© Semiconductor Components Industries, LLC, 2008
September, 2008 Rev. 3
1Publication Order Number:
NSBC114EF3/D
NSBC114EF3T5G Series
Preferred Devices
Digital Transistors (BRT)
NPN Silicon Surface Mount Transistors
with Monolithic Bias Resistor Network
This new series of digital transistors is designed to replace a single
device and its external resistor bias network. The digital transistor
contains a single transistor with a monolithic bias network consisting
of two resistors; a series base resistor and a baseemitter resistor. The
digital transistor eliminates these individual components by
integrating them into a single device. The use of a digital transistor can
reduce both system cost and board space. The device is housed in the
SOT1123 package which is designed for low power surface mount
applications.
Features
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
The SOT1123 Package can be Soldered using Wave or Reflow.
Available in 4 mm, 8000 Unit Tape & Reel
These are PbFree Devices
These are HalideFree Devices
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating Symbol Value Unit
Collector-Base Voltage VCBO 50 Vdc
Collector-Emitter Voltage VCEO 50 Vdc
Collector Current IC100 mAdc
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
NPN SILICON DIGITAL
TRANSISTORS
PIN 3
COLLECTOR
(OUTPUT)
PIN 2
EMITTER
(GROUND)
PIN 1
BASE
(INPUT)
R1
R2
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MARKING DIAGRAM
SOT1123
CASE 524AA
STYLE 1
1
x = Device Code
M = Date Code
G or G= PbFree Package
2
3
1
x M
ORDERING INFORMATION
Device Package Shipping
NSBC114EF3T5G SOT1123
(PbFree)
8000/Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking table
on page 2 of this data sheet.
NSBC114EF3T5G Series
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2
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation
TA = 25°C (Note 1)
Derate above 25°C
PD254
2.0
mW
mW/°C
Thermal Resistance (Note 1)
Junction-to-Ambient
RqJA 493 °C/W
Total Device Dissipation
TA = 25°C (Note 2)
Derate above 25°C
PD297
2.4
mW
mW/°C
Thermal Resistance Junction-to-Ambient (Note 2) RqJA 421 °C/W
Thermal Resistance JunctiontoLead 3 (Note 1) RqJL 193 °C/W
Junction and Storage Temperature TJ, Tstg 55 to +150 °C
1. FR4 @ 100 mm2, 1 oz. copper traces, still air.
2. FR4 @ 500 mm2, 1 oz. copper traces, still air.
DEVICE MARKING AND RESISTOR VALUES
Device Marking* R1 (k) R2 (k) Package Shipping
NSBC114EF3T5G A (0°) 10 10
SOT1123
(PbFree) 8000/Tape & Reel
NSBC124EF3T5G L (0°) 22 22
NSBC144EF3T5G D (0°) 47 47
NSBC114YF3T5G J (0°) 10 47
NSBC123TF3T5G T (0°) 2.2
NSBC143EF3T5G P (0°) 4.7 4.7
NSBC143ZF3T5G R (0°) 4.7 47
NSBC123JF3T5G V (0°) 2.2 47
NSBC144WF3T5G Q (0°) 47 22
NSBC114TF3T5G K (90°) 10
NSBC115TF3T5G P (90°) 100
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*(XX°) = Degree rotation in the clockwise direction.
NSBC114EF3T5G Series
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3
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
CollectorBase Cutoff Current (VCB = 50 V, IE = 0) ICBO 100 nAdc
CollectorEmitter Cutoff Current (VCE = 50 V, IB = 0) ICEO 500 nAdc
EmitterBase Cutoff Current NSBC114EF3T5G
(VEB = 6.0 V, IC = 0) NSBC124EF3T5G
NSBC144EF3T5G
NSBC114YF3T5G
NSBC114TF3T5G
NSBC123TF3T5G
NSBC115TF3T5G
NSBC143EF3T5G
NSBC143ZF3T5G
NSBC123JF3T5G
NSBC144WF3T5G
IEBO
0.5
0.2
0.1
0.2
0.9
4.0
0.1
1.5
0.18
0.2
0.13
mAdc
CollectorBase Breakdown Voltage (IC = 10 mA, IE = 0) V(BR)CBO 50 Vdc
CollectorEmitter Breakdown Voltage (Note 3)
(IC = 2.0 mA, IB = 0)
V(BR)CEO 50 Vdc
ON CHARACTERISTICS (Note 3)
DC Current Gain NSBC114EF3T5G
(VCE = 10 V, IC = 5.0 mA) NSBC124EF3T5G
NSBC144EF3T5G
NSBC114YF3T5G
NSBC114TF3T5G/NSBC115TF3T5G/NSBC123TF3T5G
NSBC143EF3T5G
NSBC143ZF3T5G
NSBC123JF3T5G
NSBC144WF3T5G
hFE 35
60
80
80
160
15
80
80
80
60
100
140
140
350
30
200
140
140
CollectorEmitter Saturation Voltage (IC = 10 mA, IB = 0.3 mA)
NSBC114EF3T5G/NSBC124EF3T5G/NSBC144EF3T5G
NSBC114YF3T5G/NSBC144WF3T5G/NSBC123JF3T5G
(IC = 10 mA, IB = 1 mA)
NSBC143EF3T5G/NSBC143ZF3T5G/NSBC123TF3T5G/
NSBC114TF3T5G
(IC = 10 mA, IB = 5 mA)
NSBC115TF3T5G
VCE(sat) 0.25 Vdc
Output Voltage (on)
