LMH6714, LMH6720
LMH6722, LMH6722-Q1
www.ti.com
SNOSA39G –NOVEMBER 2002–REVISED APRIL 2013
LMH6714/ LMH6720/ LMH6722/ LMH6722Q Wideband Video Op Amp; Single, Single with
Shutdown and Quad
Check for Samples: LMH6714,LMH6720,LMH6722,LMH6722-Q1
1FEATURES DESCRIPTION
The LMH6714/LMH6720/LMH6722 series combine
2• 400MHz (AV= +2V/V, VOUT = 500mVPP)−3dB Texas Instruments' VIP10 high speed complementary
BW bipolar process with Texas Instruments' current
• 250MHz (AV= +2V/V, VOUT = 2VPP) -3dB BW feedback topology to produce a very high speed op
• 0.1dB Gain Flatness to 120MHz amp. These amplifiers provide a 400MHz small signal
bandwidth at a gain of +2V/V and a 1800V/μs slew
• Low Power: 5.6mA rate while consuming only 5.6mA from ±5V supplies.
• TTL Compatible Shutdown Pin (LMH6720) The LMH6714/LMH6720/LMH6722 series offer
• Very Low Diff. Gain, Phase: 0.01%, 0.01° exceptional video performance with its 0.01% and
(LMH6714) 0.01° differential gain and phase errors for NTSC and
•−58 HD2/ −70 HD3 at 20MHz PAL video signals while driving a back terminated
75Ωload. They also offer a flat gain response of
• Fast Slew Rate: 1800V/μs0.1dB to 120MHz. Additionally, they can deliver 70mA
• Low Shutdown Current: 500uA (LMH6720) continuous output current. This level of performance
• 11ns Turn on Time (LMH6720) makes them an ideal op amp for broadcast quality
• 7ns Shutdown Time (LMH6720) video systems.
• Unity Gain Stable The LMH6714/LMH6720/LMH6722's small packages
(SOIC, SOT-23 and WSON), low power requirement,
• Improved Replacement for low noise and distortion allow the
CLC400,401,402,404,406 and 446 (LMH6714) LMH6714/LMH6720/LMH6722 to serve portable RF
• Improved Replacement for CLC405 (LMH6720) applications. The high impedance state during
• Improved Replacement for CLC415 (LMH6722) shutdown makes the LMH6720 suitable for use in
multiplexing multiple high speed signals onto a
• LMH6722QSD is AEC-Q100 Grade 1 Qualified shared transmission line. The LMH6720 is also ideal
and is Manufactured on an Automotive Grade for portable applications where current draw can be
Flow reduced with the shutdown function.
APPLICATIONS
• HDTV, NTSC & PAL Video Systems
• Video Switching and Distribution
• Wideband Active Filters
• Cable Drivers
• High Speed Multiplexer (LMH6720)
• Programmable Gain Amplifier (LMH6720)
• Automotive (LMH6722Q)
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2002–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
1 2 3 4
0
0.01
0.02
0.03
0.04
0.05
DIFFERENTIAL GAIN (%)
VIDEO LOADS (150: EACH)
0
0.01
0.02
0.03
0.04
0.05
DIFFERENTIAL PHASE (°)
PHASE
GAIN
110 100 1000
FREQUENCY (MHz)
GAIN (dB)
-8
-7
-6
-5
-4
-3
-2
-1
0
1
2
-225
-180
-135
-90
-45
0
PHASE (°)
AV = 1, RF = 600:
AV = 2, RF = 300:
AV = 6, RF = 200:
GAIN
PHASE
VO = 500mVPP
LMH6714, LMH6720
LMH6722, LMH6722-Q1
SNOSA39G –NOVEMBER 2002–REVISED APRIL 2013
www.ti.com
Typical Performance
Differential Gain and Phase vs. Number of Video Loads
Non-Inverting Small Signal Frequency Response (LMH6714)
Figure 1. Figure 2.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
ESD Tolerance(3) Human Body Model 2000V
Machine Model 200V
VCC ±6.75V
IOUT See(4)
Common Mode Input Voltage ±VCC
Differential Input Voltage 2.2V
Maximum Junction Temperature +150°C
Storage Temperature Range −65°C to +150°C
Lead Temperature (soldering 10 sec) +300°C
Storage Temperature Range −65°C to +150°C
Shutdown Pin Voltage(5) +VCC to VCC/2-1V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For specific specifications, see the Electrical
Characteristics tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The maximum output current (IOUT) is determined by device power dissipation limitations. See the POWER DISSIPATION section for
more details.
