Semiconductor Components Industries, LLC, 2000
August, 2000 – Rev. 1 1Publication Order Number:
AND8002/D
AND8002/D
ECLinPS, ECLinPS Lite
and ECLinPS Plus Device
Type and Date Code Marking
Guide
Gary Richards, ECL Logic Product Engineering
This is a summary of ON Semiconductor ECLinPS Logic
Device, Date Code, and Traceability Marking. We want to
provide our customers with easy access to this information
on the web. This application note summarizes and explains
the Date Code and Traceability Marking for ECL Logic
packages. This is not intended to replace the proper
documentation. To properly decode the Logic marking you
need ON Semiconductor’s marking spec 12MON00232D
and S.O.P. 7–19 ID of Products to Location of
Test/Assy/Wafer Fab. Also, you need to know the
abbreviations used for ECL Logic products (see the
appropriate Logic datasheet for the specific device
naming/ordering information).
DEVICE TYPE MARKING
Below are the ECLinPS, ECLinPS Lite, and ECLinPS Plus
device labeling guidelines.
MC Device Nomenclature:
Standard ECL family abbreviations used are:
ECL = Emitter Coupled Logic
E = ECLinPS = ECL in Pico Seconds,
EL = E–Lite = ECLinPS Lite,
EP = E–Plus = ECLinPS Plus,
LV = Low Voltage,
T = Translator.
These can be used in combination;
ELT = ECLinPS Lite Translator,
EPT = ECLinPS Plus Translator,
LVE = Low Voltage ECLinPS,
LVEL = Low Voltage ECLinPS Lite,
LVEP = Low Voltage ECLinPS Plus,
LVELT = Low Voltage ECLinPS Lite
Translator.
ECL Logic Packages
The standard ECLinPS Logic package suffixes are:
D = SOIC Narrow Body Small Outline IC,
DW = SOIC Wide Body Small Outline IC,
DT = TSSOP Thin Shrink Small Outline
Package,
FA = QFP Quad Flat Pack,
FN = PLCC Plastic Leaded Chip Carrier.
Notes:
All of the above can be combined with an R2 suffix for
tape and reel such as DR2 and FNR2.
Device Labeling Example:
MC100LVEL14DW:
MC = Motorola/ON Semiconductor brand,
100 = 100K/100E Voltage and Temperature
Compensation,
LVEL = Low Voltage ECLinPS Lite,
14 = Device Function = 1:5 Clk Dist Chip,
DW = Package Type = Wide Body SOIC.
Notes:
The combination LVET is not used.
All “MC” devices follow the same format.
MC Device Markings:
For packages lar ger than 20–lead SOIC the marking is the
same as the device type.
The 16–lead and 20–lead SOIC marking scheme is
truncated as follows:
16–Lead SOIC:
Device Nomenclature –– Marking
MC10EL15D = 10EL15
MC100EL15D = 100EL15
20–Lead SOIC:
MC100EL13DW = 100EL13
MC100LVEL13DW = 100LVEL13
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APPLICATION NOTE
AND8002/D
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2
Device marking is most challenging on 8–lead SOIC and
TSSOP devices, which do not have physical s pace on the small
packages f or f ull marking. On these packages device marking i s
limited to 5 characters for SOIC and 4 characters for TSSOP.
Because o f these limitations a s ystem of abbreviations is used a s
needed. The E for ECLinPS representation will be dropped in
the case of low voltage and translator functions, and all TSSOP
packages in the ECLinPS Lite and ECLinPS Plus families.
Standard ECLinPS family marking abbreviations used
for SOIC and TSSOP:
H = 10, to represent 10H/10E compatible,
voltage–compensated only.
K = 100, to represent 100K/100E
compatible, voltage and temperature
compensated.
L = ECLinPS Lite,
P = ECLinPS Plus,
V = LV = Low Voltage,
LT = EPT = ECLinPS Lite Translator,
PT = EPT = ECLinPS Plus Translator,
T, R, A = Translator,
T = ELT,
R = LVELT,
A = EPT.
