M53D128168A-7.5BAG - Elite Semiconductor Memory Technology, Inc.

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 1/47

Control Logic

DM

DQ

Mode Register &

Extended Mode

Register

Column

Address

Buffer

&

Refresh

Counter

Row

Address

Buffer

&

Refresh

Counter

Row Decoder

Sense Amplifier

Column Decoder

Data Control Circuit

Input & Output

Buffer

Address

Clock

Generator

CLK

CKE

CS

RAS

CAS

WE

DQS

Mobile DDR SDRAM 2M x 16 Bit x 4 Banks

Mobile DDR SDRAM

Features

z JEDEC Standard

z Internal pipelined double-data-rate architecture, two data

access per clock cycle

z Bi-directional data strobe (DQS)

z No DLL; CLK to DQS is not synchronized.

z Differential clock inputs (CLK and CLK )

z Quad bank operation

z CAS Latency : 2, 3

z Burst Type : Sequential and Interleave

z Burst Length : 2, 4, 8

z Special function support

- PASR (Partial Array Self Refresh)

- Internal TCSR (Temperature Compensated Self

Refresh)

- DS (Driver Strength)

z All inputs except data & DM are sampled at the rising

edge of the system clock(CLK)

z Data I/O transitions on both edges of data strobe (DQS)

z DQS is edge-aligned with data for READ; center-aligned

with data for WRITE

z Data mask (DM) for write masking only

z VDD/VDDQ = 1.7V ~ 1.9V

z Auto & Self refresh

z 15.6us refresh interval (64ms refresh period, 4K cycle)

z 1.8V LVCMOS-compatible inputs

z 60 ball BGA package

Ordering information :

Part NO. MAX FREQ VDD PACKAGE COMMENTS

M53D128168A -7.5BG 133MHz Pb-free

M53D128168A -10BG 100MHz

8x10 mm

BGA Pb-free

M53D128168A -7.5BAG 133MHz Pb-free

M53D128168A -10BAG 100MHz

1.8V

8x13 mm

BGA Pb-free

Functional Block Diagram

Bank A

Command Decoder

Bank D

Latch Circuit

Bank B

Bank C

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 2/47

Pin Arrangement

60 Ball BGA (8x10mm) 60 Ball BGA (8x13mm)

TOP View TOP View

VSS

A

B

C

D

E

F

G

H

J

K

DQ15

DQ13

DQ11

DQ9

UDQS

UDM

CLK

A11

A7

A4

VSSQ

DQ14

DQ12

DQ10

NC

CLK

NC

A8

A5

VDD

VDDQ

DQ1

DQ3

DQ5

NC

WE

CS

A10/AP

A2

DQ0

LDQS

CAS

BA0

A3

123 789

VDDQ

VSSQ

VDDQ

VSSQ

A6

CKE

A9

VSS

DQ7

DQ2

DQ4

DQ6

LDM

A0

VSSQ

VDDQ

VSS

VDDQ

VDD

RAS

BA1

A1

VDD

DQ8

VSSQ

DQ14

DQ12

DQ10

DQ8

NC

A

B

C

D

E

F

G

H

J

K

L

M

DQ15

VDDQ

VSSQ

VDDQ

VSSQ

VSS

CLK

NC

A11

A8

A6

A4

VSS

DQ13

DQ11

DQ9

UDQS

UDM

CLK

CKE

A9

A7

A5

VSS

VDDQ

DQ1

DQ3

DQ5

DQ7

NC

VDD

DQ2

DQ4

DQ6

LDQS

LDM

WE

RAS

BA1

A0

A2

VDD

DQ0

VSSQ

VDDQ

VSSQ

VDDQ

VDD

CAS

CS

BA0

A10/AP

A1

A3

123 789

Pin Description

Pin Name Function Pin Name Function

A0~A11,

BA0,BA1

Address inputs

- Row address A0~A11

- Column address A0~A8

A10/AP : AUTO Precharge

BA0, BA1 : Bank selects (4 Banks)

LDM, UDM

DM is an input mask signal for write

data. LDM corresponds to the data

on DQ0~DQ7; UDM correspond to

the data on DQ8~DQ15.

DQ0~DQ15 Data-in/Data-out CLK, CLK Clock input

RAS Row address strobe CKE Clock enable

CAS Column address strobe CS Chip select

WE Write enable VDDQ Supply Voltage for DQ

VSS Ground VSSQ Ground for DQ

VDD Power NC No connection

LDQS, UDQS

Bi-directional Data Strobe. LDQS

corresponds to the data on DQ0~DQ7;

UDQS correspond to the data on

DQ8~DQ15.

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 3/47

Absolute Maximum Rating

Parameter Symbol Value Unit

Voltage on any pin relative to VSS V

IN, VOUT -0.5 ~ 2.7 V

Voltage on VDD supply relative to VSS V

DD -0.5 ~ 2.7 V

Voltage on VDDQ supply relative to VSS V

DDQ -0.5 ~ 2.7 V

Storage temperature TSTG -55 ~ +150 C°

Power dissipation PD 1.0 W

Short circuit current IOS 50 mA

Note : Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded.

Functional operation should be restricted to recommend operation condition.

Exposure to higher than recommended voltage for extended periods of time could affect device reliability.

DC Operation Condition & Specifications

DC Operation Condition

Recommended operating conditions (Voltage reference to VSS = 0V, TA = 0 to 70 C°)

Parameter Symbol Min Max Unit Note

Supply voltage VDD 1.7 1.9 V

I/O Supply voltage VDDQ 1.7 1.9 V

Input logic high voltage VIH (DC) 0.7 x VDDQ VDDQ + 0.3 V

Input logic low voltage VIL (DC) -0.3 0.3 x VDDQ V

Output logic high voltage VOH (DC) 0.9 x VDDQ - V IOH = -0.1mA

Output logic low voltage VOL (DC) - 0.1 x VDDQ V IOL = 0.1mA

Input Voltage Level, CLK and CLK inputs VIN (DC) -0.3 VDDQ + 0.3 V

Input Differential Voltage, CLK and CLK inputs VID (DC) 0.4 x VDDQ V

DDQ + 0.3 V 1

Input leakage current II -2 2

μA

Output leakage current IOZ -5 5

μA

Notes:

1. VID is the magnitude of the difference between the input level on CLK and the input level on CLK .

.

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 4/47

DC CHARACTERISTICS

Recommended operating condition unless otherwise noted，TA = 0 to 70 C°

Version

Parameter Symbol Test Condition -7.5 -10 Unit

Operating Current

(One Bank Active) ICC0

tRC= tRC (min), tCK = tCK (min), CKE = High,

/CS = High between valid commands, address

inputs are switching, data input signals are stable

60 50 mA

ICC2P All banks idle,

CKE = Low, /CS = High, tCK = tCK (min), address &

control inputs are switching, data input signals are

stable

0.5

mA

Precharge Standby

Current in power-down

mode ICC2PS All banks idle,

CKE = Low, /CS = High, tCK = Low,

/tCK (min) =High, address & control inputs are

switching, data input signals are stable

0.5 mA

ICC2N

All banks idle,

CKE = Low, /CS = High, tCK = tCK (min), address &

control inputs are switching, data input signals are

stable

28 22

mA

Precharge Standby

Current in non

power-down mode

ICC2NS

All banks idle,

CKE = Low, CS = High, tCK = Low,

/tCK (min) =High, address & control inputs are

switching, data input signals are stable

28 22

mA

ICC3P One bank active,

CKE = Low, CS = High, tCK = tCK (min), address &

control inputs are switching, data input signals are

stable

5

Active Standby Current

in power-down mode

ICC3PS One bank active,

CKE = Low, CS = High, tCK = Low,

/tCK (min) =High, address & control inputs are

switching, data input signals are stable

2

mA

ICC3N

One bank active,

CKE = Low, CS = High, tCK = tCK (min), address &

control inputs are switching, data input signals are

stable

45 35 mA

Active Standby Current

in non power-down

mode

(One Bank Active)

ICC3NS

One bank active,

CKE = Low, CS = High, tCK = Low,

/tCK (min) =High, address & control inputs are

switching, data input signals are stable

25 20 mA

ICC4R

One bank active,

BL=4, tCK = tCK (min), continuous read bursts,

IOUT = 0 mA, address inputs are switching, 50%

data changing each burst

90 75 mA

Operating Current

(Burst Mode)

ICC4W

One bank active,

BL=4, tCK = tCK (min), continuous write bursts,

IOUT = 0 mA, address inputs are switching, 50%

data changing each burst

90 75 mA

Refresh Current ICC5

Burst refresh,

tRC= tRC (min), tCK = tCK (min), CKE = High,

address inputs are switching, data input signals

are stable

75 60 mA

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 5/47

TCSR range 15 45 70 85 C°

4 Banks 340 360 380 400

2 Bank 290 310 320 350

Self Refresh Current ICC6 CKE = Low, CS = High,

tck = tck (min), address &

control & data inputs are

stable

1 Bank 240 260 280 300

uA

Deep Power Down

Current ICC7 address & control & data inputs are stable 10 uA

Note: 1. It has +/- 5 °C tolerance.

