8302I-01 Low Skew, 1-to-2 LVCMOS / LVTTL Fanout Buffer W/ Complementary Output Datasheet DESCRIPTION FEATURES The 8302I-01 is a low skew, 1-to-2 LVCMOS/LVTTL Fanout Buffer w/Complementary Output. The 8302I-01 has a single ended clock input. The single ended clock input accepts LVCMOS or LVTTL input levels. The 8302I-01 is characterized at full 3.3V for input VDD, and mixed 3.3V and 2.5V for output operating supply modes (VDDO). Guaranteed output and part-to-part skew characteristics make the 8302I-01 ideal for clock distribution applications demanding well defi ned performance and repeatability. * Complementary LVCMOS / LVTTL output * LVCMOS / LVTTL clock input accepts LVCMOS or LVTTL input levels * Maximum output frequency: 250MHz * Output skew: 165ps (maximum) * Part-to-part skew: 800ps (maximum) * Small 8 lead SOIC package saves board space * Full 3.3V or 3.3V core/2.5V output supply modes * -40C to 85C ambient operating temperature * Available in lead-free compliant package PIN ASSIGNMENTS BLOCK DIAGRAM VDDO VDD CLK GND Q CLK nQ 1 2 3 4 8 7 6 5 Q GND VDDO nQ 8302I-01 8-Lead SOIC 3.8mm x 4.8mm, x 1.47mm package body M Package Top View (c)2017 Integrated Device Technology, Inc. 1 May 4, 2017 8302I-01 Datasheet TABLE 1. PIN DESCRIPTIONS Number Name Type Description 1, 6 VDDO Power 2 VDD Power 3 CLK Input 4,7 GND Power Power supply ground. 5 nQ Output Complementary clock output. LVCMOS / LVTTL interface levels. 8 Q Output Clock output. LVCMOS / LVTTL interface levels. Output supply pins. Power supply pin. Pulldown LVCMOS / LVTTL clock input. NOTE: Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values. TABLE 2. PIN CHARACTERISTICS Symbol Parameter CIN Input Capacitance CPD Power Dissipation Capacitance (per output) RPULLDOWN Input Pulldown Resistor ROUT Output Impedance (c)2017 Integrated Device Technology, Inc. Test Conditions Minimum Typical Maximum 4 Units pF VDD, VDDO = 3.465V 22 pF VDD = 3.465V, VDDO = 2.625V 16 pF 51 5 2 7 k 12 May 4, 2017 8302I-01 Datasheet ABSOLUTE MAXIMUM RATINGS Supply Voltage, VDD 4.6V Inputs, VI -0.5V to VDD + 0.5 V Outputs, VO -0.5V to VDDO + 0.5V Package Thermal Impedance, JA 112.7C/W (0 lfpm) Storage Temperature, TSTG -65C to 150C NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress specifi cations only. Functional operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Charac-teristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability. TABLE 3A. POWER SUPPLY DC CHARACTERISTICS, VDD = 3.3V5%, VDDO = 3.3V5% OR 2.5V5%, TA = -40C TO 85C Symbol Parameter Test Conditions Minimum Typical Maximum Units VDD Power Supply Voltage 3.135 3.3 3.465 V VDDO Output Power Supply Voltage 3.135 3.3 3.465 V 2.375 2.5 2.625 V IDD IDDO Power Supply Current 13 mA Output Supply Current 4 mA TABLE 3B. LVCMOS / LVTTL DC CHARACTERISTICS, VDD = 3.3V5%, VDDO = 3.3V5% OR 2.5V5%, TA = -40C TO 85C Symbol Parameter Maximum Units VIH Input High Voltage 2 VDD + 0.3 V VIL Input Low Voltage -0.3 0.8 V IIH Input High Current CLK VDD = VIN = 3.465V 150 A IIL Input Low Current CLK VDD = 3.465V, VIN = 0V -5 A VDDO = 3.465, 50 to VDDO/2 2.6 V VDDO = 3.465, IOH = -100A 2.9 V VDDO = 2.625, 50 to VDDO/2 1.8 V VDDO = 2.625, IOH = -100A 2.2 VOH Test Conditions Output High Voltage Minimum VDDO = 3.465, 50 to VDDO/2 VOL Output Low Voltage (c)2017 Integrated Device Technology, Inc. Typical V 0.5 V VDDO = 3.465, IOL = 100A 0.2 V VDDO = 2.625, 50 to VDDO/2 0.5 V VDDO = 2.625, IOL = 100A 0.2 V 3 May 4, 2017 8302I-01 Datasheet TABLE 4A. AC CHARACTERISTICS, VDD = VDDO = 3.3V5%, TA = -40C TO 85C Symbol Parameter fMAX Output Frequency tpLH Propagation Delay, Low-to-High; NOTE 1 tsk(o) tsk(pp) tR / tF Output Rise/Fall Time odc Maximum Units 250 MHz 2.7 ns Output Skew; NOTE 2, 4 165 ps Part-to-Part Skew; NOTE 3, 4 800 ps Output Duty Cycle Test Conditions Minimum Typical 1.8 20% to 80% 300 800 ps 133MHz 45 55 % 133MHz < 250MHz 40 60 % Maximum Units 250 MHz 2.9 ns NOTE 1: Measured from VDD/2 of the input to VDDO/2 of the output. NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDO/2. NOTE 3: Defined as skew between outputs on different devices operating at the same supply voltages and with equal load conditions. Using the same type of inputs on each device, the outputs are measured at VDDO/2. NOTE 4: This parameter is defined in accordance with JEDEC Standard 65. TABLE 4B. AC CHARACTERISTICS, VDD = 3.3V5%, VDDO = 2.5V5%, TA = -40C TO 85C Symbol Parameter fMAX Output Frequency Test Conditions Minimum Typical tpLH Propagation Delay, Low-to-High; NOTE 1 tsk(o) Output Skew; NOTE 2, 4 250 ps tsk(pp) Part-to-Part Skew; NOTE 3, 4 900 ps tR / tF Output Rise/Fall Time odc Output Duty Cycle 1.9 20% to 80% 100 850 ps 133MHz 45 55 % 133MHz < 250MHz 40 60 % NOTE 1: Measured from VDD/2 of the input to VDDO/2 of the output. NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDO/2. NOTE 3: Defined as skew between outputs on different devices operating at the same supply voltages and with equal load conditions. Using the same type of inputs on each device, the outputs are measured at VDDO/2. NOTE 4: This parameter is defined in accordance with JEDEC Standard 65. (c)2017 Integrated Device Technology, Inc. 4 May 4, 2017 8302I-01 Datasheet PARAMETER MEASUREMENT INFORMATION 3.3V CORE/3.3V OUTPUT LOAD AC TEST CIRCUIT 3.3V/2.5V OUTPUT LOAD AC TEST CIRCUIT PROPAGATION DELAY OUTPUT SKEW PART-TO-PART SKEW OUTPUT RISE/FALL TIME OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD (c)2017 Integrated Device Technology, Inc. 5 May 4, 2017 8302I-01 Datasheet RELIABILITY INFORMATION TABLE 5. JAVS. AIR FLOW TABLE FOR 8 LEAD SOIC JA by Velocity (Linear Feet per Minute) Single-Layer PCB, JEDEC Standard Test Boards Multi-Layer PCB, JEDEC Standard Test Boards 0 200 500 153.3C/W 112.7C/W 128.5C/W 103.3C/W 115.5C/W 97.1C/W NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs. TRANSISTOR COUNT The transistor count for 8302I-01 is: 322 (c)2017 Integrated Device Technology, Inc. 6 May 4, 2017 Package Drawing (c)2017 Integrated Device Technology, Inc. 7 8302I-01 Datasheet May 4, 2017 8302I-01 Datasheet Ordering Information Orderable Part Number Marking Package Carrier Type Temperature 8302AMI-01LF 302AI01L 3.8 x 4.8 x 1.47 mm 8-SOIC Tube -40 to +85C 8302AMI-01LF 302AI01L 3.8 x 4.8 x 1.47 mm 8-SOIC Tape and Reel -40 to +85C Revision History Revision Date Description of Change May 4, 2017 Corrected and updated the Ordering Information Table. Updated package information. Updated datasheet header/footer. March 9, 2016 Features section - removed reference to leaded package Ordering Information table - removed quantity from tape and reel. Deleted LF note below table. Added Contact Page July 29, 2010 Updated datasheet header/footer with IDT logo from ICS logo. Ordering Information table - removed ICS prefix from Part/Order Number column. Added Contact Page. Corporate Headquarters Sales Tech Support 6024 Silver Creek Valley Road San Jose, CA 95138 USA www.IDT.com 1-800-345-7015 or 408-284-8200 Fax: 408-284-2775 www.IDT.com/go/sales www.IDT.com/go/support DISCLAIMER Integrated Device Technology, Inc. (IDT) and its affiliated companies (herein referred to as "IDT") reserve the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT. Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. Integrated Device Technology, Inc.. All rights reserved. (c)2017 Integrated Device Technology, Inc. 8 May 4, 2017