(VCC = 5.0 V, VB = 2.5 V, RL = 1.0 kW) NSBC114TF3T5G
NSBC114EF3T5G
NSBC124EF3T5G
NSBC114YF3T5G
NSBC123TF3T5G
NSBC143EF3T5G
NSBC143ZF3T5G
NSBC123JF3T5G
(VCC = 5.0 V, VB = 3.5 V, RL = 1.0 kW) NSBC144EF3T5G
(VCC = 5.0 V, VB = 4.0 V, RL = 1.0 kW) NSBC144WF3T5G
(VCC = 5.0 V, VB = 5.0 V, RL = 1.0 kW) NSBC115TF3T5G
VOL
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
Vdc
3. Pulse Test: Pulse Width < 300 ms, Duty Cycle < 2.0%.
NSBC114EF3T5G Series
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4
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
ON CHARACTERISTICS (Note 4)
Characteristic Symbol Min Typ Max Unit
Output Voltage (off) (VCC = 5.0 V, VB = 0.5 V, RL = 1.0 kW)
NSBC114EF3T5G/NSBC124EF3T5G/NSBC144EF3T5G
NSBC144YF3T5G/NSBC143EF3T5G/NSBC123JF3T5G
NSBC144WF3T5G
(VCC = 5.0 V, VB = 0.25 V, RL = 1.0 kW)
NSBC123TF3T5G/NSBC143ZF3T5G/NSBC114TF3T5G/
NSBC115TF3T5G
VOH 4.9 Vdc
Input Resistor NSBC114TF3T5G
NSBC114EF3T5G
NSBC124EF3T5G
NSBC144EF3T5G
NSBC114YF3T5G
NSBC123TF3T5G
NSBC143EF3T5G
NSBC143ZF3T5G
NSBC123JF3T5G
NSBC144WF3T5G
NSBC115TF3T5G
R1 7.0
7.0
15.4
32.9
7.0
1.5
3.3
3.3
1.54
32.9
70
10
10
22
47
10
2.2
4.7
4.7
2.2
47
100
13
13
28.6
61.1
13
2.9
6.1
6.1
2.86
61.1
130
kW
Resistor Ratio
NSBC114EF3T5G/NSBC124EF3T5G/
NSBC144EF3T5G/NSBC123EF3T5G
NSBC114YF3T5G
NSBC114TF3T5G/NSBC115TF3T5G/NSBC123TF3T5G
NSBC143ZF3T5G
NSBC123JF3T5G
NSBC144WF3T5G
R1/R2
0.8
0.17
0.055
0.038
1.7
1.0
0.21
0.1
0.047
2.1
1.2
0.25
0.185
0.056
2.6
4. Pulse Test: Pulse Width < 300 ms, Duty Cycle < 2.0%.
NSBC114EF3T5G Series
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5
TYPICAL ELECTRICAL CHARACTERISTICS NSBC114EF3T5G
0.01
0.10
1.0
0 5 10 15 20 25 30 35 40 45 50
Figure 1. VCE(sat) vs. IC
IC, COLLECTOR CURRENT (mA)
VCE(SAT), COLLECTORTOEMITTER SATURATION
VOLTAGE (V)
TA=25°C
TA= 150°C
TA=55°C
1.0
10
100
1000
0.1 1 10 100
VCE = 10 V
150°C
25°C
55°C
Figure 2. DC Current Gain
IC, COLLECTOR CURRENT (mA)
hFE, DC CURRENT GAIN
0.80
1.00
1.20
1.40
1.60
1.80
2.00
2.20
2.40
0 5 10 15 20 25 30 35 40 45 50
Figure 3. Output Capacitance
VCB, COLLECTOR BASE VOLTAGE (V)
COBO, OUTPUT CAPACITANCE (pF)
0.01
0.1
1
10
100
0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
150°C
25°C
55°C
IC, COLLECTOR CURRENT (mA)
Figure 4. Output Current vs. Input Voltage
Vin, INPUT VOLTAGE (V)
0.10
1.0
10
0 5 10 15 20 25 30 35 40 45 50
Figure 5. Input Voltage vs. Output Current
IC, COLLECTOR CURRENT (mA)
Vin, INPUT VOLTAGE (V)
150°C
25°C
55°C
IC/IB = 10
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6
TYPICAL APPLICATIONS FOR NPN BRTs
LOAD
+12 V
Figure 6. Level Shifter: Connects 12 or 24 Volt Circuits to Logic
IN
OUT
VCC
ISOLATED
LOAD
FROM mP OR
OTHER LOGIC
+12 V
Figure 7. Open Collector Inverter:
Inverts the Input Signal
Figure 8. Inexpensive, Unregulated Current Source
NSBC114EF3T5G Series
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7
PACKAGE DIMENSIONS
SOT1123
CASE 524AA01
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
DIM MIN NOM MAX
MILLIMETERS
A0.34 0.37 0.40
b0.15 0.22 0.28
c0.07 0.12 0.17
D0.75 0.80 0.85
E0.55 0.60 0.65
0.95 1.00 1.05
L0.05 0.10 0.15
HE
0.013 0.015 0.016
0.006 0.009 0.011
0.003 0.005 0.007
0.030 0.031 0.033
0.022 0.024 0.026
0.037 0.039 0.041
0.002 0.004 0.006
MIN NOM MAX
INCHES
D
E
b
c
A
L
Y
X
0.08 (0.0032) XY
HE
0.40
0.30
0.90
DIMENSIONS: MILLIMETERS
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
e−−− −−−−
b1 0.10 0.15 0.20 0.004 0.006 0.008
b1
e
0.35
0.25
STYLE 1:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
1
2
3
0.35 0.40 0.014 0.016
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent
rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.
Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries,
affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury
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NSBC114EF3/D
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