2. ICC specifications are tested after the device is properly intialized.

3. Definitions for ICC: LOW is defined as V IN ≤ 0.1 * V DDQ ;

HIGH is defined as V

IN ≥ 0.9 * V DDQ ;

STABLE is defined as inputs stable at a HIGH or LOW level ;

SWITCHING is defined as: - address and command: inputs changing between HIGH and LOW once

per two clock cycles ;

- data bus inputs: DQ changing between HIGH and LOW once per clock

cycle; DM and DQS are STABLE.

AC Operation Conditions & Timing Specification

AC Operation Conditions

Parameter Symbol Min Max Unit Note

Input High (Logic 1) Voltage, DQ, DQS and DM signals VIH(AC) 0.8 x VDDQ V

DDQ+0.3 V

Input Low (Logic 0) Voltage, DQ, DQS and DM signals VIL(AC) -0.3 0.2 x VDDQ V

Input Different Voltage, CLK and CLK inputs VID(AC) 0.6 x VDDQ V

DDQ+0.3 V 1

Input Crossing Point Voltage, CLK and CLK inputs VIX(AC) 0.4 x VDDQ 0.6 x VDDQ V 2

Note1. VID is the magnitude of the difference between the input level on CLK and the input on CLK .

2. The value of VIX is expected to equal 0.5*VDDQ of the transmitting device and must track variations in the DC level of the

same.

Input / Output Capacitance

(VDD = 1.8V, VDDQ =1.8V, TA = 25 C° , f = 1MHz)

Parameter Symbol Min Max Unit

Input capacitance

(A0~A11, BA0~BA1, CKE, CS , RAS , CAS , WE ) CIN1 1.5 3.0 pF

Input capacitance (CLK, CLK ) CIN2 1.5 3.5 pF

Data & DQS input/output capacitance COUT 2.0 4.5 pF

Input capacitance (DM) CIN3 2.0 4.5 pF

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 6/47

AC Operating Test Conditions (VDD = 1.7V~ 1.9V, TA = 0 C° to 70 C°)

(VDD = 1.8V, VDDQ =1.8V, TA = 25 C° , f = 1MHz)

Parameter Value Unit

Input signal minimum slew rate 1.0 V/ns

Input levels (VIH/VIL) 0.8 x VDDQ / 0.2 x VDDQ V

Input timing measurement reference level 0.5 x VDDQ V

Output timing measurement reference level 0.5 x VDDQ V

AC Timing Parameter & Specifications

(VDD = 1.7V~1.9V, VDDQ=1.7V~1.9V, TA =0 C° to 70 C°)

-7.5 -10

Parameter Symbol

min max min max

CL3 7.5 - 10 -

Clock Period

CL2

tCK

12 - 15 -

ns

Access time from CLK/ CLK tAC 2 7 2 9 ns

CLK high-level width tCH 0.45 0.55 0.45 0.55 tCK

CLK low-level width tCL 0.45 0.55 0.45 0.55 tCK

Data strobe edge to clock edge tDQSCK 2 7 2 9 ns

Clock to first rising edge of DQS delay tDQSS 0.75 1.25 0.75 1.25

tCK

Data-in and DM setup time (to DQS) tDS 0.75 - 1.1 -

ns

Data-in and DM hold time (to DQS) tDH 0.75 - 1.1 -

ns

DQ and DM input pulse width (for each

input) tDIPW tDS + tDH t

DS + tDH ns

Input setup time (fast slew rate) tIS 2.0 - 2.0 -

ns

Input hold time (fast slew rate) tIH 1.3 - 1.5 -

ns

Input setup time (slow slew rate) tIS 2.0 - 2.0 -

ns

Input hold time (slow slew rate) tIH 1.5 - 1.7 -

ns

Control and Address input pulse width tIPW 3.0 - 3.4 -

ns

DQS input high pulse width tDQSH 0.4 0.6 0.4 0.6

tCK

DQS input low pulse width tDQSL 0.4 0.6 0.4 0.6

tCK

DQS falling edge to CLK rising-setup

time tDSS 0.2 - 0.2 -

tCK

DQS falling edge from CLK rising-hold

time tDSH 0.2 - 0.2 -

tCK

Data strobe edge to output data edge tDQSQ - 0.6 - 0.7 ns

Data-out high-impedance window from

CLK/ CLK tHZ - 6.0 - 7.0 ns

Data-out low-impedance window from

CLK/ CLK tLZ 1.0 - 1.0 - ns

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 7/47

AC Timing Parameter & Specifications-continued

-7.5 -10

Parameter Symbol

min max min max

Half Clock Period tHP tCLmin or tCHmin - tCLmin or tCHmin - ns

DQ-DQS output hold time tQH tHPmin-tQHS - tHPmin-tQHS - ns

Data hold skew factor tQHS - 0.75 - 1.0 ns

ACTIVE to PRECHARGE

command tRAS 45 70K 50 70K ns

Row Cycle Time tRC 67.5 - 80 - ns

AUTO REFRESH Row Cycle

Time tRFC 80 - 90 - ns

ACTIVE to READ,WRITE

delay tRCD 22.5 - 30 - ns

PRECHARGE command

period tRP 22.5 - 30 - ns

Minimum tCKE High/Low time tCKE 2 2 tCK

ACTIVE bank A to ACTIVE

bank B command tRRD 15 - 15 - ns

Write recovery time tWR 15 - 15 - tCK

Write data in to READ

command delay tWTR 1 - 1 - tCK

Col. Address to Col. Address

delay tCCD 1 - 1 - tCK

Average periodic refresh

interval tREFI - 15.6 - 15.6 us

Write preamble tWPRE 0.25 - 0.25 - tCK

Write postamble tWPST 0.4 0.6 0.4 0.6 tCK

DQS read preamble tRPRE 0.9 1.1 0.9 1.1 tCK

DQS read postamble tRPST 0.4 0.6 0.4 0.6 tCK

Clock to DQS write preamble

setup time tWPRES 0 - 0 - ns

Load Mode Register /

Extended Mode register

cycle time

tMRD 2 - 2 - tCK

Exit self refresh to first valid

command tXSR 120 - 120 - ns

Exit power-down mode to

first valid command tXP 25 - 25 - ns

Autoprecharge write

recovery+Precharge time tDAL

(tWR/tCK)

+

(tRP/tCK)

-

(tWR/tCK)

+

(tRP/tCK)

- ns

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 8/47

Command Truth Table

COMMAND CKEn-1 CKEn CS RAS CAS WE DM BA0,1 A10/AP A11,

A9~A0 Note

Register Extended MRS H X L L L L X OP CODE 1,2

Register Mode Register Set H X L L L L X OP CODE 1,2

Auto Refresh H 3

Entry

H

L

L L L H X X 3

L H H H 3

Refresh Self

Refresh Exit L H

H X X X

XX 3

Bank Active & Row Addr. H X L L H H X V Row Address

Auto Precharge Disable L 4

Read &

Column

Address Auto Precharge Enable

H X L H L H X V

H

Column

Address 4

Auto Precharge Disable L 4

Write &

Column

Address Auto Precharge Enable

H X L H L L X V

H

Column

Address 4,6

Entry H L L H H L X

Deep Power

Down Exit L H H X X X X

X

Burst Stop H X L H H L X X 7

Bank Selection V L

Precharge All Banks H X L L H L X X H

X

5

H X X X

Entry H L

L V V V

X

Active Power Down

Exit L H X X X X X

X

H X X X

Entry H L

L H H H

X

H X X X

Precharge Power Down

Mode

Exit L H

L V V V

X

DM H X V X 8

H X X X

No Operation Command H X L H H H

XX

(V = Valid, X = Don’t Care, H = Logic High, L = Logic Low)

1. OP Code: Operand Code. A0~A11 & BA0~BA1 : Program keys. (@EMRS/MRS)

2. EMRS/MRS can be issued only at all banks precharge state.

A new command can be issued 2 clock cycles after EMRS or MRS.

