
0 (0402) 1.0±0.1 0.50±0.05 0.50±0.05 0.25±0.15
1 (0603) 1.60±0.15 0.8±0.1 0.8±0.1 0.3±0.2
Taped end
(Unit : mm)
Pitch 2 mm (Punched Carrier Taping) : Size 0402
Pitch 4 mm (Punched Carrier Taping) : Size 0603
Symbol
ABWFEP
1P2P0fD0t1t2
Dim.
(mm)
1.0
±0.1 1.8
±0.1 8.0
±0.2 3.50
±0.05
1.75
±0.10 4.0
±0.1 2.00
±0.05
4.0
±0.1
1.5+0.1
0
1.1
max. 1.4
max.
Symbol
ABWFEP
1P2P0fD0t1t2
Dim.
(mm)
0.62
±0.05
1.12
±0.05
8.0
±0.2 3.50
±0.05
1.75
±0.10 2.00
±0.05
2.00
±0.05
4.0
±0.1
1.5+0.1
0
0.7
max. 1.0
max.
(Unit : mm)
Symbol fA
fB
CDEW
1W2
Dim.
(mm) 180–3
60.0+1. 0
13.0±0.5
21.0±0.8 2.0±0.5
9.0+1. 0
11.4 ±1.0
0
00
Size
Code
Thickness
(mm) Kind of Taping Pitch
(mm)
Quantity
(pcs./reel)
0 (0402) 0.5
Punched Carrier Taping
2 10,000
1 (0603) 0.8 4 4,000
Dimensions in mm (not to scale)
Packaging Methods
Minimum Quantity / Packing Unit
Standard Packing Quantities Reel for Taping
Leader Part and Taped End
Leader part
Part Number
(Size) Minimum Quantity/ Packing
Unit
Packing Quantity
in Carton
Carton
L×W×H (mm)
ERTJ0 (0402) 10,000 200,000 250×200×200
ERTJ1 (0603) 4,000 80,000 250×200×200
Part No., quantity and country of origin are designated on outer packages in English.
Mar. 201702