(5) The shutdown pin is designed to work between 0 and VCC with split supplies (VCC = -VEE). With single supplies (VEE = ground) the
shutdown pin should not be taken below VCC/2.
2Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: LMH6714 LMH6720 LMH6722 LMH6722-Q1
LMH6714, LMH6720
LMH6722, LMH6722-Q1
www.ti.com
SNOSA39G –NOVEMBER 2002–REVISED APRIL 2013
Operating Ratings(1)
Thermal Resistance Package (θJA)
5-Pin SOT-23 (DBV) 232°C/W
6-Pin SOT-23 (DBV) 198°C/W
8-Pin SOIC (D) 145°C/W
14-Pin SOIC (D) 130°C/W
14-Pin TSSOP (PW) 160°C/W
14-Pin WSON (NHK) 46°C/W
Operating Temperature LMH6722Q −40°C to 125°C
All others −40°C to 85°C
Supply Voltage Range 8V (±4V) to 12.5V (±6.25V)
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For specific specifications, see the Electrical
Characteristics tables.
Electrical Characteristics
Unless specified, AV= +2, RF= 300Ω: VCC = ±5V, RL= 100Ω, LMH6714/LMH6720/LMH6722. Boldface limits apply at
temperature extremes.
Symbol Parameter Conditions Min(1) Typ(2) Max(1) Units
Frequency Domain Response
SSBW −3dB Bandwidth VOUT = 0.5VPP 345 400 MHz
LSBW −3dB Bandwidth VOUT = 2.0VPP 200 250 MHz
LSBW −3dB Bandwidth, LMH6722 VOUT = 2.0VPP 170 250 MHz
TSSOP package only
Gain Flatness VOUT = 2VPP
GFP Peaking DC to 120MHz 0.1 dB
GFR Rolloff DC to 120MHz 0.1 dB
LPD Linear Phase Deviation DC to 120MHz 0.5 deg
DG Differential Gain RL= 150Ω, 4.43MHz (LMH6714) 0.01 %
DG Differential Gain RL= 150Ω, 4.43MHz (LMH6720) 0.02 %
DP Differential Phase RL= 150Ω, 4.43MHz 0.01 deg
Time Domain Response
TRS Rise and Fall Time .5V Step 1.5 ns
TRL 2V Step 2.6 ns
tsSettling Time to 0.05% 2V Step 12 ns
SR Slew Rate 6V Step 1200 1800 V/µs
Distortion and Noise Response
HD2 2nd Harmonic Distortion 2VPP, 20MHz −58 dBc
HD3 3rd Harmonic Distortion 2VPP, 20MHz −70 dBc
IMD 3rd Order Intermodulation 10MHz, POUT = 0dBm −78 dBc
Products
Equivalent Input Noise
VN Non-Inverting Voltage >1MHz 3.4 nV/√Hz
NICN Inverting Current >1MHz 10 pA/√Hz
ICN Non-Inverting Current >1MHz 1.2 pA/√Hz
(1) All limits are specified by testing, design, or statistical analysis.
(2) Typical values represent the most likely parametric norm at the time of characterization. Actual typical values may vary over time and
will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production
material.
Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LMH6714 LMH6720 LMH6722 LMH6722-Q1
LMH6714, LMH6720
LMH6722, LMH6722-Q1
SNOSA39G –NOVEMBER 2002–REVISED APRIL 2013
www.ti.com
Electrical Characteristics (continued)
Unless specified, AV= +2, RF= 300Ω: VCC = ±5V, RL= 100Ω, LMH6714/LMH6720/LMH6722. Boldface limits apply at
temperature extremes.