3. Auto refresh functions are same as the CBR refresh of DRAM.

The automatical precharge without row precharge command is meant by “Auto”..

Auto/self refresh can be issued only at all banks precharge state.

4. BA0~BA1 : Bank select addresses.

If both BA0 and BA1 are “Low” at read, write, row active and precharge, bank A is selected.

If BA0 is “High” and BA1 is “Low” at read, write, row active and precharge, bank B is selected.

If BA0 is “Low” and BA1 is “High” at read, write, row active and precharge, bank C is selected.

If both BA0 and BA1 are “High” at read, write, row active and precharge, bank D is selected.

5. If A10/AP is “High” at row precharge, BA0 and BA1 are ignored and all banks are selected.

6. During burst write with auto precharge, new read/write command can not be issued.

Another bank read/write command can be issued after the end of burst.

New row active of the associated bank can be issued at tRP after end of burst.

7. Burst stop command is valid at every burst length.

8. DM sampling at the rising and falling edges of the DQS and Data-in are masked at the both edges (Write DM latency is 0).

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 9/47

Basic Functionality

Power-Up and Initialization Sequence

The following sequence is required for POWER UP and Initialization.

1. Apply power and attempt to maintain CKE at a low state (all other inputs may be undefined.)

- Apply VDD before or at the same time as VDDQ.

2. Start clock and maintain stable condition for a minimum.

3. The minimum of 200us after stable power and clock (CLK, CLK ),apply NOP & take CKE high.

4. Issue precharge commands for all banks of the device.

5. Issue 2 or more auto-refresh commands.

6. Issue mode register set command to initialize the mode register.

7. Issue extended mode register set command to set PASR and DS.

0123456789

CLOCK

CKE

CS

RAS

CAS

ADDR

WE

DQ

DQM

A10/AP

t

RP

Key Key

BA1

BA0

High-Z

Precharge

(All Banks)

Auto Refresh Auto Refresh Mode Register Set

Extended Mode

Register Set

:Don'tcare

t

RFC

t

RFC

High level is necessary

10 11 12 13 14 15 16 17 18 19 20

RA

BS

RA

Row Active

t

MRD

t

MRD

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 10/47

Mode Register Definition

Mode Register Set (MRS)

The mode register stores the data for controlling the various operating modes of Mobile DDR SDRAM. It programs CAS

latency, addressing mode, burst length and various vendor specific options to make Mobile DDR SDRAM useful for variety of

different applications. The default value of the register is not defined, therefore the mode register must be written in the power up

sequence of Mobile DDR SDRAM. The mode register is written by asserting low on CS , RAS , CAS , WE and BA0 (The

Mobile DDR SDRAM should be in all bank precharge with CKE already high prior to writing into the mode register). The state of

address pins A0~A11 in the same cycle as CS , RAS , CAS , WE and BA0 going low is written in the mode register. Two clock

cycles are requested to complete the write operation in the mode register. The mode register contents can be changed using the

same command and clock cycle requirements during operation as long as all banks are in the idle state. The mode register is

divided into various fields depending on functionality. The burst length uses A0~A2, addressing mode uses A3, CAS latency (read

latency from column address) uses A4~A6. A7~A11 is used for test mode. A7~A11 must be set to low for normal MRS operation.

Refer to the table for specific codes for various burst length, addressing modes and CAS latencies.

BA1 BA0 A11~ A7 A6 A5 A4 A3 A2 A1 A0 Address Bus

0 0 RFU* CAS Latency BT Burst Length Mode Register

A3Burst Type

0 Sequential

1 Interleave

Burst Length

CAS Latency Latency

A6 A5 A4 Latency

A2 A1 A0

Sequential Interleave

BA1 BA0 Operating Mode 0 0 0 Reserve 0 0 0 Reserve Reserve

0 0 MRS Cycle 0 0 1 Reserve 0 0 1 2 2

1 0 EMRS Cycle 0 1 0 2 0 1 0 4 4

0 1 1 3 0 1 1 8 8

1 0 0 Reserve 1 0 0 Reserve Reserve

1 0 1 Reserve 1 0 1 Reserve Reserve

1 1 0 Reserve 1 1 0 Reserve Reserve

1 1 1 Reserve 1 1 1 Reserve Reserve

* RFU should stay “0” during MRS cycle

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 11/47

Burst Address Ordering for Burst Length

Burst

Length

Starting

Address (A2, A1,A0) Sequential Mode Interleave Mode

xx0 0, 1 0, 1

2 xx1 1, 0 1, 0

x00 0, 1, 2, 3 0, 1, 2, 3

x01 1, 2, 3, 0 1, 0, 3, 2

x10 2, 3, 0, 1 2, 3, 0, 1

4

x11 3, 0, 1, 2 3, 2, 1, 0

000 0, 1, 2, 3, 4, 5, 6, 7 0, 1, 2, 3, 4, 5, 6, 7

001 1, 2, 3, 4, 5, 6, 7, 0 1, 0, 3, 2, 5, 4, 7, 6

010 2, 3, 4, 5, 6, 7, 0, 1 2, 3, 0, 1, 6, 7, 4, 5

011 3, 4, 5, 6, 7, 0, 1, 2 3, 2, 1, 0, 7, 6, 5, 4

100 4, 5, 6, 7, 0, 1, 2, 3 4, 5, 6, 7, 0, 1, 2, 3

101 5, 6, 7, 0, 1, 2, 3, 4 5, 4, 7, 6, 1, 0, 3, 2

110 6, 7, 0, 1, 2, 3, 4, 5 6, 7, 4, 5, 2, 3, 0, 1

8

111 7, 0, 1, 2, 3, 4, 5, 6 7, 6, 5, 4, 3, 2, 1, 0

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 12/47

Extended Mode Register Set (EMRS)

The extended mode register stores for selecting PASR and DS. The extended mode register set must be done before any active

command after the power up sequence. The extended mode register is written by asserting low on CS , RAS , CAS , WE and

high on BA1,low on BA0(The Mobile DDR SDRAM should be in all bank precharge with CKE already high prior to writing into the

extended more register). The state of address pins A0~An in the same cycle as CS , RAS , CAS , WE going low is written in

the extended mode register. Refer to the table for specific codes.

The extended mode register can be changed by using the same command and clock cycle requirements during operations as long

as all banks are in the idle state. The default value extended mode register is defined as half driving strength and all banks

refreshed.

Internal Temperature Compensated Self Refresh (TCSR)

1. In order to save power consumption, Mobile DDR SDRAM includes the internal temperature sensor and control units to control

the self refresh cycle automatically according to the three temperature range : 15°C, 45°C, 70°C and 85°C.