DEVICE FAMILY SOIC TSSOP
EL = ECLinPS Lite EL L
EP = ECLinPS Plus EP P
LVEL = Low Voltage E–Lite VL V
LVEP = Low Voltage E–Plus VP U
LVELT = Low Voltage E–Lite Trans. VT R
EPT = E–Plus Translator PT A
ELT = E–Lite Translator LT T
8–Lead SOIC:(D) TSSOP:(DT)
Device Nomenclature– Marking Marking
MC10EL01D/DT = HEL01 HL01
MC100EL01D/DT = KEL01 KL01
MC100LVEL11D/DT = KVL11 KV11
MC10ELT20D/DT = HLT20 HT20
MC100ELT20D/DT = KLT20 KT20
MC100LVELT22D/DT = KVT22 KR22
MC10EP01D/DT = HEP01 HP01
MC100EP01D/DT = KEP01 KP01
MC10EPT20D/DT = HPT20 HA20
MC100EPT23D/DT = KPT23 KA23
MC10LVEP16D/DT = HVP16 HU16
MC100LVEP16D/DT = KVP16 KU16
PC/XC Device Marking
New Prototype “PC” devices and new pre–production
release, pre–reliability “XC” devices:
P = PC
X = XC
The first character is the “PC” or “XC” identifier. For a
variety of reasons, including space limitations, the
remaining characters have not been standard for different
engineering devices. On these PC and XC devices it is
important to use the date code in conjunction with the device
marking.
Examples of current markings:
XVT23 = XC100LVELT23D
PEP16 = PC10EP16D
PET23 = PC100EPT23D
DATE CODE MARKING
This is a summary of ECLinPS, ECLinPS Lite and
ECLinPS Plus Date Code Marking. The intent is to
summarize and explain the Date Code Marking for standard
ECLinPS and the special coding used for ECLinPS Lite and
ECLinPS Plus small SOIC and TSSOP packages.
Date Code / Alpha Code Marking:
32 & 52–Lead QFP, 20 & 28–Lead PLCC and 20–Lead SOIC = “AWLYYWW”
“A” – The First character indicates the Assembly Location.
“WL” – The Second & Third characters indicate the Wafer Lot Tracking Code.
“YY” – The Fourth & Fifth characters indicate the Year Assembled.
“WW” – The Sixth & Seventh characters indicate the Work Week Assembled.
XAA9646
|||||||
X|||||| = ASE Chung–Li, Taiwan. Assembly Location. (S.O.P. 7–19)
||||||
AA|||| = First Lot Assembled for that Device Type in that (Work Week).
||||
96|| = 1996
||
46 = WW46
AND8002/D
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16–Lead SOIC = “AWLYWW”
“A” – The First character indicates the Assembly Location.
“WL” – The Second & Third characters indicate the Wafer Lot Tracking Code.
“Y” – The Fourth character indicates the Year Assembled.
“WW” – The Fifth & Sixth characters indicate the Work Week Assembled.
XAA643
||||||
X||||| = ASE Chung–Li (previously Motorola METL) Taiwan. Assy Location.
|||||
AA||| = First Lot Assembled for that Device Type in that (Work Week).
|||
6|| = 1996
||
43 = WW43
Only 4 characters are used on 8–lead SOIC and TSSOP. Therefore, the following abbreviations are used:
8–Lead SOIC and TSSOP Example = “ALYW”
“A” – The First character indicates the location of Assembly Location.
“L” – The Second character indicates the Wafer Lot Tracking Code.
“Y” – The Third character indicates an “ALPHA CODE” of the Year assembled.
“W” – The Fourth character indicates an “ALPHA CODE” of the Work Week assembled.
