AA4003G-E1 - BCD Semiconductor Manufacturing Limited

2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003

Data Sheet

Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

General Description

The AA4003 is a Class AB stereo Audio Power Ampli-

fier which can deliver 2.0W into 4Ω speakers with lim-

itation of THD+N less than 1%. The chip is designed

specially for Portable DVD player, Portable Media

Player, LCD monitor and Digital Photo Frame applica-

tions.

AA4003 is available in package of SOIC-16 and

TSSOP-20 (EDP).

Features

·Output Power,

BTL: 2.0W/CH (4Ω, THD+N≤1%)

SE: 160mW/CH (16Ω, THD+N≤1%)

·Supply Voltage Range: 2.7V to 5.5V

·External Feedback Loop for Flexible Gain Set-up

·Low Power Consumption at Shutdown Mode

0.7µA Typical

·SE, BTL Mode Switchable

·Optimized Click/POP Noise Suppression

·Thermal Shutdown Protection

Applications

·Portable DVD Player

·Portable Media Player

·LCD Monitor

·Digital Photo Frame

Figure 1. Packages Type of AA4003

TSSOP-20 (EDP)

SOIC-16

2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003

Data Sheet

Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

Pin Configuration

G Package

(

TSSOP-20 (EDP

))

M Package

Figure 2. Pin Configurations of AA4003 (Top View)

SHUTDOWN

GND

OUTL+

VDD

OUTL-

LIN-

GND

LIN+

HP-SENSE

GND

OUTR+

VDD

OUTR-

RIN-

BYPASS

RIN+

SHUTDOWN

GND

OUTL+

VDD

OUTL-

LIN-

GND

LIN+

HP-SENSE

GND

OUTR+

VDD

OUTR-

RIN-

BYPASS

RIN+

PGND

(SOIC-16)

2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003

Data Sheet

Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

Pin Description

Pin Number Pin Name Function

G Package M Package

1 1 SHUTDOWN Shutdown mode enable pin, active High

2, 7, 19 2, 7, 15 GND Signal ground

3 3 OUTL+ Left channel positive output

4, 17 4, 13 VDD Power supply pin

5 5 OUTL- Left channel negative output

6 6 LIN- Left channel negative input

8 8 LIN+ Left channel positive input

9, 10, 11, 12 PGND Power ground, used for thermal release

13 9 RIN+ Right channel positive input

14 10 BYPASS Internal reference voltage pin, connect a 1.0µF capacitor to GND

15 11 RIN- Right channel negative input

16 12 OUTR- Right channel negative output

18 14 OUTR+ Right channel positive output

20 16 HP-SENSE SE, BTL Mode switch pin,

L – BTL Mode

H – SE Mode

2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003

Data Sheet

Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

Circuit Type E1: Lead Free

AA4003 -

Package Temperature

Range

Part Number Marking ID

Packing Type

Lead Free Green Lead Free Green

TSSOP-20

(EDP) -40 to 85 ℃

AA4003G-E1 AA4003G-G1 AA4003G AA4003GG Tube

AA4003GTR-E1 AA4003GTR-G1 AA4003G AA4003GG Tape & Reel

SOIC-16 -40 to 85 ℃

AA4003M-E1 AA4003M-G1 AA4003M-E1 AA4003M-G1 Tube

AA4003MTR-E1 AA4003MTR-G1 AA4003M-E1 AA4003M-G1 Tape & Reel

Package

G: TSSOP-20 (EDP)

TR: Tape and Reel

Blank: Tube

M: SOIC-16

Ordering Information

G1: Green

BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. Products with

"G1" suffix are available in green packages.

2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003

Data Sheet

Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

Absolute Maximum Ratings (Note 1)

Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.

These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in

the operation is not implied. Exposure to "Absolute Maximum Ratings" for extended periods may affect device reliability.

Note 2: Chip is soldered to 200mm2 copper (top side solder mask) of 1oz. on PCB with 8 x 0.5mm vias..