2. If the EMRS for external TCSR is issued by the controller, this EMRS code for TCSR is ignored.

3. It has +/-5°C tolerance

BA1 BA0 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 Address bus

1 0 0 0 0 0 0 DS RFU* PASR Extended Mode Register Set

A2-A0 Self Refresh Coverage

000 4Bank

001 2 Bank

(BankA& BankB) or (BA1=0)

010 1 Bank

(BankA) or (BA0=BA1=0)

011 R

100 R

101 R

PASR

111 R

Internal TCSR

A6-A5 Driver Strength

00 Full Strength

01 1/2 Strength

10 1/4 Strength

DS

11 R

Remark R : Reserved

* RFU should stay “0” during EMRS cycle

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 13/47

Precharge

The precharge command is used to precharge or close a bank that has activated. The precharge command is issued when CS ,

RAS and WE are low and CAS is high at the rising edge of the clock. The precharge command can be used to precharge

each bank respectively or all banks simultaneously. The bank select addresses (BA0, BA1) are used to define which bank is

precharged when the command is initiated. For write cycle, tWR(min.) must be satisfied until the precharge command can be issued.

After tRP from the precharge, an active command to the same bank can be initiated.

Burst Selection for Precharge by Bank address bits

A10/AP BA1 BA0 Precharge

0 0 0 Bank A Only

0 0 1 Bank B Only

0 1 0 Bank C Only

0 1 1 Bank D Only

1 X X All Banks

NOP & Device Deselect

The device should be deselected by deactivating the CS signal. In this mode, Mobile DDR SDRAM should ignore all the

control inputs. The Mobile DDR SDRAM is put in NOP mode when CS is actived and by deactivating RAS , CAS and WE .

For both Deselect and NOP, the device should finish the current operation when this command is issued.

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 14/47

Row Active

The Bank Activation command is issued by holding CAS and WE high with CS and RAS low at the rising edge of the

clock (CLK). The Mobile DDR SDRAM has four independent banks, so two Bank Select addresses (BA0, BA1) are required. The

Bank Activation command to the first read or write command must meet or exceed the minimum of RAS to CAS delay time

(tRCD min). Once a bank has been activated, it must be precharged before another Bank Activation command can be applied to the

same bank. The minimum time interval between interleaved Bank Activation command (Bank A to Bank B and vice versa) is the

Bank to Bank delay time (tRRD min).

Bank Activation Command Cycle ( CAS Latency = 3)

Address

01 23 456

Command

Bank A

Row Addr.

Bank A

Row. Addr.

Bank B

Row Addr.

Bank A

Activate NOP Bank B

Activate NOP Bank A

Activate

RAS-CAS delay (

t

RCD

)RAS-RAS delay (

t

RRD

)

ROW Cycle Time (

t

RC

)

:Don'tCare

CLK

Bank A

Col. Addr.

Write A

with Auto

Precharge

NOP

Read Bank

This command is used after the row activate command to initiate the burst read of data. The read command is initiated by

activating CS , CAS , and deasserting WE at the same clock sampling (rising) edge as described in the command truth table.

The length of the burst and the CAS latency time will be determined by the values programmed during the MRS command.

Write Bank

This command is used after the row activate command to initiate the burst write of data. The write command is initiated by

activating CS , CAS , and WE at the same clock sampling (rising) edge as describe in the command truth table. The length of

the burst will be determined by the values programmed during the MRS command.

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 15/47

Essential Functionality for Mobile DDR SDRAM

Burst Read Operation

Burst Read operation in Mobile DDR SDRAM is in the same manner as the current Mobile DDR SDRAM such that the Burst

read command is issued by asserting CS and CAS low while holding RAS and WE high at the rising edge of the clock (CLK)

after tRCD from the bank activation. The address inputs determine the starting address for the Burst, The Mode Register sets type of

burst (Sequential or interleave) and burst length (2, 4, 8). The first output data is available after the CAS Latency from the READ

command, and the consecutive data are presented on the falling and rising edge of Data Strobe (DQS) adopted by Mobile DDR

SDRAM until the burst length is completed.

01 234 5678

COMMAND READ A NOP NOP NOP NOP NOP NOP NOP NOP

CLK

CAS Latency=3

DQS

DQ's

Dout0 Dout1 Dout2 Dout3

tRPRE

tDQSCK

tRPST

tAC

Burst Write Operation

The Burst Write command is issued by having CS , CAS and WE low while holding RAS high at the rising edge of the

clock (CLK). The address inputs determine the starting column address. There is no write latency relative to DQS required for burst

write cycle. The first data of a burst write cycle must be applied on the DQ pins tDS (Data-in setup time) prior to data strobe edge

enabled after tDQSS from the rising edge of the clock (CLK) that the write command is issued. The remaining data inputs must be

supplied on each subsequent falling and rising edge of Data Strobe until the burst length is completed. When the burst has been

finished, any additional data supplied to the DQ pins will be ignored.

01 234 5678

COMMAND

DQS

DQ's

WRITEA NOP NOP NOP NOP NOP NOP

t

DQSS(

max)

t

WR

Din0 Din1 Din2 Din3

t

WPRES

CLK

t

WPREH

NOP

Din0 Din1 Din2 Din3

DQS

DQ's

t

DQSS(

min)

Din0 Din1 Din2 Din3

t

WPRES

t

WPREH

Din0 Din1 Din2 Din3

t

WR

t

DS

t

DH

WRITEB

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 16/47

Read Interrupted by a Read

A Burst Read can be interrupted before completion of the burst by new Read command of any bank. When the previous burst is

interrupted, the remaining addresses are overridden by the new address with the full burst length. The data from the first Read

command continues to appear on the outputs until the CAS latency from the interrupting Read command is satisfied. At this point

the data from the interrupting Read command appears. Read to Read interval is minimum 1 Clock.

01 234 5678

COMMAND

DQS

DQ's

READ A NOP NOP NOP NOP NOP NOP NOP

Dout A

0

READ B

Dout A

1

Dout B

2

Dout B

3

Dout B

0

Dout B

1

CLK

t

CCD(min)

t

RPRE

t

DQSCK

Hi-Z

t

RPST

Read Interrupted by a Write & Burst Stop

To interrupt a burst read with a write command, Burst Stop command must be asserted to avoid data contention on the I/O bus

by placing the DQ’s(Output drivers) in a high impedance state. To insure the DQ’s are tri-stated one cycle before the beginning the

write operation, Burt stop command must be applied at least RU(CL) clocks ［RU means round up to the nearest integer］ before

the Write command.

01 234 5678

COMMAND

DQS

DQ's

READ NOP NOP NOP NOP NOP

Dout 0

Burst Stop

Din 0

Dout 1

Din 1 Din 2 Din 3

CLK

NOP WRITE

t

DQSCK

t

RPRE

t

RPST

t

AC

t

WPRE

t

WPRES

t

WPREH

t

DQSS

t

WPST

The following functionality establishes how a Write command may interrupt a Read burst.

1. For Write commands interrupting a Read burst, a Burst Terminate command is required to stop the read burst and tristate the

DQ bus prior to valid input write data. Once the Burst Terminate command has been issued, the minimum delay to a Write

command = RU(CL) [CL is the CAS Latency and RU means round up to the nearest integer].

2. It is illegal for a Write command to interrupt a Read with autoprecharge command.

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 17/47

Read Interrupted by a Precharge

A Burst Read operation can be interrupted by precharge of the same bank. The minimum 1 clock is required for the read to

precharge intervals. A precharge command to output disable latency is equivalent to the CAS latency.

01 234 5678

COMMAND

DQS

DQ's

READ NOP NOP NOP NOP NOP NOP

Dout 0

Precharge

Dout 1

1t

CK

NOP

Interrupted by precharge

CLK

Dout 2 Dout 3 Dout 4 Dout 5 Dout 6 Dout 7

t

RPRE

t

DQSCK

t

AC

When a burst Read command is issued to a Mobile DDR SDRAM, a Precharge command may be issued to the same bank

before the Read burst is complete. The following functionality determines when a Precharge command may be given during a

Read burst and when a new Bank Activate command may be issued to the same bank.

1. For the earliest possible Precharge command without interrupting a Read burst, the Precharge command may be given on the

rising clock edge which is CL clock cycles before the end of the Read burst where CL is the CAS Latency. A new Bank

Activate command may be issued to the same bank after tRP (RAS precharge time).