The “A” Assembly Location Alpha Codes (per S.O.P. 7–19) are:
“2” = AIT Batam Island, Indonesia (formerly AMT, ASTRA),
“5” = ATP Manila, Phillippines (formerly AAP1, AAPI, AME),
“P” = OSPI ON Semiconductor Carmona, Phillippines (formerly Motorola MPC),
“X” = ASE Chung–Li, Taiwan (formerly Motorola METL),
The “Y” YEAR Alpha Codes are: The “W” Work Week Alpha Codes are:
Year Months Work Week
Code
First 6 Months
WW01 – WW26
Second 6 Months
WW27 – WW52
A = 1989 First 6 months, WW01 – WW26 A = 01 A = 27
B = 1989 Second 6 months, WW27 – WW52 B = 02 B = 28
C = 1990 First 6 months, WW01 – WW26 C = 03 C = 29
D = 1990 Second 6 months, WW27 – WW52 D = 04 D = 30
E = 1991 First 6 months, WW01 – WW26 E = 05 E = 31
F = 1991 Second 6 months, WW27 – WW52 F = 06 F = 32
G = 1992 First 6 months, WW01 – WW26 G = 07 G = 33
H = 1992 Second 6 months, WW27 – WW52 H = 08 H = 34
I = 1993 First 6 months, WW01 – WW26 I = 09 I = 35
J = 1993 Second 6 months, WW27 – WW52 J = 10 J = 36
K = 1994 First 6 months, WW01 – WW26 K = 11 K = 37
L = 1994 Second 6 months, WW27 – WW52 L = 12 L = 38
M = 1995 First 6 months, WW01 – WW26 M = 13 M = 39
N = 1995 Second 6 months, WW27 – WW52 N = 14 N = 40
O = 1996 First 6 months, WW01 – WW26 O = 15 O = 41
P = 1996 Second 6 months, WW27 – WW52 P = 16 P = 42
Q = 1997 First 6 months, WW01 – WW26 Q = 17 Q = 43
R = 1997 Second 6 months, WW27 – WW52 R = 18 R = 44
S = 1998 First 6 months, WW01 – WW26 S = 19 S = 45
T = 1998 Second 6 months, WW27 – WW52 T = 20 T = 46
U = 1999 First 6 months, WW01 – WW26 U = 21 U = 47
V = 1999 Second 6 months, WW27 – WW52 V = 22 V = 48
W = 2000 First 6 months, WW01 – WW26 W = 23 W = 49
X = 2000 Second 6 months, WW27 – WW52 X = 24 X = 50
Y = 2001 First 6 months, WW01 – WW26 Y = 25 Y = 51
Z = 2001 Second 6 months, WW27 – WW52 Z = 26 Z = 52
AND8002/D
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The date code can be determined from this information as shown in the following example:
XANS,
||||
X||| = ASE Chung–Li, Taiwan. Assembly Location. (S.O.P. 7–19)
|||
A|| = First Lot Assembled for that Device Type in that Alpha Code (Work Week).
||
N| = 1995 Second 6 months, WW27 – WW52
|
S = WW45 (Y1995 WW45)
2BWE,
||||
2||| = AIT Batam Island, Indonesia. Assembly Location. (S.O.P. 7–19)
|||
B|| = Second Lot Assembled for that Device Type in that Alpha Code (Work Week).
||
W| = 2000 First 6 months, WW01 – WW26
|
E = WW05 (Y2000 WW05)
Additional Assistance
For additional assistance, please contact your local ON
Semiconductor representative. You may also order the High
Performance ECL Data Book from the Literature
Distribution Center as document DL140/D or the ECLinPS
Plus Data Brochure as document BR1513/D. See below for
Publication Ordering Information.
