201208
FEATURES
APPLICATION
High frequency EMI prevention application to computers, printers,
VCRs, TVs and mobile phones.
DIMENSION
Type Dimension [mm]
L W t d
10 1.6±0.15 0.8±0.15 0.8±0.15 0.3±0.2
DESCRIPTION
RECOMMENDED LAND PATTERN
CIB/CIM10 Series (1608/ EIA 0603)
Perfect shape for automatic mounting, with no directionality.
Excellent solderability and high heat resistance for either flow or
reflow soldering
Monolithic inorganic material construction for high reliability
Closed magnetic circuit configuration avoids crosstalk and is
suitable for high density PCBs.
Part no. Thickness
(mm) Impedance
(Ω)±25%@100MHz DC Resistance
(Ω)Max. Rated Current
(mA) Max.
CIB10P100 0.8±0.15 10 0.05 1000
CIB10P220 0.8±0.15 22 0.05 1500
CIB10P260 0.8±0.15 26 0.08 1000
CIB10P300 0.8±0.15 30 0.08 1000
CIB10P330 0.8±0.15 33 0.08 1000
CIM10U800 0.8±0.15 80 0.10 600
CIM10U121 0.8±0.15 120 0.15 500
CIM10U221 0.8±0.15 220 0.25 400
CIM10U241 0.8±0.15 240 0.25 400
CIM10U301 0.8±0.15 300 0.30 400
CIM10U471 0.8±0.15 470 0.35 300
CIM10U601 0.8±0.15 600 0.38 500
CIM10U102 0.8±0.15 1000 0.50 400
CIM10U202 0.8±0.15 2000(at 70MHz) 1.20 200
CIB10J300 0.8±0.15 30 0.10 1000
CIM10J400 0.8±0.15 40 0.12 600
CIM10J470 0.8±0.15 47 0.12 600
CIM10J600 0.8±0.15 60 0.12 600
CIM10J750 0.8±0.15 75 0.15 550
CIM10J800 0.8±0.15 80 0.15 550
CIM10J121 0.8±0.15 120 0.20 500
CIM10J151 0.8±0.15 150 0.20 400
CIM10J221 0.8±0.15 220 0.30 400
CIM10J241 0.8±0.15 240 0.30 400
Chip Bead For EMI Suppression
0.6~0.8mm
0.6~0.8mm 0.6~0.8mm
0.6~0.8mm
Ver 201208
CHARACTERISTIC DATA
Part no. Thickness
(mm) Impedance
(Ω)±25%@100MHz DC Resistance
(Ω)Max. Rated Current
(mA) Max.
CIM10J301 0.8±0.15 300 0.35 400
CIM10J471 0.8±0.15 470 0.35 300
CIM10J601 0.8±0.15 600 0.45 300
CIM10J751 0.8±0.15 750 0.50 300
CIM10J102 0.8±0.15 1000 0.60 250
CIM10J152 0.8±0.15 1500 0.70 250
CIM10J252 0.8±0.15 2500 1.50 200
CIM10K152 0.8±0.15 1500 0.80 250
CIM10K202 0.8±0.15 2000 1.00 200
CIM10K252 0.8±0.15 2500 1.20 200
CIM10N700 0.8±0.15 70 0.30 500
CIM10N121 0.8±0.15 120 0.45 400
CIM10N241 0.8±0.15 240 0.60 300
CIM10F470 0.8±0.15 47 0.25 550
CIM10F600 0.8±0.15 60 0.25 550
CIM10F121 0.8±0.15 120 0.30 500
CIM10F331 0.8±0.15 330 0.58 400
CIM10F471 0.8±0.15 470 0.85 300
Ver 201208
Ver 201208
Ver 201208
CI M10U121NC
(1) (2) (3) (4) (5) (6) (7)
(1) Chip Beads (2) M: Multi-layer type B:Mono-layer type
(3) Dimension (4) Material Code
(5) Nominal impedance (121:120Ω, 202:2000Ω)
(6) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(7) Packaging(C:paper tape, E:embossed tape)
PACKAGING
Packaging Style Quantity(pcs/reel)
Card Board Taping 4000
RECOMMENDED SOLDERING CONDITION
PRODUCT IDENTIFICATION
REFLOW SOLDERING FLOW SOLDERING
■NOTICE :All specifications are subject to change without previous notice. Please contact with
product representatives or engineers to check specifications.