2. When a Precharge command interrupts a Read burst operation, the Precharge command may be given on the rising clock edge

which is CL clock cycles before the last data from the interrupted Read burst where CL is the CAS Latency. Once the last

data word has been output, the output buffers are tristated. A new Bank Activate command may be issued to the same bank

after tRP.

3. For a Read with autoprecharge command, a new Bank Activate command may be issued to the same bank after tRP where tRP

begins on the rising clock edge which is CL clock cycles before the end of the Read burst where CL is the CAS Latency.

During Read with autoprecharge, the initiation of the internal precharge occurs at the same time as the earliest possible

external Precharge command would initiate a precharge operation without interrupting the Read burst as described in 1 above.

4. For all cases above, tRP is an analog delay that needs to be converted into clock cycles. The number of clock cycles between a

Precharge command and a new Bank Activate command to the same bank equals tRP / tCK (where tCK is the clock cycle time)

with the result rounded up to the nearest integer number of clock cycles.

In all cases, a Precharge operation cannot be initiated unless tRAS(min) [minimum Bank Activate to Precharge time] has been

satisfied. This includes Read with autoprecharge commands where tRAS(min) must still be satisfied such that a Read with

autoprecharge command has the same timing as a Read command followed by the earliest possible Precharge command which

does not interrupt the burst.

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 18/47

Write Interrupted by a Write

A Burst Write can be interrupted before completion of the burst by a new Write command, with the only restriction that the

interval that separates the commands must be at least one clock cycle. When the previous burst is interrupted, the remaining

addresses are overridden by the new address and data will be written into the device until the programmed burst length is satisfied.

01 234 5678

COMMAND

DQS

DQ's

NOP NO P NOP NO P NOP NOP

Din A0

WRITE A

Din A1Di n B0Din B1Di n B2Din B3

1tCK

NOP WRITE B

CLK

tCCD

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 19/47

Write Interrupted by a Read & DM

A burst write can be interrupted by a read command of any bank. The DQ’s must be in the high impedance state at least one

clock cycle before the interrupting read data appear on the outputs to avoid data contention. When the read command is registered,

any residual data from the burst write cycle must be masked by DM. The delay from the last data to read command (tWTR) is

required to avoid the data contention Mobile DDR SDRAM inside. Data that are presented on the DQ pins before the read

command is initiated will actually be written to the memory. Read command interrupting write can not be issued at the next clock

edge of that of write command.

01 234 5678

COMMAND

DQS

DQ's

DQS

DQ's

NOP NOP NOP NOP READ NOP

t

DQSS(max

)

Dina0 Dina1

WRITE

Dina2 Dina3 Dina4 Dina5 Dina6 Dina7

t

DQSS(min)

DM

Dout0

Dina0 Dina1 Dina2 Dina3 Dina4 Dina5 Dina6 Dina7

CLK

DM

NOP NOP

Hi-Z

t

WPRES

t

CDLR

5)

Hi-Z

t

CDLR

t

WPRES

5)

Dout1

Dout0 Dout1

The following functionality established how a Read command may interrupt a Write burst and which input data is not written into

the memory.

1. For Read commands interrupting a Write burst, the minimum Write to Read command delay is 2 clock cycles. The case where

the Write to Read delay is 1 clock cycle is disallowed.

2. For read commands interrupting a Write burst, the DM pin must be used to mask the input data words which immediately

precede the interrupting Read operation and the input data word which immediately follows the interrupting Read operation.

3. For all cases of a Read interrupting a Write, the DQ and DQS buses must be released by the driving chip (i.e., the memory

controller) in time to allow the buses to turn around before the Mobile DDR SDRAM drives them during a read operation.

4. If input Write data is masked by the Read command, the DQS inputs are ignored by the Mobile DDR SDRAM.

5. It is illegal for a Read command interrupt a Write with autoprecharge command.

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 20/47

Write Interrupted by a Precharge & DM

A burst write operation can be interrupted before completion of the burst by a precharge of the same bank. Random column

access is allowed. A write recovery time (tWR) is required from the last data to precharge command. When precharge command is

asserted, any residual data from the burst write cycle must be masked by DM.

01 234 5678

COMMAND

DQS

DQ's

DQS

DQ's

NOP NOP NOP NOP NOP

t

DQSS(max

)

Dina0 Dina1

WRITE A

Dina2 Dina3

t

DQSS(min)

DM

Dinb0

Dina0 Dina1 Dina2 Dina3 Dina4 Dina5 Dina6 Dina7 Dinb0 Dinb1

CLK

DM

PrechargeA

Hi-Z

t

WPRES

t

WR

Hi-Z

t

WR

NOP WRITE B

t

WPREH

t

DQSS(max

)

t

WPRES

t

WPREH

t

DQSS(min)

t

WPRES

t

WPREH

t

WPRES

t

WPREH

Precharge timing for Write operations in Mobile DDR SDRAM requires enough time to allow “Write recovery” which is the time

required by a Mobile DDR SDRAM core to properly store a full “0” or “1” level before a Precharge operation. For Mobile DDR

SDRAM, a timing parameter, tWR, is used to indicate the required of time between the last valid write operation and a Precharge

command to the same bank.

The precharge timing for writes is a complex definition since the write data is sampled by the data strobe and the address is

sampled by the input clock. Inside the Mobile DDR SDRAM, the data path is eventually synchronizes with the address path by

switching clock domains from the data strobe clock domain to the input clock domain.

This makes the definition of when a precharge operation can be initiated after a write very complex since the write recovery

parameter must reference only the clock domain that is used to time the internal write operation i.e., the input clock domain.

tWR starts on the rising clock edge after the last possible DQS edge that strobed in the last valid and ends on the rising clock

edge that strobes in the precharge command.

1. For the earliest possible Precharge command following a Write burst without interrupting the burst, the minimum time for write

recovery is defined by tWR.

2. When a precharge command interrupts a Write burst operation, the data mask pin, DM, is used to mask input data during the

time between the last valid write data and the rising clock edge in which the Precharge command is given. During this time, the

DQS input is still required to strobe in the state of DM. The minimum time for write recovery is defined by tWR.

3. For a Write with autoprecharge command, a new Bank Activate command may be issued to the same bank after tWR + tRP where

tWR + tRP starts on the falling DQS edge that strobed in the last valid data and ends on the rising clock edge that strobes in the

Bank Activate commands. During write with autoprecharge, the initiation of the internal precharge occurs at the same time as

the earliest possible external Precharge command without interrupting the Write burst as described in 1 above.

4. In all cases, a Precharge operation cannot be initiated unless tRAS(min) [minimum Bank Activate to Precharge time] has been

satisfied. This includes Write with autoprecharge commands where tRAS(min) must still be satisfied such that a Write with

autoprecharge command has the same timing as a Write command followed by the earliest possible Precharge command

which does not interrupt the burst.

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 21/47

Burst Stop

The burst stop command is initiated by having RAS and CAS high with CS and WE low at the rising edge of the clock

(CLK). The burst stop command has the fewest restriction making it the easiest method to use when terminating a burst read

operation before it has been completed. When the burst stop command is issued during a burst read cycle, the pair of data and

DQS (Data Strobe) go to a high impedance state after a delay which is equal to the CAS latency set in the mode register. The burst

stop command, however, is not supported during a write burst operation.

01 234 5678

COMMAND READ A NOP NOP NOP NOP NOP NOP NOP

Burst Stop

CLK

DQS

DQ's

Dout 0 Dout 1

Hi-Z

The burst read ends after a deley equal to the CAS lantency.

The Burst Stop command is a mandatory feature for Mobile DDR SDRAM. The following functionality is required.

1. The BST command may only be issued on the rising edge of the input clock, CLK.

2. BST is only a valid command during Read burst.

3. BST during a Write burst is undefined and shall not be used.

4. BST applies to all burst lengths.

5. BST is an undefined command during Read with autoprecharge and shall not be used.

6. When terminating a burst Read command, the BST command must be issued LBST ( “BST Latency”) clock cycles before the

clock edge at which the output buffers are tristated, where LBST equals the CAS latency for read operations.

7. When the burst terminates, the DQ and DQS pins are tristated.

The BST command is not byte controllable and applies to all bits in the DQ data word and the (all) DQS pin(s).