AND8002/D
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APPENDIX A
ECLinPS Lite – Device Marking Look–Up Tables
8 LD SOIC = D Suffix
DEVICE NAME
MC10EL01D
MC10EL04D
MC10EL05D
MC10EL07D
MC10EL11D
MC10EL12D
MC10EL16D
MC10EL31D
MC10EL32D
MC10EL33D
MC10EL35D
MC10EL51D
MC10EL52D
MC10EL58D
MC10EL89D
MC100EL01D
MC100EL04D
MC100EL05D
MC100EL07D
MC100EL11D
MC100EL12D
MC100EL16D
MC100EL31D
MC100EL32D
MC100EL33D
MC100EL35D
MC100EL51D
MC100EL52D
MC100EL58D
MC100EL1648D
MC100LVEL01D
MC100LVEL05D
MC100LVEL11D
MC100LVEL12D
MC100LVEL16D
MC100LVEL31D
MC100LVEL32D
MC100LVEL33D
MC100LVEL51D
MC100LVEL58D
MC10ELT20D
MC10ELT21D
MC10ELT22D
MC10ELT24D
MC10ELT25D
MC10ELT28D
MC100ELT20D
MC100ELT21D
MC100ELT22D
MC100ELT23D
MC100ELT24D
MC100ELT25D
MC100ELT28D
MC100LVELT22D
MC100LVELT23D
8 LD SOIC
MARKING
HEL01
HEL04
HEL05
HEL07
HEL11
HEL12
HEL16
HEL31
HEL32
HEL33
HEL35
HEL51
HEL52
HEL58
HEL89
KEL01
KEL04
KEL05
KEL07
KEL11
KEL12
KEL16
KEL31
KEL32
KEL33
KEL35
KEL51
KEL52
KEL58
K1648
KVL01
KVL05
KVL11
KVL12
KVL16
KVL31
KVL32
KVL33
KVL51
KVL58
HLT20
HLT21
HLT22
HLT24
HLT25
HLT28
KLT20
KLT21
KLT22
KLT23
KLT24
KLT25
KLT28
KVT22
KVT23
8 LD TSSOP = DT Suffix
DEVICE NAME
MC10EL01DT
MC10EL04DT
MC10EL05DT
MC10EL07DT
MC10EL11DT
MC10EL12DT
MC10EL16DT
MC10EL31DT
MC10EL32DT
MC10EL33DT
MC10EL35DT
MC10EL51DT
MC10EL52DT
MC10EL58DT
MC10EL89DT
MC100EL01DT
MC100EL04DT
MC100EL05DT
MC100EL07DT
MC100EL11DT
MC100EL12DT
MC100EL16DT
MC100EL31DT
MC100EL32DT
MC100EL33DT
MC100EL35DT
MC100EL51DT
MC100EL52DT
MC100EL58DT
MC100EL1648DT
MC100LVEL01DT
MC100LVEL05DT
MC100LVEL11DT
MC100LVEL12DT
MC100LVEL16DT
MC100LVEL31DT
MC100LVEL32DT
MC100LVEL33DT
MC100LVEL51DT
MC100LVEL58DT
MC10ELT20DT
MC10ELT21DT
MC10ELT22DT
MC10ELT24DT
MC10ELT25DT
MC10ELT28DT
MC100ELT20DT
MC100ELT21DT
MC100ELT22DT
MC100ELT23DT
MC100ELT24DT
MC100ELT25DT
MC100ELT28DT
MC100LVELT22DT
MC100LVELT23DT
8 LD TSSOP
MARKING
HL01
HL04
HL05
HL07
HL11
HL12
HL16
HL31
HL32
HL33
HL35
HL51
HL52
HL58
HL89
KL01
KL04
KL05
KL07
KL11
KL12
KL16
KL31
KL32
KL33
KL35
KL51
KL52
KL58
1648
KV01
KV05
KV11
KV12
KV16
KV31
KV32
KV33
KV51
KV58
HT20
HT21
HT22
HT24
HT25
HT28
KT20
KT21
KT22
KT23
KT24
KT25
KT28
KR22
KR23
16 LD SOIC = D Suffix
DEVICE NAME
MC10EL15D
MC10EL34D
MC10EL57D
MC100EL15D
MC100EL34D
MC100EL57D
16 LD SOIC
MARKING
10EL15
10EL34
10EL57
100EL15
100EL34
100EL57
20 LD SOIC = DW Suffix
DEVICE NAME
MC100EL13DW
MC100EL14DW
MC100EL17DW
MC100EL29DW
MC100EL30DW
MC100EL38DW
MC100EL39DW