Recommended Operating Conditions

Parameter Symbol Min Max Unit

Supply Voltage VDD 2.7 5.5 V

Operating Ambient Temperature TA-40 85 oC

Parameter Symbol Value Unit

Supply Voltage VDD 6V

Input Voltage VIN -0.3 to VDD + 0.3 V

Power Dissipation PDInternally limited

Package Thermal Resistance RθJA

M Package 90

oC/W

G Package 50 (Note 2)

Operating Junction Temperature TJ150 oC

Storage Temperature Range TSTG -65 to 150 oC

Lead Temperature 1.6mm from Case for 10 Seconds TLEAD 260 oC

ESD (Human Body Model) 2000 V

ESD (Machine Model) 300 V

2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003

Data Sheet

Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

(VDD=5V, TA=25oC, CI=1µF, COUT=220µF and RI=RF=20kΩ unless otherwise specified. For SE Mode, HP_SENSE=5V,

P a r a m e t e r S y m b o l C o n d i t i o n s Min T y p M a x U n i t

Quiescent Current IDD

SE Mode, VIN=0, IO=0 310

BTL Mode, VIN=0, IO=0 620

Shutdown Current ISD VSHUTDOWN=5V 0.7 2.0 µA

HP_SENSE LOGIC

VIH 4V

VIL 0.8 V

SHUTDOWN LOGIC

VIH 3V

VIL 0.8 V

Thermal Shutdown Temperature 170 oC

Hysteresis Temperature Window 25 oC

SE Mode

Output Power PO

THD+N=1%, RL=32Ω 80

THD+N=10%, RL=32Ω 110

THD+N=1%, RL=16Ω 160

THD+N=10%, RL=16Ω 220

Total Harmonic Distortion + Noise THD+N PO=75mW, RL=32Ω, 0.2 %

Signal to Noise Ratio SNR PO=75mW, RL=32Ω, 90 dB

Crosstalk XTALK PO=75mW, RL=32Ω, f=1kHz -80 dB

Power Supply Rejection Ratio PSRR Cb=1µF, f=1KHz,

VRIPPLE=0.2VRMS, RL=16Ω60 dB

BTL Mode

Output Offset Voltage VOS VIN=0V, No load ±5±50 mV

Output Power PO

THD+N=1%, RL=4Ω 2

THD+N=10%, RL=4Ω 2.5

THD+N=1%, RL=8Ω 1.1

THD+N=10%, RL=8Ω 1.5

Total Harmonic Distortion + Noise THD+N PO=1W, RL=4Ω, 0.1 %

Signal to Noise Ratio SNR PO=1W, RL=8Ω, 95 dB

Crosstalk XTALK PO=1W, RL=8Ω, f=1kHz -80 dB

Power Supply Rejection Ratio PSRR Cb=1µF, f=1KHz,

VRIPPLE=0.2VRMS, RL=8Ω67 dB

Electrical Characteristics

for BTL Mode, HP_SENSE=0V. )

2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003

Data Sheet

Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

Typical Performance Characteristics

Figure 3.

Quiescent Current vs. Supply Voltage

Figure 4.

Quiescent Current vs. Ambient Temperature

Figure 5.

THD+N vs. Output Power Figure 6. THD+N vs. Output Power

10m 100m

1E-3

0.01

0.1

300m

THD+N (%)

Output Power (W)

VDD=5.0V, SE Mode

f=1kHz, LPF=30kHz

RL=16Ω

RL=32Ω

@ SE Mode @ BTL Mode

10m 100m 1

0.01

0.1

THD+N (%)

Output Power (W)

VDD=5.0V, BTL Mode

f=1kHz

LPF=30kHz

RL=4Ω

RL=8Ω

2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003

Data Sheet

Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

Typical Performance Characteristics

Figure 7.

THD+N vs. Output Power

Figure 8.

