Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN General Description Features The AA4003 is a Class AB stereo Audio Power Amplifier which can deliver 2.0W into 4 speakers with limitation of THD+N less than 1%. The chip is designed specially for Portable DVD player, Portable Media Player, LCD monitor and Digital Photo Frame applications. * * * * AA4003 is available in package of SOIC-16 and TSSOP-20 (EDP). * * * AA4003 Output Power, BTL: 2.0W/CH (4, THD+N1%) SE: 160mW/CH (16, THD+N1%) Supply Voltage Range: 2.7V to 5.5V External Feedback Loop for Flexible Gain Set-up Low Power Consumption at Shutdown Mode 0.7A Typical SE, BTL Mode Switchable Optimized Click/POP Noise Suppression Thermal Shutdown Protection Applications * * * * Portable DVD Player Portable Media Player LCD Monitor Digital Photo Frame TSSOP-20 (EDP) SOIC-16 Figure 1. Packages Type of AA4003 Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 1 Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003 Pin Configuration G Package (TSSOP-20 (EDP)) SHUTDOWN 1 20 HP-SENSE GND 2 19 GND OUTL+ 3 18 OUTR+ VDD 4 17 VDD OUTL- 5 16 OUTR- LIN- 6 15 RIN- GND 7 14 BYPASS LIN+ 8 13 RIN+ PGND 9 12 PGND PGND 10 11 PGND M Package (SOIC-16) SHUTDOWN 1 16 HP-SENSE GND 2 15 GND OUTL+ 3 14 OUTR+ VDD 4 13 VDD OUTL- 5 12 OUTR- LIN- 6 11 RIN- GND 7 10 BYPASS LIN+ 8 9 RIN+ Figure 2. Pin Configurations of AA4003 (Top View) Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 2 Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003 Pin Description Pin Number Pin Name Function G Package M Package 1 1 SHUTDOWN 2, 7, 19 2, 7, 15 GND 3 3 OUTL+ 4, 17 4, 13 VDD 5 5 OUTL- Left channel negative output 6 6 LIN- Left channel negative input 8 8 LIN+ Left channel positive input PGND Power ground, used for thermal release Right channel positive input 9, 10, 11, 12 Shutdown mode enable pin, active High Signal ground Left channel positive output Power supply pin 13 9 RIN+ 14 10 BYPASS 15 11 RIN- Right channel negative input 16 12 OUTR- Right channel negative output 18 14 OUTR+ Right channel positive output 20 16 HP-SENSE Internal reference voltage pin, connect a 1.0F capacitor to GND SE, BTL Mode switch pin, L - BTL Mode H - SE Mode Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 3 Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003 Ordering Information AA4003 E1: Lead Free G1: Green TR: Tape and Reel Blank: Tube Circuit Type Package G: TSSOP-20 (EDP) M: SOIC-16 Package Temperature Range TSSOP-20 (EDP) -40 to 85 SOIC-16 -40 to 85 Part Number Lead Free AA4003G-E1 Green AA4003G-G1 Marking ID Lead Free Green Packing Type AA4003G AA4003GG Tube AA4003GTR-E1 AA4003GTR-G1 AA4003G AA4003GG Tape & Reel AA4003M-E1 AA4003M-E1 AA4003M-G1 Tube AA4003MTR-E1 AA4003MTR-G1 AA4003M-E1 AA4003M-G1 Tape & Reel AA4003M-G1 BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. Products with "G1" suffix are available in green packages. Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 4 Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003 Absolute Maximum Ratings (Note 1) Parameter Symbol Value Unit Supply Voltage VDD 6 V Input Voltage VIN -0.3 to VDD + 0.3 V Power Dissipation PD Internally limited RJA Package Thermal Resistance Operating Junction Temperature M Package 90 G Package 50 (Note 2) oC/W TJ 150 TSTG -65 to 150 oC TLEAD 260 oC ESD (Human Body Model) 2000 V ESD (Machine Model) 300 V Storage Temperature Range Lead Temperature 1.6mm from Case for 10 Seconds oC Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operation is not implied. Exposure to "Absolute Maximum Ratings" for extended periods may affect device reliability. Note 2: Chip is soldered to 200mm2 copper (top side solder mask) of 1oz. on PCB with 8 x 0.5mm vias.. Recommended Operating Conditions Parameter Supply Voltage Operating Ambient Temperature Symbol Min Max Unit VDD 2.7 5.5 V TA -40 85 oC Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 5 Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003 Electrical Characteristics (VDD=5V, TA=25oC, CI=1F, COUT=220F and RI=RF=20k unless otherwise specified. For SE Mode, HP_SENSE=5V, for BTL Mode, HP_SENSE=0V. ) Parameter Symbol Quiescent Current IDD Shutdown Current ISD HP_SENSE LOGIC SHUTDOWN LOGIC Conditions Min Typ Max SE Mode, VIN=0, IO=0 3 10 BTL Mode, VIN=0, IO=0 6 20 0.7 2.0 VSHUTDOWN=5V VIH 4 mA A V VIL 0.8 VIH Unit 3 V V VIL 0.8 V Thermal Shutdown Temperature 170 oC Hysteresis Temperature Window 25 oC SE Mode Output Power Total Harmonic Distortion + Noise Signal to Noise Ratio Crosstalk Power Supply Rejection Ratio PO THD+N=1%, RL=32 80 THD+N=10%, RL=32 110 THD+N=1%, RL=16 160 THD+N=10%, RL=16 220 mW THD+N PO=75mW, RL=32, 0.2 % PO=75mW, RL=32, 90 dB XTALK PO=75mW, RL=32, f=1kHz -80 dB PSRR Cb=1F, f=1KHz, VRIPPLE=0.2VRMS, RL=16 60 dB SNR BTL Mode Output Offset Voltage Output Power Total Harmonic Distortion + Noise Signal to Noise Ratio VOS PO VIN=0V, No load 5 THD+N=1%, RL=4 2 THD+N=10%, RL=4 2.5 THD+N=1%, RL=8 1.1 THD+N=10%, RL=8 1.5 50 mV W THD+N PO=1W, RL=4, 0.1 % PO=1W, RL=8, 95 dB SNR Crosstalk XTALK PO=1W, RL=8, f=1kHz -80 dB Power Supply Rejection Ratio PSRR Cb=1F, f=1KHz, VRIPPLE=0.2VRMS, RL=8 67 dB Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 6 Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003 Typical Performance Characteristics Figure 4. Quiescent Current vs. Ambient Temperature Figure 3. Quiescent Current vs. Supply Voltage 10 10 1 THD+N (%) THD+N (%) 1 VDD=5.0V, SE Mode f=1kHz, LPF=30kHz RL=16 RL=32 0.1 VDD=5.0V, BTL Mode f=1kHz LPF=30kHz RL=4 RL=8 0.1 0.01 1E-3 10m 100m 0.01 10m 300m 100m 1 3 Output Power (W) Output Power (W) Figure 5. THD+N vs. Output Power @ SE Mode Figure 6. THD+N vs. Output Power @ BTL Mode Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 7 Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003 Typical Performance Characteristics 10 10 VDD=5.0V, BTL Mode PO=1.5W, RL=4 LPF=80kHz VDD=5.0V, SE Mode COUT=1000F, PO=150mW RL=16, LPF=80kHz 1 THD+N (%) THD+N (%) 1 0.1 0.1 0.01 20 100 1k 10k 0.01 20 20k 100 10k 20k Figure 8. THD+N vs. Output Power @ BTL Mode Figure 7. THD+N vs. Output Power @ SE Mode 10 10 BTL Mode, VDD=5.0V PO=1W, RL=8 LPF=80kHz SE Mode, VDD=5.0V PO=75mW, RL=32 LPF=80kHz, COUT=1000F 1 THD+N (%) THD+N (%) 1 0.1 0.1 0.01 20 1k Frequency (Hz) Frequency (Hz) 100 1k 10k 0.01 20 20k Frequency (Hz) 100 1k 10k 20k Frequency (Hz) Figure 9. THD+N vs. Frequency @ SE Mode Figure 10. THD+N vs. Frequency @ BTL Mode Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 8 Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003 Typical Performance Characteristics (Continued) 800 VDD=5.0V, BTL Mode f=1kHz, LPF=30kHz THD+N=10% THD+N=1% 2.0 Output Power (W) 600 Output Power (mW) 2.5 VDD=5.0V, SE Mode f=1kHz, LPF=30kHz THD+N=10% THD+N=1% 400 200 1.5 1.0 0.5 0 10 20 30 40 50 60 0.0 0.0 70 5.0 10.0 Figure 11. Output Power vs. Resistor Load @ SE Mode 25.0 30.0 35.0 3.0 SE Mode, RL=16 f=1kHz, LPF=30kHz THD+N=10% THD+N=1% BTL Mode, RL=4 f=1kHz, LPF=30kHz THD+N=10% THD+N=1% 2.5 Output Power (mW) 200 Output Power (mW) 20.0 Figure 12. Output Power vs. Resistor Load @ BTL Mode 250 150 100 50 0 2.5 15.0 Resistor Load () Resistor Load (ohm) 2.0 1.5 1.0 0.5 3.0 3.5 4.0 4.5 0.0 2.5 5.0 3.0 3.5 4.0 4.5 5.0 Supply Voltage (V) Supply Voltage (V) Figure 13. Output Power vs. Supply Voltage @ SE Mode Figure 14. Output Power vs. Supply Voltage @ BTL Mode Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 9 Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003 Typical Performance Characteristics (Continued) 75 70 70 60 65 PSRR (dB) PSRR (dB) 50 40 30 VDD=5.0V, SE Mode RL=32,Cb=1.0F VRIPPLE=0.2Vrms 20 60 55 50 VDD=5.0V, BTL Mode RL=8, Cb=1.0F VRIPPLE=0.2Vrms 45 40 10 10 100 1k 10k 20k 10 100 1k 10k 20k Frequency (Hz) Frequency (Hz) Figure 16. PSRR vs. Frequency @ BTL Mode Figure 15. PSRR vs. Frequency @ SE Mode 4 1000 -80 Gain -120 -4 Gain (dB) 600 400 -160 -8 Phase -200 -12 -240 200 0 -16 0.2 0.4 0.6 0.8 -20 10 1.0 Bypass Capacitor (F) SE Mode, VDD=5.0V RF=RI=20k, COUT=1000F 100 1k 10k -280 100k 1M 10M Frequency (Hz) Figure 17. Start-up Time vs. Bypass Capacitor Figure 18. Closed Loop Frequency Response Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 10 Phase (deg) 800 Start-up Time (ms) 0 VDD=5.0V Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN Application Information + The AA4003 can operate under 2 types of output configuration, BTL (Bridged-Tied-Load) mode and SE (Single-Ended) mode, determined by HP_SENSE pin's logic level. (Here is the discussion about left channel only, it equally applies to right channel.) + Left Out20k AMP1L 20k + + R1 100k VDD Headphone Speak Main Speak Left Out+ R1 R2 100k 100k HP_SENSE= High Level RPD 1.5k Left Out+ R2 100k HP_SENSE= Low Level RPD 1.5k AMP2L AMP2L VDD 20k _ Main Speak _ Left Out20k AMP1L COUT 220F + _ COUT 220F + _ SE/BTL Mode, HP_SENSE Pin AA4003 SLEEVE HEADPHONE JACK Figure 19. Output Configuration for Left Channel in BTL Mode When HP_SENSE pin is held low which sets the chip in BTL mode, the AMP2L unit is turned on. AMP2L has fixed unity gain internally, AC signal at OUT+ is 180 degree phase shifted from OUT-. Because the DC component (Output Bias voltage, approx 1/2 VDD) between OUT+ and OUT- is canceled, there is no necessity to use DC block capacitors for main speak. In BTL mode, output voltage swing across main speaker is about 2 times that in SE mode, so there is 4 times output power compared to SE mode with same load and input. (see Figure 19) Figure 20. Output Configuration for Left Channel in SE Mode When headphone plug is not inserted, the voltage of HP_SENSE pin is determined by voltage divider formed by R1 and RPD. For given resistor's value in Figure 19, R1=100k, RPD=1.5k, DC voltage at HP_SENSE is about 74mV. AC signal equals output amplitude of OUT- through COUT, so signal at HP_SENSE node is 74mV DC plus AC signal. The maximum peak-to-peak voltage at OUT- is no greater than VDD (supply voltage 5.0V), so the positive maximum voltage of HP_SENSE node will be no greater than 2.5V+75mV2.575V, which is less than HP_SENSE input high level minimum value (4.0V). That means the chip is in BTL mode and there is no risk of operation mode switch between SE and BTL. When headphone plug is inserted, as the RPD is disconnected from R1, the voltage of HP_SENSE pin is pulled up by R1 to VDD and sets the chip in SE mode. HP_SENSE pin can also be connected to MCU I/O port to control the mode switch through MCU. If applying high level to HP_SENSE pin which sets the chip in SE mode, the AMP2L unit is in high impedance state. There is no current loop between OUT+ and OUT-, the main speak is naturally disabled without any hardware change. The output audio signal rides on bias voltage at OUT- (Output Bias voltage, approx 1/2 VDD) , so it has to use a capacitor COUT to block DC bias and couple AC signal to headphone speak. (See Figure 20) It is necessary to note that AA4003 still can drive headphone even in BTL mode because OUT- is always active whatever the chip is in SE or BTL mode. CIN, COUT, Cb and CS (Power Supply) Selection For input stages of AA4003, input capacitors CI is used to accommodate different DC level between input source and AA4003 bias voltage (about 2.31V). Input capacitors CI and input resistors RI form a first order High Pass Filter, which determines the lower corner frequency according to the classic equation below, It is recommended to connect HP_SENSE to the headphone jack switch pin illustrated in Figure 19. Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 11 Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN Application Information (Continued) f CIL = Example: VDD=5V, RL=8, BTL configuration, Desired output power PO=1.0W (each channel), THD+N 1%. Input signal, VIN=1.0VRMS from D-A converter. 1 .............................................(1) 2RI C I Step 1, To check if the chip can deliver 1W to 8 load with the limitation of THD+N 1%, VDD=5V. From Figure 6, Figure 12, AA4003 can deliver 1W to 8 load each channel. Similarly, for output stage in SE mode, output capacitor (COUT), and headphone load also form a first order High Pass Filters, and its cut-off frequency is determined by equation 2. f COL = 1 ......................................