Symbol Parameter Conditions Min(1) Typ(2) Max(1) Units
Static, DC Performance
VIO Input Offset Voltage ±0.2 ±6 mV
±8
DVIO Average Drift 8 μV/°C
IBN Input Bias Current Non-Inverting ±1 ±10 µA
±15
DIBN Average Drift 4 nA/°C
IBI Input Bias Current Inverting −4 ±12 µA
±20
DIBI Average Drift 41 nA/°C
PSRR Power Supply Rejection Ratio DC 48 58 dB
47
CMRR Common Mode Rejection DC 48 54 dB
Ratio 45
ICC Supply Current RL=∞LMH6714 4.5 5.6 7.5
LMH6720 3 8 mA
LMH6722 18 22.5 30
15 32
ICCI Supply Current During LMH6720 500 670 μA
Shutdown
Miscellaneous Performance
RIN Input Resistance Non-Inverting 2 MΩ
CIN Input Capacitance Non-Inverting 1.0 pF
ROUT Output Resistance Closed Loop 0.06 Ω
VOUT Output Voltage Range RL=∞±3.5 ±3.9
±3.4 V
RL= 100Ω±3.6 ±3.8
±3.4
CMIR Input Voltage Range Common Mode ±2.2 V
IOUT Output Current(3) VIN = 0V, Max Linear 50 70 mA
Current
OFFMAX Voltage for Shutdown LMH6720 0.8 V
ONMIN Voltage for Turn On LMH6720 2.0 V
IIH Current Turn On LMH6720, SD = 2.0V −20 2 20 μA
−30 30
IIL Current Shutdown LMH6720, SD = .8V −600 −400 −100 μA
IOZ ROUT Shutdown LMH6720, SD = .8V 0.2 1.8 MΩ
ton Turn on Time LMH6720 11 ns
toff Turn off Time LMH6720 7 ns
(3) The maximum output current (IOUT) is determined by device power dissipation limitations. See the POWER DISSIPATION section for
more details.
4Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: LMH6714 LMH6720 LMH6722 LMH6722-Q1
V+
1
2
3
45
6
7
8
N/C
-IN
+IN
V-
OUTPUT
N/C
+
-
N/C
V+
1
2
3
45
6
7
8
N/C
-IN
+IN
V-
OUTPUT
N/C
SD
+
-
OUT
V-
+IN
V+
-IN
+-
1
2
3
5
4
OUTPUT
V-
+IN
V+
-IN
+-
1
2
3
5
4
6
SD
LMH6714, LMH6720
LMH6722, LMH6722-Q1
www.ti.com
SNOSA39G –NOVEMBER 2002–REVISED APRIL 2013
CONNECTION DIAGRAMS
Figure 3. 5-Pin SOT-23 Figure 4. 6-Pin SOT-23 Figure 5. 14-Pin SOIC, TSSOP
(LMH6714) (Top View) (LMH6720) (Top View) and WSON (LMH6722) (Top View)
See Package Number DBV See Package Number DBV See Package Numbers D, PW,
and NHK
Figure 6. 8-Pin SOIC (LMH6714) (Top View) Figure 7. 8-Pin SOIC (LMH6720) (Top View)
See Package Number D See Package Number D
Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LMH6714 LMH6720 LMH6722 LMH6722-Q1
110 100
FREQUENCY (MHz)
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
DISTORTION (dBc)
HD2
HD3
VO = 2VPP
10 100 100
0
FREQUENCY (MHz)
-2
-1
0
1
2
GAIN (dB)
VO = .5VPP
AV = -1V/V
RF = 300:
VO = 4VPP
VO = 2VPP
GAIN
PHASE
-8
-7
-6
-5
-4
-3
-225
-180
-135
-90
-45
0
PHASE (°)
110 100 1000
FREQUENCY (MHz)
GAIN (dB)
-8
-7
-6
-5
-4
-3
-2
-1
0
1
2
-225
-180
-135
-90
-45
0
PHASE (°)
RF = 300:
AV = 2V/V
GAIN
PHASE
VO = .5VPP
VO = 1VPP
VO = 4VPP
VO = 2VPP
110 100 1000
FREQUENCY (MHz)
-8
-7
-6
-5
-4
-3
-2
-1
0
1
2
GAIN (dB)
AV = -1
AV = -2
AV = -6
VO = 2VPP
RF = 300:
-225
-180
-135
-90
-45
0
PHASE (°)
110 100 1000
FREQUENCY (MHz)
GAIN (dB)
-8
-7
-6
-5
-4
-3
-2
-1
0
1
2
-225
-180
-135
-90
-45
0
PHASE (°)
AV = 1, RF = 600:
AV = 2, RF = 300:
AV = 6, RF = 200:
GAIN
PHASE
VO = 500mVPP
110 100 1000
FREQUENCY (MHz)
GAIN (dB)
-8
-7
-6
-5
-4
-3
-2
-1
0
1
2
-225
-180
-135
-90
-45
0
PHASE (°)
AV = 2,
RF = 300:
AV = 1, RF = 600:
AV = 6, RF = 200:
GAIN
PHASE
VO = 2VPP
LMH6714, LMH6720
LMH6722, LMH6722-Q1
SNOSA39G –NOVEMBER 2002–REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics
(V+= +5V, V−=−5V, AV= 2, RF= 300Ω, RL= 100ΩUnless Specified).