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 22/47

DM masking

The Mobile DDR SDRAM has a data mask function that can be used in conjunction with data write cycle. Not read cycle. When

the data mask is activated (DM high) during write operation, Mobile DDR SDRAM does not accept the corresponding data. (DM to

data-mask latency is zero) DM must be issued at the rising or falling edge of data strobe.

01 234 5678

COMMAND WRITE NOP NOP NOP NOP NOP NOP NOP

CLK

NOP

DQS

DQ's

tDQSS

DM

Dina0 Dina1 Dina2 Dina3 Dina4 Dina5 Dina6 Dina7

tWPRES tWPREH

Hi-Z

mas

k

ed b

y

D

M

=H

Read With Auto Precharge

If a read with auto-precharge command is initiated, the Mobile DDR SDRAM automatically enters the precharge operation BL/2

clock later from a read with auto-precharge command when tRAS(min) is satisfied. If not, the start point of precharge operation will

be delayed until tRAS(min) is satisfied. Once the precharge operation has started the bank cannot be reactivated and the new

command can not be asserted until the precharge time (tRP) has been satisfied

01 234 5678

COMMAND

Bank A

ACTIVE

NOP NOP NOP NOP NOP NOP NOP

Read A

Aut o P rec harge

CLK

DQS

DQ's

Dout 0 Dout 1 Dout 2 Dout 3

t

RP

910

NOP NOP

Bank can be reactivated at

completion of tRP 1)

Auto-Precharge starts

Hi-Z

Note : At burst read / write with auto precharge, CAS interrupt of the same bank is illegal.

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 23/47

Write with Auto Precharge

If A10 is high when write command is issued, the write with auto-precharge function is performed. Any new command to the

same bank should not be issued until the internal precharge is completed. The internal precharge begins after keeping tWR(min).

01 234 5678

COMMAND

DQS

DQ's

Bank A

ACTIVE NOP NOP NOP NOP NOP NOP NOP

D

IN

0D

IN

1

Write A

Auto Precharge

D

IN

2D

IN

3

*Bank can be reactivated at

completion of t

RP

t

WR

t

RP

Internal precharge start

CLK

Auto Refresh & Self Refresh

Auto Refresh

An auto refresh command is issued by having CS , RAS and CAS held low with CKE and WE high at the rising edge of

the clock(CLK). All banks must be precharged and idle for tRP(min) before the auto refresh command is applied. No control of the

external address pins is requires once this cycle has started because of the internal address counter. When the refresh cycle has

completed, all banks will be in the idle state. A delay between the auto refresh command and the next activate command or

subsequent auto refresh command must be greater than or equal to the tRFC(min).

A maximum of eight consecutive AUTO REFRSH commands (with tRFCmin) can be posted to any given Mobile DDR SDRAM,

and the maximum absolute interval between any AUTO REFRESH command and the next AUTO REFRESH command is 8x15.6

μm.

COMMAND

CKE = High

t

RP

PRE

Auto

Refresh

CMD

t

RFC

CLK

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 24/47

Self Refresh

A self refresh command is defines by having CS , RAS , CAS and CKE held low with WE high at the rising edge of the

clock (CLK). Once the self refresh command is initiated, CKE must be held low to keep the device in self refresh mode. During the

self refresh operation, all inputs except CKE are ignored. The clock is internally disabled during self refresh operation to reduce

power consumption. The self refresh is exited by supplying stable clock input before returning CKE high, asserting deselect or NOP

command and then asserting CKE high for longer than tXSRD for locking of DLL.

COMMAND

CKE

t

XSR(min)

Self

Refresh

Active NOP

t

IS

CLK

NOP NOP NOP NOP NOP

t

IS

Power Down

The device enters power down mode when CKE Low, and it exits when CKE High. Once the power down mode is initiated, all of

the receiver circuits except CLK and CKE are gated off to reduce power consumption. All banks should be in idle state prior to

entering the precharge power down mode and CKE should be set in high for at least tPDEX prior to Row active command. Refresh

operations cannot be performed during power down mode, therefore the device cannot remain in power down mode longer than

the refresh period(tREF) of the device.

COMMAND

CKE

CLK

Precharge Read

Enter Precharge

power-down

mode

t

IS

t

IS

t

IS

t

IS

t

PDEX

Active

Enter Precharge

power-down

mode

Enter Active

power-down

mode

Enter Active

power-down

mode

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 25/47

Functional Truth Table.

Current CS RAS CAS WE Address Command Action

H X X X X DESEL NOP

L H H H X NOP NOP

L H H L BA Burst Stop ILLEGAL*2

L H L X BA, CA, A10 READ / WRITE ILLEGAL*2

L L H H BA, RA Active Bank Active, Latch RA

L L H L BA, A10 PRE / PREA NOP*4

L L L H X Refresh AUTO-Refresh*5

IDLE

L L L L Op-Code Mode-Add MRS Mode Register Set*5

H X X X X DESEL NOP

L H H H X NOP NOP

L H H L BA Burst Stop NOP

L H L H BA, CA, A10 READ / READA Begin Read, Latch CA,

Determine Auto -precharge

L H L L BA, CA, A10 WRITE / WRITEA Begin Write, Latch CA,

Determine Auto -precharge

L L H H BA, RA Active Bank Active/ILLEGAL*2

L L H L BA, A10 PRE / PREA Precharge/Precharge All

L L L H X Refresh ILLEGAL

ROW ACTIVE

L L L L Op-Code Mode-Add MRS ILLEGAL

H X X X X DESEL NOP (Continue Burst to END)

L H H H X NOP NOP (Continue Burst to END)

L H H L BA Burst Stop Terminate Burst

L H L H BA, CA, A10 READ / READA

Terminate Burst, Latch CA,

Begin New Read, Determine

Auto-Precharge*3

L H L L BA, CA, A10 WRITE / WRITEA ILLEGAL

L L H H BA, RA Active Bank Active/ILLEGAL*2

L L H L BA, A10 PRE / PREA Terminate Burst, Precharge

L L L H X Refresh ILLEGAL

READ

L L L L Op-Code Mode-Add MRS ILLEGAL

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 26/47

Current State CS RAS CAS WE Address Command Action

H X X X X DESEL NOP (Continue Burst to end)

L H H H X NOP NOP (Continue Burst to end)

L H H L BA Burst Stop ILLEGAL

L H L H BA, CA, A10 READ/READA

Terminate Burst With DM=High,

Latch CA, Begin Read, Determine

Auto-Precharge*3

L H L L BA, CA, A10 WRITE/WRITEA

Terminate Burst, Latch CA,

Begin new Write, Determine

Auto-Precharge*3

L L H H BA, RA Active Bank Active/ILLEGAL*2

L L H L BA, A10 PRE / PREA Terminal Burst With DM=High,

Precharge

L L L H X Refresh ILLEGAL

WRITE

L L L L Op-Code Mode-Add MRS ILLEGAL

H X X X X DESEL NOP (Continue Burst to end)

L H H H X NOP NOP (Continue Burst to end)

L H H L BA Burst Stop ILLEGAL

L H L H BA, CA, A10 READ READ*7

L H L L BA, CA, A10 WRITE ILLEGAL

L L H H BA, RA Active Bank Active/ILLEGAL*2

L L H L BA, A10 PRE / PREA ILLEGAL*2

L L L H X Refresh ILLEGAL

READ with

AUTO

PRECHARGE

L L L L Op-Code Mode-Add MRS ILLEGAL

H X X X X DESEL NOP (Continue Burst to END)

L H H H X NOP NOP (Continue Burst to END)

L H H L BA Burst Stop ILLEGAL

L H L H BA, CA, A10 READ ILLEGAL

L H L L BA, CA, A10 WRITE Write

L L H H BA, RA Active Bank Active/ILLEGAL*2

L L H L BA, A10 PRE / PREA ILLEGAL*2

L L L H X Refresh ILLEGAL

WRITE with

AUTO

PRECHARGE

L L L L Op-Code Mode-Add MRS ILLEGAL

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 27/47

Current State CS RAS CAS WE Address Command Action

H X X X X DESEL NOP (Idle after tRP)