(2) 2RHP COUT Step 2, If yes, to calculate output voltage, VOUT = P O R L = 1* 8 = 2.83VRMS The purpose of bypass capacitor (Cb) is to filter internal noise, reduce harmonic distortion, and improve power supply rejection ratio performance. Tantalum or ceramic capacitor with low ESR is recommended, and it should be placed as close as possible to the chip in PCB layout. The chip will not work until internal DC bias is set up completely. So the size of Cb will also affect the chip start up time, which is approx linearly proportional to the value of bypass capacitor. For AA4003, here are various start-up times for several typical capacitor values. (see Figure 17) Cb (F) Start up Time (ms) 0.33 340 0.47 420 1.0 970 So pass-band gain, AV=VOUT/VIN=2.83x. Step 3, Assuming input resistor is 20k, the feedback resistor=20k*1.415=28.3k.. Select the closest standard value 28k. Shutdown AA4003 has a shutdown feature to reduce power consumption. If apply high level to shutdown pin, output amplifiers will be turned off, bias circuit is also disabled, the maximum current drawn from VDD is less than 2.0A. A logic low level will enable the device. Optimizing CLICK/POP Noise The AA4003 includes optimized circuits to suppress CLICK/POP noise during power up/power down transition. For AA4003 power supply, it is better to use an individual power source generated from voltage regulator split from video, digital circuit units in system. The power supply bypass capacitors, CS, is recommended to use one low ESR electrolytic capacitor between 4.7F to 10F with a parallel 0.1F ceramic capacitor which is located close to the chip. In BTL mode the AA4003 can effectively reduce most common mode signal including CLICK/POP noise. In SE mode, optimized ramp for rise/fall edge of BIAS can significantly reduce click/pop noise due to charge and/or discharge output capacitor (COUT). Furthermore, increasing bypass capacitor value (Cb) can slower ramp of charging bypass capacitor, prolong start-up time, mask most of transient noises before bias voltage is set up completely. It is recommended to use 1.0F capacitor with lower ESR. Setup Proper Gain, Design Example The closed loop gain of AA4003 is determined by the ratio of feedback resistor (RF) to input resistor (RI). AV = AA4003 RF ........................................................(3) RI Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 12 Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN Application Information (Continued) 2 PDBTLMAX = Power Dissipation, Efficiency and Thermal Design Consideration For Class AB amplifiers, Formula 4 is the basic equation of efficiency worked in BTL configuration, = VP .......................................................(4) o TA = TJMAX - JA PDBTLMAX =150-50*2.53=23.5 C here VP is output peak voltage across the load. That is to say, if user wants AA4003 to delivery 2W power per channel to 4 load at VDD=5.0V, BTL mode, ambient temperature has to hold lower than 23.5oC. When junction temperature exceeds about 170oC, OTSD feature will be enabled, and shutdown the device to limit total power dissipation. Thermal dissipation becomes major concern when delivering more output power especially in BTL mode. The maximum power dissipation can be calculated by following equation. Here 2VDD 2 x 52 = = 1.266W 2 RL 3.14 2 x 4 per channel, total power dissipation PDTOTAL=2* PDBTLMAX=2.53W. According to formula 6, maximum ambient temperature is, 4VDD PDMAX = AA4003 TJMAX - TA ......................................(5) There is an exposed thermal pad on bottom of the chip to provide the direct thermal path from die to heat sink. It is recommended to use copper on the surface of Printed Circuit Board as heat sink. To dig some matrix regular holes under chip, remove mask of this area copper, and make sure to keep them contact well when soldering on PCB are also recommended. (See Figure 21) JA TJMAX is maximum operating junction 150oC, temperature, TA is ambient temperature, JA is thermal resistance from junction to ambient, which is 50oC/W for TSSOP-20 (EDP), given in datasheet. Assuming TA is 25oC, the maximum power dissipation PDMAX is about 2.5W according to formula 6. Recommended PCB Layout for AA4003 Using wide traces for power supply to reduce power losses caused by parasitic resistance in all outputs is useful to help releasing heat away from the chip. It is recommended to place bypass capacitor, power supply bypass capacitors as close as possible to the chip. Figure 21 and Figure 22 show the recommended layout for double layer PCB. There is an other formula about power dissipation which is determined by supply voltage and load resistance. 