MC100EL56DW
MC100EL59DW
MC100EL90DW
MC100EL91DW
MC100LVEL13DW
MC100LVEL14DW
MC100LVEL17DW
MC100LVEL29DW
MC100LVEL30DW
MC100LVEL37DW
MC100LVEL38DW
MC100LVEL39DW
MC100LVEL40DW
MC100LVEL56DW
MC100LVEL59DW
MC100LVEL90DW
MC100LVEL91DW
MC100LVEL92DW
20 LD SOIC
MARKING
100EL13
100EL14
100EL17
100EL29
100EL30
100EL38
100EL39
100EL56
100EL59
100EL90
100EL91
100LVEL13
100LVEL14
100LVEL17
100LVEL29
100LVEL30
100LVEL37
100LVEL38
100LVEL39
100LVEL40
100LVEL56
100LVEL59
100LVEL90
100LVEL91
100LVEL92
AND8002/D
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APPENDIX B
ECLinPS Plus – Device Marking Look–Up Tables
8 LD SOIC = D Suffix
DEVICE NAME
MC10EP01D
MC10EP05D
MC10EP08D
MC10EP11D
MC10EP16D
MC10EP31D
MC10EP32D
MC10EP33D
MC10EP35D
MC10EP51D
MC10EP52D
MC10EP58D
MC10EP89D
MC100EP01D
MC100EP05D
MC100EP08D
MC100EP11D
MC100EP16D
MC100EP16FD
MC100EP31D
MC100EP32D
MC100EP33D
MC100EP35D
MC100EP51D
MC100EP52D
MC100EP58D
MC10LVEP11D
MC10LVEP16D
MC100LVEP11D
MC100LVEP16D
MC10EPT20D
MC100EPT20D
MC100EPT21D
MC100EPT22D
MC100EPT23D
MC100EPT24D
MC100EPT25D
MC100EPT26D
8 LD SOIC
MARKING
HEP01
HEP05
HEP08
HEP11
HEP16
HEP31
HEP32
HEP33
HEP35
HEP51
HEP52
HEP58
HEP89
KEP01
KEP05
KEP08
KEP11
KEP16
KEP60
KEP31
KEP32
KEP33
KEP35
KEP51
KEP52
KEP58
HVP11
HVP16
KVP11
KVP16
HPT20
KPT20
KPT21
KPT22
KPT23
KPT24
KPT25
KPT26
8 LD TSSOP = DT Suffix
DEVICE NAME
MC10EP01DT
MC10EP05DT
MC10EP08DT
MC10EP11DT
MC10EP16DT
MC10EP31DT
MC10EP32DT
MC10EP33DT
MC10EP35DT
MC10EP51DT
MC10EP52DT
MC10EP58DT
MC10EP89DT
MC100EP01DT
MC100EP05DT
MC100EP08DT
MC100EP11DT
MC100EP16DT
MC100EP16FDT
MC100EP31DT
MC100EP32DT
MC100EP33DT
MC100EP35DT
MC100EP51DT
MC100EP52DT
MC100EP58DT
MC10LVEP11DT
MC10LVEP16DT
MC100LVEP11DT
MC100LVEP16DT
MC10EPT20DT
MC100EPT20DT
MC100EPT21DT
MC100EPT22DT
MC100EPT23DT
MC100EPT24DT
MC100EPT25DT
MC100EPT26DT
8 LD TSSOP
MARKING
HP01
HP05
HP08
HP11
HP16
HP31
HP32
HP33
HP35
HP51
HP52
HP58
HP89
KP01
KP05
KP08
KP11
KP16
KP60
KP31
KP32
KP33
KP35
KP51
KP52
KP58
HU11
HU16
KU11
KU16
HA20
KA20
KA21
KA22
KA23
KA24
KA25
KA26
20 LD SOIC = DW Suffix
DEVICE NAME
MC10EP17DT
MC10EP56DT
MC10EP57DT
MC10EP90DT
MC100EP17DT
MC100EP56DT
MC100EP57DT
MC100EP90DT
MC100EP139DT
MC100LVEP14DT
20 LD SOIC
MARKING
MC10
EP17
MC10
EP56
MC10
EP57
MC10
EP90
100
EP17
100
EP56
100
EP57
100
EP90
KEP
139
100
VP14
AND8002/D
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Notes
AND8002/D
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