Non-Inverting Small Signal Frequency Response Non-Inverting Large Signal Frequency Response
Figure 8. Figure 9.
Inverting Frequency Response Non-Inverting Frequency Response vs. VO
Figure 10. Figure 11.
Inverting Frequency Response vs. VOHarmonic Distortion vs. Frequency
Figure 12. Figure 13.
6Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: LMH6714 LMH6720 LMH6722 LMH6722-Q1
0510 15 20 25 30 35 40 45 50
-4
-3
-2
-1
0
1
2
3
4
VOUT (V)
TIME (nS)
AV = 2V/V
12 3 4
0
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
DIFFERENTIAL GAIN (%)
NUMBER OF VIDEO LOADS
GAIN PHASE
0
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
DIFFERENTIAL PHASE (°)
0
0 0.5 1 1.5 2 2.5 3 3.5 4
-100
DISTORTION (dBc)
VOUT (VPP)
-90
-80
-70
-60
-50
-40
-30
-20
-10
50MHz
10MHz
5MHz
00.5 1 1.5 22.5 33.5 4
-100
0
DISTORTION (dBc)
VOUT (VPP)
-90
-80
-70
-60
-50
-40
-30
-20
-10
50MHz
10MHz
5MHz
LMH6714, LMH6720
LMH6722, LMH6722-Q1
www.ti.com
SNOSA39G –NOVEMBER 2002–REVISED APRIL 2013
Typical Performance Characteristics (continued)
(V+= +5V, V−=−5V, AV= 2, RF= 300Ω, RL= 100ΩUnless Specified).
2nd Harmonic Distortion vs. VOUT 3rd Harmonic Distortion vs. VOUT
Figure 14. Figure 15.
DG/DP (LMH6714) DG/DP (LMH6720)
Figure 16. Figure 17.
DG/DP (LMH6722) Large Signal Pulse Response
Figure 18. Figure 19.
Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: LMH6714 LMH6720 LMH6722 LMH6722-Q1
0
0.1 110 100 1000
FREQUENCY (MHz)
-60
-50
-40
-30
-20
-10
CMRR (dB)
110 100 1000
FREQUENCY (MHz)
-8
-7
-6
-5
-4
-3
-2
-1
0
1
GAIN (dB)
RF = 400:
RF = 600:
RF = 147:
RF = 300:
AV = 2V/V
VOUT = 0.5VPP
0.1 1 10 100 1000
FREQUENCY (MHz)
-70
-60
-50
-40
-30
-20
-10
0
PSRR (dB)
-PSRR
+PSRR
130
0.01 11000
FREQUENCY (MHz)
50
80
TRANSIMPEDANCE (dB:)
100
10
0.1
110
100
70
60
90
120
MAGNITUDE
PHASE
-180
-45
-90
-135
0
PHASE (°)
0 5 10 15 20 25 30 35 40 45 50
-1.5
-1
-0.5
0
0.5
1
1.5
VOUT (V)
TIME (nS)
AV = -1V/V
RF = 300:
AV = +2V/V
RF = 300:
0.01 11000
FREQUENCY (MHz)
0.01
1
1000
ROUT (:)
100
10
0.1
100
10
0.1
LMH6714, LMH6720
LMH6722, LMH6722-Q1
SNOSA39G –NOVEMBER 2002–REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics (continued)
(V+= +5V, V−=−5V, AV= 2, RF= 300Ω, RL= 100ΩUnless Specified).
Small Signal Pulse Response Closed Loop Output Resistance
Figure 20. Figure 21.
Open Loop Transimpedance Z(s) PSRR vs. Frequency
Figure 22. Figure 23.
CMRR vs. Frequency Frequency Response vs. RF
Figure 24. Figure 25.
8Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: LMH6714 LMH6720 LMH6722 LMH6722-Q1
1100 10k 1M
FREQUENCY (Hz)
100k1k
10
VOLTAGE NOISE (nV/ Hz)
VOLTAGE
INVERTING CURRENT
NON-INVERTING
CURRENT
1
10
100
1000
1
10
100
1000
CURRENT NOISE (pA/ Hz)
-15 -12 -9 -6 -3 0 3 6 9 12 15
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
SPURIOUS SIGNAL LEVEL (dBc)
OUTPUT POWER FOR EACH TONE (dBmW)
TWO EQUAL POWER
TONES CENTERED AT
LISTED FREQUENCY
100MHz
20MHz
5MHz
10MHz
0.1 1 100 100 1000
FREQUENCY (MHz)
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
CROSSTALK (dBc)
C
D
A
B
-40 -20 020 40 60 80 100
TEMPERATURE (°C)
-1.4
-1.2
-1
-0.8
-0.6
-0.4
-0.2
0
VOS (mV)
-8
-7
-6
-5
-4
-3
-2
-1
0
INPUT BIAS CURRENT (PA)
-9
IBN
IBI VOS
0.1 1 10 100 1000
FREQUENCY (MHz)
1
2
3
4
5
6
7
8
MAXIMUM VOUT (VPP)
LMH6714, LMH6720
LMH6722, LMH6722-Q1
www.ti.com
SNOSA39G –NOVEMBER 2002–REVISED APRIL 2013
Typical Performance Characteristics (continued)
(V+= +5V, V−=−5V, AV= 2, RF= 300Ω, RL= 100ΩUnless Specified).
DC Errors vs. Temperature Maximum VOUT vs. Frequency
Figure 26. Figure 27.
Crosstalk vs. Frequency (LMH6722)
3rd Order Intermodulation vs. Output Power for each channel with all others active
Figure 28. Figure 29.
Noise vs. Frequency
Figure 30.
Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Links: LMH6714 LMH6720 LMH6722 LMH6722-Q1
1 2 3 4 5 6 7 8 9 10
0
100
200
300
400
500
600
700
SUGGESTED RF (:)
GAIN (V/V)
110 100 1000
FREQUENCY (MHz)
-8
-7
-6
-5
-4
-3
-2
-1
0
1
GAIN (dB)
RF = 400:
RF = 600:
RF = 147:
RF = 300:
AV = 2V/V
VOUT = 0.5VPP
LMH6714, LMH6720
LMH6722, LMH6722-Q1
SNOSA39G –NOVEMBER 2002–REVISED APRIL 2013
www.ti.com
APPLICATION SECTION
FEEDBACK RESISTOR SELECTION
One of the key benefits of a current feedback operational amplifier is the ability to maintain optimum frequency
response independent of gain by using appropriate values for the feedback resistor (RF). The Electrical
Characteristics and Typical Performance plots specify an RFof 300Ω, a gain of +2V/V and ±5V power supplies
(unless otherwise specified). Generally, lowering RFfrom it's recommended value will peak the frequency
response and extend the bandwidth while increasing the value of RFwill cause the frequency response to roll off
faster. Reducing the value of RFtoo far below it's recommended value will cause overshoot, ringing and,
eventually, oscillation.
Figure 31. Frequency Response vs. RF
Figure 31 shows the LMH6714/LMH6720/LMH6722's frequency response as RFis varied (RL= 100Ω, AV= +2).
This plot shows that an RFof 147Ωresults in peaking. An RFof 300Ωgives near maximal bandwidth and gain
flatness with good stability. An RFof 400Ωgives excellent stability with only a small bandwidth penalty. Since all
applications are slightly different it is worth some experimentation to find the optimal RFfor a given circuit. Note
that it is not possible to use a current feedback amplifier with the output shorted directly to the inverting input.
The buffer configuration of the LMH6714/LMH6720/LMH6722 requires a 600Ωfeedback resistor for stable
operation.
For more information see Application Note OA-13 (SNOA366) which describes the relationship between RFand
closed-loop frequency response for current feedback operational amplifiers. The value for the inverting input
impedance for the LMH6714/LMH6720/LMH6722 is approximately 180Ω. The LMH6714/LMH6720/LMH6722 is
designed for optimum performance at gains of +1 to +6 V/V and −1to−5V/V. When using gains of ±7V/V or
more the low values of RGrequired will make inverting input impedances very low.
When configuring the LMH6714/LMH6720/LMH6722 for gains other than +2V/V, it is usually necessary to adjust
the value of the feedback resistor. Figure 32 and Figure 33 provide recommended feedback resistor values for a
number of gain selections.