L H H H X NOP NOP (Idle after tRP)

L H H L BA Burst Stop ILLEGAL*2

L H L X BA, CA, A10 READ/WRITE ILLEGAL*2

L L H H BA, RA Active ILLEGAL*2

L L H L BA, A10 PRE / PREA NOP*4 (Idle after tRP)

L L L H X Refresh ILLEGAL

PRE-CHARGIN

G

L L L L Op-Code Mode-Add MRS ILLEGAL

H X X X X DESEL NOP (ROW Active after tRCD)

L H H H X NOP NOP (ROW Active after tRCD)

L H H L BA Burst Stop ILLEGAL*2

L H L X BA, CA, A10 READ / WRITE ILLEGAL*2

L L H H BA, RA Active ILLEGAL*2

L L H L BA, A10 PRE / PREA ILLEGAL*2

L L L H X Refresh ILLEGAL

ROW

ACTIVATING

L L L L Op-Code Mode-Add MRS ILLEGAL

H X X X X DESEL NOP

L H H H X NOP NOP

L H H L BA Burst Stop ILLEGAL*2

L H L H BA, CA, A10 READ ILLEGAL*2

L H L L BA, CA, A10 WRITE WRITE

L L H H BA, RA Active ILLEGAL*2

L L H L BA, A10 PRE / PREA ILLEGAL*2

L L L H X Refresh ILLEGAL

WRITE

RECOVERING

L L L L Op-Code Mode-Add MRS ILLEGAL

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 28/47

Current State CS RAS CAS WE Address Command Action

H X X X X DESEL NOP (Idle after tRP)

L H H H X NOP NOP (Idle after tRP)

L H H L BA Burst Stop ILLEGAL

L H L X BA, CA, A10 READ/WRITE ILLEGAL

L L H H BA, RA Active ILLEGAL

L L H L BA, A10 PRE / PREA ILLEGAL

L L L H X Refresh ILLEGAL

RE-FRESHING

L L L L Op-Code Mode-Add MRS ILLEGAL

H X X X X DESEL NOP (Idle after tRP)

L H H H X NOP NOP (Idle after tRP)

L H H L BA Burst Stop ILLEGAL

L H L X BA, CA, A10 READ / WRITE ILLEGAL

L L H H BA, RA Active ILLEGAL

L L H L BA, A10 PRE / PREA ILLEGAL

L L L H X Refresh ILLEGAL

MODE

REGISTER

SETTING

L L L L Op-Code Mode-Add MRS ILLEGAL

ABBREVIATIONS :

H = High Level, L = Low level, V = Valid, X = Don’t Care

BA = Bank Address, RA =Row Address, CA = Column Address, NOP = No Operation

Note :

1. All entries assume that CKE was High during the preceding clock cycle and the current clock cycle.

2. ILLEGAL to bank in specified state; function may be legal in the bank indicated by BA, depending on the state of the

bank.

3. Must satisfy bus contention, bus turn around and write recovery requirements.

4. NOP to bank precharging or in idle state. May precharge bank indicated by BA.

5. ILLEGAL of any bank is not idle.

6. Same bank’s previous auto precharg will not be performed. But if the bank is different, previous auto precharge will be

performed.

7. Refer to “Read with Auto Precharge: for more detailed information.

ILLEGAL = Device operation and / or data integrity are not guaranteed.

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 29/47

Current State CKE

n-1

CKE

n CS RAS CAS WE Add Action

H X X X X X X INVALID

L H H X X X X Exit Self-Refresh

L H L H H H X Exit Self-Refresh

L H L H H L X ILLEGAL

L H L H L X X ILLEGAL

L H L L X X X ILLEGAL

SELF-REFRESHING*

1

L L X X X X X NOP (Maintain Self-Refresh)

H X X X X X X INVALID

L H X X X X X Exit Power Down

POWER DOWN

L L X X X X X NOP (Maintain Power Down)

H X X X X X X INVALID

L H H X X X X Exit Deep Power Down *3

DEEP POWER

DOWN

L L X X X X X NOP (Maintain Deep Power Down)

H H X X X X X Refer to Function True Table

H L L L L H X Enter Self-Refresh

H L H X X X X Exit Power Down

H L L H H H X Exit Power Down

H L L H H L X ILLEGAL

H L L H L X X ILLEGAL

H L L L X X X ILLEGAL

ALL BANKS IDLE*2

L L L X X X X Refer to Current State = Power Down

H H X X X X X Refer to Function True Table

ANY STATE other

than listed above

ABBREVIATIONS :

H = High Level, L = Low level, V = Valid, X = Don’t Care

Note :

1. CKE Low to High transition will re-enable CLK, CLK and other inputs asynchronously. A minimum setup time must be

satisfied before issuing any command other than EXIT.

2. Power-Down and Self-Refresh can be entered only from All Bank Idle state.

3. The Deep Power Down mode is exited by asserting CKE high and full initialization is required after exiting Deep Power

Down mode.

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 30/47

Basic Timing (Setup, Hold and Access Time @ BL=4, CL=3)

CKE

CS

RAS

CAS

BA0,BA1

ADDR

(A0~An)

WE

DQS

DQ

01 234 5678910

HIGH

DM

COMMAND

A

10

/AP

BAa BAb

t

CK

t

IS

t

IH

t

WPREH

t

DQSS

Qa0 Qa1 Qa2 Qa3

t

DQSS

t

RPST

t

DQSH

t

DQSL

t

WPST

Hi-Z

READ WRITE

CLK

t

CL

t

RPRE

t

AC

t

QHS

11 12 13

t

CH

BAa

Ra

Ra Cb

Ca

Hi-Z

t

DQSCK

Hi-Z

t

DSC

t

WPRES

Db0 Db1 Db3

Db2

Active

Hi-Z

t

DS

t

DH

Note 1. tHP is lesser of tCL or tCH clock transition collectively when a bank is active.

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 31/47

Multi Bank Interleaving READ (@BL=4, CL=3)

CKE

CS

RAS

CAS

BA0,BA1

WE

DQS

DQs

01 234 5678910

HIGH

DM

COMMAND

A

10

/AP

ADDR

(A0~An)

BAa

Qb0 Qb1 Qb3

Qb2

ACTIVE

BAb BAa BAb

Ra Rb

Ra

Qa0 Qa1 Qa3

Qa2

ACTIVE READ

t

RCD

READ

t

RRD

t

CCD

Rb

CLK

11 12 13

Ca Cb

Hi-Z

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 32/47

Multi Bank Interleaving WRITE (@BL=4)

CKE

CS

RAS

CAS

BA0,BA1

WE

DQS

DQ

01 234 5678910

HIGH

DM

COMMAND

A

10

/AP

ADDR

(A0~An)

BAa

Db0 Db1 Db3

Db2

ACTIVE

BAb BAa BAb

Ra Rb

Ra Ca Cb

Da0 Da1 Da3

Da2

ACTIVE READ

t

RCD

READ

t

RRD

t

RCD

Rb

CLK

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Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 33/47

Read with Auto Precharge (@BL=8)

CKE

CS

RAS

CAS

BA0,BA1

WE

DQS(CL=3)

DQ(CL=3)

01 234 5678910

HIGH

DM

A

10

/AP

ADDR

(A0~An)

BAa

Qa4 Qa5 Qa7

Qa6

BAa

t

RP

Qa0 Qa1 Qa3

Qa2

Ca

Auto precharge start

Note

CLK

Ra

Hi-Z

1)

READ

ACTIVE

COMMAND

Note 1. The row active command of the precharge bank can be issued after tRP from this point.

The new read/write command of another activated bank can be issued from this point.

At burst read/write with auto precharge, CAS interrupt of the same bank is illegal.