THD+N vs. Output Power

Figure 9. THD+N vs. Frequency

@ SE Mode

Figure 10. THD+N vs. Frequency

@ BTL Mode

@ SE Mode @ BTL Mode

100 1k 10k

0.01

0.1

20k

THD+N (%)

Frequency (Hz)

BTL Mode, VDD=5.0V

PO=1W, RL=8Ω

LPF=80kHz

100 1k 10k

0.01

0.1

20k20

THD+N (%)

Frequency (Hz)

SE Mode, VDD=5.0V

PO=75mW, RL=32Ω

LPF=80kHz, COUT=1000µF

100 1k 10k

0.01

0.1

20 20k

THD+N (%)

Frequency (Hz)

VDD=5.0V, BTL Mode

PO=1.5W, RL=4Ω

LPF=80kHz

100 1k 10k

0.01

0.1

20 20k

THD+N (%)

Frequency (Hz)

VDD=5.0V, SE Mode

COUT=1000µF, PO=150mW

RL=16Ω, LPF=80kHz

2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003

Data Sheet

Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

Typical Performance Characteristics (Continued)

Figure 11. Output Power vs. Resistor Load

0 10203040506070

200

400

600

800

VDD=5.0V, SE Mode

f=1kHz, LPF=30kHz

THD+N=10%

THD+N=1%

Output Power (mW)

Resistor Load (ohm)

@ SE Mode

Figure 12. Output Power vs. Resistor Load

0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0

0.0

0.5

1.0

1.5

2.0

2.5 VDD=5.0V, BTL Mode

f=1kHz, LPF=30kHz

THD+N=10%

THD+N=1%

Output Power (W)

Resistor Load (Ω)

@ BTL Mode

Figure 13. Output Power vs. Supply Voltage

@ SE Mode

Figure 14. Output Power vs. Supply Voltage

2.5 3.0 3.5 4.0 4.5 5.0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

BTL Mode, RL=4Ω

f=1kHz, LPF=30kHz

THD+N=10%

THD+N=1%

Output Power (mW)

Supply Voltage (V)

@ BTL Mode

2.5 3.0 3.5 4.0 4.5 5.0

100

150

200

250

SE Mode, RL=16Ω

f=1kHz, LPF=30kHz

THD+N=10%

THD+N=1%

Output Power (mW)

Supply Voltage (V)

2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003

Data Sheet

Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

Typical Performance Characteristics (Continued)

Figure 15.

PSRR vs. Frequency Figure 16. PSRR vs. Frequency

Figure 17.

Start-up Time vs. Bypass Capacitor Figure 18. Closed Loop Frequency Response

10 100 1k 10k 100k 1M 10M

-20

-16

-12

-8

-4

-280

-240

-200

-160

-120

-80

SE Mode, VDD=5.0V

RF=RI=20k, COUT=1000µF

Phase

Phase (deg)

Gain (dB)

Frequency (Hz)

Gain

0.20.40.60.81.0

200

400

600

800

1000

VDD=5.0V

Start-up Time (ms)

Bypass Capacitor (µF)

@ SE Mode @ BTL Mode

10 100 1k 10k

20k

VDD=5.0V, BTL Mode

RL=8Ω, Cb=1.0µF

VRIPPLE=0.2Vrms

PSRR (dB)

Frequency (Hz)

10 100 1k 10k

20k

PSRR (dB)

Frequency (Hz)

VDD=5.0V, SE Mode

RL=32Ω,Cb=1.0µF

VRIPPLE=0.2Vrms

2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003

Data Sheet

Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

Application Information

SE/BTL Mode, HP_SENSE Pin

The AA4003 can operate under 2 types of output

configuration, BTL (Bridged-Tied-Load) mode and SE

(Single-Ended) mode, determined by HP_SENSE pin's

logic level. (Here is the discussion about left channel

only, it equally applies to right channel.)

When HP_SENSE pin is held low which sets the chip

in BTL mode, the AMP2L unit is turned on. AMP2L

has fixed unity gain internally, AC signal at OUT+ is

180 degree phase shifted from OUT-. Because the DC

component (Output Bias voltage, approx 1/2 VDD)

between OUT+ and OUT- is canceled, there is no

necessity to use DC block capacitors for main speak. In

BTL mode, output voltage swing across main speaker

is about 2 times that in SE mode, so there is 4 times

output power compared to SE mode with same load

and input. (see Figure 19)

If applying high level to HP_SENSE pin which sets the

chip in SE mode, the AMP2L unit is in high impedance

state. There is no current loop between OUT+ and

OUT-, the main speak is naturally disabled without any

hardware change. The output audio signal rides on bias

voltage at OUT- (Output Bias voltage, approx 1/2

VDD) , so it has to use a capacitor COUT to block DC

bias and couple AC signal to headphone speak. (See

Figure 20)

It is recommended to connect HP_SENSE to the

headphone jack switch pin illustrated in Figure 19.