2 PDBTLMAX 2V = 2DD ......................................(6) RL If power dissipation calculated in an application is larger than that package permitted, there will be a need to assemble an additional heat sink, or keep ambient temperature around the chip low, or increase load resistance, or decrease power supply voltage. Here is an example. Assuming VDD=5.0V, RL=4, stereo in BTL mode, Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 13 Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003 Application Information (Continued) Figure 21. Copper and Holes under Part Figure 22. Top Route and Silk Screens Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 14 Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003 Typical Application RF 20k CS 10F + VDD 4,13 CI 1uF + Left IN RI 6 LIN- 20k 8 LIN+ VDD 16 100k COUT RPD 220F 1.5k + _ + 20k AMP1L HP-SENSE OUTL- 5 OUTL+ 3 20k 100k _ To control pin + AMP2L CI 1F RI + Right IN 20k Cb 1.0F 10 BYPASS 11 RIN- 9 RIN+ + COUT 220F + _ + To HP-Sense circuit 20k AMP1R OUTR- 12 OUTR+ 14 20k SLEEVE RPD 1.5k HEADPHONE JACK _ + 1 SHUTDOWN AMP2R 2,7,15 RF 20k Figure 23. Typical Application Circuit of AA4003 (M Package) Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 15 Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003 Mechanical Dimensions TSSOP-20(EDP) Unit: mm(inch) 6.400(0.252) 6.600(0.260) 4.100(0.161) 4.300(0.169) 2.900(0.114) 3.100(0.122) 6.200(0.244) 6.600(0.260) EXPOSED PAD 4.300(0.169) 4.500(0.177) #1 PIN INDEX0.750(0.030)Dp0.000(0.000) 0.850(0.033) 0.100(0.004) 0.100(0.004) 0.190(0.007) 0.650(0.026)TYP 0.900(0.035) 1.050(0.041) 0.340(0.013) 0.540(0.021) 4-10 14 TOP & BOTTOM 0.200(0.008)MIN R0.090(0.004)MIN 1.200(0.047) MAX 0.050(0.002) R0.090(0.004)MIN 0.150(0.006) 0.250(0.010)TYP 0 8 0.200(0.008) 0.280(0.011) 0.450(0.018) 0.750(0.030) Aug. 2008 Rev. 1. 2 1.000(0.039) REF BCD Semiconductor Manufacturing Limited 16 Data Sheet 2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003 Mechanical Dimensions (Continued) SOIC-16 1.000(0.039) 1.300(0.051) Unit: mm(inch) 1.650(0.065) 0.406(0.016) 0.700(0.028) 7 2.000(0.079) Depth 0.060(0.002) 0.100(0.004) 7 B A 20:1 0.250(0.010) 0.500(0.020) 10.000(0.394) 1 5 R0.200(0.008) R0.200(0.008) 0.150(0.006) 0.250(0.010) 0.203(0.008) 6.040(0.238) 3.940(0.155) 9.5 8 0.200(0.008) S 1.000(0.039) 8 8 C-C 50:1 B 20:1 C 3 7 0.250(0.010) 0.200(0.008)MIN Depth 0.200(0.008) A 0.400(0.016)x45 1.000(0.039) 1.270(0.050) 0.600(0.024) C Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 17 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com IMPORTANT NOTICE IMPORTANT NOTICE BCD Semiconductor BCD Semiconductor Manufacturing Manufacturing Limited Limited reserves reserves the the right right to to make make changes changes without without further further notice notice to to any any products products or or specifispecifications herein. cations herein. BCD BCD Semiconductor Semiconductor Manufacturing Manufacturing Limited Limited does does not not assume assume any any responsibility responsibility for for use use of of any any its its products products for for any any particular purpose, particular purpose, nor nor does does BCD BCD Semiconductor Semiconductor Manufacturing Manufacturing Limited Limited assume assume any any liability liability arising arising out out of of the the application application or or use use of any of any its its products products or or circuits. circuits. BCD BCD Semiconductor Semiconductor Manufacturing Manufacturing Limited Limited does does not not convey convey any any license license under under its its patent patent rights rights or or other rights other rights nor nor the the rights rights of of others. others. 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