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Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 34/47

Write with Auto Precharge (@BL=8)

CKE

CS

RAS

CAS

BA0,BA1

WE

DQS

DQ

01 234 5678910

HIGH

DM

COMMAND

A

10

/AP

ADDR

(A0~An)

BAa

Da4 Da5 Da7

Da6

t

RP

Da0 Da1 Da3

Da2

ACTIVE

WRITE

Ca

Auto precharge start

Note1

BAa

Ra

t

WR

CLK

t

DAL

Note 1. The row active command of the precharge bank can be issued after tRP from this point.

The new read/write command of another activated bank can be issued from this point.

At burst read/write with auto precharge, CAS interrupt of the same/another bank is illegal.

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 35/47

Read Interrupted by Precharge (@BL=8)

.

CKE

CS

RAS

CAS

BA0,BA1

WE

DQS

DQs

01 234 5678910

HIGH

COMMAND

A

10

/AP

ADDR

(A0~An)

BAa

Qa0 Qa1

READ

BAa

Ca

PRE

CHARGE

CLK

Qa2 Qa3 Qa4 Qa5

DM

Hi-Z

2

t

CK

Valid

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Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 36/47

Read Interrupted by a Read (@BL=8, CL=3)

CKE

CS

RAS

CAS

BA0,BA1

WE

DQS

DQs

01 234 5678910

HIGH

DM

COMMAND

A

10

/AP

ADDR

(A0~An)

BAa

Qa0 Qa1 Qb1Qb0

READ

Ca

BAb

Cb

Qb2 Qb3 Qb5

Qb4 Qb7

Qb6

READ

CLK

Hi-Z

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 37/47

Read Interrupted by a Write & Burst stop (@BL=8, CL=3)

CKE

CS

RAS

CAS

BA0,BA1

WE

DQS

DQs

01 234 5678910

HIGH

DM

COMMAND

BAa

Qa0 Qa1

READ

Db0 Db5

Db1 Db4

Db3Db2 Db6

BAb

Cb

Burst

Stop WRITE

Db7

CLK

A

10

/AP

ADDR

(A0~An) Ca

Hi-Z

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 38/47

Write followed by Precharge (@BL=4)

CKE

CS

RAS

CAS

BA0,BA1

WE

DQS

DQ

01 234 5678910

HIGH

DM

COMMAND

A10/AP

ADDR

(A0~An)

BAa BAa

tWR

Da0 Da1 Da3

Da2

PRE

CHARGE

WRITE

Ca

CLK

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 39/47

Write Interrupted by Precharge & DM (@BL=8)

CKE

CS

RAS

CAS

BA0,BA1

WE

DQS

DQ

01 234 012345

HIGH

DM

COMMAND

A

10

/AP

ADDR

(A0~An)

BAa BAa

Da0 Da1 Da3

Da2

PRE

CHARGE

WRITE WRITE WRITE

Ca

CLK

BAb BAc

Cb Cc

Da4 Da5 Da6 Da7 Db0 Db1 Dc1Dc0 Dc3

Dc2

t

WR

t

CCD

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 40/47

Write Interrupted by a Read (@BL=8, CL=3)

CKE

CS

RAS

CAS

BA0,BA1

WE

DQS

DQ

01 234 5678910

HIGH

DM

COMMAND

BAa

t

CDLR

Da0 Da1 Da3

Da2

WRITE READ

Ca

CLK

BAb

Cb

Da5

Da4 Qb0 Qb1 Qb3

Qb2 Qb4 Qb5

Maskecd by DM

A

10

/AP

ADDR

(A0~An)

Hi-Z

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 41/47

DM Function (@BL=8) only for write

CKE

CS

RAS

CAS

BA0,BA1

WE

DQS(CL=3)

DQ(CL=3)

01 234 5678910

HIGH

DM

COMMAND

A

10

/AP

ADDR

(A0~An)

BAa

Da4 Da5 Da7

Da6

Da0 Da1 Da3

Da2

WRITE

Ca

CLK

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 42/47

Deep Power Down Mode Entry & Exit Cycle

Note :

DEFINITION OF DEEP POWER MODE FOR Mobile DDR SDRAM :

Deep Power Down Mode is an operating mode to achieve maximum power reduction by cutting the power of the whole memory of

the device. Once the device enters in Deep Power Down Mode, data will not be retained. Full initialization is required when the

device exits from Deep Power Down Mode.

TO ENTER DEEP POWER DOWN MODE

1) The deep power down mode is entered by having CS and held low with RAS and CAS high at the rising edge of the

clock. While CKE is low.

2) Clock must be stable before exited deep power down mode.

3) Device must be in the all banks idle state prior to entering Deep Power Down mode.

TO EXIT DEEP POWER DOWN MODE

4) The deep power down mode is exited by asserting CKE high.

5) In case of 2/CS, 2CKE device with 2/CS & 2CKE, 200μs wait tine is required even if only 1 device exits from Deep Power

Down.

6) Upon exiting deep power down an all bank precharge command must be issued followed by two auto refresh commands

and a load mode register sequence.

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 43/47

Mode Register Set

CKE

CS

RAS

CAS

ADDR

(A0~An)

Precharge

Command

All Bank

DQS

DQs

MRS

Command

Any

Command

BA0,BA1

A10/AP

WE

DM

ADDRESS KEY

t

RP

CLK

t

MRD

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

HIGH

KEY

Hi-Z

COMMAND

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 44/47

PACKING DIMENSIONS

60-BALL DDR SDRAM ( 8x10 mm )

Symbol Dimension in mm Dimension in inch

Min Norm Max Min Norm Max

A

1.00

0.039

A1 0.25 0.30 0.35 0.010 0.012 0.014

A2

0.66

0.026

Φb 0.35 0.40 0.45 0.014 0.016 0.018

D 7.95 8.00 8.05 0.313 0.315 0.317

E 9.95 10.00 10.05 0.392 0.394 0.396

D1 6.40 BSC 0.252 BSC

E1 7.20 BSC 0.283 BSC

e 0.80 BSC 0.031 BSC

Controlling dimension : Millimeter.

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 45/47

PACKING DIMENSIONS

60-BALL DDR SDRAM ( 8x13 mm )

Symbol Dimension in mm Dimension in inch

Min Norm Max Min Norm Max

A

1.20

0.047

A1 0.30 0.35 0.40 0.012 0.014 0.016

A2

0.80

0.031

Φb 0.40 0.45 0.50 0.016 0.018 0.020

D 7.90 8.00 8.10 0.311 0.315 0.319

E 12.90 13.00 13.10 0.508 0.512 0.516

D1

6.40

0.252

E1

11.0

0.433

e

0.80

0.031

e1

1.00

0.039

Controlling dimension : Millimeter.

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 46/47

Revision History

Revision Date Description

1.0 2007.11.16 Original

1.1 2008.01.02

1. Change BGA package

2. Modify tIS

1.2 2008.01.16 Add 8x10mm BGA package

1.3 2008.06.13

1. Move Revision History to the last

2. Modify tIS

1.4 2008.09.01

Modify the arrangement of 60 Ball BGA (ball F1 : VREF =>

NC)

ESMT

Preliminary M53D128168A

Elite Semiconductor Memory Technology Inc. Publication Date : Sep. 2008

Revision : 1.4 47/47

Important Notice

No part of this document may be reproduced or duplicated in any form or by any

means without the prior permission of ESMT.

The contents contained in this document are believed to be accurate at the time

of publication. ESMT assumes no responsibility for any error in this document,

and reserves the right to change the products or specification in this document

without notice.

The information contained herein is presented only as a guide or examples for

the application of our products. No responsibility is assumed by ESMT for any

infringement of patents, copyrights, or other intellectual property rights of third

parties which may result from its use. No license, either express , implied or

otherwise, is granted under any patents, copyrights or other intellectual property

rights of ESMT or others.

A

ny semiconductor devices may have inherently a certain rate of failure. To

minimize risks associated with customer's application, adequate design and

operating safeguards against injury, damage, or loss from such failure, should be

provided by the customer when making application designs.

ESMT's products are not authorized for use in critical applications such as, but

not limited to, life support devices or system, where failure or abnormal operation

may directly affect human lives or cause physical injury or property damage. If

products described here are to be used for such kinds of application, purchaser

must do its own quality assurance testing appropriate to such applications.