Figure 32. RFvs. Non-Inverting Gain
10 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: LMH6714 LMH6720 LMH6722 LMH6722-Q1
1 2 3 4 5 6 7 8 9 10
0
50
100
150
200
250
300
350
400
450
SUGGESTED RF (:)
GAIN (-V/V)
LMH6714, LMH6720
LMH6722, LMH6722-Q1
www.ti.com
SNOSA39G –NOVEMBER 2002–REVISED APRIL 2013
In the Figure 32 and Figure 33 charts, the recommended value of RFis depicted by the solid line, which starts
high, decreases to 200Ωand begins increasing again. The reason that a higher RFis required at higher gains is
the need to keep RGfrom decreasing too far below the output impedance of the input buffer. For the
LMH6714/LMH6720/LMH6722 the output resistance of the input buffer is approximately 180Ωand 50Ωis a
practical lower limit for RG. Due to the limitations on RGthe LMH6714/LMH6720/LMH6722 begins to operate in a
gain bandwidth limited fashion for gains of ±5V/V or greater.
Figure 33. RFvs. Inverting Gain
ACTIVE FILTERS
When using any current feedback Operational Amplifier as an active filter it is important to be very careful when
using reactive components in the feedback loop. Anything that reduces the impedance of the negative feedback,
especially at higher frequencies, will almost certainly cause stability problems. Likewise capacitance on the
inverting input needs to be avoided. See Application Notes OA-07 (SNOA365) and OA-26 (SNOA387) for more
information on Active Filter applications for Current Feedback Op Amps.
Figure 34. Enable/Disable Operation
ENABLE/DISABLE OPERATION USING ±5V SUPPLIES (LMH6720 ONLY)
The LMH6720 has a TTL logic compatible disable function. Apply a logic low (<.8V) to the DS pin and the
LMH6720 is disabled. Apply a logic high (>2.0V), or let the pin float and the LMH6720 is enabled. Voltage, not
current, at the Disable pin determines the enable/disable state. Care must be exercised to prevent the disable pin
voltage from going more than .8V below the midpoint of the supply voltages (0V with split supplies, VCC/2 with
single supplies) doing so could cause transistor Q1 to Zener resulting in damage to the disable circuit. The core
amplifier is unaffected by this, but disable operation could become slower as a result.
Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Links: LMH6714 LMH6720 LMH6722 LMH6722-Q1
+5V
C4 C2
.01PF
6.8PF
.1PF
C1
C3
.01PF
6.8PF
C5
+
-
50:
50:
ROUT
RIN OUT
IN
300:
300:
RF
RG
-5V
LMH6714, LMH6720
LMH6722, LMH6722-Q1
SNOSA39G –NOVEMBER 2002–REVISED APRIL 2013
www.ti.com
Disabled, the LMH6720 inputs and output become high impedances. While disabled the LMH6720 quiescent
current is approximately 500μA. Because of the pull up resistor on the disable circuit the ICC and IEE currents are
not balanced in the disabled state. The positive supply current (ICC) is approximately 500μA while the negative
supply current (IEE) is only 200μA. The remaining IEE current of 300μA flows through the disable pin.
The disable function can be used to create analog switches or multiplexers. Implement a single analog switch
with one LMH6720 positioned between an input and output. Create an analog multiplexer with several
LMH6720's. The LMH6720 is at it's best at a gain of 1 for multiplexer applications because there is no RGto
shunt signals to ground.
DISABLE LIMITATIONS (LMH6720 ONLY)
The feedback Resistor (RF) limits off isolation in inverting gain configurations. During shutdown the impedance of
the LMH6720 inputs and output become very high (>1MΩ), however RFand RGare the dominant factor for
effective output impedance.
Do not apply voltages greater than +VCC or less than 0V (VCC/2 single supply) to the disable pin. The input ESD
diodes will also conduct if the signal leakage through the feedback resistors brings the inverting input near either
supply rail.
Figure 35. Typical Application with Suggested Supply Bypassing
LAYOUT CONSIDERATIONS
Whenever questions about layout arise, use the evaluation board as a guide. The following Evaluation boards
are available with sample parts:
LMH6714 SOT-23 LMH730216
SOIC LMH730227
LMH6720 SOT-23 LMH730216
SOIC LMH730227
LMH6722 SOIC LMH730231
TSSOP LMH730131
To reduce parasitic capacitances, the ground plane should be removed near the input and output pins. To
reduce series inductance, trace lengths of components in the feedback loop should be minimized. For long signal
paths controlled impedance lines should be used, along with impedance matching at both ends.