When headphone plug is not inserted, the voltage of

HP_SENSE pin is determined by voltage divider

formed by R1 and RPD. For given resistor's value in

Figure 19, R1=100kΩ, RPD=1.5kΩ, DC voltage at

HP_SENSE is about 74mV. AC signal equals output

amplitude of OUT- through COUT, so signal at

HP_SENSE node is 74mV DC plus AC signal. The

maximum peak-to-peak voltage at OUT- is no greater

than VDD (supply voltage 5.0V), so the positive

maximum voltage of HP_SENSE node will be no

greater than 2.5V+75mV≈2.575V, which is less than

HP_SENSE input high level minimum value (4.0V).

That means the chip is in BTL mode and there is no

risk of operation mode switch between SE and BTL.

When headphone plug is inserted, as the RPD is

disconnected from R1, the voltage of HP_SENSE pin

is pulled up by R1 to VDD and sets the chip in SE

mode.

HP_SENSE pin can also be connected to MCU I/O

port to control the mode switch through MCU.

It is necessary to note that AA4003 still can drive

headphone even in BTL mode because OUT- is always

active whatever the chip is in SE or BTL mode.

CIN, COUT

, Cb and CS (Power Supply) Selection

For input stages of AA4003, input capacitors CI is used

to accommodate different DC level between input

source and AA4003 bias voltage (about 2.31V). Input

capacitors CI and input resistors RI form a first order

High Pass Filter, which determines the lower corner

frequency according to the classic equation below,

Figure 19. Output Configuration for Left Channel

in BTL Mode

Figure 20. Output Configuration for Left Channel

in SE Mode

20kΩ

Left Out-

Left Out+

COUT

220µF

RPD

1.5kΩ

AMP1L

AMP2L

SLEEVE

HEADPHONE

JACK

100kΩ

HP_SENSE= Low Level

100kΩ

VDD

Main

Speak

20kΩ

Left Out-

Left Out+

COUT

220µF

AMP1L

AMP2L

100kΩ

VDD

Headphone

Speak

Main

Speak

HP_SENSE= High Level

RPD

1.5kΩ

2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003

Data Sheet

Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

Application Information (Continued)

.............................................(1)

Similarly, for output stage in SE mode, output

capacitor (COUT), and headphone load also form a first

order High Pass Filters, and its cut-off frequency is

determined by equation 2.

......................................(2)

The purpose of bypass capacitor (Cb) is to filter

internal noise, reduce harmonic distortion, and

improve power supply rejection ratio performance.

Tantalum or ceramic capacitor with low ESR is

recommended, and it should be placed as close as

possible to the chip in PCB layout. The chip will not

work until internal DC bias is set up completely. So the

size of Cb will also affect the chip start up time, which

is approx linearly proportional to the value of bypass

capacitor. For AA4003, here are various start-up times

for several typical capacitor values. (see Figure 17)

For AA4003 power supply, it is better to use an

individual power source generated from voltage

regulator split from video, digital circuit units in

system. The power supply bypass capacitors, CS, is

recommended to use one low ESR electrolytic

capacitor between 4.7µF to 10µF with a parallel 0.1µF

ceramic capacitor which is located close to the chip.

Setup Proper Gain, Design Example

The closed loop gain of AA4003 is determined by the

ratio of feedback resistor (RF) to input resistor (RI).

........................................................(3)

Example:

VDD=5V, RL=8Ω, BTL configuration, Desired output

power PO=1.0W (each channel), THD+N ≤1%.

Input signal, VIN=1.0VRMS from D-A converter.

Step 1,

To check if the chip can deliver 1W to 8Ω load with the

limitation of THD+N ≤1%, VDD=5V. From Figure 6,

Figure 12, AA4003 can deliver 1W to 8Ω load each

channel.

Step 2,

If yes, to calculate output voltage,

So pass-band gain, AV=VOUT/VIN=2.83x.

Step 3,

Assuming input resistor is 20kΩ, the feedback

resistor=20kΩ*1.415=28.3kΩ.. Select the closest

standard value 28kΩ.

Shutdown

AA4003 has a shutdown feature to reduce power

consumption. If apply high level to shutdown pin,

output amplifiers will be turned off, bias circuit is also

disabled, the maximum current drawn from VDD is less

than 2.0µA. A logic low level will enable the device.

Optimizing CLICK/POP Noise

The AA4003 includes optimized circuits to suppress

CLICK/POP noise during power up/power down

transition.

In BTL mode the AA4003 can effectively reduce most

common mode signal including CLICK/POP noise.

In SE mode, optimized ramp for rise/fall edge of BIAS

can significantly reduce click/pop noise due to charge

and/or discharge output capacitor (COUT).

Furthermore, increasing bypass capacitor value (Cb)

can slower ramp of charging bypass capacitor, prolong

start-up time, mask most of transient noises before bias

voltage is set up completely. It is recommended to use

1.0µF capacitor with lower ESR.

Cb (µF) Start up Time (ms)

0.33 340

0.47 420

1.0 970

RMSLOOUT VRPV 83.28*1 ==∗=

OUTHP

COL CR

f∗

CIL CR

f∗

2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003

Data Sheet

Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

Application Information (Continued)

Power Dissipation, Efficiency and Thermal

Design Consideration

For Class AB amplifiers, Formula 4 is the basic

equation of efficiency worked in BTL configuration,

.......................................................(4)

here VP is output peak voltage across the load.

Thermal dissipation becomes major concern when

delivering more output power especially in BTL mode.

The maximum power dissipation can be calculated by

following equation.

......................................(5)

Here TJMAX is maximum operating junction

temperature, 150oC, TA is ambient temperature, θ JA is

thermal resistance from junction to ambient, which is

50oC/W for TSSOP-20 (EDP), given in datasheet.

Assuming TA is 25oC, the maximum power dissipation

PDMAX is about 2.5W according to formula 6.

There is an other formula about power dissipation

which is determined by supply voltage and load

resistance.

......................................(6)

If power dissipation calculated in an application is

larger than that package permitted, there will be a need

to assemble an additional heat sink, or keep ambient

temperature around the chip low, or increase load

resistance, or decrease power supply voltage.

Here is an example. Assuming VDD=5.0V, RL=4Ω,

stereo in BTL mode,

per channel, total power dissipation PDTOTAL=2*

PDBTLMAX=2.53W. According to formula 6, maximum

ambient temperature is,

=150-50*2.53=23.5 oC

That is to say, if user wants AA4003 to delivery 2W

power per channel to 4Ω load at VDD=5.0V, BTL

mode, ambient temperature has to hold lower than

23.5oC. When junction temperature exceeds about

170oC, OTSD feature will be enabled, and shutdown

the device to limit total power dissipation.

There is an exposed thermal pad on bottom of the chip

to provide the direct thermal path from die to heat sink.

It is recommended to use copper on the surface of

Printed Circuit Board as heat sink. To dig some matrix

regular holes under chip, remove mask of this area

copper, and make sure to keep them contact well when

soldering on PCB are also recommended. (See Figure

21)

Recommended PCB Layout for AA4003

Using wide traces for power supply to reduce power

losses caused by parasitic resistance in all outputs is

useful to help releasing heat away from the chip. It is

recommended to place bypass capacitor, power supply

bypass capacitors as close as possible to the chip.

Figure 21 and Figure 22 show the recommended layout

for double layer PCB.

AJMAX

DMAX

−

DBTLMAX R

DBTLMAX 266.1

414.3

522

DBTLMAXJAJMAXA PTT

∗

−

2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003

Data Sheet

Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

Application Information (Continued)

Figure 21. Copper and Holes under Part

Figure 22. Top Route and Silk Screens

2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003

Data Sheet

Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

Typical Application

Figure 23. Typical Application Circuit of AA4003 (M Package)

20kΩ

OUTL-

OUTL+

COUT

220µF1.5kΩ

AMP1L

AMP2L

To HP-Sense circuit

SLEEVE

HEADPHONE

JACK

20kΩ

OUTR-

OUTR+

COUT

220µF

1.5kΩ

AMP1R

AMP2R

VDD

10µF

Left IN

1uF

1.0µF+

100kΩ

1µF

Right IN

To control pin

10 BYPASS

2,7,15

4,13

1 SHUTDOWN

HP-SENSE

LIN-

LIN+

RIN-

RIN+

RPD

VDD

2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003

Data Sheet

Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

TSSOP-20(EDP) Unit: mm(inch)

Mechanical Dimensions

0.650(0.026)TYP

6.200(0.244)

6.600(0.260)

#1 PIN

6.400(0.252)

6.600(0.260)

INDEX

0.750(0.030)

0.850(0.033)Dp

0.000(0.000)

0.100(0.004)

2.900(0.114)

3.100(0.122)

4.100(0.161)

4.300(0.169)

0.200(0.008)

0.280(0.011)

0.050(0.002)

0.150(0.006)

0.900(0.035)

1.050(0.041)

1.200(0.047)

MAX

0.340(0.013)

0.540(0.021)

10°

14°

0.250(0.010)TYP

0.450(0.018)

0.750(0.030) 1.000(0.039)

REF

0°

8°

R0.090(0.004)MIN

TOP & BOTTOM

0.200(0.008)MIN

4.300(0.169)

4.500(0.177)

0.100(0.004)

0.190(0.007)

EXPOSED PAD

2W STEREO AUDIO POWER AMPLIFIER WITH SHUTDOWN AA4003

Data Sheet

Aug. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

Mechanical Dimensions (Continued)

SOIC-16 Unit: mm(inch)

7°

10.000(0.394)

6.040(0.238)

0.406(0.016)

20:1

1.650(0.065)

0.700(0.028)

7°

1°

5°

1.000(0.039)

S 1.000(0.039)

0.200(0.008)

20:1

50:1

C-C

0.250(0.010)

0.200(0.008)MIN

0.500(0.020)

0.600(0.024)

0.250(0.010)

Depth 0.060(0.002)

0.100(0.004)

2.000(0.079)

1.300(0.051)

1.000(0.039)

1.270(0.050)

Depth 0.200(0.008)

0.250(0.010)

0.150(0.006)

R0.200(0.008)

0.203(0.008)

3.940(0.155)

3°

8°

9.5°

8°

7°

0.400(0.016)×45°

IMPORTANT NOTICE

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-

cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility fo r use of any its products for any

particular purpose, nor does BCD Semiconductor Man ufacturing Limited assume any liability arising out of the application or use

of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or

other rights nor the rights of others.

- Wafer Fab

Shanghai SIM-BCD Semiconductor Manufacturing Limited

800, Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008

BCD Semiconductor Manufacturing Limited

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4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei,

Taiwan

Tel: +886-2-2656 2808

Fax: +886-2-2656 2806

USA Office

BCD Semiconductor Corporation

30920 Huntwood Ave. Hayward,

CA 94544, U.S.A

Tel : +1-510-324-2988

Fax: +1-510-324-2788

- IC Design Group

Advanced Analog Circuits (Shanghai) Corporation

8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6495 9539, Fax: +86-21-6485 9673

BCD Semiconductor Manufacturing Limited

http://www.bcdsemi.com

BCD Semiconductor Manufacturing Limited

IMPORTANT NOTICE

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-

cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any

particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use

of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or

other rights nor the rights of others.

- Wafer Fab

Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008

MAIN SITE

REGIONAL SALES OFFICE

Shenzhen Office

Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office

Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen,

518026, China

Tel: +86-755-8826 7951

Fax: +86-755-8826 7865

Taiwan Office

BCD Semiconductor (Taiwan) Company Limited

4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei,

Taiwan

Tel: +886-2-2656 2808

Fax: +886-2-2656 2806

USA Office

BCD Semiconductor Corp.

30920 Huntwood Ave. Hayward,

CA 94544, USA

Tel : +1-510-324-2988

Fax: +1-510-324-2788

- Headquarters

BCD Semiconductor Manufacturing Limited

No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China

Tel: +86-21-24162266, Fax: +86-21-24162277