Bypass capacitors should be placed as close to the device as possible. Bypass capacitors from each rail to
ground are applied in pairs. The larger electrolytic bypass capacitors can be located anywhere on the board, the
smaller ceramic capacitors should be placed as close to the device as possible. In addition Figure 35 shows a
capacitor (C1) across the supplies with no connection to ground. This capacitor is optional, however it is required
for best 2nd Harmonic suppression. If this capacitor is omitted C2 and C3 should be increased to .1μF each.
12 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: LMH6714 LMH6720 LMH6722 LMH6722-Q1
LMH6714, LMH6720
LMH6722, LMH6722-Q1
www.ti.com
SNOSA39G –NOVEMBER 2002–REVISED APRIL 2013
VIDEO PERFORMANCE
The LMH6714/LMH6720/LMH6722 has been designed to provide excellent performance with both PAL and
NTSC composite video signals. Performance degrades as the loading is increased, therefore best performance
will be obtained with back terminated loads. The back termination reduces reflections from the transmission line
and effectively masks capacitance from the amplifier output stage. While all parts offer excellent video
performance the LMH6714 and LMH6722 are slightly better than the LMH6720.
WIDE BAND DIGITAL PROGRAMMABLE GAIN AMPLIFIER (LMH6720 ONLY)
Figure 36. Wideband Digitally Controlled Programmable Gain Amplifier
Channel Switching
Figure 37. PGA Output
As shown in Figure 36 and Figure 37 the LMH6720 can be used to construct a digitally controlled programmable
gain amplifier. Each amplifier is configured to provide a digitally selectable gain. To provide for accurate gain
settings, 1% or better tolerance is recommended on the feedback and gain resistors. The gain provided by each
digital code is arbitrary through selection of the feedback and gain resistor values.
Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Links: LMH6714 LMH6720 LMH6722 LMH6722-Q1
LMH6714, LMH6720
LMH6722, LMH6722-Q1
SNOSA39G –NOVEMBER 2002–REVISED APRIL 2013
www.ti.com
AMPLITUDE EQUALIZATION
Sending signals over coaxial cable greater than 50 meters in length will attenuate high frequency signal
components much more than lower frequency components. An equalizer can be made to pre emphasize the
higher frequency components so that the final signal has less distortion. This process can be done at either end
of the cable. The circuit in Figure 38 shows a receiver with some additional components in the feedback loop to
equalize the incoming signal. The RC networks peak the signal at higher frequencies. This peaking is a
piecewise linear approximation of the inverse of the frequency response of the coaxial cable. Figure 39 shows
the effect of this equalization on a digital signal that has passed through 150 meters of coaxial cable. Figure 40
shows a Bode plot of the frequency response of the circuit in Figure 38 along with equations needed to design
the pole and zero frequencies. Figure 41 shows a network analyzer plot of an LMH6714/LMH6720/LMH6722 with
the following component values:
RG= 309Ω
R1 = 450Ω
C1 = 470pF
R2 = 91Ω
C2 = 68pF
Figure 38. Equalizer Circuit Schematic
Figure 39. Digital Signal without and with Equalization
14 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: LMH6714 LMH6720 LMH6722 LMH6722-Q1
10
10k 1M 1G
FREQUENCY (Hz)
-6
0
GAIN (dB)
100M
10M
100k
6
4
-2
-4
2
8
LMH6714, LMH6720
LMH6722, LMH6722-Q1
www.ti.com
SNOSA39G –NOVEMBER 2002–REVISED APRIL 2013
Figure 40. Design Equations
Figure 41. Equalizer Frequency Response
POWER DISSIPATION
Follow these steps to determine the Maximum power dissipation for the LMH6714/LMH6720/LMH6722:
1. Calculate the quiescent (no load) power: PAMP = ICC (VCC -VEE)
2. Calculate the RMS power at the output stage: POUT (RMS) = ((VCC - VOUT (RMS)) * IOUT (RMS)), where VOUT
and IOUT are the voltage and current across the external load.
3. Calculate the total RMS power: PT= PAMP + POUT
The maximum power that the LMH6714/LMH6720/LMH6722, package can dissipate at a given temperature can
be derived with the following equation:
PMAX = (150° - TA)/ θJA, where TA= Ambient temperature (°C) and θJA = Thermal resistance, from junction to
ambient, for a given package (°C/W). For the SOIC package θJA is 145°C/W, for the 5-pin SOT-23 it is 232°C/W.
Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: LMH6714 LMH6720 LMH6722 LMH6722-Q1
LMH6714, LMH6720
LMH6722, LMH6722-Q1
SNOSA39G –NOVEMBER 2002–REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision F (April 2013) to Revision G Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 15
16 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: LMH6714 LMH6720 LMH6722 LMH6722-Q1
PACKAGE OPTION ADDENDUM
www.ti.com 1-Nov-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LMH6714MA NRND SOIC D 8 95 TBD Call TI Call TI -40 to 85 LMH67
14MA
LMH6714MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH67
14MA
LMH6714MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH67
14MA
LMH6714MF NRND SOT-23 DBV 5 1000 TBD Call TI Call TI -40 to 85 A95A
LMH6714MF/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A95A
LMH6714MFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A95A
LMH6720MA NRND SOIC D 8 95 TBD Call TI Call TI -40 to 85 LMH67
20MA
LMH6720MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH67
20MA
LMH6720MAX NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 85 LMH67
20MA
LMH6720MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH67
20MA
LMH6720MF/NOPB ACTIVE SOT-23 DBV 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A96A
LMH6720MFX/NOPB ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A96A
LMH6722MA NRND SOIC D 14 55 TBD Call TI Call TI -40 to 85 LMH67
22MA
LMH6722MA/NOPB ACTIVE SOIC D 14 55 Green (RoHS
& no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 85 LMH67
22MA
LMH6722MAX NRND SOIC D 14 2500 TBD Call TI Call TI -40 to 85 LMH67
22MA
LMH6722MAX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 85 LMH67
22MA
LMH6722MT/NOPB ACTIVE TSSOP PW 14 94 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH67
22MT
PACKAGE OPTION ADDENDUM
www.ti.com 1-Nov-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LMH6722MTX/NOPB ACTIVE TSSOP PW 14 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH67
22MT
LMH6722QSD/NOPB ACTIVE WSON NHK 14 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L6722Q
LMH6722QSDX/NOPB ACTIVE WSON NHK 14 4500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L6722Q
LMH6722SD/NOPB ACTIVE WSON NHK 14 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L6722
LMH6722SDX/NOPB ACTIVE WSON NHK 14 4500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L6722
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
PACKAGE OPTION ADDENDUM
www.ti.com 1-Nov-2013
Addendum-Page 3
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LMH6722, LMH6722-Q1 :
•Catalog: LMH6722
•Automotive: LMH6722-Q1
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LMH6714MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMH6714MF SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMH6714MF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMH6714MFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMH6720MAX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMH6720MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMH6720MF/NOPB SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMH6720MFX/NOPB SOT-23 DBV 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMH6722MAX SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1
LMH6722MAX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1
LMH6722MTX/NOPB TSSOP PW 14 2500 330.0 12.4 6.95 8.3 1.6 8.0 12.0 Q1
LMH6722QSD/NOPB WSON NHK 14 1000 178.0 12.4 3.3 4.3 1.0 8.0 12.0 Q1
LMH6722QSDX/NOPB WSON NHK 14 4500 330.0 12.4 3.3 4.3 1.0 8.0 12.0 Q1
LMH6722SD/NOPB WSON NHK 14 1000 178.0 12.4 3.3 4.3 1.0 8.0 12.0 Q1
LMH6722SDX/NOPB WSON NHK 14 4500 330.0 12.4 3.3 4.3 1.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMH6714MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMH6714MF SOT-23 DBV 5 1000 210.0 185.0 35.0
LMH6714MF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
LMH6714MFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0
LMH6720MAX SOIC D 8 2500 367.0 367.0 35.0
LMH6720MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMH6720MF/NOPB SOT-23 DBV 6 1000 210.0 185.0 35.0
LMH6720MFX/NOPB SOT-23 DBV 6 3000 210.0 185.0 35.0
LMH6722MAX SOIC D 14 2500 367.0 367.0 35.0
LMH6722MAX/NOPB SOIC D 14 2500 367.0 367.0 35.0
LMH6722MTX/NOPB TSSOP PW 14 2500 367.0 367.0 35.0
LMH6722QSD/NOPB WSON NHK 14 1000 210.0 185.0 35.0
LMH6722QSDX/NOPB WSON NHK 14 4500 367.0 367.0 35.0
LMH6722SD/NOPB WSON NHK 14 1000 210.0 185.0 35.0
LMH6722SDX/NOPB WSON NHK 14 4500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 2
MECHANICAL DATA
NHK0014A
www.ti.com
SDA14A (Rev A)
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated